Registre Brevet USPTO
Numéro d'application 17826674
Statut En instance
Date de dépôt 2022-05-27
Date de la première publication 2023-01-26
Date de publication 2023-01-26
Propriétaire Intel Corporation (USA)
  • Koker, Altug
  • Akhbari, Farshad
  • Chen, Feng
  • Kim, Dukhwan
  • Srinivasa, Narayan
  • Satish, Nadathur Rajagopalan
  • Ma, Liwei
  • Bottleson, Jeremy
  • Nurvitadhi, Eriko
  • Ray, Joydeep
  • Tang, Ping T.
  • Strickland, Michael S.
  • Chen, Xiaoming
  • Shpeisman, Tatiana
  • Appu, Abhishek R.


An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.

Classes IPC  ?

  • G06F 15/80 - Architectures of general purpose stored program computers comprising an array of processing units with common control, e.g. single instruction multiple data processors
  • G06F 13/40 - Bus structure
  • G06T 1/20 - Processor architectures; Processor configuration, e.g. pipelining
  • G06F 9/30 - Arrangements for executing machine instructions, e.g. instruction decode
  • G06F 13/00 - Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
  • G06N 3/04 - Architecture, e.g. interconnection topology
  • G06N 3/063 - Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
  • G06N 3/08 - Learning methods