METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES
|Date de dépôt||2022-09-29|
|Date de la première publication||2023-01-26|
|Date de publication||2023-01-26|
|Propriétaire||Intel Corporation (USA)|
AbrégéMethods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.
Classes IPC ?
- H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
- H05K 7/10 - Plug-in assemblages of components
- H05K 7/14 - Mounting supporting structure in casing or on frame or rack
- H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating