METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK

Registre Brevet USPTO
Numéro d'application 17955210
Statut En instance
Date de dépôt 2022-09-28
Date de la première publication 2023-01-19
Date de publication 2023-01-19
Propriétaire Intel Corporation (USA)
Inventeur(s)
  • Geng, Phil
  • Johnson, Jordan
  • Liu, Mengqi
  • Miele, Ralph
  • Pei, Min

Abrégé

Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.

Classes IPC  ?

  • H01R 12/70 - Coupling devices
  • H01R 12/82 - Coupling devices connected with low or zero insertion force
  • H01R 43/26 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
  • H05K 7/14 - Mounting supporting structure in casing or on frame or rack