STATS ChipPAC Pte. Lte.

Singapore

 
Total IP 1,523
Total IP Rank # 840
IP Activity Score 3.1/5.0    257
IP Activity Rank # 2,757
Parent Entity JCET-SC (Singapore) Pte. Ltd

Patents

Trademarks

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Last Patent 2024 - Semiconductor device and method ...
First Patent 1998 - Method of forming extended lead ...

Latest Inventions, Goods, Services

2024 Invention Semiconductor device and method of forming vertical interconnect structure for pop module. A sem...
Invention Cooling device and process for cooling double-sided sip devices during sputtering. A semiconduct...
Invention Semiconductor device with partial emi shielding removal using laser ablation. A semiconductor de...
Invention Die-beam alignment for laser-assisted bonding. A method of making a semiconductor device involve...
Invention Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip m...
2023 Invention Method for making a semiconductor device using a double side molding technology. A method for ma...
Invention Semiconductor device and method for making the same. A semiconductor device and a method for mak...
Invention Semiconductor device and method of forming semiconductor package with rf antenna interposer havin...
Invention Double-sided partial molded sip module. A semiconductor device has a substrate and a first compo...
Invention Semiconductor device and method of stacking devices using support frame. A semiconductor device ...
Invention Laser-based redistribution and multi-stacked packages. A semiconductor device has a first packag...
Invention Semiconductor device and method for making the same. A semiconductor device comprises a substrat...
Invention Semiconductor device and method for making the same. A method for singulating a semiconductor su...
Invention Semiconductor device and method for making the same. A semiconductor device and a method for for...
Invention Integrated package and method for making the same. An integrated package and a method for making...
Invention Sensor assembly and method for forming the same. Provided is a sensor assembly, comprising: a se...
Invention Semiconductor devices with pyramidal shielding and method for making the same. A semiconductor d...
Invention Heat spreader assembly for use with a semiconductor device. Provided is a heat spreader assembly...
Invention Electronic components with improved insulation, electronic packages incorporating such electronic...
Invention Semiconductor device and method of making a semiconductor package with graphene for die attach. ...
Invention Antenna module, semiconductor device and methods for making the same. An antenna module comprise...
Invention Developing apparatus and substrate processing apparatus. The present application relates to a de...
Invention Modular semiconductor devices and electronic devices incorporating the same. A modular semicondu...
Invention Method for selectively forming a shielding layer on a semiconductor device. A method for selecti...
Invention Semiconductor device and method of making a semiconductor package with graphene-coated interconne...
Invention Semiconductor device and method of forming rdl with graphene-coated core. A semiconductor device...
2022 Invention Semiconductor device and method of die attach with adhesive layer containing graphene-coated core...
Invention Semiconductor device and method of forming graphene core shell embedded within shielding layer. ...
Invention Semiconductor device and method of stacking hybrid substrates with embedded electric components. ...
Invention Semiconductor device and methods of making and using thermally advanced semiconductor packages. ...
Invention Semiconductor device and method of stacking hybrid substrates. A semiconductor device has an RDL...
Invention Semiconductor device and method of forming graphene-coated core embedded within tim. A semicondu...
Invention Semiconductor device and method of forming hybrid substrate with uniform thickness. A semiconduc...
Invention Semiconductor device and method for partial emi shielding. A semiconductor device includes a sub...
Invention Semiconductor device and method of forming module-in-package structure using redistribution layer...
Invention Semiconductor device and method of forming package with double-sided integrated passive device. ...
Invention Semiconductor device and method of forming dummy vias in wlp. A semiconductor device has a semic...
Invention Semiconductor device and method of forming hybrid substrate with ipd over active semiconductor wa...
Invention Power envelope analysis for the thermal optimization of multi-chip modules. A semiconductor devi...
Invention Semiconductor device and method of forming underfill dam for chip-to-wafer device. A semiconduct...
Invention Semiconductor device and method of forming thin heat sink using e-bar substrate. A semiconductor...
Invention Semiconductor device and method of forming emi shielding material in two-step process to avoid co...
Invention Semiconductor device and method of heat dissipation using graphene. A semiconductor device has a...
Invention Semiconductor device and method of forming embedded magnetic shielding. A semiconductor device h...
Invention Semiconductor device and method of double shielding. A semiconductor device has a substrate. A f...