Abrégé

An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H03H 9/46 - Filtres

Abrégé

A system includes at least one processor and at least one memory storing program instructions that, when executed by the at least one processor, cause the system to send an acoustic ranging transmitter signal between a plurality of calibration reference positions and at least one anchor point, receive an acoustic ranging receiver signal associated with the acoustic ranging transmitter signal and with distances between the plurality of calibration reference positions and the at least one anchor point, and estimate a speed of sound based on the acoustic ranging receiver signal.

Classes IPC  ?

• G01S 5/30 - Détermination de distances absolues à partir de plusieurs points espacés d'emplacement connu
• G01S 15/02 - Systèmes utilisant la réflexion ou la reradiation d'ondes acoustiques, p.ex. systèmes sonar utilisant la réflexion d'ondes acoustiques