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2024
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G/S
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Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin... |
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2023
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G/S
|
Metalworking machines and tools; semiconductor manufacturing machines |
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G/S
|
Metalworking machines and tools; semiconductor manufacturing
machines. |
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Invention
|
Method of processing wafer and wafer processing apparatus.
A method of processing a wafer includ... |
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Invention
|
Processing method of bonded wafer and processing apparatus.
A method for processing a bonded waf... |
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Invention
|
Optical element assembly.
An optical element assembly includes a first optical element and a sec... |
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Invention
|
Cutting apparatus and cutting method.
A cutting liquid supply unit of a cutting apparatus includ... |
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Invention
|
Wafer processing method and device chip manufacturing method.
A wafer processing method for proc... |
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Invention
|
Device wafer processing method.
A device wafer processing method includes a protective film form... |
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G/S
|
Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates |
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G/S
|
Cemented carbide cutting tools; other metalworking machines and tools |
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G/S
|
Cemented carbide cutting tools; other metalworking machines
and tools. |
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G/S
|
Metalworking machines and tools; semiconductor manufacturing machines Processing of semiconductor... |
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G/S
|
Metalworking machines and tools; semiconductor manufacturing
machines. Processing of semiconduct... |
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G/S
|
Semi-conductor wafers; semi-conductor substrates; compound
semi-conductor substrates. |
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Invention
|
Manufacturing method of chips.
Provided is a manufacturing method of a plurality of chips by div... |
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Invention
|
Inspection method of workpiece and inspection apparatus.
An inspection method of a workpiece inc... |
|
|
Invention
|
Processing method of bonded wafer and processing apparatus.
A processing method of a bonded wafe... |
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|
Invention
|
Processing method of substrate and manufacturing method of chips.
A processing method of a subst... |
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Invention
|
Holding table.
A holding table includes a holder made of porous ceramic and configured to hold a... |
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Invention
|
Chip manufacturing method.
A chip manufacturing method for dividing a workpiece along a projecte... |
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|
Invention
|
Polishing liquid for polishing compound semiconductor substrate.
A polishing liquid for polishin... |
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|
Invention
|
Processing method of wafer.
A processing method of a wafer includes a water-soluble resin applic... |
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|
Invention
|
Wafer processing method.
A wafer processing method includes emitting a laser beam along an annul... |
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|
Invention
|
Method of manufacturing laminated device chips.
A method of manufacturing laminated device chips... |
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|
Invention
|
Polishing apparatus and polishing method.
A polishing apparatus includes a holding table for hol... |
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Invention
|
Method for processing device wafer.
Disclosed is a method for processing a device wafer, in whic... |
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Invention
|
Mounting method and cutting apparatus.
A mounting method includes a storing step of storing a pl... |
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G/S
|
Metalworking machines and tools; semiconductor manufacturing machines and systems Software for ma... |
|
|
G/S
|
Metalworking machines and tools; semiconductor manufacturing
machines and systems. Software for ... |
|
|
Invention
|
Laser processing machine.
A laser beam irradiation unit of a laser processing machine includes a... |
|
|
Invention
|
Processing method of wafer.
A wafer is processed by causing a cutting blade to cut into an outer... |
|
|
Invention
|
Dividing method of wafer.
In a dividing method of a wafer, first edge parts and second edge part... |
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|
Invention
|
Processing apparatus.
A processing apparatus includes a holding table and a processing unit. The... |
|
|
Invention
|
Grindstone.
A grindstone includes abrasive grains and a binder for fixing the abrasive grains, a... |
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|
Invention
|
Processing method of wafer.
In a processing method of a wafer having a front surface and a back ... |
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|
Invention
|
Cutting apparatus.
A cutting apparatus includes a cutting liquid supply nozzle disposed adjacent... |
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G/S
|
Auxiliary chemical fluids containing organic acid and
oxidizing agent for use in cutting; indust... |
|
|
Invention
|
Workpiece processing method.
Pressing a protective member causes the protective member to be emb... |
|
|
Invention
|
Chuck table manufacturing method.
A chuck table manufacturing method capable of changing over th... |
|
|
Invention
|
Wafer processing method.
After first processed grooves are formed by application of a laser beam... |
|
|
Invention
|
Polishing pad.
A polishing pad for polishing a silicon carbide substrate contains polyurethane a... |
|
|
Invention
|
Laser processing machine and manufacturing method of wafer.
A laser oscillation unit of a laser ... |
|
|
Invention
|
Workpiece grinding method.
A workpiece grinding method includes a rotary-shaft direction grindin... |
|
|
Invention
|
Lift-off method.
A lift-off method includes joining a transfer substrate to a face side of an op... |
|
|
Invention
|
Transfer apparatus.
A transfer unit of a transfer apparatus includes a battery that is a power s... |
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|
Invention
|
Chip treating method.
A chip treating method includes a first tape affixing step of affixing a f... |
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|
Invention
|
Processing method of workpiece.
A processing method of a workpiece includes a protective film co... |
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|
Invention
|
Cutting blade stock apparatus.
There is provided a cutting blade stock apparatus that stocks mul... |
|
|
Invention
|
Method of and apparatus for grinding wafer.
A wafer is ground by switching between a self-sharpe... |
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|
Invention
|
Workpiece grinding method.
Prior to a stopping step in which spark-out is conducted, a spacing s... |
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Invention
|
Spinner unit.
A spinner unit is provided with a spinner table which holds a plate-shaped workpie... |
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|
Invention
|
Method and apparatus for processing a single crystal blank.
The disclosed method is for processi... |
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|
Invention
|
Cleaning tool and workpiece processing method.
There is provided a cleaning tool which is used i... |
|
|
Invention
|
Grinding method for slice wafer.
A wafer grinding method includes a step of forming a protective... |
|
|
Invention
|
Manufacturing method of substrate.
In the state in which a laser beam is split in such a manner ... |
|
|
Invention
|
Device wafer processing method and processing apparatus.
A device wafer processing method includ... |
|
|
Invention
|
Diamond substrate manufacturing method.
A diamond substrate manufacturing method includes a foca... |
|
|
Invention
|
Device wafer processing method.
A device wafer processing method includes a protective film coat... |
|
2022
|
Invention
|
Method of processing a wafer. Edge trimming is performed on a wafer while a cleaning liquid is su... |
|
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G/S
|
Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin... |
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|
G/S
|
Chemical agents; industrial chemicals. |
|
|
G/S
|
Dressing tools for diamond blades. |
|
2021
|
G/S
|
Machine part, namely, dressing apparatus for diamond blades |
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|
G/S
|
Dressing apparatus for diamond blades. |
|
|
G/S
|
Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork... |
|
|
G/S
|
Power-operated semiconductor grinder |
|
2020
|
G/S
|
Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines... |
|
|
G/S
|
Semiconductor manufacturing machines and systems;
metalworking machines and tools; loading-unloa... |
|
|
G/S
|
Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se... |
|
|
G/S
|
Liquid chemical agents for forming protective films on surfaces of semiconductor wafers |
|
|
G/S
|
Liquid chemical agents for forming protective films on
surfaces of semiconductor wafers; other c... |
|
|
G/S
|
Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch... |
|
2019
|
G/S
|
Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ... |
|
2018
|
G/S
|
Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while anot... |
|
2017
|
G/S
|
Metalworking machines in the nature of cutting machines, grinding machines, and drilling machines... |
|
|
G/S
|
Semiconductor wafer processing machines, namely, machines for stretching a plastic film to which ... |
|
2016
|
G/S
|
Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines ... |
|
|
G/S
|
Metalworking machines and tools; semiconductor manufacturing machines and systems; laser processi... |
|
|
G/S
|
Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines,... |
|
2015
|
G/S
|
Cartridges including ion-exchange resins for deionizing water so as to produce purified water. |
|
2008
|
G/S
|
Power-operated grinding wheels for grinding the surfaces of semiconductor wafers |
|
2007
|
G/S
|
Filter cartridges for coolant used in cutting machines, grinding machines and other metalworking ... |
|
2006
|
G/S
|
Water-soluble chemical additives for reducing contamination adhesion during dicing of semiconduct... |
|
2004
|
G/S
|
Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor... |
|
|
G/S
|
cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor... |
|
|
G/S
|
Cutting machines, grinding machines, polishing machines,
metalworking machines utilizing laser b... |
|
|
G/S
|
Cutting machines, namely, dicing saws, and wafer dicing saws; grinding machines, namely, surface ... |
