Registre Brevet USPTO
Numéro d'application 17956486
Statut En instance
Date de dépôt 2022-09-29
Date de la première publication 2023-01-19
Date de publication 2023-01-19
Propriétaire Intel Corporation (USA)
  • Han, Dong-Ho
  • Subramanya, Bala
  • Govind, Greeshmaja
  • E, Sun Ye
  • Koh, Boon Ping
  • Paavola, Juha
  • Stevens, Kerry
  • Delaplane, Neil
  • Wee, Quek Liang


Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.

Classes IPC  ?

  • H01L 23/552 - Protection against radiation, e.g. light
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
  • H01L 23/367 - Cooling facilitated by shape of device
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups