Ningbo Semiconductor International Corporation (Shanghai Branch)

China

 
Total IP 155
Total IP Rank # 8,138
IP Activity Score 3/5.0    193
IP Activity Rank # 3,577

Patents

Trademarks

21 0
0 0
134 0
0
 
Last Patent 2023 - Film bulk acoustic resonator and...
First Patent 2018 - Wafer level system packaging met...

Latest Inventions, Goods, Services

2022 Invention Method for manufacturing semiconductor-on-insulator structure. The present invention relates to a...
Invention Mems device and manufacturing method therefor. An MEMS device and a manufacturing method therefor...
Invention Wafer-level system packaging method and wafer-level system packaging structure. The present inven...
Invention Wafer-level package system-in-package structure and packaging method. Disclosed are a wafer-level...
Invention Wafer-level system packaging structure and packaging method. Provided in the present invention ar...
Invention Wafer-level packaging structure and manufacturing method therefor. The present invention provides...
2021 Invention Mems device and method for fabrication thereof. Provided are a micro-electro-mechanical system (M...
Invention Board-level system-level packaging method and structure, and circuit board and forming method. A ...
Invention Thin-film piezoelectric acoustic resonator. Disclosed is a thin-film piezoelectric acoustic reson...
Invention Thin-film surface acoustic wave resonator and manufacturing method therefor. The present inventio...
Invention Film bulk acoustic resonator and manufacturing method therefor, and filter. The present invention...
Invention Semiconductor substrate and manufacturing method therefor, and semiconductor device structure and...
Invention Bulk acoustic wave resonator, filter and radio frequency communication system. A bulk acoustic w...
Invention Method for manufacturing film bulk acoustic resonator, and filter. The present invention relates ...
Invention Method for manufacturing thin-film bulk acoustic resonator. Disclosed is a method for manufacturi...
Invention Manufacturing method for thin film bulk acoustic wave resonator. Disclosed in the present inventi...
Invention Thin-film bulk acoustic wave resonator and method for manufacture thereof and filter. Disclosed a...
Invention Radio frequency semiconductor device structure and manufacturing method therefor. The present inv...
Invention Film bulk acoustic resonator, manufacturing method therefor and filter thereof. The present inven...
Invention Surface acoustic wave resonator and production method therefor. A surface acoustic wave resonator...
Invention Wafer-level packaging method. A wafer-level packaging method. The method comprises: providing a f...
Invention Wafer level packaging method and packaging structure. A wafer level packaging method and a packag...
Invention Wafer-grade packaging method and packaging structure. A water-grade packaging method and a packag...
Invention Wafer level packaging method and package structure of mems device. A wafer level packaging method...
Invention Thin-film bulk acoustic wave resonator and manufacturing method therefor. The present invention r...
Invention Film bulk acoustic resonator and manufacturing method therefor. The present invention relates to ...
Invention Method for manufacturing semiconductor-on-insulator structure. Provided is a method for manufactu...
2020 Invention Moving mechanism and forming method and driving method therefor, electronic device, and imaging a...
Invention Film bulk acoustic resonator and fabrication method thereof. A film bulk acoustic resonator and ...
2019 Invention Integration method and integration structure for control circuit and acoustic wave filter. The p...
Invention Integration method and integration structure for control circuit and bulk acoustic wave filter. ...
Invention Integration method and integration structure for control circuit and surface acoustic wave filter...
Invention Integrated structure of crystal resonator and control circuit and integration method therefor. A...
Invention Mems package structure and method for manufacturing same. A MEMS package structure and a method ...
Invention Mems encapsulation structure and manufacturing method thereof. A micro-electro-mechanical system...
Invention Mems packaging structure and manufacturing method therefor. a) through a bonding layer (500). The...
Invention Mems package structure and manufacturing method therefor. A micro-electro-mechanical system (MEM...
Invention Integration structure of crystal osciliator and control circuit and integration method therefor. ...
Invention Crystal resonator, and integrated structure of control circuit and integration method therefor. ...
Invention Integrated structure of and integrated method for crystal resonator and control circuit. A struc...
Invention Integrating structure for crystal resonator and control circuit, and integrating method therefor....
Invention Mems packaging structure and fabrication method therefor. A micro-electro-mechanical system (MEM...