METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES

Registre	Brevet USPTO
Numéro d'application	17956612
Statut	En instance
Date de dépôt	2022-09-29
Date de la première publication	2023-01-26
Date de publication	2023-01-26
Propriétaire	Intel Corporation (USA)
Inventeur(s)	Ramirez Macias, Andres Buddrius, Eric Smalley, Jeffory Gonzalez Lenero, Fernando Colorado Alonso, Francisco Javier Elias Flores, Fatima Laido, Rolf

Abrégé

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

Classes IPC ?

H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H05K 7/10 - Plug-in assemblages of components
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating