A resist composition including a resin component having a constitutional unit represented by General Formula (a0-1) and a compound represented by General Formula (d0-1). In General Formula (a0-1), R0 represents a hydrogen atom, an alkyl group, a halogen atom, or a halogenated alkyl group; Vax0 represents a single bond or a divalent linking group; Wa represents a divalent aromatic hydrocarbon group; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; and Ra00 represents an acid dissociable group. In General Formula (d0-1), X0 represents a bromine atom or an iodine atom; Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom; nd1 represents an integer of 1 to 5; nd2 represents an integer of 0 to 4; Yd0 represents a divalent linking group or a single bond; Mm+ represents an m-valent organic cation; and m represents an integer of 1 or greater
A resist composition including a resin component having a constitutional unit represented by General Formula (a0-1) and a compound represented by General Formula (d0-1). In General Formula (a0-1), R0 represents a hydrogen atom, an alkyl group, a halogen atom, or a halogenated alkyl group; Vax0 represents a single bond or a divalent linking group; Wa represents a divalent aromatic hydrocarbon group; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; and Ra00 represents an acid dissociable group. In General Formula (d0-1), X0 represents a bromine atom or an iodine atom; Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom; nd1 represents an integer of 1 to 5; nd2 represents an integer of 0 to 4; Yd0 represents a divalent linking group or a single bond; Mm+ represents an m-valent organic cation; and m represents an integer of 1 or greater
C08F 212/14 - Monomères contenant un seul radical aliphatique non saturé contenant un cycle substitué par des hétéro-atomes ou des groupes contenant des hétéro-atomes
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
A chip for cell culture, including a laminate having a flow path structure inside, in which respective members constituting respective layers of the laminate are adhered by adhesive layers, and the adhesive layer includes a first adhesive layer formed of an adhesive that contains a polyester-based resin having a glass transition temperature of 37° C. or higher and 120° C. or lower.
C12M 3/06 - Appareillage pour la culture de tissus, de cellules humaines, animales ou végétales, ou de virus avec des moyens de filtration, d'ultrafiltration, d'osmose inverse ou de dialyse
C12M 1/00 - Appareillage pour l'enzymologie ou la microbiologie
C12M 1/12 - Appareillage pour l'enzymologie ou la microbiologie avec des moyens de stérilisation, filtration ou dialyse
3.
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A resist composition including a resin component (A1), a compound (B0) represented by General Formula (b0), and a photodegradable base (D0) that has a carboxylic acid with a pKa of 0.3 to 2.5 as a generated acid. In formula (b0), Rb11 to Rb13 represent a halogen atom, Rb21 to Rb23 each independently represents a hydrogen atom, mb1, nb1, and ob1 represent an integer of 2 to 5, mb2 represents an integer of 5-mb1, nb2 represents an integer of 5-nb1, ob2 represents an integer of 5-ob1, R101 represents a cyclic group, R102 represents a fluorinated alkyl group or a fluorine atom, Y101 represents a divalent linking group having an oxygen atom or a single bond, and V101 represents a single bond, an alkylene group, or a fluorinated alkylene group
A resist composition including a resin component (A1), a compound (B0) represented by General Formula (b0), and a photodegradable base (D0) that has a carboxylic acid with a pKa of 0.3 to 2.5 as a generated acid. In formula (b0), Rb11 to Rb13 represent a halogen atom, Rb21 to Rb23 each independently represents a hydrogen atom, mb1, nb1, and ob1 represent an integer of 2 to 5, mb2 represents an integer of 5-mb1, nb2 represents an integer of 5-nb1, ob2 represents an integer of 5-ob1, R101 represents a cyclic group, R102 represents a fluorinated alkyl group or a fluorine atom, Y101 represents a divalent linking group having an oxygen atom or a single bond, and V101 represents a single bond, an alkylene group, or a fluorinated alkylene group
A film-forming composition including a polyhedral oligomeric silsesquioxane represented by General Formula (a1), an acid generating agent component, and a crosslinking agent component. In Formula (a1), R1 to R8 represent an aromatic group containing a phenolic hydroxyl group, a hydrocarbon group having 1 to 10 carbon atoms, or a hydrogen atom; at least one of R1 to R8 represents an aromatic group containing a phenolic hydroxyl group; L1 to L8 represent a specific divalent linking group at least one of L1 to L8 represents a divalent linking group represented by General Formula (a1-L-2) or General Formula (a1-L-3), ZX and ZY represent a hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom, and n2 and n3 represent an integer of 0 to 10).
A chip for cell culture, including a laminate having a flow path structure inside, in which the laminate includes a bottom plate substrate, a flow path substrate in which a flow path is formed by laser processing, and a top plate substrate in this order, and the flow path substrate includes a resin having a glass transition temperature of 37° C. or higher, an elastic modulus at 25° C. of 1×109 Pa or more, and an elastic modulus at 150° C. of 1×107 Pa or less.
A resist composition containing a polymeric compound having a constitutional unit containing a phenolic hydroxyl group, an acid generator, at least one crosslinking agent among a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glycoluril-based crosslinking agent, and an epoxy-based crosslinking agent, and a polyether compound, a content of which is less than 50 parts by mass with respect to 100 parts by mass of the polymeric compound.
A photocurable liquid composition capable of forming a cured product in which localization of metal oxide nanoparticles is suppressed, a cured product of the photocurable liquid composition, and a method for producing a cured product using the photocurable liquid composition. As a photopolymerizable monomer, a polyfunctional monomer having 3 or more ethylenically unsaturated double bond is added to the photocurable liquid composition including the photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiator.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
A resist composition that contains a resin component having a constitutional unit containing an acid-dissociable group represented by General Formula (a01-r) below and contains an acid generator component containing a compound represented by General Formula (b0) below. In General Formula (a01-r), Ra01 and Ra02 represent a saturated aliphatic hydrocarbon group, Ra01 and Ra02 may be bonded to each other to form an alicyclic group. Ra03 to Ra05 represent an aliphatic hydrocarbon group and two or more of Ra03 to Ra05 may be bonded to each other to form an alicyclic group. In General Formula (b-0), X0 represents an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, nb2 represents an integer in a range of 0 to 4, 1≤nb1+nb2≤5, Yb0 represents a divalent linking group, Vb0 represents an alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms, and Mm+ represents an m-valent organic cation
A resist composition that contains a resin component having a constitutional unit containing an acid-dissociable group represented by General Formula (a01-r) below and contains an acid generator component containing a compound represented by General Formula (b0) below. In General Formula (a01-r), Ra01 and Ra02 represent a saturated aliphatic hydrocarbon group, Ra01 and Ra02 may be bonded to each other to form an alicyclic group. Ra03 to Ra05 represent an aliphatic hydrocarbon group and two or more of Ra03 to Ra05 may be bonded to each other to form an alicyclic group. In General Formula (b-0), X0 represents an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, nb2 represents an integer in a range of 0 to 4, 1≤nb1+nb2≤5, Yb0 represents a divalent linking group, Vb0 represents an alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms, and Mm+ represents an m-valent organic cation
A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymer containing a siloxane bond and an ionic group represented by General Formula (I0), which is decomposed upon exposure to generate an acid. In General Formula (I0), Mm+ represents a sulfonium cation or an iodonium cation, m represents an integer of 1 or more, and * represents a bonding site
A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymer containing a siloxane bond and an ionic group represented by General Formula (I0), which is decomposed upon exposure to generate an acid. In General Formula (I0), Mm+ represents a sulfonium cation or an iodonium cation, m represents an integer of 1 or more, and * represents a bonding site
A resin component (A1) and a compound (B0) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, and Rb1 to Rb15 each independently represents a hydrogen atom or a substituent, and at least two of Rb1 to Rb5 represent a fluorine atom or at least one of Rb1 to Rb5 represents a perfluoroalkyl group
A resin component (A1) and a compound (B0) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, and Rb1 to Rb15 each independently represents a hydrogen atom or a substituent, and at least two of Rb1 to Rb5 represent a fluorine atom or at least one of Rb1 to Rb5 represents a perfluoroalkyl group
C07C 211/63 - Composés d'ammonium quaternaire ayant des atomes d'azote quaternisés liés à des atomes de carbone acycliques
C07C 303/22 - Préparation d'esters ou d'amides d'acides sulfuriques; Préparation d'acides sulfoniques ou de leurs esters, halogénures, anhydrides ou amides d'acides sulfoniques ou de leurs halogénures à partir d'acides sulfoniques par des réactions n'impliquant pas la formation de groupes sulfo ou halogénosulfonyle
C07C 309/12 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'oxygène liés au squelette carboné contenant des groupes hydroxy estérifiés liés au squelette carboné
A substrate support that allows for effortless debonding of a circuit pattern, the substrate support including a base material having a bonding surface to which a semiconductor substrate (circuit pattern) is bonded; and an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface.
A method for efficiently producing circuit patterns (semiconductor devices) that allows for effortless pickup of circuit patterns after dicing. The method includes producing a semiconductor substrate with circuit patterns formed on a first surface; forming a first laminate by bonding a first support through a first adhesive layer to the first surface; forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface; debonding the first support from the second laminate; and picking up the circuit patterns from the second support.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
An aqueous cleaning liquid containing hydrofluoric acid, at least one kind of triazole compound selected from the group consisting of triazole and a triazole derivative, and a nonionic surfactant.
An aqueous cleaning liquid containing hydrofluoric acid and an aliphatic sulfonic acid, where the aqueous cleaning liquid is used in a case of cleaning a substrate having cobalt in a surface layer.
There is provided an aqueous cleaning liquid containing hydrofluoric acid and a water-soluble aromatic compound, where the aqueous cleaning liquid has a pH of more than 5.
Provided are a composition for producing a porous film the composition enabling a decrease in a pore diameter of a produced porous film and improvement of a flow rate through the porous film, a method for producing a porous film, and a porous film. A composition for producing a porous film, the composition comprising at least one resin component (A) selected from a group consisting of polyamide acid, polyimide, a polyamide-imide precursor, polyamide-imide, and polyethersulfone, fine particles (B), and a solvent (S), the fine particles (B) comprising fine particles (B1) and fine particles (B2) having an average particle diameter larger than that of the fine particles (B1), the fine particles (B1) having an average particle diameter of smaller than 100 nm.
C08J 9/26 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolaires; Leur post-traitement par élimination d'une phase solide d'un objet ou d'une composition macromoléculaire, p.ex. par lessivage
There is provided an aqueous cleaning liquid containing hydrofluoric acid and at least one kind of chelating compound selected from the group consisting of a β-diketone compound and a compound containing a total of two or more carboxy groups or hydroxyl groups in a molecule, where the aqueous cleaning liquid is used in a case of cleaning a substrate that contains aluminum oxide in a surface layer.
A resist composition including a resin component which has a constitutional unit (a01a) containing a polycyclic lactone-containing cyclic group and a constitutional unit (a02) represented by General Formula (a0-2), and a compound (B0) represented by General Formula (b0), Ra05 to Ra08 each independently represents a hydrogen atom, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, R0 represents a hydrogen atom, Mm+ represents an m-valent organic cation, m represents an integer of 1 or greater
A resist composition including a resin component which has a constitutional unit (a01a) containing a polycyclic lactone-containing cyclic group and a constitutional unit (a02) represented by General Formula (a0-2), and a compound (B0) represented by General Formula (b0), Ra05 to Ra08 each independently represents a hydrogen atom, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, R0 represents a hydrogen atom, Mm+ represents an m-valent organic cation, m represents an integer of 1 or greater
C08F 212/14 - Monomères contenant un seul radical aliphatique non saturé contenant un cycle substitué par des hétéro-atomes ou des groupes contenant des hétéro-atomes
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
A resist composition including a resin component (A1) which has a constitutional unit (a0) containing a photodegradable base that is decomposed upon light exposure and loses acid diffusion controllability, and an acid generator component (B) which contains a compound (BO) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, where 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater
A resist composition including a resin component (A1) which has a constitutional unit (a0) containing a photodegradable base that is decomposed upon light exposure and loses acid diffusion controllability, and an acid generator component (B) which contains a compound (BO) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, where 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater
The present invention provides: a photocurable composition that, although including metal oxide microparticles at high concentration, is such that the metal oxide microparticles are satisfactorily dispersed and leakability to a to-be-coated substrate is satisfactory; a cured product of said photocurable composition; and a cured film formation method that uses the photocurable composition. A photocurable resin composition contains a photopolymerizable compound (A), metal oxide microparticles (B), an initiator (C), and a solvent (S). A compound having a radical-polymerizable-group-containing group or a cationically-polymerizable-group-containing group is used as the photopolymerizable compound (A). As the solvent (S), a plurality of solvents (S1) are used that have a specific structure that includes an oxyalkylene group, and are such that the Hildebrand solubility parameter value thereof is 21.0 MPa0.5 (alternatively, the solvent (S1) and another solvent (S2) are used at a prescribed mass ratio).
C09D 4/00 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
Provided are: a compound used as a capping agent which imparts particles having excellent dispersibility and refractive index; particles coated with the compound; a method for producing the same; and a dispersion composition containing said particles. A compound according to the present invention has a structure represented by formula (1). In the formula, R1 represents an organic group having 1-30 carbon atoms, R2 represents a group represented by OR3 or a group represented by formula (2), R3 represents an organic group having 1-30 carbon atoms, n1 and n2 each represent an integer of at least 0, n1+2×n2 represents a valence determined by the type of L, L represents aluminum, gallium, yttrium, titanium, zirconium, hafnium, bismuth, tin, vanadium, or tantalum, * represents a bond, R4 and R5 each represent an organic group having 1-30 carbon atoms which may have an oxygen atom. Particles according to the present invention have a structure represented by formula (1) on a surface thereof.
A resist composition containing a base material component (A) and a compound (B0) represented by General Formula (b0), in which Rb0 represents a condensed cyclic group containing a condensed ring containing one or more aromatic rings, the condensed cyclic group has, as a substituent, an acid decomposable group that is decomposed under action of acid to form a polar group, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more
A resist composition containing a base material component (A) and a compound (B0) represented by General Formula (b0), in which Rb0 represents a condensed cyclic group containing a condensed ring containing one or more aromatic rings, the condensed cyclic group has, as a substituent, an acid decomposable group that is decomposed under action of acid to form a polar group, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more
A method for suppressing collapse of a three-dimensional structure which can hydrophobize a surface of a three-dimensional structure on a substrate, regardless of a material of the substrate and a material of the three-dimensional structure, and can suppress collapse of the three-dimensional structure on the substrate, as a result of hydrophobization, a surface treatment liquid, a method for producing the surface treatment liquid, and a substrate having a three-dimensional structure with silane condensate that is a component of the surface treatment liquid and is attached or bound to a surface of the three-dimensional structure. The method includes preparing a substrate having a three-dimensional structure on a surface thereof, and contacting a surface treatment liquid to a surface of the three-dimensional structure, a surface treatment liquid including a silane condensate that is a silane condensate formed by hydrolyzation condensation of a hydrolyzable silane compound including a trifunctional silane compound having a specific structure.
Provided are a composition and a photosensitive composition that contain inorganic fine particles dispersed stably over a long period of time and are less likely to undergo excessive loss of the mass of their components (or non-solvent components in a case where the composition or the photosensitive composition contains a solvent) even when heated; a product of curing of such a photosensitive composition; a compound suitable for use in such a photosensitive composition; and a method of producing such a compound. The composition includes a photopolymerizable compound (A) and inorganic fine particles (B) and the photosensitive composition includes a photopolymerizable compound (A), inorganic fine particles (B), and an initiating agent (C), in which the photopolymerizable compound (A) is a compound of a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group.
CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), an acid component (B) that is two or more acid components having different pKa's one another, provided that perchloric acid is excluded, and water.
Provided are a highly-curable photosensitive composition capable of forming cured products that are less likely to undergo excessive mass loss even when heated; and a product of curing of such a photosensitive composition. The photosensitive composition includes photopolymerizable compounds (A) and an initiating agent (C), in which the photopolymerizable compounds (A) include a combination of a compound of a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group and a polyfunctional compound different from the compound of a specific structure.
An undercoat agent that is used for subjecting a layer including a block copolymer to phase separation on a substrate, the undercoat agent containing a resin component (A1) having a constitutional unit (u1) represented by General Formula (u1) and a constitutional unit (u2) represented by General Formula (u2). In General Formula (u1), R11 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, R12 represents a substituent, and n represents an integer of 0 to 5. In General Formula (u2), R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, L2 represents a single bond or a divalent linking group, and Y2 represents a divalent linking group having 5 to 15 carbon atoms
An undercoat agent that is used for subjecting a layer including a block copolymer to phase separation on a substrate, the undercoat agent containing a resin component (A1) having a constitutional unit (u1) represented by General Formula (u1) and a constitutional unit (u2) represented by General Formula (u2). In General Formula (u1), R11 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, R12 represents a substituent, and n represents an integer of 0 to 5. In General Formula (u2), R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, L2 represents a single bond or a divalent linking group, and Y2 represents a divalent linking group having 5 to 15 carbon atoms
C09D 153/00 - Compositions de revêtement à base de copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone; Compositions de revêtement à base de dérivés de tels polymères
C09D 5/00 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produits; Apprêts en pâte
G03F 7/11 - Matériaux photosensibles - caractérisés par des détails de structure, p.ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p.ex. couches d'ancrage
G03F 7/26 - Traitement des matériaux photosensibles; Appareillages à cet effet
28.
CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), an acid component (B) selected from the group consisting of carbonic acid, formic acid, propionic acid, butyric acid, and sulfonic acid, and salts thereof, and water.
C23F 1/30 - Compositions acides pour les autres matériaux métalliques
H01L 21/3213 - Gravure physique ou chimique des couches, p.ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
29.
CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), a metal component (B) including a transition metal other than cerium, and water, in which a content of the metal component (B) is less than 1.65×10−3 parts by mass with respect to 1 part by mass of the cerium-containing oxidizing agent (A) in terms of the transition metal.
A resin composition for forming a phase-separated structure contains a block copolymer that is formed of a first block, a second block, and a third block, which are bonded to one another. The structure of a constituent unit of a polymer constituting the first block is identical to the structure of a constituent unit of a polymer constituting the third block. The number-average molecular weight (Mn3) of the polymer constituting the third block is smaller than the number-average molecular weight (Mn1) of the polymer constituting the first block.
C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone; Compositions contenant des dérivés de tels polymères
31.
METHOD OF PRODUCING BLOCK COPOLYMER, AND BLOCK COPOLYMER
A method of producing a triblock copolymer, the method including reacting a diblock copolymer that contains a first block formed from a repeating structure including a constituent unit containing an aromatic hydrocarbon group, and a second block formed from a repeating structure including a constituent unit derived from an α-substituted acrylic acid ester with a homopolymer that contains a third block formed from a repeating structure including a constituent unit containing an aromatic hydrocarbon group and containing a hydroxy group bonded to a terminal of a main chain in the third block to obtain a triblock copolymer, in which the reaction is transesterification of the constituent unit derived from an (α-substituted) acrylic acid ester at a terminal of a main chain of the diblock copolymer with the homopolymer.
C08F 299/00 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires
B29C 59/00 - Façonnage de surface, p.ex. gaufrage; Appareils à cet effet
B29C 59/02 - Façonnage de surface, p.ex. gaufrage; Appareils à cet effet par des moyens mécaniques, p.ex. par pressage
B29K 81/00 - Utilisation de polymères contenant dans la chaîne principale uniquement du soufre avec ou sans azote, oxygène ou carbone comme matière de moulage
A method for producing a polymer, including reacting a polymer (P1) having a structure represented by General Formula (t1-1) at a terminal of a main chain with a nucleophilic agent in which a pKa of a conjugate acid is 11 or less to obtain a polymer (P2) having a structure represented by Formula (t2-1) at a terminal of a main chain. In formula (t1-1), Z represents a monovalent organic group, and in both formulas, * represents a bonding site bonded to a carbon atom which constitutes a main chain of an adjacent constitutional unit
A method for producing a polymer, including reacting a polymer (P1) having a structure represented by General Formula (t1-1) at a terminal of a main chain with a nucleophilic agent in which a pKa of a conjugate acid is 11 or less to obtain a polymer (P2) having a structure represented by Formula (t2-1) at a terminal of a main chain. In formula (t1-1), Z represents a monovalent organic group, and in both formulas, * represents a bonding site bonded to a carbon atom which constitutes a main chain of an adjacent constitutional unit
A composition for selectively modifying a base material having a surface having two or more regions made of materials that are different from each other and contains a polymer and a solvent, in which the polymer has at least one structure represented by Formula (1-1) at a terminal of a main chain thereof. In the formula, X represents NR1, O, S, or Te; R1 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms; A1 represents a monovalent substituent having substrate adsorbability at a terminal; and * represents a bonding site that is bonded to the main chain of the polymer
A composition for selectively modifying a base material having a surface having two or more regions made of materials that are different from each other and contains a polymer and a solvent, in which the polymer has at least one structure represented by Formula (1-1) at a terminal of a main chain thereof. In the formula, X represents NR1, O, S, or Te; R1 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms; A1 represents a monovalent substituent having substrate adsorbability at a terminal; and * represents a bonding site that is bonded to the main chain of the polymer
*—X-A1 (1-1).
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
A photocurable composition containing metal oxide nanoparticles (X), a photopolymerizable compound (B), and a photoradical polymerization initiator (C), in which the content of the photoradical polymerization initiator (C) is 10 parts by mass or more with respect to 100 parts by mass of the total content of the metal oxide nanoparticles (X) and the photopolymerizable compound (B).
B29C 59/00 - Façonnage de surface, p.ex. gaufrage; Appareils à cet effet
B29C 59/02 - Façonnage de surface, p.ex. gaufrage; Appareils à cet effet par des moyens mécaniques, p.ex. par pressage
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
Provided is a composition having magnetostrictive properties, which contains a component (P): a compound having a polymerizable group, a component (M): a powdery magnetostrictive material, and a component (R): a radical polymerization initiator.
H01F 1/28 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p.ex. de poudre dispersées ou suspendues dans un liant
C08F 299/06 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés à partir de polyuréthanes
C08G 18/42 - Polycondensats contenant des groupes ester carboxylique ou carbonique dans la chaîne principale
C08G 18/67 - Composés non saturés contenant un hydrogène actif
C08G 18/75 - Polyisocyanates ou polyisothiocyanates cycliques cycloaliphatiques
C08K 3/11 - Composés contenant des métaux des groupes 4 à 10 ou des groupes 14 à 16 de la classification périodique
38.
PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT
A photocurable liquid composition capable of forming a cured product in which localization of metal oxide nanoparticles is suppressed, a cured product of the photocurable liquid composition, and a method for producing a cured product using the photocurable liquid composition. As a nitrogen-containing compound, at least one of an amine compound having a specific structure and an imine compound having specific structure is added to the photocurable liquid composition including the photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiator.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
This fluid circuit device includes a block that has a guide portion in which a pipe allowing a fluid sent from a pump to circulate therein is attachable and detachable. The guide portion includes at least one of a recessed portion that guides the pipe along a surface of the block, and a hole portion that guides the pipe through the inside of the block.
A resist composition including a silicon-containing resin and an acid generator component that generates acid upon exposure. The acid generator component includes an onium salt containing an anion moiety having an iodine atom and a cation moiety.
A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term of a Hansen solubility parameter from a polar term of the Hansen solubility parameter.
H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
42.
NEGATIVE PHOTOSENSITIVE COMPOSITION AND METHOD FOR PRODUCING HOLLOW STRUCTURE
A negative photosensitive composition for forming a top plate portion of a hollow structure which contains an epoxy group-containing compound, a cationic polymerization initiator, a polyfunctional (meth)acrylate compound, and a photoradical polymerization initiator.
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p.ex. composés éthyléniques avec des liants
An aqueous cleaning liquid including hydrofluoric acid and tetradecylphosphonic acid, and a method of cleaning an electronic device, contacting the electronic device with the aqueous cleaning liquid.
An object is to provide a porous film which has excellent removal performance of viruses and the like and a long lifetime, a virus removal method which uses the porous film as a filter, a method for producing a virus-free product which uses the porous film as a filter and a device which includes the porous film as a filter. In a porous film including a structure of spherical pores communicating with each other, an interconnected pore is an opening of the spherical pores communicating with each other, and the pore diameter of the interconnected pore is set to 10 nm or more and 35 nm or less, and the number of spherical pores which are present between one surface of the porous film and the other surface thereof and are 50 nm or more and 200 nm or less is set to 200 or more and 1000 or less.
C08J 9/26 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolaires; Leur post-traitement par élimination d'une phase solide d'un objet ou d'une composition macromoléculaire, p.ex. par lessivage
A61L 9/014 - Compositions désodorisantes contenant un matériau sorbant, p.ex. du charbon actif
B01D 46/54 - Séparateurs de particules utilisant des feuilles ou diaphragmes filtrants à structure ultra-fine, p.ex. appareils de précipitation de poussières
B01D 69/02 - Membranes semi-perméables destinées aux procédés ou aux appareils de séparation, caractérisées par leur forme, leur structure ou leurs propriétés; Procédés spécialement adaptés à leur fabrication caractérisées par leurs propriétés
B01D 71/64 - Polyimides; Polyamide-imides; Polyester-imides; Polyamide-acides ou précurseurs similaires de polyimides
C02F 1/44 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par dialyse, osmose ou osmose inverse
45.
PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM
A photosensitive dry film including a chemically amplified positive type photosensitive composition, in which the photosensitive dry film can suppress white turbidity and separation caused by resin contained therein and can prevent bubbles generated while solvent is removed by heating from remaining. The photosensitive dry film including a chemically amplified positive type photosensitive composition includes an acid generating agent, resin having alkali solubility that increases under action of an acid, and organic solvent, the resin including an acrylic resin, the acrylic resin including a constituent unit derived from (meth)acrylate including an acid-non-dissociable alicyclic hydrocarbon group-comprising group, the organic solvent (S) including a high boiling point organic solvent that has a boiling point at atmospheric pressure of 150° C. or more, and a value of δh, a term of energy by hydrogen bonding relating to a Hansen solubility parameter, of 11 (MPa)0.5 or less.
A polymer having a high refractive index and providing a molded product that has excellent solvent resistance; a triazine compound; a method for producing the triazine compound; a method for producing the polymer using the triazine compound; a non-photosensitive liquid composition including the polymer; a method for producing a molded product using the composition; a molded product of the composition; a film formed from the molded product; a microlens formed from the molded product; and an optical element including the microlens. A polymer including a unit having a specific structure in which an aromatic group having a hydroxy group protected with a tert-butoxycarbonyloxy group, a tert-butoxycarbonylamino group, or an acetal protecting group is linked to a triazine ring through a specific linking group.
C08G 73/06 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principale de la macromolécule; Polyhydrazides; Polyamide-acides ou précurseurs similaires de polyimides
A negative photosensitive composition including a novolak-type polyfunctional aromatic epoxy resin (Ap), a trifunctional epoxy monomer (Am), and a sulfonium salt represented by Formula (I0). A mass ratio of (Am)/(Ap) is 5/5 to 8/2. In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4; L is —S—, —O—, —SO—, —SO2—, or —CO— and X− represents a monovalent polyatomic anion
A negative photosensitive composition including a novolak-type polyfunctional aromatic epoxy resin (Ap), a trifunctional epoxy monomer (Am), and a sulfonium salt represented by Formula (I0). A mass ratio of (Am)/(Ap) is 5/5 to 8/2. In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4; L is —S—, —O—, —SO—, —SO2—, or —CO— and X− represents a monovalent polyatomic anion
Provided are a curable composition curing well and having a good film formation ability with an inkjet coating, a cured product of the curable composition, and a method for forming a cured film using the curable composition. The curable composition contains a polyfunctional vinyl ether compound (A), a polyfunctional thiol compound (B), a curing agent (C), a photosensitizing agent (D), and stabilizing agent (E). In the curable composition, a photoradical initiator (C1) and a photoacid generator (C2) are used as the curing agent (C), a carbazole compound is used as the photosensitizing agent (D), and an imidazole compound is used as the stabilizing agent (E).
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p.ex. réticulation par UV qui suit l’impression
C09D 11/102 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
B41J 11/00 - Dispositifs ou agencements pour supporter ou manipuler un matériau de copie en feuilles ou en bandes
B41M 7/00 - Traitement ultérieur des travaux imprimés, p.ex. chauffage, irradiation
50.
METHOD FOR PRODUCING HOLLOW PACKAGE AND METHOD FOR PROVIDING PHOTOSENSITIVE COMPOSITION
A method for producing a hollow package, including forming a side wall on a substrate having an aluminum wire, and forming a top plate portion on the side wall to prepare a hollow structure accommodating the aluminum wire, in which the photosensitive composition that forms the side wall and/or the top plate portion contains an anion represented by General Formula (I1-an) in which A represents a heteroatom, X represents a halogen atom, R represents a monovalent organic group, k represents an integer of 1 to 6, m represents an integer of 0 to 5, n represents an integer of 1 to 3, and m/(k+m) is 0 or greater and less than 0.7)
A method for producing a hollow package, including forming a side wall on a substrate having an aluminum wire, and forming a top plate portion on the side wall to prepare a hollow structure accommodating the aluminum wire, in which the photosensitive composition that forms the side wall and/or the top plate portion contains an anion represented by General Formula (I1-an) in which A represents a heteroatom, X represents a halogen atom, R represents a monovalent organic group, k represents an integer of 1 to 6, m represents an integer of 0 to 5, n represents an integer of 1 to 3, and m/(k+m) is 0 or greater and less than 0.7)
A resist composition containing a resin component having a constitutional unit containing a phenolic hydroxyl group and a compound represented by General Formula (b0-1), in which the proportion of the constitutional unit in the resin component is more than 5% by mole and less than 45% by mole with respect to the total (100% by mole) of all constitutional units constituting the resin component. In the formula, Rb1 represents a hydrocarbon group having 1 or more and 30 or less carbon atoms, n and m represents an integer in a range of 0 to 3, Ra1 and Ra2 represents a hydrogen atom or an organic group, Q1 and Q2 represent a fluorine atom or a perfluoroalkyl group having 1 or more and 6 or less carbon atoms, and L represents an ester bond
A resist composition containing a resin component having a constitutional unit containing a phenolic hydroxyl group and a compound represented by General Formula (b0-1), in which the proportion of the constitutional unit in the resin component is more than 5% by mole and less than 45% by mole with respect to the total (100% by mole) of all constitutional units constituting the resin component. In the formula, Rb1 represents a hydrocarbon group having 1 or more and 30 or less carbon atoms, n and m represents an integer in a range of 0 to 3, Ra1 and Ra2 represents a hydrogen atom or an organic group, Q1 and Q2 represent a fluorine atom or a perfluoroalkyl group having 1 or more and 6 or less carbon atoms, and L represents an ester bond
METAL OXIDE FILM-FORMING COMPOSITION, METHOD FOR PRODUCING METAL OXIDE FILMS USING SAME, AND METHOD FOR REDUCING VOLUME SHRINKAGE RATIO OF METAL OXIDE FILMS
A metal oxide film-forming composition that yields a metal oxide film that exhibits a suppression of volume shrinkage in heating up to 400° C.; a method for producing metal oxide films that uses the metal oxide film-forming composition; and a method for reducing the volume shrinkage ratio of metal oxide films. The metal oxide film-forming composition includes metal oxide nanoclusters, a capping agent, a base material, and solvent. The size of the metal oxide nanoclusters is not more than 5 nm, and the capping agent includes at least one of alkoxysilanes, phenols, alcohols, carboxylic acids, and carboxylic acid halides. In the solid fraction of the metal oxide film-forming composition, the proportion of the mass of the inorganic fraction, with reference to the sum of the mass of the inorganic fraction and the mass of the organic fraction, is at least 25 mass %.
G03F 1/20 - Masques ou masques vierges d'imagerie par rayonnement d'un faisceau de particules chargées [CPB charged particle beam], p.ex. par faisceau d'électrons; Leur préparation
C09D 125/14 - Copolymères du styrène avec des esters non saturés
C09D 7/62 - Adjuvants non macromoléculaires inorganiques modifiés par traitement avec d’autres composés
H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
53.
POLYMERIZABLE COMPOSITION AND MANUFACTURING METHOD FOR ELEMENT-MOUNTED SUBSTRATE
A polymerizable composition and a manufacturing method for an element-mounted substrate using the polymerizable composition. The polymerizable composition includes a water-soluble polymer, a nitrogen-containing monofunctional (meth)acrylic monomer, and a polymerization initiator. The composition is used to restrict a region where a sealing agent can flow in a sealing step in which at least a portion of an element provided on a substrate is sealed by using the sealing agent, and to form a sealing agent restricting material that is removed from the substrate after the sealing step.
C08L 33/26 - Homopolymères ou copolymères de l'acrylamide ou de la méthacrylamide
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
A film cleaning solution that contains a solvent and a metal removing agent, in which two or more kinds of the solvents are contained, and a distance between a Hansen solubility parameter of the film cleaning solution and a Hansen solubility parameter of dimethylacetamide is 1.0 or less.
C11D 7/26 - Composés organiques contenant de l'oxygène
55.
COMPOSITION FOR METAL OXIDE FILM FORMATION, METHOD FOR PRODUCING COMPOSITION FOR METAL OXIDE FILM FORMATION, AND METHOD FOR PRODUCING METAL OXIDE FILM USING THE COMPOSITION FOR METAL OXIDE FILM FORMATION
Provided are a composition for metal oxide film formation, a method for producing the composition for metal oxide film formation, and a method for producing a metal oxide film using the composition for metal oxide film formation, which allow for a decrease in amount of residual metals after washing.
Provided are a composition for metal oxide film formation, a method for producing the composition for metal oxide film formation, and a method for producing a metal oxide film using the composition for metal oxide film formation, which allow for a decrease in amount of residual metals after washing.
The composition for metal oxide film formation according to an embodiment of the invention contains metal oxide nanoparticles, a capping agent, a polycarboxylic acid compound, and a solvent, wherein the metal oxide nanoparticles have a size of 5 nm or less; the capping agent includes at least one selected from the group consisting of an alkoxysilane, a phenol, an alcohol, a carboxylic acid, and a carboxylic acid halide; at least one of molecular chain(s) linking any two carboxy groups in the polycarboxylic acid compound has a side chain optionally having a heteroatom, and the side chain has an alkyl group; and in the solid content of the composition for metal oxide film formation, the ratio of the mass of inorganic matter is 25% by mass or more.
C23C 20/08 - Revêtement avec des matériaux inorganiques autres que des matériaux métalliques avec des composés, des mélanges ou des solutions solides, p.ex. borures, carbures, nitrures
56.
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A resist composition containing a metal compound, in which a structure of the metal compound is changed upon exposure, and the metal compound exhibits changed solubility in a developing solution, in which the metal compound includes a cubane-structured metal oxide.
An etchant composition including an oxidizing agent, an organic tertiary amine or quaternary amine represented by the following Formula (1) or Formula (2), a basic compound, and a solvent, the etchant composition having a pH value of 7 or higher.
An etchant composition including an oxidizing agent, an organic tertiary amine or quaternary amine represented by the following Formula (1) or Formula (2), a basic compound, and a solvent, the etchant composition having a pH value of 7 or higher.
An etchant composition including an oxidizing agent, an organic tertiary amine or quaternary amine represented by the following Formula (1) or Formula (2), a basic compound, and a solvent, the etchant composition having a pH value of 7 or higher.
In Formula (1) and Formula (2), R1 and R2 each independently represents an alkyl group having 1 to 4 carbon atoms or a group represented by —(C2H4O)nH, where n represents 1 or 2, and R1 and R2 may be bonded to each other to form a nitrogen-containing heterocyclic ring together with the nitrogen atom; and R3 represents a linear alkyl group having 4 to 18 carbon atoms, which may be substituted with a hydroxy group or an amino group at a terminal, and a methylene group included in the linear alkyl group may be substituted with an oxygen atom.
An etchant for selectively removing, from a semiconductor substrate, a tungsten-containing hard mask having compatibility with silicon germanium (SiGe) or silicon phosphorus (SiP), the etchant including an organic solvent, a sulfur-containing salt, and an oxidant.
C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
Provided are: a surface treatment liquid having a hydrophilization effect that is not easily deteriorated over time even if a surface-treated article is exposed to various agents; and a surface treatment method using the surface treatment liquid. The surface treatment liquid contains a resin (A) and a solvent (S). The resin (A) contains a constituent unit (a1) derived from a betaine monomer comprising a group having an ethylenically unsaturated double bond, a cationic group, and an anionic group, and not comprising an ester bond or an amide bond. The cationic group is preferably a quaternary nitrogen cation group, and the anionic group is preferably a sulfonic acid anion group, a phosphonic acid anion group, or a carboxylic acid anion group.
A production method of niobium(V) oxide nanocrystals is provided which is capable of obtaining niobium(V) oxide nanocrystals having a size of less than 100 nm in a state where an amorphous phase is less likely to be generated. The production method of niobium(V) oxide nanocrystals according to the present invention includes heating a mixture containing a pentaalkoxyniobium(V), water, and a water-soluble solvent to 255° C. or higher to allow a hydrothermal reaction to proceed, wherein alkoxy groups in the pentaalkoxyniobium(V) are independently an alkoxy group having 2 to 5 carbon atoms. A molar ratio between water and pentaalkoxyniobium(V) is preferably 0.20 or more. The hydrothermal reaction is preferably allowed to proceed at a pressure of 400 psi or more.
A negative-tone resist composition containing a silicon-containing resin, an acid generator component that generates acid upon exposure, and a crosslinking agent component. The silicon-containing resin (A) contains a silicon-containing polymer having a phenolic hydroxyl group, and the acid generator component contains a sulfonium salt having a fluorine atom in a cation moiety.
A photoresist stripper including a quaternary ammonium hydroxide, an alkanolamine compound, and an organic solvent, in which a content of the component is in a range of 45% to 90% by mass, and the component contains a nitrogen-containing heterocyclic aromatic compound.
A radio wave absorber with which it is possible to obtain both excellent radio wave absorption characteristics in a high-frequency band and excellent heat dissipation characteristics, and a radio wave absorber formation paste suitable for use in producing the radio wave absorber. The radio wave absorber includes a composite layer made of a radio wave absorption material and a thermally conductive material, the radio wave absorption material includes one or more types of an ε-Fe2O3 crystal; and a crystal in which the crystal and the space group are identical to those of ε-Fe2O3 and a part of an Fe site of the ε-Fe2O3 is substituted with an element M other than Fe, and that is represented by the formula ε-MxFe2-xO3 in which x is greater than 0 and less than 2.
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenne; Combinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
C09K 5/14 - Substances solides, p.ex. pulvérulentes ou granuleuses
Nanoparticles including inorganic oxide particles and having good dispersibility, a dispersion of nanoparticles including said nanoparticles, and a production method of said nanoparticles are provided. Surfaces of inorganic oxide particles is functionalized with a functionalizing agent including niobium compound having a specific structure and a silane compound having a specific structure. The inorganic oxide particles are preferably titanium oxide particles or zirconium oxide particles. Average primary particle size of the nanoparticles measured by X-ray diffraction method is preferably 3 nm or more and 20 nm or less.
A surface treatment liquid which adhesiveness of a component that achieves a surface treatment effect is good, and a desired surface treatment effect is easily obtained, and a surface treatment method using the surface treatment liquid are provided.
A surface treatment liquid which adhesiveness of a component that achieves a surface treatment effect is good, and a desired surface treatment effect is easily obtained, and a surface treatment method using the surface treatment liquid are provided.
A surface treatment liquid including a resin (A) and a solvent (S), in which the resin (A) includes a constituent unit (a1) derived form a compound having a hydrophilic group and an ethylenic double bond and a constituent unit (a2) derived from a compound a nitrogen-containing heterocyclic group, an ethylenic double bond, and a specific type of polar group is used.
C09D 139/04 - Homopolymères ou copolymères de monomères contenant des hétérocycles possédant de l'azote dans le cycle
C09D 147/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carbone; Compositions de revêtement à base de dérivés de tels polymères
To provide a radiation sheet that exhibits favorable heat dissipating performance, a heat dissipation plate including the radiation sheet, a heat dissipation device provided with the heat dissipation plate, and a curable paste capable of being suitably used for forming the above-mentioned radiation sheet. A sheet including a cured material of a curable paste that contains a polymerizable monomer (A) having only an ethylenic unsaturated double bond-containing group as a polymerizable group, a radical polymerization initiator (B) and a layered silicate (C) is used as a radiation sheet.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
68.
CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE
A chemically amplified positive-type photosensitive composition capable of forming a patterned resist film having a square cross-section of a nonresist portion and good plating liquid resistance, even when forming a thick patterned resist film; a photosensitive dry film including a photosensitive layer consisting of the photosensitive composition; a production method of a substrate having a template for plating using the photosensitive composition; and a production method of a plated article using the substrate having the template formed by the aforementioned method. An acrylic resin having a constituent unit derived from a crosslinkable monomer which meets predetermined requirements as a resin is added to a chemically amplified positive-type photosensitive composition containing an acid generator which generates an acid by irradiation of active rays or radioactive rays and the resin, and a calculated value of glass transition temperature of hypothetical non-crosslinked acrylic resin which the constituent unit is excluded from the acrylic resin is set to 90° C. or higher and 120° C. or lower.
A surface treatment liquid capable of forming a hydrophilic resinous coating film adhering well to a surface of an object to be surface-treated and providing a surface treatment effect that does not decrease over time, even when the surface-treated article is exposed to a variety of agents, and a surface treatment method using the surface treatment liquid is provided.
A surface treatment liquid capable of forming a hydrophilic resinous coating film adhering well to a surface of an object to be surface-treated and providing a surface treatment effect that does not decrease over time, even when the surface-treated article is exposed to a variety of agents, and a surface treatment method using the surface treatment liquid is provided.
A surface treatment liquid including a polymerizable compound (A), a thermal polymerization initiator (B), and a solvent (S),
in which the polymerizable compound (A) includes a betaine monomer (a1) having a group including an ethylenic unsaturated double bond, an anionic group, and a cationic group, an unsaturated group-containing silicon compound (a2) having a group including an ethylenic unsaturated double bond, and a hydrolyzable silyl group, and/or a polar polymerizable compound (a3) having an ethylenic unsaturated double bond, and a polar group selected from amino group, carboxylic group, mercapto group, hydroxy group, and cyano group is used.
C08F 236/20 - Copolymères de composés contenant plusieurs radicaux aliphatiques non saturés et l'un au moins contenant plusieurs liaisons doubles carbone-carbone le radical ne contenant que deux doubles liaisons carbone-carbone non conjuguées
C08F 226/06 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par une liaison simple ou double à l'azote ou par un hétérocyc par un hétérocycle contenant de l'azote
C09D 147/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carbone; Compositions de revêtement à base de dérivés de tels polymères
C09D 139/04 - Homopolymères ou copolymères de monomères contenant des hétérocycles possédant de l'azote dans le cycle
70.
RINSING SOLUTION, METHOD OF TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A rinsing solution for rinsing a substrate with a protrusion portion, including an organic solvent (S1) that contains no hydroxyl group or fluorine atom and that has a dynamic viscosity of equal to or smaller than 1.05×106 m2/s. A method of treating a substrate with a protrusion portion, including a step (A) of bringing the rinsing solution into contact with a surface of the substrate with the protrusion portion, the protrusion portion being formed on the surface; and a step (B) of removing the rinsing solution from the surface on which the protrusion portion is formed.
A composition that gives a cured product having both of high refractive index and high light transmittance, and a cured product of said composition are provided. In the composition including a photopolymerizable compound (A) and metal oxide particles (B), metal oxide particles (B) where those surfaces are functionalized with a functionalizing agent, and which are composed of a metal oxide that exhibits a refractive index of 2.0 or higher for light at a wavelength of 550 nm are used, and a first functionalizing agent including a metal atom having HOMO-LUMO band gap of more than 3.1 eV and 6.0 eV or less, and a second functionalizing agent having a spacer group and not corresponding to the first functionalizing agent are used as the functionalizing agent in combination.
C08F 136/22 - Homopolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carbone le radical contenant au moins trois doubles liaisons carbone-carbone
C08K 3/11 - Composés contenant des métaux des groupes 4 à 10 ou des groupes 14 à 16 de la classification périodique
A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator which includes a sulfonium salt represented by General Formula (I0). In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom. k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4. A is a group represented by —S—, —O—, —SO—, —SO2—, or —CO—. X− represents a monovalent polyatomic anion
A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator which includes a sulfonium salt represented by General Formula (I0). In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom. k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4. A is a group represented by —S—, —O—, —SO—, —SO2—, or —CO—. X− represents a monovalent polyatomic anion
G03F 7/42 - Elimination des réserves ou agents à cet effet
G03F 7/32 - Compositions liquides à cet effet, p.ex. développateurs
G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
73.
CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE
A chemically amplified photosensitive composition capable of forming a template for plating which can form a plated article with uniform dimensions by photolithography method; a photosensitive dry film including a photosensitive layer consisting of this chemically amplified photosensitive composition; a production method of a substrate having a template for plating using the aforementioned chemically amplified photosensitive composition; and a production method of a plated article using the substrate having the template formed by the aforementioned method. A coumarin compound is blended into a chemically amplified photosensitive composition containing an acid generator which generates an acid by irradiation of active rays or radioactive rays.
A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
C08G 8/24 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes de formaldéhyde, p.ex. de formaldéhyde formé in situ avec des mélanges de plusieurs phénols qui ne sont pas couverts par un seul des groupes
C08G 61/12 - Composés macromoléculaires contenant d'autres atomes que le carbone dans la chaîne principale de la macromolécule
C09D 125/14 - Copolymères du styrène avec des esters non saturés
C09D 161/06 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes avec des phénols
C09D 165/00 - Compositions de revêtement à base de composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principale; Compositions de revêtement à base de dérivés de tels polymères
G03F 7/16 - Procédés de couchage; Appareillages à cet effet
H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
A cleaning liquid for cleaning a substrate in which at least one of molybdenum and tungsten is exposed on a surface, in which the cleaning liquid includes at least one of a compound represented by General Formula (a1), a hydrate of the compound, and a salt of the compound, a water-soluble basic compound with a pH of 9.5 or more in a 0.1 M aqueous solution, which is measured at 23° C. with a pH meter, and water. In General Formula (a1), R1 and R2 each independently represents an organic group including no carbonyl group or a hydrogen atom
A cleaning liquid for cleaning a substrate in which at least one of molybdenum and tungsten is exposed on a surface, in which the cleaning liquid includes at least one of a compound represented by General Formula (a1), a hydrate of the compound, and a salt of the compound, a water-soluble basic compound with a pH of 9.5 or more in a 0.1 M aqueous solution, which is measured at 23° C. with a pH meter, and water. In General Formula (a1), R1 and R2 each independently represents an organic group including no carbonyl group or a hydrogen atom
A cleaning liquid for cleaning a substrate having a first metal atom-containing layer that contains ruthenium and a second metal atom-containing layer that contains a metal atom other than ruthenium, both of the layers contacting each other, and at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface. The cleaning liquid includes at least one of a compound represented by General Formula (a1), a hydrate of the compound, and a salt of the compound, and at least one amine other than the hydrazine compound and a quaternary hydroxide. In General Formula (a1), R1 and R2 represent an organic group including no carbonyl group or a hydrogen atom
A cleaning liquid for cleaning a substrate having a first metal atom-containing layer that contains ruthenium and a second metal atom-containing layer that contains a metal atom other than ruthenium, both of the layers contacting each other, and at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface. The cleaning liquid includes at least one of a compound represented by General Formula (a1), a hydrate of the compound, and a salt of the compound, and at least one amine other than the hydrazine compound and a quaternary hydroxide. In General Formula (a1), R1 and R2 represent an organic group including no carbonyl group or a hydrogen atom
A resist composition which generates an acid when the resist composition is exposed and whose solubility with respect to a developing liquid varies by action of the acid. The resist composition contains a base material component whose solubility with respect to a developing liquid is varied by action of an acid and an acid generator component that generates an acid when the acid generator component is exposed. The base material component contains a polymer compound that includes a constituent represented by a general formula (a-1) described in the specification and a constituent (a2) represented by a general formula (a-2) described in the specification. The acid generator component contains a compound represented by a general formula (b1) described in the specification.
A method for treating surface of substrate, the method including forming a film including a high molecular weight condensate of a silylation agent on the surface thereof to allow a substrate having a plurality of regions to be modified at modification degrees that are different depending on materials of the regions on a surface of the substrate. The method includes preparing a substrate having a surface including two or more regions having different materials; exposing the surface to a surface treatment agent; and baking the substrate, the method not including rinsing the surface with a liquid between the exposing and the baking, the surface treatment agent including a silylation agent and not a nitrogen-containing heterocyclic compound, the silylation agent including organomonosilane that has 2 to 4 nitrogen atoms bonded to a silicon atom.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
C09D 183/14 - Compositions de revêtement à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carbone; Compositions de revêtement à base de dérivés de tels polymères dans lesquels au moins deux atomes de silicium, mais pas la totalité, sont liés autrement que par des atomes d'oxygène
C08G 77/62 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant du silicium, avec ou sans soufre, azote, oxygène ou carbone dans lesquels tous les atomes de silicium sont liés autrement que par des atomes d'oxygène par des atomes d'azote
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c. à d. procédés de dépôt chimique en phase vapeur (CVD) caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
A metal resist remover containing a solvent and a sulfuric acid, in which a pH value, which is measured with a pH meter, of a liquid formed by subjecting the cleaning liquid to a 10-fold dilution with pure water is 2.5 or less.
A metal resist remover containing a solvent and a strong acid that is liquid at 20° C., in which a pH value, which is measured with a pH meter, of a liquid formed by subjecting the cleaning liquid to a 10-fold dilution with pure water is 2.5 or less.
Provided are an introduction step of using a particle capturing device (1) for introducing a fluid including target particles (CT) and non-target particles (CA)-(CC) from an inlet channel (18) into a chamber (20), an enrichment step of enriching the target particles (CT) and at least a part of the non-target particles (CA) in a filter (12) by discharging at least a part of the fluid through the first outlet channel (8), a separation step of separating the filtered out non-target particles (CA) from the target particles (CT) by a suction unit (30), and a storage step of storing the target particles (CT) in wells.
A resist pattern formation method including forming a resist film on a support by using a resist composition; exposing the resist film; and subjecting the exposed resist film to alkali development to form a positive-tone resist pattern. The resist composition contains a first resin component and a second resin component. The first resin component contains a polymeric compound having a constitutional unit derived from acrylic acid in which a hydrogen atom bonded to a carbon atom at an α-position may be substituted with a substituent, and the second resin component contains a polymeric compound having both a constitutional unit containing a phenolic hydroxyl group and a constitutional unit containing an acid decomposable group having a polarity that is increased under action of acid.
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08F 220/06 - Acide acrylique; Acide méthacrylique; Leurs sels métalliques ou leurs sels d'ammonium
C08F 220/28 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle ne contenant pas de cycles aromatiques dans la partie alcool
83.
CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, AND ACID DIFFUSION SUPPRESSING AGENT
A chemically amplified positive-type photosensitive composition which easily forms a resist pattern having a high resolution, high dimensional controllability and satisfactory cross-sectional rectangularity; a photosensitive dry film which has a photosensitive layer including the chemically amplified positive-type photosensitive composition; a method of manufacturing the photosensitive dry film; a method of manufacturing a patterned resist film using the chemically amplified positive-type photosensitive composition; and an acid diffusion suppressing agent which is to be mixed with the chemically amplified positive-type photosensitive composition. An acid diffusion inhibitor having a specific structure is mixed in the chemically amplified positive photosensitive composition which includes: an acid generator that generates acid due to irradiation with active light rays or radiation; and a resin that has a solubility for alkali that increases as a result of the action of the acid.
A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymeric compound having a constitutional unit (a0) represented by General Formula (a0-1), a compound (B1) represented by General Formula (b1), and a compound (D1) represented by General Formula (d1). In the formulas, R represents a hydrogen atom; Va01 represents a divalent linking group; naoi represents an integer of 1 or 2; Ra01 represents a lactone-containing cyclic group having a cyano group; Yb01 represents a divalent linking group or a single bond; Lb01 represents —C(═O)—O—; Rb01 to Rb03 represent an alkyl group; Rb04 to Rb06 represent an alkyl group; nb04 represents an integer of 0 to 4; nb05 and nb06 represent an integer of 0 to 5; X− represents a counter anion; Rd01 represents a cyclic group; and Mm+ represents an m-valent organic cation
A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymeric compound having a constitutional unit (a0) represented by General Formula (a0-1), a compound (B1) represented by General Formula (b1), and a compound (D1) represented by General Formula (d1). In the formulas, R represents a hydrogen atom; Va01 represents a divalent linking group; naoi represents an integer of 1 or 2; Ra01 represents a lactone-containing cyclic group having a cyano group; Yb01 represents a divalent linking group or a single bond; Lb01 represents —C(═O)—O—; Rb01 to Rb03 represent an alkyl group; Rb04 to Rb06 represent an alkyl group; nb04 represents an integer of 0 to 4; nb05 and nb06 represent an integer of 0 to 5; X− represents a counter anion; Rd01 represents a cyclic group; and Mm+ represents an m-valent organic cation
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
85.
CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, METHOD FOR PRODUCING SUBSTRATE PROVIDED WITH TEMPLATE, AND METHOD FOR PRODUCING A PLATED ARTICLE
A chemically amplified positive-type photosensitive resin composition with which a resist pattern having a rectangular cross-sectional shape is easily formed, which has satisfactory sensitivity, and which can suppress decomposition of the acid generating agent; a photosensitive dry film having a photosensitive layer including the photosensitive resin composition; a method for producing the photosensitive dry film; a method for producing a patterned resist film using the positive-type photosensitive resin composition; a method for producing a substrate provided with a template using the positive-type photosensitive resin composition; and a method for producing a plated article using the positive-type photosensitive resin composition. The photosensitive resin composition includes an acid generating agent to generate an acid by irradiation with an active ray or radiation, a resin having alkali solubility that increases under action of an acid, and an acid diffusion suppressing agent, wherein the acid generating agent includes a non-ionic acid generating agent that generates sulfonic acid upon the irradiation, and the acid diffusion suppressing agent includes a compound having a specific structure that is decomposed by the irradiation.
A curable composition capable of forming a cured product having a high transparency, a resistance to loss of transparency when heated, and an excellent organic solvent resistance, a cured product of the curable composition, and a method for producing a cured film using the curable composition. A polymerizable fluorene compound having a radical polymerizable group-containing group or a cationic polymerizable group-containing group and a fluorene skeleton as a polymerizable compound, and thermal initiator as an initiator are used in a curable composition including a polymerizable compound, metal oxide microparticles (B) including titanium oxide microparticles, an initiator, and a solvent.
C09D 4/00 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
87.
PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT
A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a silicone resin is used as the base component, and a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination at a specific ratio.
A metal oxide film-forming composition including a tertiary alkyloxycarbonyloxy group-containing aromatic hydrocarbon ring-modified fluorene compound represented by Formula (1) below; metal oxide nanoparticles surface-treated with a capping agent; and a solvent. In the formula, ring Z1 represents an aromatic hydrocarbon ring, R1a and R1b each independently represents a halogen atom, a cyano group, or an alkyl group, R2a and R2b each independently represents an alkyl group, R3a, R3b, R4a, R4b, R5a, and R5b each independently represents an alkyl group having 1 to 8 carbon atoms, k1 and k2 each independently represents an integer of 0 or more and 4 or less, and m1 and m2 each independently represents an integer of 0 or more and 6 or less
A metal oxide film-forming composition including a tertiary alkyloxycarbonyloxy group-containing aromatic hydrocarbon ring-modified fluorene compound represented by Formula (1) below; metal oxide nanoparticles surface-treated with a capping agent; and a solvent. In the formula, ring Z1 represents an aromatic hydrocarbon ring, R1a and R1b each independently represents a halogen atom, a cyano group, or an alkyl group, R2a and R2b each independently represents an alkyl group, R3a, R3b, R4a, R4b, R5a, and R5b each independently represents an alkyl group having 1 to 8 carbon atoms, k1 and k2 each independently represents an integer of 0 or more and 4 or less, and m1 and m2 each independently represents an integer of 0 or more and 6 or less
NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMATION METHOD, CURED FILM, CURED FILM PRODUCTION METHOD, AND ROLLED BODY
A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.
A surface treatment agent including a compound represented by the general formula HO—P(═O)R1R2 in which R1 and R2 are each independently bonded to the phosphorus atom and are each independently a hydrogen atom, an alkyl group, a fluorinated alkyl group, or an aromatic hydrocarbon group which may have a substituent, provided that R1 and R2 are not hydrogen atoms at the same time, and an organic solvent.
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c. à d. procédés de dépôt chimique en phase vapeur (CVD) caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
91.
PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT
A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination such that the ratio of the mass W2 of the oxime ester compound is 35% by mass or more relative to sum of a mass W1 of the phosphine oxide compound and the mass W2 of the oxime ester compound.
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
92.
PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT
A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and applicable to an inkjet method even though the photosensitive ink composition does not include the solvent, or include small amount of the solvent, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the above photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, metal compound particles, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure as the photopolymerizable compound, and at least one selected from the group consisting of titanium oxide particles, barium titanate particles, cerium oxide particles, and zinc sulfide particles, as the metal compound particles are used.
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p.ex. composés éthyléniques avec des substances accroissant la photosensibilité, p.ex. photo-initiateurs
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
93.
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
A laminate that can be used for diffusing an impurity diffusion component into a semiconductor substrate and manufactured by a method with good film formability, and which allows sufficient diffusion of the impurity diffusion component; a method for manufacturing the laminate; and a method for manufacturing a semiconductor substrate using the laminate. The laminate includes a diffusion-undergoing semiconductor substrate, an amine compound layer, and an impurity diffusion component layer, the amine compound layer is in contact with one main surface of the diffusion-undergoing semiconductor substrate, the impurity diffusion component layer is in contact with a main surface of the amine compound layer, the main surface is not in contact with the diffusion-undergoing semiconductor substrate, and the amine compound layer includes an amine compound including two or more nitrogen atoms and having an amino group constituted by at least one of the two or more nitrogen atoms; and/or an amine compound residue having one or more amino groups and bonding to the main surface via a covalent bond.
H01L 21/225 - Diffusion des impuretés, p.ex. des matériaux de dopage, des matériaux pour électrodes, à l'intérieur ou hors du corps semi-conducteur, ou entre les régions semi-conductrices; Redistribution des impuretés, p.ex. sans introduction ou sans élimination de matériau dopant supplémentaire en utilisant la diffusion dans ou hors d'un solide, à partir d'une ou en phase solide, p.ex. une couche d'oxyde dopée
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/22 - Diffusion des impuretés, p.ex. des matériaux de dopage, des matériaux pour électrodes, à l'intérieur ou hors du corps semi-conducteur, ou entre les régions semi-conductrices; Redistribution des impuretés, p.ex. sans introduction ou sans élimination de matériau dopant supplémentaire
94.
METHOD FOR MANUFACTURING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PREMIX SOLUTION FOR PREPARING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, METHOD FOR MANUFACTURING PHOTOSENSITIVE DRY FILM, AND METHOD FOR MANUFACTURING PATTERNED RESIST FILM
A method for manufacturing a chemically amplified photosensitive composition capable of reducing a foreign matter derived from a sulfur-containing compound. The method includes an acid generating agent which generates an acid by irradiation with an active ray or radiation, a sulfur-containing compound which is a solid at room temperature, a first solvent having a Hansen solubility parameter in which a polar term δp is 10 (MPa0.5) or more, and a second solvent which is different than the first solvent, the method including preparing a solution of the sulfur-containing compound by dissolving the sulfur-containing compound in the first solvent, and blending the solution of the sulfur-containing compound, the acid generating agent, and the second solvent.
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 18/10 - Esters vinyliques d'acides monocarboxyliques contenant au moins trois atomes de carbone
C08F 36/14 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carbone le radical ne contenant que deux doubles liaisons carbone-carbone conjuguées contenant des éléments autres que le carbone et l'hydrogène
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p.ex. polyxylylènes uniquement des atomes de carbone aliphatiques
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
96.
CLEANING COMPOSITION, METHOD OF CLEANING COATING FILM FORMING DEVICE, METHOD OF PRODUCING SUBSTRATE FOR LITHOGRAPHY, AND METHOD OF FORMING RESIST PATTERN
A cleaning composition which is used for cleaning a coating film forming device, the composition including an acid component having a pKa of 12 or less.
A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and a high transparency, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure are used as the photopolymerizable compound, and a phosphine oxide compound and an oxime ester compound are used as the photopolymerization initiator.
A resist composition containing a base material component and a compound represented by General Formula (d0), in which in the formula, Rd0 represents a condensed cyclic group containing a condensed ring containing at least one aromatic rings, the condensed cyclic group having, as a substituent, an acid decomposable group which is decomposed under action of acid to form a polar group, Yd0 represents a divalent linking group or a single bond, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more
A resist composition containing a base material component and a compound represented by General Formula (d0), in which in the formula, Rd0 represents a condensed cyclic group containing a condensed ring containing at least one aromatic rings, the condensed cyclic group having, as a substituent, an acid decomposable group which is decomposed under action of acid to form a polar group, Yd0 represents a divalent linking group or a single bond, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more
The objective of the invention is to provide a wavelength conversion film demonstrating a high optical density, a wavelength conversion film forming composition used suitably for forming the wavelength conversion film, and a production method for a cluster-containing quantum dot that may be applied suitably to the wavelength conversion film and the wavelength conversion film forming composition. In this invention, for a wavelength conversion film containing a quantum dot converting blue light into red light or green light, the light beam transmittance of the wavelength conversion film at 450 nm wavelength is set to 40% or lower, the light beam transmittance of the wavelength conversion film at 650 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is red, and the light beam transmittance of the wavelength conversion film at 550 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is green.
A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light-absorbing agent, a basic compound, and a solvent. The basic compound is an alkylamine, an alkanolamine, an imidazole compound, ammonia, or an alkali metal hydroxide. The light-absorbing agent content of the protective film forming agent is 0.1-10 mass % (inclusive).
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
brevets
