Namics Corporation

Japan


 
Total IP 392
Total IP incl. subs 398 (+ 6 for subs)
Total IP Rank # 3,165
IP Activity Score 3.2/5.0    274
IP Activity Rank # 2,590
Dominant Nice Class Rubber and plastic; packing and ...

Patents

Trademarks

92 17
0 3
263 11
6
 
Last Patent 2024 - Epoxy resin composition, semicon...
First Patent 1996 - Conductive adhesive and circuit ...
Last Trademark 2021 - KINOMEC
First Trademark 1998 - NAMICS

Subsidiaries

1 subsidiaries with IP (6 patents, 0 trademarks)

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2023 Invention Resin composition, cured product, camera module, and electronic device. The purpose of the presen...
Invention Electroconductive paste, electrode, electronic component, and electronic appliance. An electrocon...
Invention Conductive composition, sintered compact thereof, laminated structure, electronic part, and semic...
Invention Resin composition, cured product of resin composition, semiconductor device, and electronic compo...
Invention Resin composition, cured product in which resin composition is used, prepreg, printed wiring boar...
Invention Conductive paste, electrode, electronic component, and electronic device. Provided is a conductiv...
Invention Resin composition, adhesive film, bonding sheet for interlayer adhesion, and resin composition fo...
Invention Conductive resin composition, electromagnetic wave shield layer, and electronic component. ITIT f...
Invention Epoxy resin composition, semiconductor device, and method for producing semiconductor device. Pro...
Invention Epoxy resin composition, semiconductor device, and method for producing semiconductor device. The...
Invention Electroconductive paste, electric circuit, flexible electric circuit object, and method for produ...
Invention Conductive paste, electrode, electronic component, and electronic device. This conductive paste c...
Invention Electrically conductive paste, solar cell, and method for manufacturing solar cell. GFGFGF of the...
Invention Resin composition, adhesive, encapsulation material, cured object, semiconductor device, and elec...
Invention Resin composition, adhesive agent, encapsulant, cured product, semiconductor device, and electron...
Invention Resin composition, adhesive, sealing material, cured product, semiconductor device and electronic...
Invention Resin composition, adhesive or encapsulation material, cured object, semiconductor device, and el...
Invention Resin composition, adhesive, sealing material, cured product, semiconductor device, and electroni...
Invention Curable resin composition, adhesive, cured product, camera module, and electronic device. The pur...
Invention Resin composition and curable resin composition using same. The purpose of the present invention ...
Invention Liquid polymerizable composition and curable resin composition using same. One purpose of the pre...
Invention Conductive composition, conductive paste, cured product and solar cell. The present invention pro...
2022 Invention Metal member. The purpose of the present invention is to provide a novel metal member. According ...
Invention Composite copper member and power module including composite copper member. The purpose of the pr...
Invention Curable resin composition. The present invention provides a curable resin composition that yields...
Invention Resin composition, semiconductor device, and methods for producing same. thth for the fatigue cra...
Invention Resin composition, semiconductor device, and method for producing semiconductor device. Provided ...
Invention Method for ejecting resin composition, method for producing electronic component, and electronic ...
Invention Resin composition for jet dispensing, adhesive for electronic component, cured products thereof, ...
Invention Resin composition, adhesive for electronic component, cured products of these, and electronic com...
Invention Epoxy resin composition. The present invention provides: an epoxy composition configured for redu...
Invention Resin composition, adhesive film, bonding sheet for interlayer bonding, resin composition for sem...
Invention Epoxy resin composition. A problem addressed by the present invention is to provide a resin compo...
Invention Resin composition, and printed wiring board, cured product, prepreg, and electronic component for...
Invention Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor d...
Invention Liquid sealing agent, electronic component and method for producing same, and semiconductor devic...
Invention Liquid compression molding material, electronic component, semiconductor device and method for pr...
2021 Invention Alumina composite sol composition, method for producing the same, and method for producing an alu...
Invention Base-releasing composition and curable resin composition using the same. A base-releasing compos...
Invention Stretchable conductive paste and film. A conductive paste that can reduce an increase in electric...
G/S Chemicals; industrial chemicals; soldering pastes (chemicals); chemicals in paste form used in m...
G/S Industrial chemicals; chemicals in paste form used in manufacturing electronic circuits; chemical...
Invention Photosensitive resin composition, cured product thereof, and wiring structure containing cured pr...
Invention Conductive composition, die attachment material, pressure-sintered die attachment material, and e...
Invention Liquid compression molding material. A method for producing a semiconductor element by wafer-lev...
Invention Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive and cured arti...
Invention Photocurable resin composition. An object of the present invention is to provide a photocurable ...
Invention Low-voltage varistor, circuit board, semiconductor component package, and interposer. A low-volt...
2020 Invention Composite copper components. The present invention is directed to provide novel composite copper...
Invention Polymerizable composition and curable resin composition using same. A polymerizable composition ...
Invention Curing catalyst, resin composition, sealing material, adhesive and cured product. An object of t...
2012 G/S Chemicals for use in the copper industry, namely, surface preparation agents for copper foil used...
G/S Surface preparation agents for copper foil used for manufacturing copper clad laminates; surface...
G/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive adhesives for i...
2011 G/S Electric conductors, namely, conductive pastes for industrial purposes; electric conductors, name...
G/S Chemicals for use in industry; industrial chemicals; adhesives for industrial purposes; industria...
G/S Insulating liquid sealants, namely underfill sealants, encapsulant sealants, chip resistor protec...
G/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive pastes for indus...
2005 G/S Adhesives for semiconductors; adhesives, other than for stationery or household purposes Electric...
G/S Adhesives for semiconductors; adhesives (not for stationery or household purposes). Conductive t...
G/S Conductive pastes for use with electronic components. Conductive paste for use with electronic co...
G/S Conductive pastes for use with electronic components. Conductive films, tapes and sheets, namely,...
G/S Conductive pastes for use in the manufacture of electronic components, namely, chip resisters, ch...
G/S Conductive pastes.
G/S Conductive pastes for use in the electrodes and circuits of various electronic parts and the inte...
G/S Conductive substances (chemicals); conductive materials (chemicals); chemical preparations having...
2004 G/S Paints for use in protecting the surfaces of electric and electronic parts
G/S Paints [ Precious metals ]
G/S Paints. Electrical insulating materials.
G/S Electrical insulating materials
G/S Paints Electrical insulating materials
G/S Paints. Precious metals.
2001 G/S Insulating paints for use in the manufacture of electrical components; insulating and protective ...
G/S Insulating paints; insulating and protective coating for semi-conductor; wire insulating tube; el...
2000 G/S EPOXY COMPOUNDS FOR UNDERFILLING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; EPOXY [ AND ...
G/S Electric insulating materials.
1998 G/S ADHESIVES AND CONDUCTIVE PASTES AND POWDERS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVIC...
G/S Paints, pastes and powders for industrial purposes, especially epoxy/phenolic resin coating mater...