MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
|Date de dépôt||2022-09-29|
|Date de la première publication||2023-01-19|
|Date de publication||2023-01-19|
|Propriétaire||Intel Corporation (USA)|
AbrégéMicroelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
Classes IPC ?
- H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
- H01L 23/498 - Leads on insulating substrates
- H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices