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2023
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Invention
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Semiconductor device, semiconductor device package, and manufacturing methods thereof.
A method ... |
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Invention
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Component-containing substrate.
A component-containing substrate includes a substrate base. The ... |
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Invention
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Wiring board.
A wiring board includes a core layer having a first through hole formed therein, a... |
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Invention
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Wiring board.
A wiring board includes a first insulating layer, a pad formed on one surface of t... |
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Invention
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Interconnect substrate and method of making the same.
An interconnect substrate includes a pad f... |
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Invention
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Embedded printed circuit board.
An embedded PCB includes a first substrate, an electronic compon... |
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Invention
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Loop-type heat pipe.
A loop-type heat pipe includes a loop-type heat pipe main body including a ... |
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Invention
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Interconnect substrate.
An interconnect substrate includes a first interconnect substrate having... |
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Invention
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Substrate fixing device.
A substrate fixing device includes a base plate having a first through-... |
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Invention
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Method and apparatus for determining biological movement.
A method of determining biological mov... |
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Invention
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Wiring substrate, semiconductor device, and method of manufacturing wiring substrate.
A wiring s... |
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Invention
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Measuring device and measuring system.
A measuring device includes a substrate having a first su... |
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2022
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Invention
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Substrate with optical waveguide, and optical communication device.
An optical waveguide on a wi... |
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Invention
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Semiconductor device.
A semiconductor device includes a lower substrate, a semiconductor element... |
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Invention
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Lead frame, method of making lead frame, semiconductor apparatus, and method of making semiconduc... |
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Invention
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Embedded printed circuit board.
An embedded printed circuit board includes a first substrate, a ... |
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Invention
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Wiring board.
A wiring board includes an insulating layer that is formed by using insulating res... |
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Invention
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Wiring board and electronic device.
A wiring board includes a plurality of insulating layers eac... |
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Invention
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Semiconductor device.
A semiconductor device includes: a first semiconductor element; a second s... |
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Invention
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Electrostatic chuck.
An electrostatic chuck includes a base plate, a ceramic plate fixed to the ... |
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Invention
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Semiconductor device.
A semiconductor device includes: a first semiconductor element including a... |
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Invention
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Header for semiconductor package.
A header for a semiconductor package, includes an eyelet havin... |
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Invention
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Electronic device.
An electronic device includes a loop type heat pipe including a loop-shaped f... |
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Invention
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Metal component and ceramic substrate.
A columnar metal component includes a first main surface,... |
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Invention
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Circuit board, semiconductor device, and method of manufacturing circuit board.
A circuit board ... |
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Invention
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Interconnect substrate, method of manufacturing the same, and semiconductor apparatus.
An interc... |
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Invention
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Wiring substrate and semiconductor device.
A wiring substrate includes an insulating layer, a pa... |
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Invention
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Wiring board.
A wiring board includes a pad configured to make an external electrical connection... |
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Invention
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Wiring board and semiconductor device.
A wiring board includes an interconnect structure. The in... |
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Invention
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Wiring board.
A wiring board includes a first wiring layer including a wiring pattern and a pad,... |
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Invention
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Wiring board and manufacturing method of wiring board.
A wiring board includes: a wiring layer;... |
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Invention
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Lead frame, semiconductor device and examination method.
A lead frame includes a die pad that in... |
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Invention
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Ceramic composition and method for manufacturing ceramic composition.
A ceramic composition is p... |
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Invention
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Base plate and substrate fixing device.
A base plate has one surface and the other surface oppos... |
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Invention
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Interconnect substrate.
An interconnect substrate includes a core layer including a resin layer ... |
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Invention
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Wiring board and semiconductor device.
A wiring board includes an interconnect structure includi... |
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Invention
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Wafer.
A wafer includes a substrate and conductive bumps on a surface of the substrate. In a pla... |
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Invention
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Sensor module.
A sensor module includes a metal member having a side surface extending in a ring... |
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Invention
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Circuit board.
A circuit board includes a support member having a first major surface and a seco... |
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Invention
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Electrostatic chuck and substrate fixing device.
The electrostatic chuck includes an insulating ... |
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Invention
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Wiring board.
A wiring board includes a wiring layer, an insulating layer, a plurality of openin... |
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Invention
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Circuit board and circuit module.
A circuit board includes a magnetic shielding member having a ... |
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Invention
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Loop heat pipe.
A loop heat pipe includes: an evaporator configured to vaporize a working fluid;... |
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Invention
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Wiring board and wiring board manufacturing method.
A wiring board includes a base material, a t... |
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Invention
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Electrostatic chuck and substrate fixing device.
An electrostatic chuck includes a ceramic plate... |
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2021
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Invention
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Electrostatic chuck and substrate holding device.
An electrostatic chuck includes a base having ... |
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Invention
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Substrate fixing device.
A substrate fixing device includes a baseplate, an electrostatic attrac... |
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2013
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G/S
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multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-... |
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2007
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G/S
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Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ... |
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G/S
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Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit |
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2004
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G/S
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Computer program for the purpose of determining exposing conditions, and determining the pattern ... |
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G/S
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Computer program for the purpose of determining exposing conditions, pattern data of mask less ex... |
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2000
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G/S
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Lead frames for semiconductor devices |
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1997
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G/S
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Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout... |
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1992
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G/S
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[ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c... |
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G/S
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components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp... |
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G/S
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components for the manufacture of semiconductors and electronic devices; namely, glass to metal s... |
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1985
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G/S
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ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS... |
