GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION

Registre Brevet USPTO
Numéro d'application 17956766
Statut En instance
Date de dépôt 2022-09-29
Date de la première publication 2023-01-19
Date de publication 2023-01-19
Propriétaire Intel Corporation (USA)
Inventeur(s)
  • Qian, Zhiguo
  • Aygun, Kemal
  • Zhang, Yu

Abrégé

Embodiments of the present disclosure are directed towards techniques and configurations for ground via clustering for crosstalk mitigation in integrated circuit (IC) assemblies. In some embodiments, an IC package assembly may include a first package substrate configured to route input/output (I/O) signals and ground between a die and a second package substrate. The first package substrate may include a plurality of contacts disposed on one side of the first package substrate and at least two ground vias of a same layer of vias, and the at least two ground vias may form a cluster of ground vias electrically coupled with an individual contact. Other embodiments may be described and/or claimed.

Classes IPC  ?