BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PRINTED CIRCUIT BOARDS AND ASSOCIATED METHODS
|Date de dépôt||2022-09-29|
|Date de la première publication||2023-01-26|
|Date de publication||2023-01-26|
|Propriétaire||Intel Corporation (USA)|
AbrégéBack plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.