|
2023
|
Invention
|
Loop-type heat pipe.
An evaporator includes a first metal layer having a first inner surface and... |
|
|
Invention
|
Cap housing, cap, and semiconductor device.
A cap housing includes a tubular part, and a top pla... |
|
|
Invention
|
Heat spreader and electronic component device.
A heat spreader includes a metal substrate and a ... |
|
|
Invention
|
Biological information measurement device and biological information measurement method.
A biolo... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate having a first bonding ... |
|
|
Invention
|
Temperature adjusting member.
A temperature adjusting member includes a base body, an insulator ... |
|
|
Invention
|
Electrostatic chuck, substrate fixing device and paste.
An electrostatic chuck includes a base b... |
|
|
Invention
|
Semiconductor device.
A semiconductor device includes a first inorganic insulating layer, a meta... |
|
|
Invention
|
Myoelectric sensor array.
A myoelectric sensor array includes a plurality of myoelectric sensors... |
|
|
Invention
|
Wiring board assembly, wiring board, and wiring board manufacturing method.
A wiring board assem... |
|
|
Invention
|
Substrate with optical waveguide and optical communication device.
A substrate with optical wave... |
|
|
Invention
|
Connection structural body and semiconductor device.
A connection structural body includes a fir... |
|
|
Invention
|
Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate.
A wiri... |
|
|
Invention
|
Wiring board.
A wiring board includes a first interconnect structure including a first interconn... |
|
|
Invention
|
Interconnect substrate, method of making the same, and method of identifying interconnect substra... |
|
|
Invention
|
Interconnect substrate.
An interconnect substrate includes alternately stacked pads and insulati... |
|
|
Invention
|
Wiring substrate.
A wiring substrate includes a wiring layer, a protective insulation layer cove... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate, a heat-generating part... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate, a ceramic plate bonded... |
|
|
Invention
|
Wiring board.
A wiring board includes a first interconnect layer, a first insulating layer cover... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate, a ceramic plate fixed ... |
|
|
Invention
|
Semiconductor device.
A semiconductor device includes a lower substrate, a first wiring pattern ... |
|
|
Invention
|
Laminated wiring board.
A laminated wiring board includes a plurality of first wiring boards lam... |
|
|
Invention
|
Laminated wiring board.
A laminated wiring board includes a first wiring board, a plurality of s... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate, a ceramic plate, and a... |
|
|
Invention
|
Wiring board, semiconductor device, and wiring board manufacturing method.
A wiring board includ... |
|
|
Invention
|
Heat conductor.
A heat conductor includes a first resin layer and a second resin layer each free... |
|
|
Invention
|
Substrate.
A substrate includes a heat conduction member including a plurality of carbon nanotub... |
|
|
Invention
|
Ceramic substrate, method of manufacturing the ceramic substrate, electrostatic chuck, substrate ... |
|
|
Invention
|
Silicon photonics element and optical module.
A silicon photonics element including an optical e... |
|
|
Invention
|
Latent heat storage.
A latent heat storage includes a ceramic part, formed of a polycrystalline ... |
|
|
Invention
|
Semiconductor device, semiconductor device package, and manufacturing methods thereof.
A method ... |
|
|
Invention
|
Heat pipe.
The heat pipe includes an injection port into which a working fluid is injected. The ... |
|
|
Invention
|
Stem for semiconductor package and semiconductor package.
A stem for a semiconductor package inc... |
|
|
Invention
|
Wiring substrate.
A wiring substrate includes a wiring layer that includes a first pad on which ... |
|
|
Invention
|
Ceramic substrate, electrostatic chuck, substrate fixing device, and package for semiconductor de... |
|
|
Invention
|
Component-containing substrate.
A component-containing substrate includes a substrate base. The ... |
|
|
Invention
|
Wiring board.
A wiring board includes a first insulating layer, a pad formed on one surface of t... |
|
|
Invention
|
Connection structural body and semiconductor device.
A connection structural body includes: a fi... |
|
|
Invention
|
Interconnect substrate and method of making the same.
An interconnect substrate includes a pad f... |
|
|
Invention
|
Embedded printed circuit board.
An embedded PCB includes a first substrate, an electronic compon... |
|
|
Invention
|
Loop-type heat pipe.
A loop-type heat pipe includes a loop-type heat pipe main body including a ... |
|
|
Invention
|
Interconnect substrate.
An interconnect substrate includes a first interconnect substrate having... |
|
|
Invention
|
Substrate fixing device.
A substrate fixing device includes a base plate having a first through-... |
|
|
Invention
|
Method and apparatus for determining biological movement.
A method of determining biological mov... |
|
|
Invention
|
Wiring substrate, semiconductor device, and method of manufacturing wiring substrate.
A wiring s... |
|
|
Invention
|
Measuring device and measuring system.
A measuring device includes a substrate having a first su... |
|
2022
|
Invention
|
Substrate with optical waveguide, and optical communication device.
An optical waveguide on a wi... |
|
2013
|
G/S
|
multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-... |
|
2007
|
G/S
|
Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ... |
|
|
G/S
|
Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit |
|
2004
|
G/S
|
Computer program for the purpose of determining exposing conditions, and determining the pattern ... |
|
|
G/S
|
Computer program for the purpose of determining exposing conditions, pattern data of mask less ex... |
|
2000
|
G/S
|
Lead frames for semiconductor devices |
|
1997
|
G/S
|
Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout... |
|
1992
|
G/S
|
[ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c... |
|
|
G/S
|
components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp... |
|
|
G/S
|
components for the manufacture of semiconductors and electronic devices;, namely, glass to metal ... |
|
|
G/S
|
components for the manufacture of semiconductors and electronic devices; namely, glass to metal s... |
|
1985
|
G/S
|
ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS... |
