MODULAR VAPOR CHAMBER AND CONNECTION OF SEGMENTS OF MODULAR VAPOR CHAMBER
| Registre | Brevet USPTO |
|---|---|
| Numéro d'application | 17955205 |
| Statut | En instance |
| Date de dépôt | 2022-09-28 |
| Date de la première publication | 2023-01-19 |
| Date de publication | 2023-01-19 |
| Propriétaire | Intel Corporation (USA) |
| Inventeur(s) |
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Abrégé
Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.