Registre Brevet USPTO
Numéro d'application 17479871
Statut En instance
Date de dépôt 2021-09-20
Date de la première publication 2023-03-23
Date de publication 2023-03-23
Propriétaire Intel Corporation (USA)
  • Ibrahim, Tarek A.
  • Manepalli, Rahul N.
  • Agraharam, Sairam
  • Sun, Xiaoxuan


An electronic device and associated methods are disclosed. In one example, the electronic device includes a semiconductor device. In selected examples, the semiconductor device may include two semiconductor dies, a redistribution layer, an interconnect bridge coupled between the two semiconductor dies and located vertically between the two semiconductor dies and the redistribution layer, and a metallic connection passing through the redistribution layer and coupled to one or more of the two semiconductor dies in a solder-free connection.

Classes IPC  ?

  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups