Shinko Electric Industries Co., Ltd.

Japan


 
Total IP 1,179
Total IP Rank # 1,086
IP Activity Score 3.4/5.0    479
IP Activity Rank # 1,510
Stock Symbol
ISIN JP3375800004
Market Cap. 642742584210.0  (JPY)
Industry Semiconductors
Sector Technology
Dominant Nice Class Scientific and electric apparatu...

Patents

Trademarks

1,159 15
1 0
4 0
0
 
Last Patent 2024 - Interconnect substrate, method o...
First Patent 1979 - Method of making a take-carrier ...
Last Trademark 2013 - I-THOP
First Trademark 1984 - SD

Industry (Nice Classification)

Latest Inventions, Goods, Services

2024 Invention Wiring substrate. A wiring substrate includes a first insulation layer, a first wiring layer inc...
2023 Invention Electronic apparatus. An electronic apparatus includes a first metal layer, a component mounting...
Invention Electronic apparatus. An electronic apparatus includes a lead frame, a wiring board, and a seali...
Invention Wiring board. A wiring board includes a first interconnect layer, an insulating layer covering t...
Invention Optical connector. An optical connector includes a holding member to which a waveguide member is...
Invention Tray and substrate fixing device. A tray mounted on an electrostatic chuck includes an accommoda...
Invention Wiring substrate. A wiring substrate includes a metal layer, a resin layer, and a wiring structu...
Invention Wiring substrate. A wiring substrate includes a first wiring layer, an insulation layer covering...
Invention Stem and method of manufacturing stem. A stem includes a base member and a block member. The bas...
Invention Heat conductor and thermal management part. A heat conductor includes a base including a forest ...
Invention Semiconductor device. A semiconductor device includes a laminate including a semiconductor eleme...
Invention Interconnect substrate, method of making the same, and semiconductor apparatus. An interconnect ...
Invention Interconnect substrate and method of making the same. A method of making an interconnect substra...
Invention Optical connection structure and optical module. An optical connection structure includes a firs...
Invention Loop-type heat pipe. An evaporator includes a first metal layer having a first inner surface and...
Invention Cap housing, cap, and semiconductor device. A cap housing includes a tubular part, and a top pla...
Invention Heat spreader and electronic component device. A heat spreader includes a metal substrate and a ...
Invention Biological information measurement device and biological information measurement method. A biolo...
Invention Substrate fixing device. A substrate fixing device includes a base plate having a first bonding ...
Invention Temperature adjusting member. A temperature adjusting member includes a base body, an insulator ...
Invention Electrostatic chuck, substrate fixing device and paste. An electrostatic chuck includes a base b...
Invention Semiconductor device. A semiconductor device includes a first inorganic insulating layer, a meta...
Invention Myoelectric sensor array. A myoelectric sensor array includes a plurality of myoelectric sensors...
Invention Wiring board assembly, wiring board, and wiring board manufacturing method. A wiring board assem...
Invention Substrate with optical waveguide and optical communication device. A substrate with optical wave...
Invention Connection structural body and semiconductor device. A connection structural body includes a fir...
Invention Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate. A wiri...
Invention Wiring board. A wiring board includes a first interconnect structure including a first interconn...
Invention Interconnect substrate, method of making the same, and method of identifying interconnect substra...
Invention Interconnect substrate. An interconnect substrate includes alternately stacked pads and insulati...
Invention Wiring substrate. A wiring substrate includes a wiring layer, a protective insulation layer cove...
Invention Substrate fixing device. A substrate fixing device includes a base plate, a heat-generating part...
Invention Substrate fixing device. A substrate fixing device includes a base plate, a ceramic plate bonded...
Invention Wiring board. A wiring board includes a first interconnect layer, a first insulating layer cover...
Invention Substrate fixing device. A substrate fixing device includes a base plate, a ceramic plate fixed ...
Invention Semiconductor device. A semiconductor device includes a lower substrate, a first wiring pattern ...
Invention Laminated wiring board. A laminated wiring board includes a plurality of first wiring boards lam...
Invention Laminated wiring board. A laminated wiring board includes a first wiring board, a plurality of s...
Invention Substrate fixing device. A substrate fixing device includes a base plate, a ceramic plate, and a...
Invention Wiring board, semiconductor device, and wiring board manufacturing method. A wiring board includ...
Invention Heat conductor. A heat conductor includes a first resin layer and a second resin layer each free...
Invention Substrate. A substrate includes a heat conduction member including a plurality of carbon nanotub...
Invention Ceramic substrate, method of manufacturing the ceramic substrate, electrostatic chuck, substrate ...
Invention Silicon photonics element and optical module. A silicon photonics element including an optical e...
Invention Latent heat storage. A latent heat storage includes a ceramic part, formed of a polycrystalline ...
Invention Heat pipe. The heat pipe includes an injection port into which a working fluid is injected. The ...
Invention Stem for semiconductor package and semiconductor package. A stem for a semiconductor package inc...
Invention Connection structural body and semiconductor device. A connection structural body includes: a fi...
2013 G/S multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-...
2007 G/S Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ...
G/S Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit
2004 G/S Computer program for the purpose of determining exposing conditions, pattern data of mask less ex...
G/S Computer program for the purpose of determining exposing conditions, and determining the pattern ...
2000 G/S Lead frames for semiconductor devices
1997 G/S Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout...
1992 G/S [ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c...
G/S components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp...
G/S components for the manufacture of semiconductors and electronic devices;, namely, glass to metal ...
G/S components for the manufacture of semiconductors and electronic devices; namely, glass to metal s...
1985 G/S ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS...