THERMAL MANAGEMENT SYSTEMS HAVING PRESTRESSED BIASING ELEMENTS AND RELATED METHODS
| Registre | Brevet USPTO |
|---|---|
| Numéro d'application | 17710822 |
| Statut | En instance |
| Date de dépôt | 2022-03-31 |
| Date de la première publication | 2023-01-26 |
| Date de publication | 2023-01-26 |
| Propriétaire | The Intel Corporation (USA) |
| Inventeur(s) |
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Abrégé
Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.