BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PRINTED CIRCUIT BOARDS AND ASSOCIATED METHODS
| Registre | Brevet USPTO |
|---|---|
| Numéro d'application | 17956540 |
| Statut | En instance |
| Date de dépôt | 2022-09-29 |
| Date de la première publication | 2023-01-26 |
| Date de publication | 2023-01-26 |
| Propriétaire | Intel Corporation (USA) |
| Inventeur(s) |
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Abrégé
Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.