The present disclosure provides a method of fabricating a sensor assembly in which a sensor surface has an anchor species provided thereon, the anchor species having a first functional group attached. The method further comprises disposing a fluid channel over the surface and subsequently providing an analyte capture species to the fluid channel. The analyte capture species comprises a second functional group configured to react with the first functional group. The surface is then exposed to photo radiation and the first and second functional groups react forming a link between the analyte capture species and the anchor species on the sensing surface.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
B01L 3/00 - Récipients ou ustensiles pour laboratoires, p.ex. verrerie de laboratoire; Compte-gouttes
2.
MULTI-MODAL FAR FIELD USER INTERFACES AND VISION-ASSISTED AUDIO PROCESSING
Far field devices typically rely on audio only for enabling user interaction and involve only audio processing. Adding a vision-based modality can greatly improve the user interface of far field devices to make them more natural to the user. For instance, users can look at the device to interact with it rather than having to repeatedly utter a wakeword. Vision can also be used to assist audio processing, such as to improve the beamformer. For instance, vision can be used for direction of arrival estimation. Combining vision and audio can greatly enhance the user interface and performance of far field devices.
The present disclosure provides a method of fabricating a sensor assembly in which a sensor surface has an anchor species provided thereon, the anchor species having a first functional group attached. The method further comprises disposing a fluid channel over the surface and subsequently providing an analyte capture species to the fluid channel. The analyte capture species comprises a second functional group configured to react with the first functional group. The surface is then exposed to photo radiation and the first and second functional groups react forming a link between the analyte capture species and the anchor species on the sensing surface.
G01N 33/543 - Tests immunologiques; Tests faisant intervenir la formation de liaisons biospécifiques; Matériaux à cet effet avec un support insoluble pour l'immobilisation de composés immunochimiques
4.
TARGET CAPTURE AND SENSOR ASSEMBLY FABRICATION METHOD AND TARGET CAPTURE AND SENSOR ASSEMBLY
The present disclosure provides a method of fabricating a target capture and sensor assembly. The method comprises the steps of: providing a fluid path with a target capture surface comprising an anchor species with a first functional group disposed thereon; providing a target capture species to the target capture surface of the fluid path, wherein each target capture species comprises a target capture part and a second functional group configured to react with the first functional group; and exposing at least a portion of the target capture surface of the fluid path to photo radiation so as to cause a photo-initiated reaction between the first functional group and the second functional group, wherein the target capture and sensor assembly further comprises a sensing surface in the fluid path and wherein the target capture surface and the sensing surface are in fluid communication with one another.
G01N 33/543 - Tests immunologiques; Tests faisant intervenir la formation de liaisons biospécifiques; Matériaux à cet effet avec un support insoluble pour l'immobilisation de composés immunochimiques
Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.
H01L 23/498 - Connexions électriques sur des substrats isolants
G01R 31/28 - Test de circuits électroniques, p.ex. à l'aide d'un traceur de signaux
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
6.
COMPOUND SEMICONDUCTOR DEVICES WITH A CONDUCTIVE COMPONENT TO CONTROL ELECTRICAL CHARACTERISTICS
Integrated circuits can include compound semiconductor devices having conductive components that control electrical characteristics of the compound semiconductor devices. In one or more examples, one or more conductive components can be located to increase the concentration of electrons in relation to a source electrical contact or a drain electrical contact. In one or more additional examples, a conductive component can be located to reduce the concentration of electrons in relation to a gate electrical contact. The compound semiconductor devices can include a number of compound semiconductor layers that include one or more materials having at least one Group 13 element and at least one Group 15 element.
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 29/66 - Types de dispositifs semi-conducteurs
7.
TARGET CAPTURE AND SENSOR ASSEMBLY FABRICATION METHOD AND TARGET CAPTURE AND SENSOR ASSEMBLY
The present disclosure provides a method of fabricating a target capture and sensor assembly. The method comprises the steps of: providing a fluid path with a target capture surface comprising an anchor species with a first functional group disposed thereon; providing a target capture species to the target capture surface of the fluid path, wherein each target capture species comprises a target capture part and a second functional group configured to react with the first functional group; and exposing at least a portion of the target capture surface of the fluid path to photo radiation so as to cause a photo-initiated reaction between the first functional group and the second functional group, wherein the target capture and sensor assembly further comprises a sensing surface in the fluid path and wherein the target capture surface and the sensing surface are in fluid communication with one another.
G01N 33/543 - Tests immunologiques; Tests faisant intervenir la formation de liaisons biospécifiques; Matériaux à cet effet avec un support insoluble pour l'immobilisation de composés immunochimiques
G01N 33/531 - Production de matériaux de tests immunochimiques
8.
METHODS AND SYSTEMS FOR OPERATING A SENSOR NETWORK
Aspects of the present disclosure include a detection system including a base device including a power source configured to provide electrical energy to a plurality of edge nodes of a sensor network and a base data link configured to transmit a sensor interrogation signal to at least one of the plurality of edge nodes in the detection system and receive reporting information from at least one of the plurality of edge nodes, and the plurality of edge nodes sequentially coupled within the sensor network, wherein each edge node includes an edge data link configured to receive at least a portion of the electrical energy and the sensor interrogation signal, relay the at least a portion of the electrical energy and the sensor interrogation signal to a next edge node of the plurality of edge nodes, and transmit to the base device, in response to the sensor interrogation signal, the reporting information including sensor information associated with the edge node or a no selection match indication.
H04L 67/12 - Protocoles spécialement adaptés aux environnements propriétaires ou de mise en réseau pour un usage spécial, p.ex. les réseaux médicaux, les réseaux de capteurs, les réseaux dans les véhicules ou les réseaux de mesure à distance
H04L 41/0654 - Gestion des fautes, des événements, des alarmes ou des notifications en utilisant la reprise sur incident de réseau
H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
9.
FULLY COMPENSATED OPTICAL GAS SENSING SYSTEM AND APPARATUS
System and apparatus for robust, portable gas detection. Specifically, this disclosure describes apparatuses and systems for optical gas detection in a compact package using two optical pathways. There is a need for a very compact, low-power, gas detection system for gases such as CO2, NOx, water vapor, methane, etc. This disclosure provides an ultra-compact and highly stable and efficient optical measurement system based on principals of optical absorption spectroscopy using substantially collinear pathways.
G01N 21/3504 - Couleur; Propriétés spectrales, c. à d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p.ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse des gaz, p.ex. analyse de mélanges de gaz
G01N 21/01 - Dispositions ou appareils pour faciliter la recherche optique
Digital isolators operable in multiple power modes are described. The digital isolators include a low power mode, in which some circuitry of the isolator operates in a lower power state than in other mode(s) of operation or may be deactivated, and in which data communication across the isolator is not permitted. The isolator may wake from the low power mode in response to a detected event or may periodically wake. Circuitry on one side of the isolator may dictate when and how the isolator wakes from a lower power mode.
A multi-phase regulator circuit includes one or more switching converter circuits. Each switching converter circuit includes a transformer including a primary winding and a multi-segment secondary winding, a primary side switch circuit configured to connect the primary winding to an input of the multi-phase regulator circuit, and multiple secondary side circuits including multiple coupled-inductor circuits. Each coupled-inductor circuit includes a first winding magnetically coupled to a second winding. Each segment of the transformer multi-segment secondary winding is operatively coupled to the first winding of a coupled-inductor circuit and each of the first windings is connected to an output of the multi-phase regulator circuit.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/14 - Dispositions de réduction des ondulations d'une entrée ou d'une sortie en courant continu
12.
Method of Providing Interference Reduction and a Dynamic Region of Interest in a LIDAR System
A system and method for providing a dynamic region of interest in a lidar system can include scanning a light beam over a field of view to capture a first lidar image, identifying a first object within the captured first lidar image, selecting a first region of interest within the field of view that contains at least a portion of the identified first object, and capturing a second lidar image, where capturing the second lidar image includes scanning the light beam over the first region of interest at a first spatial sampling resolution, and scanning the light beam over the field of view outside of the first region of interest at a second spatial sampling resolution, wherein the second sampling resolution is different the first spatial sampling resolution.
G01S 7/483 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe - Détails de systèmes à impulsions
G01S 7/481 - Caractéristiques de structure, p.ex. agencements d'éléments optiques
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G01S 17/931 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour prévenir les collisions de véhicules terrestres
13.
SELF-ALIGNED SILICIDE GATE FOR DISCRETE SHIELDED-GATE TRENCH POWER MOSFET
Apparatus and methods for shielded-gate trench power MOSFETs are disclosed herein. The power MOSFETs are fabricated using a self-aligned gate poly silicide to achieve low gate resistance. Accordingly, the power MOSFETs can be used in high speed applications operating with fast transistor switching speeds. Moreover, the self-aligned gate poly silicide processing can be achieved in relatively few processing steps, and thus can avoid the cost and/or complexity associated with conventional silicidation techniques for trench power MOSFETs. In particular, silicidation can include applying a silicide that is self-aligned to a gate oxide without an additional mask.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 21/285 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un gaz ou d'une vapeur, p.ex. condensation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
14.
METHODS AND APPARATUS FOR DIGITAL DATA COMMUNICATION WITH BUS POWER OVER INTERCONNECTS
Aspects of the present disclosure include methods and systems for transmitting digital information including generating digital information, converting the digital information to two or more transmission signals, outputting each of the two or more transmission signals onto a respective wire of two wires of a cable for at least a first slave node, and outputting a supply current via the two wires for at least the first slave node.
The present subject matter relates to active balun circuits. An active balun circuit includes a plurality of transistors; an output transmission line connected to output terminals of the transistors; an input transmission line; and a plurality of serial capacitors coupled to an input terminal of the transistors and the input transmission line.
H03D 7/12 - Transfert de modulation d'une porteuse à une autre, p.ex. changement de fréquence au moyen de dispositifs à semi-conducteurs ayant plus de deux électrodes
16.
METHODS AND APPARATUS FOR DIGITAL DATA COMMUNICATION WITH BUS POWER OVER INTERCONNECTS
Aspects of the present disclosure include methods and systems for transmitting digital information including generating digital information, converting the digital information to two or more transmission signals, outputting each of the two or more transmission signals onto a respective wire of two wires of a cable for at least a first slave node, and outputting a supply current via the two wires for at least the first slave node.
A contact pin printhead for microfluidic array spot printing can include a printhead chassis with a plurality of micro-pins insertable within respective sockets in the printhead chassis. An individual micro-pin can include a micro-pin tip that can be individually biased in a distal direction toward a target substrate via an elastic mechanical biaser associated with the micro-pin. An individual micro-pin can deposit fluid carried within a cavity therein and onto a target substrate during physical contact therewith at a micro-pin tip. Also, an individual micro-pin can retain fluid carried within the cavity, without depositing, absent physical contact at the micro-pin tip.
A system for gas sensing of a biological specimen can include a chamber, such as to receive the biological specimen therewithin. The system can also include a gas sensing unit to be coupled to the chamber and separated therefrom by a moveable separator. A gas sensor included in the gas sensing unit can be selectively exposed to a fluid headspace of the first chamber, such as a gas environment associated with the biological specimen, upon modification or moving of a separator.
An incubation system for gas detection of a biological specimen can include a gas or optical sensor. The sensor can be arranged to be placed in communication with at least one biological specimen vessel for generating an electrical response signal indicating a chemical characteristic associated with the specimen. The specimen can be incubated in a temperature-controlled chamber, such as within a shelf defining a plurality of receptacles. Processing circuitry can be included or used such as to place the sensor and at least one biological specimen vessel in communication with each other.
C12M 1/00 - Appareillage pour l'enzymologie ou la microbiologie
C12M 1/34 - Mesure ou test par des moyens de mesure ou de détection des conditions du milieu, p.ex. par des compteurs de colonies
C12M 1/36 - Appareillage pour l'enzymologie ou la microbiologie comportant une commande sensible au temps ou aux conditions du milieu, p.ex. fermenteurs commandés automatiquement
C12M 1/02 - Appareillage pour l'enzymologie ou la microbiologie avec des moyens d'échange de chaleur
Aspects of the present disclosure include a scalable proportional to absolute temperature (PTAT) hybrid circuit, comprising a bias mirror circuit configured to provide a zero temperature coefficient (ZTC) current, a PTAT control circuit configured to generate, based on the ZTC current, a PTAT current with a slope having a non-zero value, alter the PTAT current by at least scaling the PTAT current or changing the slope of the PTAT current to generate an altered PTAT current, and provide the altered PTAT current, a hybrid circuit configured to receive the ZTC current and the altered PTAT current, and output a larger current of the ZTC current and the altered PTAT current as a hybrid current.
G05F 1/567 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final sensible à une condition du système ou de sa charge en plus des moyens sensibles aux écarts de la sortie du système, p.ex. courant, tension, facteur de puissance pour compensation de température
A contact pin printhead for microfluidic array spot printing can include a printhead chassis with a plurality of micro-pins insertable within respective sockets in the printhead chassis. An individual micro-pin can include a micro-pin tip that can be individually biased in a distal direction toward a target substrate via an elastic mechanical biaser associated with the micro-pin. An individual micro-pin can deposit fluid earned within a cavity therein and onto a target substrate during physical contact therewith at a micro-pin tip. Also, an individual micro-pin can retain fluid carried within the cavity, without depositing, absent physical contact at the micro-pin tip.
A system for gas sensing of a biological specimen can include a chamber, such as to receive the biological specimen therewithin. The system can also include a gas sensing unit to be coupled to the chamber and separated therefrom by a moveable separator. A gas sensor included in the gas sensing unit can be selectively exposed to a fluid headspace of the first chamber, such as a gas environment associated with the biological specimen, upon modification or moving of a separator.
Systems, devices, and methods related to wireless battery management system (wBMS) are provided. For example, a wBMS network manager comprises a memory to store a list of hardware identifiers (IDs), wherein each hardware ID in the list is associated with a respective one of a plurality of battery modules; and mapped, based on a predetermined mapping, to a different one of a plurality of source IDs; an interface to receive, from a remote battery module, a packet including a source ID and a hardware ID associated with the remote battery module; and one or more processing units to search, using the source ID in the received packet and the predetermined mapping, for a first hardware ID from the list of hardware IDs; and authenticating the remote battery module based on a comparison of the hardware ID in the received packet to the first hardware ID from the list.
B60L 50/64 - Propulsion électrique par source d'énergie intérieure au véhicule utilisant de la puissance de propulsion fournie par des batteries ou des piles à combustible utilisant de l'énergie fournie par des batteries - Détails de construction des batteries spécialement adaptées aux véhicules électriques
A target gas composition, such as within ambient gas in an environment, can be detected using a gas chemical detector. A functionalized region of the gas chemical detector can be exposed to the ambient gas. The functionalized region can include an optical property indicative of the target gas composition. An optical response signal can be generated based on the optical property and indicative of the target gas composition within the ambient gas in the environment using the functionalized region. An electrical property can be electrochemically transduced, the electrical property indicative of the target gas composition into an electrical response signal. Both the electrical and optical properties can be used together to determine a presence or other characteristic of a target gas in an ambient environment, such as can be produced by a bacteria or infectious agent of interest.
A target gas composition, such as within ambient gas in an environment, can be detected using a gas chemical detector (100). A functionalized region (110) of the gas chemical detector (100) can be exposed to the ambient gas. The functionalized region (110) can include an optical property indicative of the target gas composition. An optical response signal can be generated based on the optical property and indicative of the target gas composition within the ambient gas in the environment using the functionalized region (110). An electrical property can be electrochemically transduced, the electrical property indicative of the target gas composition into an electrical response signal. Both the electrical and optical properties can be used together to determine a presence or other characteristic of a target gas in an ambient environment, such as can be produced by a bacteria or infectious agent of interest.
G01N 21/25 - Couleur; Propriétés spectrales, c. à d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes
G01N 21/77 - Systèmes dans lesquels le matériau est soumis à une réaction chimique, le progrès ou le résultat de la réaction étant analysé en observant l'effet sur un réactif chimique
G01N 21/78 - Systèmes dans lesquels le matériau est soumis à une réaction chimique, le progrès ou le résultat de la réaction étant analysé en observant l'effet sur un réactif chimique produisant un changement de couleur
An incubation system for gas detection of a biological specimen includes an optical gas sensor. The sensor (210) is arranged to be placed in communication with a biological specimen vessel (215) for generating a response signal. The specimen is incubated in a temperature-controlled chamber (220), within a shelf (218) defining a plurality of receptacles (214). Processing circuitry (226) controls the placing of the sensor (210) and the vessel (215) in communication with each other.
C12M 1/34 - Mesure ou test par des moyens de mesure ou de détection des conditions du milieu, p.ex. par des compteurs de colonies
G01N 35/02 - Analyse automatique non limitée à des procédés ou à des matériaux spécifiés dans un seul des groupes ; Manipulation de matériaux à cet effet en utilisant une série de récipients à échantillons déplacés par un transporteur passant devant un ou plusieurs postes de traitement ou d'analyse
A fluid sensor cartridge that can be used to monitor composition of constituent materials or characteristics of a sample fluid or a patient's blood. The fluid sensor cartridge can be connected in-line with a medical device during a medical treatment. The fluid sensor cartridge can utilize one or more valves, one or more channels, and one or more reservoirs to enable sampling, sensing, and calibrating of a sample fluid or a patient's blood in one container with minimal amounts of sample/blood and calibration fluid.
Embodiments of the disclosure provide improved mismatch shaping for a digital to analog converter, the method including splitting an original input of a circuit into a plurality of time interleaved data streams; element rotation selection (ERS) logic to process the plurality of time interleaved data streams; and directing one of the plurality of time interleaved data streams to the ERS logic according to a decision of a data-weighted sigma-delta (SD) modulator. In other example implementations, the method can further include multiplexing one of the plurality of time interleaved data streams to be provided to a barrel shifter. In yet other examples, the method can include monitoring a difference between the plurality of time interleaved data streams as a basis for the directing such that a data sample rate for the digital to analog converter is reduced over a time interval.
A digital front end processor is proposed that includes a transmit channel and/or a receive channel. The digital front end processor may be a part of a multi-antenna wireless communication system or any other system including multiple data channels for which data output is to be in synchronization. The digital front end processor includes a data buffer to receive input data in synchronization with a first strobe signal and generate output data based in the input data. The digital front end processor is to synchronize the output data of transmit channels or receive channels of a plurality of digital front end processors based on a data delay applied to the input data.
Systems, devices, and methods related to wireless battery management system (wBMS) are provided. For example, a wBMS network manager comprises a memory to store a list of hardware identifiers (IDs), wherein each hardware ID in the list is associated with a respective one of a plurality of battery modules; and mapped, based on a predetermined mapping, to a different one of a plurality of source IDs; an interface to receive, from a remote battery module, a packet including a source ID and a hardware ID associated with the remote battery module; and one or more processing units to search, using the source ID in the received packet and the predetermined mapping, for a first hardware ID from the list of hardware IDs; and authenticating the remote battery module based on a comparison of the hardware ID in the received packet to the first hardware ID from the list.
Apparatus and methods for frequency compensation of amplifiers are provided herein. In certain embodiments, an amplifier includes an input transistor (which can be part of a differential input pair) electrically connected to a first node, a folded cascode transistor electrically connected between the first node and a second node, a current source electrically connected to a third node, a current source transistor electrically connected between the third node and the first node, a first output transistor having an input (for example, a gate) electrically connected to the second node and an output (for example, a drain) electrically connected to a fourth node, and a frequency compensation capacitor electrically connected between the fourth node and the third node.
H03F 1/14 - Modifications des amplificateurs pour réduire l'influence défavorable de l'impédance interne des éléments amplificateurs par utilisation de moyens de neutrodynage
H03F 1/22 - Modifications des amplificateurs pour réduire l'influence défavorable de l'impédance interne des éléments amplificateurs par utilisation de couplage dit "cascode", c. à d. étage avec cathode ou émetteur à la masse suivi d'un étage avec grille ou base à la masse respectivement
H03F 1/42 - Modifications des amplificateurs pour augmenter la bande passante
32.
TECHNIQUE FOR ESTIMATION OF INTERNAL BATTERY TEMPERATURE
One embodiment is a method for estimating an internal temperature of a battery, the method comprising obtaining multiple terminal impedance measurements, wherein each of the terminal impedance measurements is taken at a different one of a plurality of frequencies; determining model parameters for a multivariable polynomial regression model; and applying the multivariable polynomial regression model to the multiple terminal impedance measurements to estimate the internal temperature of the battery.
A network node device of an area network includes physical layer (PHY) circuitry configured to transmit and receive frames of data via a communication link of the communication network; medium access layer (MAC) circuitry; a receive interface between the PHY circuitry and the MAC circuitry, and timestamp circuitry. The receive interface includes a receive clock signal and a DLL. The timestamp circuitry is configured to produce multiple sample signals derived from the receive clock signal using the DLL and a local clock signal of the network node, and produce a timestamp offset using the multiple sample signals. The timestamp offset is representative of an instantaneous phase offset between a local clock of the network node and a local clock of a neighbor node of the network node.
A gyroscope includes a substrate, a proof mass coupled to the substrate and configured to move in direction of an X axis and in direction of a Y axis orthogonal to the first axis, an X axis shuttle to selectively drive the proof mass along the X axis as a drive axis or sense movement of the proof mass along the X axis as a sense axis in response to the proof mass driven along the Y axis as the drive axis, and a Y axis shuttle to selectively sense movement of the proof mass along the Y axis as a sense axis in response to the proof mass driven along the X axis or drive the proof mass along the Y axis as the drive axis. The X axis shuttle is symmetric to the Y axis shuttle along a diagonal axis that is diagonal to both the X axis and the Y axis. The X and Y axis shuttles have gaps designed for a predetermined DC voltage to generate spring softening (negative cubic nonlinearity) that is equal to spring hardening (positive cubic nonlinearity), ensuring linear motion at high amplitudes (⅓ of the capacitive gap).
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
35.
SYNCHRONOUS AUDIO COMMUNICATION AND BUS POWER OVER MULTI-PAIR CABLES AND CONNECTORS
In some examples of both networks and methods, a data communication network includes a plurality of nodes. The nodes include a main node (MN) and at least one sub node (SNi=SN0, . . . SNX). Each node includes a node transceiver. The node transceiver is operable to perform data communication in accordance with a first network protocol for power over data via a pair of conductors (e.g., the conductors of bus). A physical layer includes a cable segment (e.g., the cable segment of bus) between each node. Each cable segment includes a plurality of pairs of conductors (e.g., pairs) and a connector (e.g., 8P8C connector—though other connectors with multiple pairs of conductors can be used) at each end. A first pair of the conductors (e.g., connected to pin 4 and pin 5 of the 8P8C connector) implements the first network protocol between the nodes. One or more of the remaining pairs of the conductors provide supplemental power to the nodes 102.
A network includes nodes. The nodes include a main node (MN) and a plurality of sub nodes (SNi=SN0, . . . SNX). Each node includes a node transceiver that is operable to perform data communication in accordance with a first network protocol. Each node transceiver includes and a positive power contact (V+) and a negative power contact (V−) operable to power the node transceiver to perform the data communication. The data communication network includes a two conductor combined power and data physical layer/medium. The physical layer connects the SN0 V+ to a bus power source positive power contact (VS+) in a first conductive path. The physical layer connects the MN V− and SNX V− to the bus power source negative power contact (VS−) in a second conductive path. The physical layer connects each SNi V−, for i=0 to X−1, to the SNi+1 V+ in the first conductive path.
In some examples of networks and methods, a data network includes nodes. The nodes include a main node (MN) and at least one sub node. Each node includes a node transceiver. The node transceiver is operable to perform data communication in accordance with a first network protocol for power over data via a first pair of conductors. A physical layer includes a cable segment (e.g., the cable segment of bus) between each node. Each cable segment includes a plurality of pairs of conductors (e.g., pairs) and a connector (e.g., 8P8C connector- though other connectors with multiple pairs of conductors can be used) at each end. A first pair of the conductors (e.g., connected to pin 4 and pin 5 of the 8P8C connector) implements the first network protocol between the nodes. One or more of the remaining pairs of the conductors provide supplemental power to the nodes.
A fully symmetrical and balanced monolithic or multi-die integrated circuit transformer device is described. The device can comprise a first and second transformer. The first and second transformer can each comprise a symmetrical bottom coil including electrically conductive crossovers between individual windings of pairs of adjacent windings. Each of the bottom coils can further comprise a first, a second differential terminal, and a center tap third terminal electrically connected to the inner-most winding of the bottom coil. Each transformer can further comprise a spiral top coil electrically connected to an encompassed inner pad and a laterally offset outer pad, the top coil, inner pad, and outer pad including a shared electrically conductive integrated circuit layer. The respective top coils of each transformer can be overlaid and separated from the respective bottom coils by an electrically insulating dielectric layer.
Apparatus and methods for logarithmic current to voltage conversion are disclosed herein. In certain embodiments, a logarithmic current to voltage converter includes an input terminal that receives an input current, an output terminal that provides a logarithmic output voltage, a first field-effect transistor (FET) having a gate connected to the input terminal, a first bipolar transistor having a collector connected to the input terminal and an emitter connected to the output terminal, and a stacked transistor connected to the output terminal and to the first FET to form a feedback loop. For example, the stacked transistor can correspond to a second bipolar transistor having a collector connected to the output terminal and a base connected to the source of the first FET, or to a second FET having a drain connected to the output terminal and a gate connected to the source of the first FET.
G05F 1/59 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de réglage final pour une charge unique
G05F 1/46 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu
H01L 31/02 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails
Apparatus and methods for control and calibration of external oscillators are provided herein. In certain embodiments, an electronic oscillator system includes a semiconductor die and a controllable oscillator that is external to the semiconductor die. The oscillation frequency of the controllable oscillator is tuned by a first varactor and a second varactor. The semiconductor die includes a phase-locked loop (PLL) that provides fine tuning to the controllable oscillator by controlling the first varactor, and a calibration circuit that provides coarse tuning to the controllable oscillator by controlling the second varactor.
H03L 7/099 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase concernant principalement l'oscillateur commandé de la boucle
H03L 1/02 - Stabilisation du signal de sortie du générateur contre les variations de valeurs physiques, p.ex. de l'alimentation en énergie contre les variations de température uniquement
H03L 7/189 - Synthèse de fréquence indirecte, c. à d. production d'une fréquence désirée parmi un certain nombre de fréquences prédéterminées en utilisant une boucle verrouillée en fréquence ou en phase en utilisant un diviseur de fréquence ou un compteur dans la boucle une différence de temps étant utilisée pour verrouiller la boucle, le compteur entre des nombres fixes ou le diviseur de fréquence divisant par un nombre fixe utilisant des moyens pour accorder grossièrement l'oscillateur commandé en tension de la boucle utilisant un convertisseur numérique/analogique pour engendrer un accord grossier de tension
Processes for using a capacitive sensor to control drug delivery are described. The capacitive sensor measures a capacitance across a pair of electrodes arranged along either side of a container. The container includes an air chamber, a fluid chamber, and a stopper separating the air chamber from the fluid chamber. A volume of drug in the fluid chamber may be determined based on the measured capacitance. The volume is compared to a target volume, and if the volume in the fluid chamber is greater than the target volume, a stopper actuator expels a portion of the drug from the fluid chamber.
A61M 5/168 - Moyens pour commander l'écoulement des agents vers le corps ou pour doser les agents à introduire dans le corps, p.ex. compteurs de goutte-à-goutte
A61M 5/145 - Perfusion sous pression, p.ex. utilisant des pompes utilisant des réservoirs sous pression, p.ex. au moyen de pistons
A method of automatically detecting delay due to cable length between network nodes coupled to a two-wire communication bus of a network. The method includes establishing, by a first node of the network, a first specified delay value of a variable delay setting; discovering a next node on the communication bus using a variable delay setting including the delay setting established at the first specified delay value; after discovering the next node, changing the variable delay setting until the next node drops off the communication bus at a second specified delay value of the variable delay setting; and setting a communication delay setting between the first node and the next node using the first and second specified delay values.
Electrostatic discharge protection for high speed transceiver interface is disclosed. In one aspect, an electrical overstress (EOS) protection device includes an anode terminal and a cathode terminal, a silicon controlled rectifier, a second NPN bipolar transistor including a base connected to the anode terminal and an emitter connected to an emitter of the first PNP bipolar transistor, and a second PNP bipolar transistor including an emitter connected to an emitter of the second NPN bipolar transistor and a base connected to a base of the first PNP bipolar transistor. Two or more paths for current conduction are present during a positive overstress transient that increases a voltage of the anode terminal relative to the cathode terminal, including a first path through the silicon controlled rectifier and a second path through the second NPN bipolar transistor and the second PNP bipolar transistor.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
45.
NODE DISCOVERY AND CONFIGURATION IN A DAISY-CHAINED NETWORK
Disclosed herein are systems and techniques for node discovery and configuration in a daisy-chained network. For example, in some embodiments, a main node may “auto-discover” the topology and identity of sub nodes in a daisy-chained network so that changes in the topology may be readily adapted to without substantial interruptions in data transfer in the network.
H04L 41/12 - Découverte ou gestion des topologies de réseau
H04L 41/0816 - Réglages de configuration caractérisés par les conditions déclenchant un changement de paramètres la condition étant une adaptation, p.ex. en réponse aux événements dans le réseau
A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.
G01F 11/02 - Appareils qu'il faut actionner de l'extérieur, adaptés à chaque opération répétée et identique, pour mesurer et séparer le volume prédéterminé d'un fluide ou d'un matériau solide fluent à partir d'une alimentation ou d'un récipient sans tenir compte avec chambres de mesure qui se dilatent ou se contractent au cours du mesurage
A61M 5/315 - Pistons; Tiges de piston; Guidage, blocage, ou limitation des mouvements de la tige; Accessoires disposés sur la tige pour faciliter le dosage
During gallium nitride (GaN) semiconductor fabrication, a nucleation layer, e.g., aluminum nitride (AlN) may be formed superjacent a substrate, e.g., silicon carbide (SiC). Next, a semiconductor layer, such as including GaN, may be formed over the nucleation layer. This disclosure describes various techniques for forming a thick enough layer of gallium nitride (GaN) to ensure complete coalescence and minimal surface roughness, then removing the excess GaN until a desired thickness is achieved. In some examples, the GaN removal may be performed by desorption, such as may be performed in-situ by using hydrogen gas close to the growth temperature.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
H01L 29/66 - Types de dispositifs semi-conducteurs
Systems and methods are provided for operating an electrolyzer. The systems and methods perform operations comprising obtaining a plurality of impedance measurements of the plurality of electrolytic cells at a plurality of frequencies; tracking changes to the plurality of impedance measurements of the plurality of electrolytic cells over a time period; and generating, based on the changes to the plurality of impedance measurements, a model representing operating conditions of the electrolytic cells on an individual electrolytic cell basis.
Herein disclosed are multiple embodiments of a signal-processing circuit that may be utilized in various circuits, including conversion circuitry. The signal-processing circuit may receive an input and produce charges on multiple different capacitors during different phases of operation based on the input. The charges stored on two or more of the multiple different capacitors may be utilized for producing an output of the signal-processing circuit, such as by combing the charges stored on two or more of the multiple different capacitors. Utilizing the charges on the multiple different capacitors may provide for a high level of accuracy and robustness to variations of environmental factors, and/or a low noise level and power consumption when producing the output.
A sensor system that obtains and processes time-of-flight data (TOF) obtained in an arbitrary orientation is provided. A TOF sensor obtains distance data describing various surfaces. A processor identifies a horizontal Z-plane in the environment, and transforms the data to align with the Z-plane. In some embodiments, the environment includes a box, and the processor identifies a bottom and a top of the box in the transformed data. The processor can further determine dimensions of the box, e.g., the height between the top and bottom of the box, and the length and width of the box top.
G01S 7/4865 - Mesure du temps de retard, p.ex. mesure du temps de vol ou de l'heure d'arrivée ou détermination de la position exacte d'un pic
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01B 11/22 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la profondeur
51.
METHOD FOR LOW POWER MONITORING OF SYSTEM PARAMETERS
Battery monitoring techniques, which consume low amounts of power, are described herein. The battery monitoring techniques can be used when the host device (e.g., electric vehicle) is not operating, thus providing a time to use low power techniques. Measurement devices can measure system parameters when a host processor is off or in a low power mode using a heartbeat (HB) sequencing technique. Based on the HB message, the host processor can be alerted and awakened when a fault is detected.
Aspects of the embodiments are directed to auxiliary communication over a pulse density modulated (PDM) interface. Systems utilize a PDM interface between a sigma-delta modulator and a decimation filter to transmit data between devices. In some examples, the PDM interface is used to add non-PDM coded data communication between devices. Devices having a sigma-delta modulator can include microphones and accelerometers. Devices having a decimator can include digital signal processors (DSPs), microcontrollers, and audio codecs. In some examples, non-PDM coded data can be communicated between microphones and a node in a two-wire communication system, between a microphone and a digital signal processor (DSP), or between two microphones.
Systems, devices, and methods related to envelope regulated, digital predistortion (DPD) are provided. An example apparatus includes an envelope regulator circuit to process, based on a parameterized model, an input signal to generate an envelope regulated signal; a digital predistortion (DPD) actuator circuit to process the envelope regulated signal and the input signal based on DPD coefficients associated with a nonlinearity characteristic of a nonlinear component; and a DPD adaptation circuit to update the DPD coefficients based on a feedback signal indicative of an output of the nonlinear component.
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
G05B 13/02 - Systèmes de commande adaptatifs, c. à d. systèmes se réglant eux-mêmes automatiquement pour obtenir un rendement optimal suivant un critère prédéterminé électriques
54.
DELTA MODULATED BASELINE RESTORATION FOR PHOTON COUNTING COMPUTED TOMOGRAPHY
One embodiment is a baseline restoration (“BLR”) circuit for a photo-counting computed tomography (“PCCT”) signal chain, the BLR circuit comprising a comparator for comparing a shaper voltage output from a shaper component of the PCCT signal chain with a baseline voltage, the comparator outputting a single bit indicative of whether the shaper voltage is above or below the baseline voltage; a low pass filter connected to filter a voltage signal output from the comparator; and a transconductor connected to receive a filtered voltage signal output from the low pass filter, convert the filtered voltage signal to a current signal, and feed the current signal back to an input of the PCCT signal chain.
G01N 23/046 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p.ex. rayons X ou neutrons, non couvertes par les groupes , ou en transmettant la radiation à travers le matériau et formant des images des matériaux en utilisant la tomographie, p.ex. la tomographie informatisée
An analog-to-digital converter (ADC) system, such as a subranging ADC, including a cascade of buffer circuits and signal processing circuitry to measure and cancel the distortion introduced by the buffer circuits. Thus, buffer circuits can be added to the signal path of an input signal without the detrimental effects, such as added distortion, that typically accompany the addition of buffers.
H03M 1/46 - Valeur analogique comparée à des valeurs de référence uniquement séquentiellement, p.ex. du type à approximations successives avec convertisseur numérique/analogique pour fournir des valeurs de référence au convertisseur
H03M 1/06 - Compensation ou prévention continue de l'influence indésirable de paramètres physiques
56.
SYSTEM AND METHOD FOR STATE OF POWER ESTIMATION OF A BATTERY USING IMPEDANCE MEASUREMENTS
A method is provided for pretraining a hyper model configured for use in predicting a state of power (SoP) of a vehicle battery. The method includes performing electrochemical impedance spectroscopy (EIS) scans on a plurality of batteries having a set of similar operating characteristics to the vehicle battery. The EIS scans are performed across various states of the vehicle battery. The method further includes fitting parameters of the hyper model by applying an optimization technique to results of the EIS scans. The hyper model includes a family of models that each define a voltage response of a respective cell from among a plurality of cells of the vehicle battery to a current profile over the various states of the vehicle battery.
G01R 31/367 - Logiciels à cet effet, p.ex. pour le test des batteries en utilisant une modélisation ou des tables de correspondance
G01R 31/3842 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p.ex. état de charge combinant des mesures de tension et de courant
G01R 31/389 - Mesure de l’impédance interne, de la conductance interne ou des variables similaires
G01R 31/396 - Acquisition ou traitement de données pour le test ou la surveillance d’éléments particuliers ou de groupes particuliers d’éléments dans une batterie
B60L 3/12 - Enregistrement des paramètres de fonctionnement
B60L 58/18 - Procédés ou agencements de circuits pour surveiller ou commander des batteries ou des piles à combustible, spécialement adaptés pour des véhicules électriques pour la surveillance et la commande des batteries de plusieurs modules de batterie
B60L 3/00 - Dispositifs électriques de sécurité sur véhicules propulsés électriquement; Contrôle des paramètres de fonctionnement, p.ex. de la vitesse, de la décélération ou de la consommation d’énergie
57.
COMPACT OPTICAL SMOKE DETECTOR SYSTEM AND APPARATUS
Herein disclosed in some embodiments is a fault detector for power amplifiers of a communication system. The fault detector can detect a portion of the power amplifiers that are in fault condition and can prevent or limit current flow to the power amplifiers in fault condition while allowing the rest of the power amplifiers to operate normally. The fault detector can further indicate which power amplifiers are in fault condition and/or the cause for the power amplifiers to be in fault condition. Based on the indication, a controller can direct communications away from the power amplifiers in fault condition and/or perform operations to correct the fault condition.
G01N 15/06 - Recherche de la concentration des suspensions de particules
G08B 17/107 - Déclenchement par la présence de fumée ou de gaz utilisant un dispositif émetteur et récepteur de lumière pour détecter une diffusion de lumière due à de la fumée
G08B 17/113 - Déclenchement par la présence de fumée ou de gaz utilisant une chambre d'ionisation pour détecter de la fumée ou du gaz - Détails de structure
A connector assembly is disclosed. The connector assembly can include first and second connectors. The first connector can include a first electronic component mounted on a first component mount region of the first substrate. The second connector can include a second electronic component mounted on a second component mount region of the second substrate. The first connector and the second connector have different profiles from each other as seen from a top plan view, and can have wider middle portions that overlap when assembled. The first connector can be configured to connect to a sensor panel and a first external substrate or component. The second connector can be configured to connect to the sensor panel and a second external substrate or component.
H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
H01R 12/72 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires
The present disclosure provides designs and techniques to improve turn “off” times of a bootstrapped switch, maximizing the total “on” time of the bootstrapped switch. The techniques described herein provide a protection device coupled to the bootstrapped switch. The protection device may be controlled by an input voltage to the bootstrapped switch during a boosting phase and may be controlled by a constant voltage during a non-boosting phase. The techniques for reducing turn “off” times are particularly useful in high-speed applications, such as high-speed, low-voltage analog-to-digital converters.
H03K 3/017 - Réglage de la largeur ou du rapport durée période des impulsions
H03K 17/041 - Modifications pour accélérer la commutation sans réaction du circuit de sortie vers le circuit de commande
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
H02M 1/08 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques
H03M 1/46 - Valeur analogique comparée à des valeurs de référence uniquement séquentiellement, p.ex. du type à approximations successives avec convertisseur numérique/analogique pour fournir des valeurs de référence au convertisseur
A low-profile coupled inductor is disclosed to provide compact and high performance magnetic coupling. The low-profile coupled inductor has an asymmetrical geometry, having a pair of complementary ferrite cores supporting a pair of conducting strips in an alternating serpentine pattern. One or more core gaps exist between the cores to create a strong flux coupling between adjacent magnetic fields of either conducting strip. The alternating serpentine conductors and core gaps serve to increase energy transfer between the magnetic fields and improve the overall power density of the low-profile coupled inductor.
H01F 27/26 - Fixation des parties du noyau entre elles; Fixation ou montage du noyau dans l'enveloppe ou sur un support
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateurs; Appareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
61.
QUADRATURE TRIM VERTICAL ELECTRODES FOR YAW AXIS CORIOLIS VIBRATORY GYROSCOPE
Microelectromechanical systems (MEMS) yaw gyroscopes having out-of-plane quadrature trim electrodes are described. The gyroscope includes a proof mass configured to be driven in-plane. The proof mass includes an opening, or a plurality of openings. The out-of-plane quadrature trim electrodes are positioned to laterally overlap edges of the opening in a projection plane. The out-of-plane quadrature trim electrodes trim in-plane motion of the proof mass in one or two directions to limit quadrature motion. The out-of-plane quadrature trim electrodes may be arranged in a symmetric pattern to enable mode switching.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
Aspects of the present disclosure include a hybrid circuit, including a first current sink configured to sink a zero temperature coefficient (ZTC) current, a second current sink configured to sink a positive temperature coefficient (PTC) current, a first transistor configured to provide a first current, a second transistor configured to provide a second current, a third transistor configured to provide a third current mirroring the ZTC current, a fourth transistor configured to provide a sum current of the first current and the third current, and a current mirror configured provide a hybrid current mirroring the sum current.
G05F 3/16 - Régulation de la tension ou du courant là où la tension ou le courant sont continus utilisant des dispositifs non commandés à caractéristiques non linéaires consistant en des dispositifs à semi-conducteurs
G05F 1/567 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final sensible à une condition du système ou de sa charge en plus des moyens sensibles aux écarts de la sortie du système, p.ex. courant, tension, facteur de puissance pour compensation de température
Aspects of the present disclosure include aligning multiple three-dimensional (3D) point clouds into a common 3D point cloud. A first subset of points within a first 3D point cloud generated from one time-of-flight (TOF) view can be associated with a second subset of points within a second 3D point cloud generated from another TOF view based on each point in the first subset of points having a threshold correspondence to a unique counterpart point in the second subset of points. The first subset of points and the second subset of points can be refined, and a relative rotation and translation between the first 3D point cloud and the second 3D point cloud can be determined. The first 3D point cloud and the second 3D point cloud can be aligned within a common coordinate system based on the relative rotation and translation.
G06T 3/40 - Changement d'échelle d'une image entière ou d'une partie d'image
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c. à d. recalage des images utilisant des procédés basés sur les caractéristiques
G06T 3/60 - Rotation d'une image entière ou d'une partie d'image
64.
MINIATURIZED PHASE CALIBRATION APPARATUS FOR TIME-OF-FLIGHT DEPTH CAMERA
Systems and apparatus for phase calibration in time-of-flight cameras. In particular, systems and methods are presented for a miniaturized cover design that at least partially encloses the time-of-flight (ToF) module. The geometry of the miniaturized design causes the signals reflected from the calibration device back to the ToF imager to have essentially the same time-of-flight. The design of the calibration device prevents the modulated emissions from leaking out to the environment.
G06T 7/586 - Récupération de la profondeur ou de la forme à partir de plusieurs images à partir de plusieurs sources de lumière, p.ex. stéréophotométrie
65.
GALLIUM NITRIDE DEVICE FOR HIGH FREQUENCY AND HIGH POWER APPLICATIONS
A semiconductor device includes a layer of a first semiconducting material, where the first semiconducting material is epitaxially grown to have a crystal structure of a first substrate. The semiconductor device further includes a layer of a second semiconducting material disposed adjacent to the layer of the first semiconducting material to form a heterojunction with the layer of the first semiconducting material. The semiconductor device further includes a first component that is electrically coupled to the heterojunction, and a second substrate that is bonded to the layer of the first semiconducting material.
H01L 29/205 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV comprenant plusieurs composés dans différentes régions semi-conductrices
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
An electronic device is disclosed. The electronic device can include a molded integrated device package, where the molded integrated device package comprising a substrate, at least one electronic element mounted to the substrate, and a molding compound in which the electronic element is at least partially embedded, a slot formed through the molding compound. The integrated package can include a conductor comprising a horizontal section and a vertical section extending nonparallel from the horizontal section, the horizontal section having a lower side attached by an adhesive to an upper portion of the molding compound and the vertical section inserted into the slot and electrically connected to the substrate or to pads on the substrate by a conductive adhesive, such as solder.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
67.
TRANS-INDUCTOR VOLTAGE REGULATOR CURRENT SENSING TECHNIQUES
Several current sensing techniques are described that may be used to obtain an accurate current signal, which may help to achieve the best performance with a trans-inductor voltage regulator (TLVR) topology. The techniques may have the coupling effect from the secondary side included, so the current sensing signal is accurate for the regulation and other functions related to the current signal. The current sensing techniques may have more accurate gain and phase information in the middle frequency and high frequency ranges. The coupling effect from the secondary side may be well represented in the current sensing signal. The advantages of TLVR topology may be enhanced with accurate current information.
H02M 1/00 - APPAREILS POUR LA TRANSFORMATION DE COURANT ALTERNATIF EN COURANT ALTERNATIF, DE COURANT ALTERNATIF EN COURANT CONTINU OU VICE VERSA OU DE COURANT CONTINU EN COURANT CONTINU ET EMPLOYÉS AVEC LES RÉSEAUX DE DISTRIBUTION D'ÉNERGIE OU DES SYSTÈMES D'ALI; TRANSFORMATION D'UNE PUISSANCE D'ENTRÉE EN COURANT CONTINU OU COURANT ALTERNATIF EN UNE PUISSANCE DE SORTIE DE CHOC; LEUR COMMANDE OU RÉGULATION - Détails d'appareils pour transformation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
One embodiment is a method for binning charge events in a photon-counting CT scanning system comprising a plurality of discriminators, wherein each discriminator is associated with a respective one of a plurality of threshold voltage levels, the method comprising detecting a transition in a signal output from one of the discriminators; and incrementing a count corresponding to the threshold voltage level associated with the one of the discriminators only if the detected discriminator output signal transition was immediately preceded by an opposite transition in the discriminator output signal.
G01T 1/29 - Mesure effectuée sur des faisceaux de radiations, p.ex. sur la position ou la section du faisceau; Mesure de la distribution spatiale de radiations
G01T 1/17 - Dispositions de circuits non adaptés à un type particulier de détecteur
69.
METHODS AND SYSTEMS FOR PERFORMING OBJECT DIMENSIONING
Aspects of the present disclosure include isolating a target scene object from multiple images of a time-of-flight (TOF) sensor. Multiple images from a TOF sensor can be transformed into multiple three-dimensional (3D) point clouds. In each of the multiple 3D point clouds, one or more large planes having a minimal threshold size can be identified. A common 3D point cloud can be generated by aligning rotated and translated point clouds corresponding to at least a portion of the multiple 3D point clouds. The common 3D point cloud can be rotated and translated to have one of one or more large planes identified as a ground plane within a common coordinate system of the common 3D point cloud, and a target object can be isolated.
Aspects described herein relate to estimating mean arterial pressure (MAP) of a living being. The estimating may include obtaining pulsatile arterial blood pressure (pABP) waveform, obtaining arterial blood flow (ABF) waveform, identifying a set of segments of the pABP waveform in steady state, identifying a set of segments of the ABF waveform in steady state, and estimating the MAP based on the identified segment of the pABP waveform in steady state and the identified segment of the ABF waveform in steady state.
A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
A61B 5/00 - Mesure servant à établir un diagnostic ; Identification des individus
A61B 5/02 - Mesure du pouls, du rythme cardiaque, de la pression sanguine ou du débit sanguin; Détermination combinée du pouls, du rythme cardiaque, de la pression sanguine; Evaluation d'un état cardio-vasculaire non prévue ailleurs, p.ex. utilisant la combinaison de techniques prévues dans le présent groupe et des techniques d'électrocardiographie; Sondes cardiaques pour mesurer la pression sanguine
Aspects of the present disclosure include obtaining images from a time-of-flight (TOP) sensor for determining dimensions of an object. A prompt to capture at least one image of an object can be displayed on an interface. At least one image of the object can be captured based on an interaction with the prompt. It can be determined whether multiple images including the at least one image are sufficient for performing object dimensioning, and if so, the images can be provided for performing object dimensioning to compute or display dimensions of the object.
Aspects of the present disclosure include aligning multiple three-dimensional (3D) point clouds into a common 3D point cloud. A first subset of points within a first 3D point cloud generated from one time-of-flight (TOF) view can be associated with a second subset of points within a second 3D point cloud generated from another TOF view based on each point in the first subset of points having a threshold correspondence to a unique counterpart point in the second subset of points. The first subset of points and the second subset of points can be refined, and a relative rotation and translation between the first 3D point cloud and the second 3D point cloud can be determined. The first 3D point cloud and the second 3D point cloud can be aligned within a common coordinate system based on the relative rotation and translation.
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c. à d. recalage des images utilisant des procédés basés sur les caractéristiques
G06T 7/521 - Récupération de la profondeur ou de la forme à partir de la projection de lumière structurée
G06T 17/00 - Modélisation tridimensionnelle [3D] pour infographie
G06T 19/00 - Transformation de modèles ou d'images tridimensionnels [3D] pour infographie
73.
METHODS AND SYSTEMS FOR PERFORMING OBJECT DIMENSIONING
Aspects of the present disclosure include obtaining images from a time-of-flight (TOP) sensor for determining dimensions of an object including obtaining, from the TOP sensor, multiple images including the object, validating whether the multiple images are taken at desired poses relative to the object, and where the multiple images are validated as taken at the desired poses, providing the multiple images for object dimensioning to compute or display dimensions of the object.
An electronic device is disclosed. The electronic device can include a molded integrated device package, where the molded integrated device package comprising a substrate, at least one electronic element mounted to the substrate, and a molding compound in which the electronic element is at least partially embedded, a slot formed through the molding compound. The integrated package can include a conductor comprising a horizontal section and a vertical section extending nonparallel from the horizontal section, the horizontal section having a lower side attached by an adhesive to an upper portion of the molding compound and the vertical section inserted into the slot and electrically connected to the substrate or to pads on the substrate by a conductive adhesive, such as solder.
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H01L 23/482 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
75.
METHODS AND SYSTEMS FOR PERFORMING OBJECT DIMENSIONING
Aspects of the present disclosure include obtaining images from a time-of-flight (TOF) sensor for determining dimensions of an object including obtaining, from the TOF sensor, multiple images including the object, validating whether the multiple images are taken at desired poses relative to the object, and where the multiple images are validated as taken at the desired poses, providing the multiple images for object dimensioning to compute or display dimensions of the object.
Device for improving an optical detecting smoke apparatus and implementing thereof. Apparatus and methods for detecting the presence of smoke in a small, long-lasting smoke detector are disclosed. Specifically, the present disclosure shows how to build one or more optimized blocking members in a smoke detector to augment signal to noise ratio. This is performed while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust. In particular, geometrical optical elements, e.g., cap and optical deflection elements, are disclosed.
G01N 15/14 - Recherche par des moyens électro-optiques
G08B 17/107 - Déclenchement par la présence de fumée ou de gaz utilisant un dispositif émetteur et récepteur de lumière pour détecter une diffusion de lumière due à de la fumée
77.
NON-INVASIVE AND NON-OBTRUSIVE MEAN ARTERIAL PRESSURE ESTIMATION
Aspects described herein relate to estimating mean arterial pressure (MAP) of a living being. The estimating may include obtaining pulsatile arterial blood pressure (pABP) waveform, obtaining arterial blood flow (ABF) waveform, identifying a set of segments of the pABP waveform in steady state, identifying a set of segments of the ABF waveform in steady state, and estimating the MAP based on the identified segment of the pABP waveform in steady state and the identified segment of the ABF waveform in steady state
Aspects of the present disclosure include isolating a target scene object from multiple images of a time-of-flight (TOF) sensor. Multiple images from a TOF sensor can be transformed into multiple three-dimensional (3D) point clouds. In each of the multiple 3D point clouds, one or more large planes having a minimal threshold size can be identified. A common 3D point cloud can be generated by aligning rotated and translated point clouds corresponding to at least a portion of the multiple 3D point clouds. The common 3D point cloud can be rotated and translated to have one of one or more large planes identified as a ground plane within a common coordinate system of the common 3D point cloud, and a target object can be isolated.
Aspects of the present disclosure include obtaining images from a time-of-flight (TOF) sensor for determining dimensions of an object. A prompt to capture at least one image of an object can be displayed on an interface. At least one image of the object can be captured based on an interaction with the prompt. It can be determined whether multiple images including the at least one image are sufficient for performing object dimensioning, and if so, the images can be provided for performing object dimensioning to compute or display dimensions of the object.
A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AISb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.
H01L 33/06 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une structure à effet quantique ou un superréseau, p.ex. jonction tunnel au sein de la région électroluminescente, p.ex. structure de confinement quantique ou barrière tunnel
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 31/024 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de température
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
81.
PHASE DETECTORS WITH EXTRAPOLATION OF TIMING EVENTS
Apparatus and methods for clock synchronization and frequency translation are provided herein. Clock synchronization and frequency translation integrated circuits (ICs) generate one or more output clock signals having a controlled timing relationship with respect to one or more reference signals. The teachings herein provide a number of improvements to clock synchronization and frequency translation ICs, including, but not limited to, reduction of system clock error, reduced variation in clock propagation delay, lower latency monitoring of reference signals, precision timing distribution and recovery, extrapolation of timing events for enhanced phase-locked loop (PLL) update rate, fast PLL locking, improved reference signal phase shift detection, enhanced phase offset detection between reference signals, and/or alignment to phase information lost in decimation.
H03L 7/107 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase pour assurer la synchronisation initiale ou pour élargir le domaine d'accrochage utilisant une fonction de transfert variable pour la boucle, p.ex. un filtre passe-bas ayant une largeur de bande variable
H03L 7/08 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase
G06F 1/12 - Synchronisation des différents signaux d'horloge
Multiple transmit and receive channels in a communication transceiver may be dynamically configured using corresponding channel registers. In order to support fast frequency hopping, arbitrary sample rate change or profile switching, the present disclosure proposes a profile-based direct memory access (PDMA) that can be used to transfer data from a memory and program specific profile registers in a randomly accessed addressing manner. PDMAs can offload the system processor from reprogramming many system registers based on external or internal events in a multi channels communication system. Furthermore, a PDMA based DMA controller is proposed to configure the fast frequency hopping registers of the transceiver based on PDMA.
H04B 1/7136 - Dispositions pour la production de sauts de fréquences, p.ex. utilisant une batterie de sources de fréquence, un accord continu ou une transformée
Herein disclosed are approaches for protecting sensitive information within a fingerprint authentication system that can be snooped and utilized to access the device, secured information, or a secured application. The approaches can utilize encryption keys and hash functions that are unique to the device in which the fingerprint authentication is being performed to protect the sensitive information that can be snooped.
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p.ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
G06F 21/62 - Protection de l’accès à des données via une plate-forme, p.ex. par clés ou règles de contrôle de l’accès
G06F 21/83 - Protection des dispositifs de saisie, d’affichage de données ou d’interconnexion dispositifs de saisie de données, p.ex. claviers, souris ou commandes desdits claviers ou souris
Techniques are described for forming a sealed cavity within a semiconductor wafer, where a conductor wafer includes a structure, such as a T-gate electrode or passive component, formed over a substrate. The sealed-cavity structure may be embedded into the wafer without interfering with any subsequent processes. That is, once the cavity is closed, any subsequent backend processes may continue as usual.
H01L 29/51 - Matériaux isolants associés à ces électrodes
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
According to some aspects, there is provided a microelectromechanical systems (MEMS) device wherein one or more components of the MEMS device exhibit attenuated motion relative to one or more other moving components. The MEMS device may comprise a substrate; a proof mass coupled to the substrate and configured to move along a resonator axis; and a first shuttle coupled to the proof mass and comprising one of a drive structure configured to drive the proof mass along the resonator axis or a sense structure configured to move along a second axis substantially perpendicular to the resonator axis in response to motion of the proof mass along the resonator axis, wherein displacement of at least a first portion of the proof mass is attenuated relative to displacement of the first shuttle and/or a second portion of the proof mass.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
86.
APPARATUS AND METHODS FOR SWITCH-MODE POWER SUPPLY START-UP
Apparatus and methods for switch-mode power supply start-up are provided herein. In certain embodiments, a switch-mode power supply includes an inductor and one or more power switches used to control a current through the inductor to provide voltage regulation. The switch-mode power supply uses external voltage levels to regulate one or more internal control signals (for example, for opening or closing the one or more power switches) to their zero output current switching state at the appropriate switch duty cycle. Furthermore, the switch-mode power supply can be implemented to provide a first pulse timing signal to establish the inductor current waveform for zero net output current delivery to a load.
H02M 1/36 - Moyens pour mettre en marche ou arrêter les convertisseurs
H02M 3/157 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation avec commande numérique
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
87.
METHODS FOR USING A SURFACE ACOUSTIC WAVE RESONATOR FOR AUTOMOBILE SECURITY
Remote keyless entry (RKE) systems and devices are described. The RKE devices include one or more passive radios that respond to an interrogation signal from an interrogating device such as a vehicle. The passive radio sends a responsive signal that can include a decaying portion representing a ringdown signal. The passive radio includes a SAW resonator in some situations.
B60R 25/24 - Moyens pour enclencher ou arrêter le système antivol par des éléments d’identification électroniques comportant un code non mémorisé par l’utilisateur
G06K 19/067 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
Techniques for setting a gain of an amplifier circuit in which the external resistor of the amplifier circuit is used to determine an internal gain setting to select. A voltage across the external resistor can be compared to an on-chip reference, and then used to program the desired gain. The techniques can mitigate or eliminate the need for a high-accuracy external resistor and can allow substantial improvements in initial gain accuracy and gain drift for existing boards and/or systems with only a bill of material change.
H03G 3/00 - Commande de gain dans les amplificateurs ou les changeurs de fréquence
H03F 3/04 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs
H03G 3/30 - Commande automatique dans des amplificateurs comportant des dispositifs semi-conducteurs
H03M 7/16 - Conversion en, ou à partir de codes à distance unitaire, p.ex. code de Gray, code binaire réfléchi
A MEMS device is provided comprising a mass configured to move along a first axis and a second axis substantially perpendicular to the first axis; a drive structure coupled to the mass and configured to cause the mass to move along the first axis; a sense structure coupled to the mass and configured to detect motion of the mass along the second axis; a stress relief structure coupled to one of the drive structure or the sense structure; and at least one anchor coupled to an underlying substrate of the MEMS device, wherein the stress relief structure is coupled to the at least one anchor and the at least one anchor is disposed outside of the stress relief structure.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
90.
POWER CONVERTER LOOP GAIN IDENTIFICATION AND COMPENSATION USING A MACHINE-LEARNING MODEL
Technologies are provided for identification of closed-loop gain response and compensation of power supply devices. In an aspect, a computing device can receive data indicative of a transient output voltage of a power supply device. The computing device also can determine frequency-domain loop response of a control loop of the power supply device by applying a machine-learned model to the data indicative of the transient output voltage. In addition, or in other aspects, the computing device also can adjust one or multiple compensation component(s) of the power supply device in order to achieve a satisfactory performance during operation of the power supply device.
Techniques that enable calibration of digital-to-analog Converters (DACs) with minimal processing overhead. A single frequency bin can be used to calibrate errors between bits. A low frequency feedback path can be included into a low frequency low power ADC to determine the error signal that exists in the calibration bin. The bits are calibrated when this error signal is minimized. The calibration techniques described provide an extremely efficient and optimal calibration at the DAC output of both static and dynamic errors.
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
technology development services in the field of integrated circuits and semiconductors and Ethernet network design; research and design services in the field of technology, namely, integrated circuits and semiconductors and Ethernet network design provided to the commercial sector, universities and research institutions; providing temporary use of non-downloadable software featuring technology information for displaying models in the field of integrated circuits, signal processing solutions and network design; providing an on-line searchable database featuring technology information in the field of integrated circuits, signal processing solutions and network design; design of electronic circuits provided via the internet; providing information via the internet regarding the design and development of electronic circuits; design services relating to the development of Ethernet networks in the nature of designing hardware and architecture in the automotive space;
A method of providing cyber security to an industrial control system is described. The method includes detecting an anomaly and recording and reporting the detected anomaly to a control system within a network associated with the industrial control system. Detecting the anomaly may include recording all unauthorized attempts to connect to a communication port in the network, capturing identifying information associated with the unauthorized attempts, detecting scanning activity of a hacker in the network, detecting an attempt to manipulate a log file to conceal malicious activity in the network; and recording and reporting the detected anomaly to a controller within the network
A low-profile dual-phase inverse coupled inductor structure can include diagonally overlapped windings and gap controlled inverse coupling, such as can be useful to help achieve strong negative coupling and high saturation current for POL applications. The device may include a coupled inductor structure comprising a first magnetic core piece, and a conductive first winding portion on at least a portion of the first magnetic core piece. An electrical insulator may be included on at least a portion of the first winding portion and a conductive second winding portion may be located such as to cover the insulator. At least a portion of the second winding portion overlaps, and may be separated by the insulator from, at least an underlying portion of the first winding portion. A second magnetic core piece may be located on the second winding portion.
A device may include a coupled inductor structure comprising a first winding portion, a second winding portion, and a magnetic core structure. The magnetic core structure may include a first and second core piece that are at least partially cross-sectionally U-shaped. A first connecting core piece may be attached to a first portion of the first core piece to a first portion of the second core piece, and a second connecting core piece may attach a second portion of the first core piece to a second portion of the second core piece.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre eux; Fixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateurs; Appareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
An apparatus including a bidirectional power converter circuit. The power converter circuit includes a primary circuit side including a plurality of primary switches, an isolation transformer, and a secondary circuit side separated from the primary circuit side by the isolation transformer. The secondary circuit side includes an inductor, a rectifier circuit coupled to the inductor and configured to receive energy from the primary circuit side and provide energy to the primary circuit side, and a clamp circuit coupled to the inductor and configured to provide a reset voltage to the inductor that prevents inductor current runaway.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
An analog-to-digital (ADC) converter system and method of using the system that can be used in low power situations. The converter can periodically or recurrently turn off a reference standard in order to conserve power and instead using a stable supply source as a reference voltage. A precise conversion for signal from the analog to the digital domain while maintaining a low quiescent current.
Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p.ex. comportant des membranes ou des lamelles élastiques
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
B81C 3/00 - Assemblage de dispositifs ou de systèmes à partir de composants qui ont reçu un traitement individuel
H01L 21/77 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun
100.
MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES
Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm x 2 mm in the planar axes and less than 500 — 800 μm in height.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
H01L 25/03 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,