INTEGRATED CIRCUIT ASSEMBLIES WITH STACKED COMPUTE LOGIC AND MEMORY DIES

Abrégé

Integrated circuit (IC) assemblies with stacked compute logic and memory dies, and associated systems and methods, are disclosed. One example IC assembly includes a compute logic die and a stack of memory dies provided above and coupled to the compute logic die, where one or more of the memory dies closest to the compute logic die include memory cells with transistors that are thin-film transistors (TFTs), while one or more of the memory dies further away from the compute logic die include memory cells with non-TFT transistors. Another example IC assembly includes a similar stack of compute logic die and memory dies where one or more of the memory dies closest to the compute logic die include static random-access memory (SRAM) cells, while one or more of the memory dies further away from the compute logic die include memory cells of other memory types.

Classes IPC  ?

• H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
• H01L 29/786 - Thin-film transistors
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices