An assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The assembled battery contains the battery cells, a flameproof material covering the peripheral surface of the battery cells, and a heat dissipation member covering the peripheral surface of the battery cells which is covered with the flameproof material.
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p.ex. ronde ou elliptique
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
H01M 10/6555 - Barres ou plaques disposées entre les éléments
H01M 50/474 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES - Détails de construction ou procédés de fabrication des parties non actives des cellules électrochimiques autres que les piles à combustible, p.ex. piles hybrides Éléments d’espacement dans les cellules Éléments d'espacement à l'intérieur des cellules autres que les séparateurs, les membranes ou les diaphragmes; Leurs procédés de fabrication caractérisés par leur position dans les cellules
H01M 50/477 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES - Détails de construction ou procédés de fabrication des parties non actives des cellules électrochimiques autres que les piles à combustible, p.ex. piles hybrides Éléments d’espacement dans les cellules Éléments d'espacement à l'intérieur des cellules autres que les séparateurs, les membranes ou les diaphragmes; Leurs procédés de fabrication caractérisés par leur forme
This optical waveguide includes: a core 51 provided with a first surface 511 and a second surface 512 on the side opposite the first surface 511; a first cladding layer 521 formed so as to adjoin the first surface 511; and a second cladding layer 522 formed so as to adjoin the second surface 512. One end of the optical waveguide 5 includes a first end surface F1 and a second end surface F2. The first end surface F1 is a surface which is substantially flush with the core 51 and the first cladding layer 521, and at which the core is exposed. The second end surface F2 is a surface of the second cladding layer 522 which extends from the first end surface F1.
This connection structure includes, on a wiring substrate 100, an optical waveguide 5 and an optical element E1. The optical waveguide 5 includes: a core 51 provided with a first surface 511 and a second surface 512 on the side opposite the first surface 511; a first cladding layer 521 formed so as to adjoin the first surface 511; and a second cladding layer 522 formed so as to adjoin the second surface 512. One end 5a of the optical waveguide 5 includes a first end surface F1 and a second end surface F2. The first end surface F1 is a surface which is substantially flush with the core 51 and the first cladding layer 521, and at which the core is exposed. The second end surface F2 is a surface of the second cladding layer 522 which extends from the first end surface F1. The optical element E1 includes an exposed light-receiving surface or light-emitting surface. The light-receiving surface or light-emitting surface of the optical element E1 faces a light transmission surface which is a part of the core 51 and which is exposed at the first end surface F1. The optical element is disposed on the second end surface F2.
Provided is a bus bar that can be protected from high temperature and flames from a battery cell in the case of a battery abnormality, as well as collisions with broken objects. Also provided is a method for manufacturing a bus bar, the method not requiring winding work such as that necessary for mica sheets, thereby being free from problems such as winding unevenness, formation of gaps between sheets, and separation of sheets, the method being easily applicable to the manufacturing of a bus bar that has a complicated shape. A bus bar (1) is used in an electric power storage device that includes a battery cell (110), the bus bar having a bus bar body (5) that includes an electrically conductive material, said bus bar body being covered by an insulating film that includes an insulating material and one or both of an organic fibrous material and an inorganic fibrous material. In addition, in the method for manufacturing the bus bar (1), the bus bar body (5) that includes an electrically conductive material is coated with a coating solution that includes the insulating material and one or both of the organic fibrous material and the inorganic fibrous material, and is then dried.
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
5.
MAT MATERIAL, EXHAUST GAS PURIFICATION DEVICE, AND METHOD FOR MANUFACTURING MAT MATERIAL
Provided is a mat material wherein, on at least one of first and second principal surfaces of a base material mat containing inorganic fibers and having the first and second principal surfaces, a network is formed by a plurality of base parts made up of organic matter and fibers extending in at least two directions from each of the plurality of base parts.
This heat insulating material covers a periphery of a heat generating body, and is characterized in that: the heat insulating material includes, in a thickness direction thereof, at least three layers having different specific gravities; each of the at least three layers includes carbon fibers; if the at least three layers are defined as a first heat insulating material layer, a second heat insulating material layer and a third heat insulating material layer, in order from the side closest to the heat generating body, and the specific gravities of the first heat insulating material layer, the second heat insulating material layer and the third heat insulating material layer are defined as S1, S2 and S3, respectively, then S1>S2>S3, and S1: 0.10 to 0.30 g/cm3, S2: 0.06 to 0.20 g/cm3, and S3: 0.03 to 0.10 g/cm3; and if thicknesses of the first heat insulating material layer, the second heat insulating material layer and the third heat insulating material layer are defined as T1, T2 and T3 respectively, then T1>T2>T3, and ratios of the thicknesses of each heat insulating material layer to the overall thickness of the heat insulating material are T1 ratio: 40% or more and 60% or less, T2 ratio: 20% or more and 40% or less, and T3 ratio: 10% or more and less than 30%.
F16L 59/14 - Dispositions pour l'isolation des tuyaux ou des tuyauteries
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
C04B 35/80 - Fibres, filaments, "whiskers", paillettes ou analogues
C04B 35/83 - Fibres de carbone dans une matrice carbonée
A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A wiring board (1) according to an embodiment comprises an electric wiring portion (2) including insulating layers (21, 22, 32) and conductor layers (11, 12, 31); an optical wiring portion (3) disposed on one surface (2a) of the electric wiring portion (2); and a component area (CA) where it is possible to dispose a component (E1) on the optical wiring portion (3). The optical wiring portion (3) includes an optical waveguide (5) including a core portion (51) and a cladding portion (52); and a support substrate (6) that includes a conductor area (CA), which has a conductor, and a non-conductor area (NC), and that is provided with a first face (6b) on the side where the component (E1) is disposed and a second face (6a) on the electric wiring portion (2) side. The support substrate (6) has a thermal expansion coefficient lower than the thermal expansion coefficient of the optical waveguide (5). In the non-conductor area (NC), the optical waveguide (5) is formed on the first face (6b) of the support substrate (6). In the conductor area (CA), a through conductor (61) is included that passes between the first face (6b) of the support substrate (6) and the second face (6a) of the support substrate (6).
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulating layer, and interlayer conductors formed along wall surfaces surrounding the through holes such that each interlayer conductor has a film-like shape and is connecting the first and second conductor layers. The interlayer conductors include first conductors formed in first region of the insulating layer and second conductors formed in second region of the insulating layer at density higher than density of the first conductors, and a thickness of each first interlayer conductor in its end part is substantially same as or larger than a thickness of each second conductor in its end part and a thickness of each first conductor in its center part is larger than a thickness of each second conductor in its center part.
A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the inorganic particles include first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin, the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin respectively, and the first surface of the resin insulating layer includes a surface of the resin and surfaces of the first portions exposed from the surface of the resin.
A drill for forming through holes in a glass fiber reinforced substrate includes a drill body having a cutting edge part on a front end side, and a neck part on a base end side. The cutting edge part has a larger diameter than the neck part. The drill body has a step formed between the cutting edge and neck parts and a single continuous chip evacuation groove having main and secondary grooves. The main groove has an L-shaped cross section and is extending from front end of the cutting edge part over the step to the neck part. The secondary groove has a U-shaped cross section and smaller groove width and depth than the main groove and is extending along the main groove from the front end of the cutting edge part over the step to the neck part and merging into the main groove at the neck part.
A heat transfer suppression sheet for a battery pack, the heat transfer suppression sheet being used in a battery pack in which battery cells are connected in series or in parallel, and being interposed between the battery cells, the heat transfer suppression sheet containing a heat-insulating material containing at least one of inorganic particles or inorganic fibers, and a covering material covering at least a part of the heat-insulating material, in which a gap is formed between the heat-insulating material and the covering material.
[Problem] The purpose of the present invention is to provide a coil substrate having a high space factor. [Solution] A coil substrate 10 according to the present embodiment has a flexible substrate 22 that has one end 22L and another end 22R, and a coil C that is formed on the flexible substrate 22. At least three coils C partially overlap one another.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
15.
HEAT TRANSFER SUPPRESSION SHEET FOR BATTERY PACK, AND BATTERY PACK
A heat transfer suppression sheet for a battery pack, the heat transfer suppression sheet being used in a battery pack in which battery cells are connected in series or in parallel and being interposed between the battery cells, the heat transfer suppression sheet containing: a heat-insulating material containing at least one of inorganic particles or inorganic fibers; and a covering material covering at least a part of the heat-insulating material, in which a sealed gap is formed between the heat-insulating material and the covering material, and the covering material is configured such that a communication opening that allows the gap to communicate with the outside of the covering material is formed at a temperature of 60° C. or more.
A conduction inspection jig includes a first member having first openings and a flexural strength of 300 MPa or higher, a second member having second openings and positioned above the first member, a support member positioned between the first member and the second member such that the support member is forming a space between the first member and the second member, and a probe that is positioned in one of the first openings in the first member and one of the second openings in the second member such that the probe penetrates through the one of the first openings, the space formed between the first member and the second member, and the one of the second openings and has a first end portion protruding from the first member and a second end portion protruding from the second member on the opposite side with respect to the first end portion.
Provided is a bus bar capable of protection from high temperature and flames from a battery cell in the case of a battery abnormality, as well as collisions with broken objects. Also provided is a power storage device in which a plurality of battery cells or a plurality of battery modules are connected by means of the bus bar and that exhibits high safety even when a battery abnormality occurs. A bus bar (1) used for a power storage device including a battery cell (110) is formed by coating a bus bar body (5) containing a conductive material with an insulating coating (10) containing a silicate compound and a glass material. Furthermore, a power storage device (100) is formed by connecting a plurality of battery cells (110) or battery modules with the bus bar (1).
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
18.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
A wiring substrate includes an insulating layer, and a conductor layer formed on a surface of the insulating layer and including wiring patterns such that the conductor layer has a polished surface on the opposite side with respect to the insulating layer and includes an upper layer including a plating film and a lower layer including a seed layer for the plating film and directly formed on the surface of the insulating layer. The conductor layer is formed such that a ratio of a thickness of the lower layer to a thickness of the conductor layer is 2.5% or less, the wiring patterns have the minimum wiring width of 5 μm or less and the minimum inter-wiring distance of 7 μm or less, and each of the wiring patterns has an aspect ratio in a range of 2.0 to 4.0.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
Provided is a heat transfer suppression sheet that has excellent thermal insulation, and that can mitigate contamination of the surroundings due to powder drop. A heat transfer suppression sheet (10) comprises: a thermal insulation material (11) including inorganic particles and organic fibers; and a resin film (12) that has therein the thermal insulation material (11). The resin film (12) has a plurality of pores (13), and is constituted of a first surface-side film (12a) and a second surface-side film (12b) that are respectively disposed on the first surface-side and the second surface-side, perpendicular to the thickness direction of the thermal insulation material (11), and an edge surface-side film (12c) disposed on the edge surface-side parallel to the thickness direction of the thermal insulation material. The proportion of area taken up by the pores (13) in the first surface-side film (12a) and the second surface-side film (12b) to the total area of the first surface-side film (12a) and the second surface-side film (12b) is greater than the proportion of area taken up by the pores (13) in the edge surface-side film (12c) to the total area of the edge surface-side film (12c).
The present invention provides a bus bar which can be protected from high temperatures or flames from a battery cell at the time of abnormality of a battery. The present invention also provides a method for producing a bus bar, the method being not required a winding work that is necessary for mica sheets, thereby being free from problems such as winding unevenness, formation of a gap between sheets and separation of a sheet, and the method being easily applicable to the production of a bus bar that has a complicated shape. A bus bar (1) according to the present invention, which is used in a power storage device that comprises a battery cell (110), is obtained by covering a bus bar main body (5) that contains a conductive material with an insulating coating film (10) that contains an insulating material which has an expansion initiation temperature of 250°C or more. In a method for producing a bus bar (1) according to the present invention, a coating liquid that contains an insulating material which has an expansion initiation temperature of 250°C or more is applied to a bus bar main body (5) that contains a conductive material, and the coating liquid is subsequently dried.
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less.
Provided is a bus bar that can be protected from high temperatures and flames from a battery cell in a time of abnormality of a battery. A bus bar (1) is obtained by a bus bar main body (5) containing an electroconductive material being covered by an insulating covering film (10) that is formed on the surface thereof and includes a first layer (11) containing an insulating material of which an expansion initiation temperature is a predetermined temperature or higher, and a second layer (12) that is formed on the surface of the first layer (11) and that contains a resin that melts at a temperature lower than the predetermined temperature.
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
A wiring substrate includes a first build-up part includes first insulating layers, first conductor layers and first via conductors, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers and second via conductors. The first conductor layers in the first build-up part and the second conductor layers in the second build-up part include wirings such that a wiring width and an inter-wiring distance of the wirings in the first conductor layers are smaller than a wiring width and an inter-wiring distance of the wirings in the second conductor layers, an aspect ratio of the wirings in the first conductor layers is in the range of 2.0 to 4.0, the wiring width of the wirings in the first conductor layers is 3 μm or less, and the inter-wiring distance of the wirings in the first conductor layers is 3 μm or less.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A wiring substrate includes a core substrate; a first build-up part including first conductor layers, a second build-up part including second conductor layers, a third build-up part including third conductor layers and having the outermost surface of the wiring substrate, and a fourth build-up part including one or more fourth conductor layers and having the outermost surface of the wiring substrate. The minimum wiring width of wirings in the third conductor layers is smaller than that of wirings in the first, second and fourth conductor layers. The minimum inter-wiring distance of the wirings in the third conductor layers is smaller than that of the wirings in the first, second and fourth conductor layers. The wirings in the third conductor layers have the minimum wiring width of 3 μm or less, the minimum inter-wiring distance of 3 μm or less, and an aspect ratio in the range of 2.0 to 4.0.
A wiring substrate includes insulating layers, conductor layers formed on the insulating layers, and via conductors formed in the insulating layers such that the via conductors are connecting the conductor layers through the insulating layers. The conductor layers include a first conductor layer and the outermost conductor layer formed such that the outermost conductor layer includes first conductor pads positioned to mount a first component and second conductor pads positioned to mount a second component and that the first conductor layer includes wiring patterns including first wiring patterns connecting the first conductor pads and second conductor pads, and the first conductor layer in the conductor layers is formed such that the wiring patterns have the minimum wiring width of 3 μm or less, the minimum inter-wiring distance of 3 μm or less and an aspect ratio in the range of 2.0 to 4.0.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
26.
MATTING, EXHAUST GAS PURIFICATION DEVICE, AND METHOD FOR MANUFACTURING MATTING
A mat material having a sufficiently high initial compression surface pressure is provided. The mat material of the present disclosure includes inorganic fibers; and an inorganic binder and an organic binder attached to the inorganic fibers, wherein the mat material has an initial compression surface pressure of 900 kPa or more as measured when compressed to a bulk density of 0.50 g/cm3.
A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer and including a wiring pattern, an organic coating film formed on the conductor layer such that the organic coating film is formed on the wiring pattern of the conductor layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer is formed such that the wiring pattern has a polished surface on the opposite side with respect to the first insulating layer, and the organic coating film is formed on the wiring pattern of the conductor layer such that the organic coating film is covering the polished surface of the wiring pattern.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A wiring substrate includes a core substrate, a first build-up part formed on a first surface of the substrate and including insulating layers and conductor layers, and a second build-up part formed on a second surface of the substate on the opposite side with respect to the first surface and including insulating layers and conductor layers. The first build-up part includes a first region and a second region such that a distance between adjacent conductor layers in the second region is smaller than a distance between adjacent conductor layers in the first region, the conductor layers in the second region include second wirings having the minimum wiring width and the minimum inter-wiring distance that are smaller than the minimum wiring width and the minimum inter-wiring distance of first wirings of the conductor layers in the first region and the insulating layers are continuous in the first region and second region.
Provided are: a flame retardant sheet which exhibits excellent heat insulation and impact resistance, and which, even when a battery cell fires, enables preventing flame from spreading to an adjacent battery cell or battery case; and a battery module which exhibits excellent safety. In a flame retardant sheet (1), an inorganic fiber cloth (20) which includes second inorganic fibers (21) and in which inorganic particles (15) are present among the second inorganic fibers (21) is disposed on at least one surface of a heat insulating layer (10) including first inorganic fibers (11) and the inorganic particles (15). The flame retardant sheet (1) is manufactured by pouring an aqueous slurry, which contains a material for forming the heat insulating layer (10), on the inorganic fiber cloth (20) and dewatering and molding the resultant, to thereby form a sheet. Further, a battery module (100) is composed of: a plurality of battery cells (110); a battery case (120) for accommodating therein the battery cells (110); and the flame retardant sheet (1).
A62C 2/00 - Prévention ou limitation de l'extension des incendies
A62C 3/16 - Prévention, limitation ou extinction des incendies spécialement adaptées pour des objets ou des endroits particuliers dans les installations électriques, p.ex. chemins de câbles
The present invention provides: a heat transfer suppression sheet which has excellent thermal insulation properties and prevents ingress of water, thereby being capable of preventing ignition due to a short circuit between battery cells, and the like, and which is preferably capable of preventing a decrease in the thermal insulation properties due to ingress of an electrolyte solution; and a battery pack which comprises this heat transfer suppression sheet. A heat transfer suppression sheet (10) being interposed between a plurality of battery cells comprises: at least one kind of fibers (glass fibers (1)) which are selected from among inorganic fibers and organic fibers; and a liquid repellent substance (2) which has a surface tension that is lower than the surface tension of water.
H01M 10/643 - Chauffage ou refroidissement; Commande de la température caractérisé par la forme des éléments Éléments cylindriques
H01M 10/647 - Chauffage ou refroidissement; Commande de la température caractérisé par la forme des éléments Éléments prismatiques ou plans, p.ex. éléments de type poche
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
A printed wiring board includes a first conductor layer, a resin insulating layer having an opening extending from a first surface to a second surface of the resin insulating layer and laminated on the first conductor layer, a second conductor layer formed on the first surface of the resin insulating layer such that the first conductor layer is facing the second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the opening of the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer and that the via conductor and the second conductor layer include a seed layer and an electrolytic plating layer formed on the seed layer. The seed layer includes an amorphous metal in a range of 5 wt % to 80 wt %.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including one or more conductor circuits, an insulating adhesive layer covering a surface of the conductor layer and a part or parts of the insulating layer exposed from the conductor layer, and a resin insulating layer formed on the insulating layer and the conductor layer such that the insulating adhesive layer is sandwiched between the conductor layer and the resin insulating layer. The insulating adhesive layer includes a first portion covering an upper surface of the one or more conductor circuits and a second portion covering a side surface of the one or more conductor circuits and a thickness of the first portion is greater than a thickness of the second portion.
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings formed such that each of the outer wirings has the undercut part on the side surface facing an adjacent one of the wirings is smaller than the undercut part on the side surface farther from the adjacent one of the wirings.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
35.
MAT MATERIAL, EXHAUST GAS PURIFICATION APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFICATION APPARATUS
A mat material that is substantially rectangular in plan view and includes inorganic fibers, the mat material characterized by having a first main surface and a second main surface that face away from each other in the thickness direction, a first end surface and a second end surface that face away from each other in the longitudinal direction serving as a wrapping direction, and a first side surface and a second side surface that face away from each other in the width direction orthogonal to both the thickness direction and the longitudinal direction, the mat material moreover being characterized in that: a projecting section that protrudes toward the second end surface during wrapping, and non-protruding sections that are disposed on both width-direction sides of the projecting section and do not protrude toward the second end surface, are formed on the first end surface; a recessed section that corresponds to the shape of the projecting section of the first end surface during wrapping, and non-sunken sections that are disposed on both width-direction sides of the recessed section and correspond to the shapes of the non-protruding sections of the first end surface, are formed on the second end surface; and the ratio (D/C) of the width-direction length (D) of the non-sunken sections to the longitudinal-direction length (C) of the non-sunken sections is 1.0 or greater.
A wiring substrate includes an insulating layer, a first conductor layer formed on the insulating layer and including a first wiring and a second wiring formed adjacent to the first wiring, and a second conductor layer on the opposite side with respect to first conductor layer such that the insulating layer is covering the second conductor layer. The first conductor layer is formed such that each of the first wiring and the second wiring has an aspect ratio in the range of 2.0 to 4.0 and a wiring width of 5 μm or less and that the first wiring and the second wiring are separated by the distance of 7 μm or less, and the first conductor layer includes a seed layer formed on the insulating layer, and an electrolytic plating film formed on the seed layer.
The objective of the invention is to provide a plant activator with superior plant growth-promoting effect and low toxicity and soil contamination. A plant activator comprising, as an active ingredient,
a hydroxy fatty acid derivative of general formula (I) and/or (II):
The objective of the invention is to provide a plant activator with superior plant growth-promoting effect and low toxicity and soil contamination. A plant activator comprising, as an active ingredient,
a hydroxy fatty acid derivative of general formula (I) and/or (II):
HOOC—(R1)—CH(OH)—CH(OH)—CH═CH—CH(OH)—R2 (I),
The objective of the invention is to provide a plant activator with superior plant growth-promoting effect and low toxicity and soil contamination. A plant activator comprising, as an active ingredient,
a hydroxy fatty acid derivative of general formula (I) and/or (II):
HOOC—(R1)—CH(OH)—CH(OH)—CH═CH—CH(OH)—R2 (I),
HOOC—(R1)—CH(OH)—CH═CH—CH(OH)—CH(OH)—R2 (II),
(wherein, R1 is a straight or branched hydrocarbon group with 4 to 12 carbon atoms, optionally comprises one or more double bonds and/or OH groups, and the position of the double bond is not limited, provided that the double bond is comprised, and R2 is a straight or branched hydrocarbon group with 2 to 8 carbon atoms, optionally comprises one or more double bonds and/or OH groups, and the position of the double bond is not limited, provided that the double bond is comprised) or a salt or an ester thereof.
A01N 37/36 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant au moins un groupe carboxylique ou un thio-analogue, ou d'un de leurs dérivés, et un atome d'oxygène ou de soufre lié par une liaison simple, liés au même squelette carboné, cet atome d'oxygène ou de soufre ne faisant pas partie d'un groupe
A01P 21/00 - Régulateurs de croissance des végétaux
C05F 11/10 - Engrais contenant des vitamines ou des hormones végétales
Provided are: a heat transfer suppression sheet that has a degree of strength, enabling the shape of the heat transfer suppression sheet to be maintained, and that has a high retention capacity with respect to inorganic particles even when compression stress is applied to the heat transfer suppression sheet, whereby the heat transfer suppression sheet can maintain superior heat insulation performance; and a battery pack having this heat transfer suppression sheet. A heat transfer suppression sheet (10) has a matrix (14) including inorganic particles (4), and organic fibers (1) three-dimensionally oriented in the matrix (14). The organic fibers (1) have fused parts (5) of which at least part of the surfaces are covered, and the organic fibers (1) are fused to each other by the fused parts (5).
H01M 10/643 - Chauffage ou refroidissement; Commande de la température caractérisé par la forme des éléments Éléments cylindriques
H01M 10/647 - Chauffage ou refroidissement; Commande de la température caractérisé par la forme des éléments Éléments prismatiques ou plans, p.ex. éléments de type poche
H01M 10/6555 - Barres ou plaques disposées entre les éléments
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
Provided are: a heat transfer suppression sheet having enough strength to maintain the shape thereof even when an impact or pressing force is applied thereto, thus making it possible to suppress powder falling and maintain excellent heat insulation performance; and a battery pack having said heat transfer suppression sheet. The heat transfer suppression sheet (10) has inorganic particles (4) and organic fibers (1). In addition, a first region (2) having a streaky fiber bundle (7) composed of a plurality of organic fibers (1), and a second region (3) in which the fiber bundle (7) is not present are formed on the surface of the heat transfer suppression sheet (10).
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
40.
HEAT-TRANSMISSION CONTROLLING SHEET AND BATTERY PACK
Provided are: a heat-transmission controlling sheet that, even if a compressive stress applied to the heat-transmission controlling sheet is increased, can maintain heat insulating properties and prevent breakage of the sheet when an adjacent battery cell undergoes thermal runaway; and a battery pack including the heat-transmission controlling sheet. A heat-transmission controlling sheet (10) includes inorganic particles (4) and organic particles (1), and also includes a plurality of voids (7) which are three-dimensionally linked.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
Provided are: a heat transfer suppression sheet that has a strength that enables retaining of the shape even when a compressional stress is applied thereto, and has high ability of retaining inorganic particles, and thereby can maintain excellent heat insulation performance; and a battery pack having said heat transfer suppression sheet. A heat transfer suppression sheet (10) comprises: a matrix (14) including inorganic particles (4); inorganic fibers (15) dispersed in the matrix (14); and organic fibers (1). The organic fibers (1) and the inorganic fibers (15) are entangled with each other and form a three dimensional web structure.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
Provided are: a heat transfer suppression sheet that has such a strength that the shape thereof can be maintained even when a compressive stress is applied to the heat transfer suppression sheet, and that also has a high retention capacity with respect to inorganic particles, thereby being capable of maintaining excellent heat insulation performance; and a battery pack having said heat transfer suppression sheet. A heat transfer suppression sheet (10) has inorganic particles (4) and organic fibers (1). At least some of the organic fibers (1) have a branched structure consisting of a base section (2) and branch sections (3) extending from the base section (2) in, for example, four directions, namely, a direction D1, a direction D2, a direction D3, and a direction D4.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that an elongation rate of the first insulating layer is greater than an elongation rate of each insulating layer other than the first insulating layer in the build-up part, and the covering layer is formed such that the covering layer has an opening entirely exposing an upper surface and a side surface of the first conductor pad.
Provided are: a bus bar that can be protected from a high temperature or flame from a battery cell at the time of abnormality; and a power storage device exhibiting high safety even at the time of abnormality. A bus bar (A1) for use in a power storage device (A100) including battery cells (A110) has a laminate (A10) that includes an inorganic thermal insulation member (A20) and an inorganic fiber sheet (A30) and that is disposed on a surface of a bus bar body (A5) made from a conductive material. In addition, in the power storage device (A100), the bus bar (A1) mutually connects the adjacent battery cells (A110) or modules.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/6595 - Moyens de commande de la température associés de façon structurelle avec les éléments par des réactions chimiques autres que les réactions électrochimiques des éléments, p.ex. appareils de chauffage catalytique ou brûleurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that a tensile strength of the first insulating layer is higher than a tensile strength of each insulating layer other than the first insulating layer in the first build-up part, and the covering layer is formed such that the covering layer has opening entirely exposing an upper surface and a side surface of the first conductor pad.
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in an opening formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The via conductor is formed such that the via conductor includes a seed layer covering an inner wall surface of the resin insulating layer inside of the opening and an electrolytic plating layer formed on the seed layer such that the seed layer has a plurality of columnar parts grown in columnar shapes.
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in an opening formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface of the insulating layer in the opening, and a third portion formed on the first conductor layer exposed from the opening and that the first portion has a thickness that is greater than a thickness of the second portion and a thickness of the third portion.
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer and including a conductor circuit, and a via conductor formed in an opening formed in the insulating layer and connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first layer and a second layer formed on the first layer, the first layer has a width greater than a width of the second layer in cross section of the conductor circuit in the second conductor layer and that the electrolytic plating layer has a width greater than the width of the first layer in cross section of the conductor circuit in the second conductor layer.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
49.
FLAME-RETARDANT SHEET, MANUFACTURING METHOD THEREFOR, AND BATTERY PACK
Provided is a flame-retardant sheet that is capable of further suppressing heat propagation between battery cells not only in a normal state but also in an abnormal state, that has excellent resistance to external forces such as bending and twisting, and that can be easily manufactured. A flame-retardant sheet (1) is formed by layering flame-retardant materials (10) and an elastic member (20). By using, for example, resin staples (50) or resin tag pins (60), the joining surfaces (40) of the flame-retardant materials (10) with the elastic member (20) and the joining surfaces (40) of the elastic member (20) with the flame-retardant materials (10) can be joined so as to be moveable along the surfaces of the joining surfaces (40). Further, a battery pack (100) has: a plurality of battery cells (110); a battery case (120) that accommodates the battery cells (110); and the flame-retardant sheet (1).
B32B 7/08 - Liaison entre couches par des moyens mécaniques
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/262 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports avec des moyens de fixation, p.ex. des serrures
50.
FLAMEPROOF STRUCTURE, METHOD FOR MANUFACTURING SAME, AND BATTERY MODULE
The present invention provides a flameproof structure that, in addition to having a more exceptional heat-insulating effect and flameproof effect, achieves enhanced joint strength between a battery case and a heat-insulating material, undergoes little time-dependent deterioration of the joint strength and has exceptional reliability, and furthermore has exceptional followability to the internal shape of the battery case. This flameproof structure (1) comprises a metal base material (20) and a heat-insulating material (10) containing inorganic fibers or infusible fibers. In a joint layer (30) obtained by joining the metal base material (20) and the heat-insulating material (10), a formation material for the metal base material (20) enters space in a formation material for the heat insulating material (10) and is integrated therewith. The flameproof structure (1) is obtained by using the heat-insulating material (10) as an insert member and insert-molding the formation material for the metal base material (20). Additionally, a battery module (100) is provided with: a storage battery (110); and a battery case for accommodating the storage battery (110), at least one of the canopy, sidewall, and bottom wall of the battery case being the flameproof structure (1).
H01M 50/229 - Matériau composite constitué d'un mélange de matériaux organiques et inorganiques
H01M 50/231 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par le matériau des boîtiers ou des bâtis ayant une structure en couches
A method for manufacturing a printed wiring board includes forming a first conductor layer, forming an adhesive layer including a nitrogen-based organic compound and covering a surface of the first layer, forming a resin insulating layer covering the adhesive layer and having the second surface facing the first conductor layer, forming a protective film on the first surface of the insulating layer, forming an opening in the insulating layer such that the opening penetrates through the insulating layer and reaches the adhesive layer, applying plasma to the opening of the insulating layer such that the plasma cleans an inside of the opening, removing the protective film from the insulating layer after cleaning the inside of the opening, forming a second conductor layer on the first surface of the insulating layer, and forming a via conductor in the opening such that the via conductor connects the first layer and second layer.
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
52.
FLAMEPROOF MATERIAL, METHOD FOR PRODUCING SAME, AND BATTERY MODULE
Provided are: a flameproof material that is configured as a multilayer structure, thus has an excellent heat insulation effect and flameproofing effect, and additionally has excellent reliability in which the layering state of each layer is suitably maintained without using an adhesive; a method for producing the flameproof material; and a battery module. The flameproof material (1) includes a heat insulation material (10) containing inorganic fibers or infusible fibers, and an inorganic fiber cloth (20). The heat insulation material (10) and the inorganic fiber cloth (20) are integrated by a physical means that is preferably at least one of needling, resin stapling, and sewing. In addition, storage batteries (110) are accommodated in a battery case (120) in the battery module (100), and the flameproof material (1) is disposed in at least one of the lid, the side walls, and the bottom wall of the battery case (120) and/or the area between the storage batteries (110).
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
Provided is a manufacturing method for a heat transfer suppression sheet that has a degree of strength, enabling the shape of the heat transfer suppression sheet to be maintained, and that has a high retention capacity with respect to inorganic particles; consequently the heat transfer suppression sheet can maintain superior heat insulation performance. The manufacturing method for a heat transfer suppression sheet includes a processing step for processing, into a sheet form, a mixture containing inorganic particles (4), binder fibers (3) having a core-sheath structure, and a hot melt powder. The binder fibers (3) having the core-sheath structure include a core portion (1) extending in the longitudinal direction thereof, and a sheath portion (2) formed so as to cover the outer peripheral surface of the core portion (1). The melting point of a first organic material forming the core portion (1) is higher than the melting point of a second organic material forming the sheath portion (2) and the melting point of a third organic material forming the hot melt powder.
A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.
The present invention provides a production method for a heat transfer suppression sheet that has strength which makes it possible to retain the shape of the heat transfer suppression sheet, and that has high inorganic particle holding performance and can thus maintain excellent thermal insulation performance. A production method for a heat transfer suppression sheet comprises a processing step for processing a mixture of inorganic particles (4) and binder fibers (3) having a core-sheath structure into a sheet via a dry method. The binder fibers (3) having a core-sheath structure have a core part (1) that extends in the lengthwise direction thereof, and a sheath part (2) that is formed so as to cover the outer peripheral surface of the core part (1). The melting point of a first organic material that constitutes the core part (1) is higher than the melting point of a second organic material (7) that constitutes the sheath part (2).
A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land and first plane parts, the second conductor layer includes second land and second plane parts, the third conductor layer includes fine wirings and a third plane part, the fourth conductor layer includes fine wirings and a fourth plane part, the substrate includes a through-hole conductor connecting the first and second land parts through the core insulating layer, a first via conductor connecting the first land part and third conductor layer, a second via conductor connecting the second land part and fourth conductor layer, a third via conductor connecting the first and third plane parts, and a fourth via conductor connecting the second and fourth plane parts.
Provided are a coil substrate that makes it possible to achieve a motor that has stable performance, a motor coil substrate that is formed using the coil substrate, and a motor that is formed using the motor coil substrate. According to the present invention, a coil substrate includes a flexible substrate that has a first surface and a second surface that is on the reverse side from the first surface, a coil that is formed from coil-shaped wiring that is provided on the first surface and coil-shaped wiring that is provided on the second surface, a terminal that is formed at one edge of the flexible substrate in the width direction, and a connection wire that connects the terminal and the wiring of the coil or a connection wire that connects the two wirings of the coil. The coil substrate can be given a cylindrical shape by being wound along the longitudinal direction of the flexible substrate from a reference edge that is on one end side in the longitudinal direction around an axis that extends in a perpendicular direction that is perpendicular to the longitudinal direction. The connection wire extends diagonally relative to the longitudinal direction.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
D04H 1/488 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p.ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres en combinaison avec au moins une autre méthode de consolidation en combinaison avec des agents de liage
B01D 46/00 - Filtres ou procédés spécialement modifiés pour la séparation de particules dispersées dans des gaz ou des vapeurs
B01D 53/94 - Epuration chimique ou biologique des gaz résiduaires des gaz d'échappement des moteurs à combustion par des procédés catalytiques
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 de la classification périodique; Aluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexes; Un tel traitement combiné avec un traitement mécanique, p.ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturés; Leurs sels ou esters
A mat material comprising inorganic fibers and having multiple interlaced points formed by needling on the front surface and/or back surface thereof, the mat material being characterized in that: the density ρ of the interlaced points is in the range of 0.5/cm2≤ρ<18/cm2; in a 25 mm×25 mm region, a first region, which is a 4 mm×4 mm region in which there are no interlaced points, and/or a second region, which is a 3 mm×8 mm region in which there are no interlaced points, is disposed; an inorganic binder is included; the shear modulus is at least 0.20; and the surface pressure after baking is at least 50 kPa.
D04H 1/488 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p.ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres en combinaison avec au moins une autre méthode de consolidation en combinaison avec des agents de liage
B01D 46/00 - Filtres ou procédés spécialement modifiés pour la séparation de particules dispersées dans des gaz ou des vapeurs
B01D 53/94 - Epuration chimique ou biologique des gaz résiduaires des gaz d'échappement des moteurs à combustion par des procédés catalytiques
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 de la classification périodique; Aluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexes; Un tel traitement combiné avec un traitement mécanique, p.ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturés; Leurs sels ou esters
A wiring substrate includes a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, a second conductor layer formed on the second insulating layer, and a via conductor formed in the second insulating layer such that the via conductor is connecting the first and second conductor layers. The second insulating layer has a via hole in which the via conductor is formed, and the via conductor includes a first plating film and a second plating film such that the first plating film has a bottom portion formed at bottom of the via hole and a side portion formed on side of the via hole and separated from the bottom portion by gap and that the second plating film is covering the gap of the first plating film and at least part of the first plating film.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
Provided are a coil substrate for motors with which a motor having stable performance can be obtained and a motor formed by using the coil substrate for motors. The coil substrate for motors is formed by winding a coil substrate N times (N is an integer equal to or larger than 2) in the circumferential direction, the coil substrate comprising a flexible substrate having a first surface and a second surface opposite the first surface; and a plurality of coils formed by first wiring provided on the first surface and second wiring provided on the second surface. The first surface is placed on the inner circumferential side, the second surface is placed on the outer circumferential side, and the N layers, which are formed by winding the coil substrate N times, have a space formed between the M-th layer (M is an integer equal to larger than 1 and smaller than N) and the (M+1)-th layer, the M-th layer and the (M+1)-th layer being counted from the inside.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H01F 5/04 - Dispositions des connexions électriques aux bobines, p.ex. fils de connexion
64.
FLAMEPROOF SHEET FOR BATTERIES, TERMINAL COVER AND BATTERY MODULE
The present invention provides: a flameproof sheet for batteries, the flameproof sheet having greater flameproof effect and high reliability; a terminal cover; and a battery module. A flameproof sheet (1) for batteries according to the present invention is formed of short fibers (10) which are mainly composed of thermosetting fibers or infusibilized fibers, while preferably having a carbon content of 55 to 95 wt%; and this flameproof sheet (1) for batteries has the configuration of a mat, a body made through a papermaking process, or a blanket. In addition, this flameproof sheet (1) for batteries is contained in a battery package (120) together with a storage battery (110), thereby constituting a battery module (100).
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
H01M 50/55 - Bornes caractérisées par la position des terminaux sur les cellules sur le même côté de la cellule
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
The present invention provides technology that enables wiring on an inner peripheral layer and wiring on an outer peripheral layer to be positioned more accurately when a coil substrate is wound into a cylindrical shape. The coil substrate comprises: a flexible substrate having a first surface and a second surface on the reverse side from the first surface; and a coil formed from coil-shaped wiring provided on the first surface and coil-shaped wiring provided on the second surface. The coil substrate can be formed into a cylindrical shape by being circumferentially wound about an axis extending in the lateral direction orthogonal to the longitudinal direction, starting from a reference side at one end in the longitudinal direction of the flexible substrate. The flexible substrate has recesses formed on at least one of the two sides thereof in the width direction.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H02K 3/47 - Enroulements à espace d'air, c. à d. enroulements ne comportant pas de noyau de fer
66.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate with which a motor having stable performance can be obtained; a coil substrate for motors which is formed by using the coil substrate; and a motor formed by using the coil substrate for motors. The coil substrate comprises a flexible substrate having a first surface and a second surface opposite the first surface; and a plurality of coils formed by first wiring provided on the first surface and second wiring provided on the second surface. The coil substrate can be formed in a cylindrical shape in which the first surface is placed on the inner peripheral side and the second surface is placed on the outer peripheral side by being circumferentially wound about an axis extending, from a first end in the longitudinal direction of the flexible substrate as a start point, in a direction orthogonal to the longitudinal direction. The flexible substrate has a first region in the neighborhood of the first end, and a second region adjacent to the first region. The second wiring is formed in the first region, and the first wiring is not formed in the first region.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
67.
FLAMEPROOF STRUCTURE, MANUFACTURING METHOD THEREFOR, AND BATTERY MODULE
The present invention provides a flameproof structure which, in addition to having more excellent heat insulating effect and flameproof effect, achieves enhanced joint strength between a battery case and a heat insulating material, has little time-dependent deterioration of the joint strength and excellent reliability, and further has excellent followability to the internal shape of the battery case. A flameproof structure (1) comprises a resin base material (20) and a heat insulating material (10) containing inorganic fibers or infusible fibers, and in a joint layer (30) obtained by joining the resin base material (20) and the heat insulating material (10), a formation material for the resin base material (20) enters space in a formation material for the heat insulating material (10) and is integrated. This flameproof structure (1) is obtained by using the heat insulating material (10) as an insert member and insert-molding the formation material for the resin base material (20). A battery module (100) is provided with a storage battery (110), and a battery case which houses the storage battery (110) and at least one of the canopy, sidewall, and bottom wall of which is the flameproof structure (1).
H01M 50/229 - Matériau composite constitué d'un mélange de matériaux organiques et inorganiques
H01M 50/231 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par le matériau des boîtiers ou des bâtis ayant une structure en couches
68.
HEAT TRANSFER SUPPRESSING SHEET, AND BATTERY ASSEMBLY
The objective of the present invention is to further increase a retention performance of particles by improving dispersion between fibers and particles, thereby further enhancing the shape retention, strength, and compression characteristics, for example, required of a heat transfer suppressing sheet, and to prevent a deterioration in the shape retention, strength and the compression characteristics, for example, of the sheet as a whole, even if thermal runaway of a battery cell occurs. This heat transfer suppressing sheet includes a fiber component and a particle component, wherein: a main component of a first inorganic fiber (1) contained in the fiber component is of the same type as a main component of a first inorganic particle (2) contained in the particle component; and the content of the main component of the first inorganic particle (2) is greater than the content of the main component of the first inorganic fiber (1).
The present invention further improves shape retainability, strength, compression characteristics and the like required for heat transfer suppression sheets and prevents decrease in the shape retainability, strength, compression characteristics and the like as the entirety of the sheet even if a battery cell experiences thermal runaway. A heat transfer suppression sheet according to the present invention comprises: at least either (1) first inorganic fibers that have a glass transition temperature of 800°C or less or (2) first inorganic particles that have a glass transition temperature of 800°C or less; (3) second inorganic fibers that have a glass transition temperature of 1000°C or more; (4) second inorganic particles that have a glass transition temperature of 1000°C or more; and (5) an organic binder.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
The present invention provides: a heat transfer suppression sheet which is capable of maintaining the shape thereof even in cases where the heat transfer suppression sheet is exposed to high temperatures, thereby being capable of suppressing a decrease in the heat insulation performance; and a battery pack which comprises this heat transfer suppression sheet. A heat transfer suppression sheet (10) according to the present invention contains: first organic fibers (1) that do not have a glass transition temperature at a temperature less than 120°C; first inorganic particles (2); and a resin binder (9). The first organic fibers (1) have a melting point Tm at a temperature not less than 200°C; and it is preferable that the elastic modulus of the first organic fibers (1) at Tm°C is 0.1% or more relative to the elastic modulus of the first organic fibers (1) at 23°C.
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
Provided are a battery protection sheet and a battery pack module that have a high level of thermal insulation, in addition to mechanical shock resistance. The battery protection sheet (1) comprises a papermaking-process-formed sheet layer (10) containing first inorganic fibres, and a cloth layer (20) comprising second inorganic fibres. The battery pack module comprises a plurality of battery packs, a case accommodating the battery packs, and the battery protection sheet, which is affixed to the inside of the case.
H01M 50/242 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p.ex. dimensions adaptés pour protéger les batteries contre les vibrations, les collisions ou le gonflement
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/233 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p.ex. dimensions
In the present invention, uniform heat insulation and heat dissipation are obtained, and if thermal runaway occurs in a battery cell, heat is blocked between adjacent battery cells, and the heat generated by the battery cells is quickly dissipated. A heat transfer suppression sheet (10) includes: uniformly dispersed inorganic particles (21); first inorganic fibers (23) that are uniformly dispersed and oriented in one direction parallel to the main surfaces (10a, 10b) of the sheet; and second inorganic fibers (24) that intertwine with the first inorganic fibers (23) to form a (3)-dimensional web structure.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
The present invention provides an insulating sheet having outstanding insulating properties over a broad temperature range from temperatures during ordinary battery use to high temperatures of 500°C or more. An insulating sheet (10) includes first inorganic particles (20), second inorganic particles (21) comprising nanoparticles, first inorganic fibers (30), and second inorganic fibers (31). The total content of the first inorganic particles (20) and the second inorganic particles (21) is 30 wt. % to 90 wt. %, inclusive, of the total mass of the insulating sheet, and in the cumulative distribution by volume of the first inorganic particles measured by a laser diffraction and scattering method, D50 of the first inorganic particles (20) is 1 µm to 100 µm, inclusive, and the ratio of D90 to D10 (D90/D10) is 10 to 1000, inclusive, where D10, D50, and D90 are the cumulative 10%, 50%, and 90% particle diameters, respectively, starting from small particle diameters.
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p.ex. capacité calorifique, changements ou transitions de phase liquide-solide
74.
HEAT TRANSFER SUPPRESSING SHEET, METHOD FOR MANUFACTURING SAME, AND BATTERY PACK
Provided are: a heat transfer suppressing sheet capable of maintaining the shape thereof even when the heat transfer suppressing sheet is pressed due to the expansion of a battery cell and thereby suppressing deterioration of thermal insulation properties; a method for manufacturing the same; and a battery pack having said heat transfer suppressing sheet. The heat transfer suppressing sheet contains first inorganic particles (1), a resin binder (6), and organic fibers (3), and the glass transition temperature of the organic fibers (3) is higher than the glass transition temperature of the resin binder (6). Further, at least some of the organic fibers (3) are fused together to form a three-dimensional skeleton (8). The resin binder (9) is fused with part of the skeleton (8) and at least part of the first inorganic particles (1) to cause at least part of the first inorganic particles (1) to adhere to the skeleton (8).
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
D04H 1/413 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles contenant des granulés autres que les substances absorbantes
D04H 1/58 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles par application, incorporation ou activation de liages chimiques ou thermoplastiques, p.ex. adhésifs
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p.ex. capacité calorifique, changements ou transitions de phase liquide-solide
A wiring substrate includes a first conductor pattern, a second conductor pattern, an insulating layer interposed between the first and second patterns and having a through hole, and a plating conductor integrally formed with the second pattern and filling the through hole in the insulating layer such that the plating conductor is in contact with the first pattern. The through hole has an expansion part such that an opening width of the through hole on the first pattern side is widened, and the plating conductor includes a first plating film directly formed on inner wall of the through hole and a second plating film formed on the first plating film such that the minimum thickness of the first plating film in the expansion part is in the range of 55% to 95% of the minimum thickness of the first plating film in the through hole other than the expansion part.
A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 μm to 0.5 μm.
A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on the first conductor layer and covering the first conductor layer, a second conductor layer formed on the interlayer insulating layer and including wirings, a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first conductor layer and the second conductor layer, and a wiring part formed in the interlayer insulating layer and including an embedded wiring layer filling one or more grooves formed in the interlayer insulating layer. The interlayer insulating layer includes a first insulating layer and a second insulating layer laminated on the first insulating layer, and the embedded wiring layer is formed in the first insulating layer on a side facing the second insulating layer and filling the groove or grooves formed in the first insulating layer.
A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on and covering the first conductor layer, a wiring layer formed in the interlayer insulating layer and including wirings, a second conductor layer formed on the interlayer insulating layer and including wirings, and a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first and second conductor layers. The interlayer insulating layer includes first and second insulating layers such that the wiring layer is formed on a surface of the first insulating layer, and the wiring layer is formed such that an aspect ratio of the wirings in the wiring layer is in the range of 2.0 to 6.0 and that aspect ratios of the wirings in the first and second conductor layers are in the range of 1.0 to 2.0.
A method for manufacturing a printed wiring board includes forming an electroless plating layer on a solder resist layer such that the electroless plating layer has a film thickness in the range of 0.05 μm to 0.70 μm, forming plating resist such that the plating resist has openings exposing portions of the electroless plating layer, applying electrolytic plating such that metal posts are formed in the openings of the plating resist, removing the plating resist, and etching the electroless plating layer exposed from the metal posts. The solder resist layer is formed such that the solder resist layer has openings exposing portions of the outermost conductor layer, the electroless plating layer is formed on the portions of the outermost conductor layer, and the plating resist is formed such that the openings of the plating resist expose the portions of the electroless plating layer formed in the openings of the solder resist layer.
H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement; Dépôt par contact par réduction ou par substitution, p.ex. dépôt sans courant électrique
The present disclosure provides a plate-shaped heat insulator less susceptible to damage caused by thermal shrinkage. Provided is a plate-shaped heat insulator including an aggregate of multiple heat insulating members containing inorganic fibers, wherein the plate-shaped heat insulator is intended to be disposed in a combustion chamber.
An object of the present invention is to provide a plate-shaped heat insulator with good workability during construction and less susceptible to damage after construction. Provided is a plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, wherein the plate-shaped heat insulator is intended to be disposed in a combustion chamber.
A wiring substrate includes a first insulating layer, a conductor layer including first and second pads, a second insulating layer having first openings exposing the first pads and a second opening exposing the second pads, metal posts formed on the first pads and filling the first openings, and a wiring structure positioned in the second opening and having first and second connection pads such that the second connection pads are connected to the second pads. The upper surfaces of the first connection pads and the upper surfaces of the metal posts form a component mounting surface having first, second and third regions, the first connection pads are formed in the first, second and third regions and include a group of first connection pads formed in the first and second regions and electrically connected and a group of first connection pads formed in the first and third regions and electrically connected.
A wiring substrate includes a first insulating layer, a conductor layer including first and second conductor pads, a second insulating layer having an opening exposing the second conductor pads, and a wiring structure including a resin insulating layer and a wiring layer and formed in the opening of the second insulating layer. The wiring structure has first surface side connection pads, second surface side connection pads and electrically connected to the second conductor pads of the conductor layer, and conductors that electrically connect the first surface side connection pads and the second surface side connection pads, the first surface side connection pads form a component mounting surface having first and second component mounting region, and the first surface side connection pads include a group of pads in the first region and a group of pads in the second region electrically connected to the group of pads in the first region.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.
Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). The first inorganic fibers (30) are amorphous fibers. The second inorganic fibers (31) contain at least one kind selected from amorphous fibers having a glass transition point higher than that of the first inorganic fibers (30) and crystalline fibers.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A wiring board (100) according to one embodiment of the present invention comprises: an electric wiring part (200) which comprises insulating layers (21, 22, 32) and conductor layers (11, 12, 31); and an optical wiring part (300) which is arranged on the surface of the electric wiring part (200). The optical wiring part (300) is provided with: a supporting plate (6); and an optical waveguide (5) which is formed on the supporting plate (6) and comprises a core part (51) that transmits light and a cladding part (52) that surrounds the core part (51). The supporting plate (6) has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the optical waveguide (5).
Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). An average fiber diameter of the first inorganic fibers (30) is larger than an average fiber diameter of the second inorganic fibers (31). The first inorganic fibers (30) have a linear shape or a needle shape, and the second inorganic fibers (31) have a dendritic shape or a crimped shape.
The purpose of the present invention is to simplify the structure of an optical waveguide provided to a wiring substrate, and to enhance the efficiency of optical coupling between an optical waveguide and a component. This wiring substrate (100) includes: an insulating layer (21) that has a surface provided with a first conductor pad (11a); a first component region (A1) which is a region to be covered by a component (E1) connected to the first conductor pad (11a); and an optical waveguide (5) that includes a core section (51) for transmitting light and that is disposed outside the first component region (A1). The core section (51) includes a first end surface (5a) exposed facing the first component region (A1) side. The optical waveguide (5) is positioned so that the first component region (A1) and the first end surface (5a) are adjacent to one another.
G02B 6/122 - Elements optiques de base, p.ex. voies de guidage de la lumière
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer such that the conductor layer includes a conductor pad, and a solder resist layer formed on the surface of the insulating layer such that the solder resist layer is covering the conductor layer and having an opening exposing the conductor pad. The conductor pad of the conductor layer has a substantially rectangular planar shape such that the conductor pads has a main surface, a pair of long sides, a pair of short sides and four corner portions, and the solder resist layer is formed such that the opening is exposing side surfaces at the long sides and 50% or more of the main surface and that the solder resist layer is covering side surfaces at the short sides.
A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
91.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are: a coil substrate with which a motor having stable performance can be obtained; a coil substrate for motors which is formed by using the coil substrate; and a motor formed by using the coil substrate for motors. A coil substrate according to an embodiment has: a flexible substrate having a first surface and a second surface on the side opposite the first surface; and a coil formed by coil-shaped wiring provided on the first surface and coil-shaped wiring provided on the second surface. The coil substrate can be formed in an approximately cylindrical shape by being circumferentially wound about an axis extending, from a reference side on one end side in the longitudinal direction of the flexible substrate as a start point, in an orthogonal direction orthogonal to the longitudinal direction. The wiring has an orthogonal section extending in the orthogonal direction. The orthogonal section includes: a first orthogonal section on the first surface; and a second orthogonal section on the second surface. At least one slit is formed along the orthogonal direction in at least one among the first orthogonal section or the second orthogonal section.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H01F 5/04 - Dispositions des connexions électriques aux bobines, p.ex. fils de connexion
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.
A semiconductor package includes a printed wiring board, a logic IC mounted on a first surface of the board, a connector mounted on a second surface of the board on the opposite side with respect to the first surface, an optical element that converts an optical signal and an electrical signal and positioned on the opposite side with respect to the first surface such that the optical element is at least partially embedded in the board, a path that is formed in the board and electrically connects the logic IC on the first surface and the optical element on the opposite side with respect to the first surface, and an optical waveguide that is embedded on the opposite side with respect to the first surface and optically connects the connector on the second surface and the optical element on the opposite side with respect to the first surface.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad, and a solder resist layer formed on the insulating layer such that the solder resist layer has an opening entirely exposing an upper surface and a side surface of the conductor pad. The conductor layer is formed such that the conductor pad has a pad body extending along a surface of the insulating layer, and a protective layer covering an upper surface and a side surface of the pad body and including material different from material of the pad body, and the pad body of the conductor pad has a notch part formed at a peripheral edge portion of the pad body such that the notch part separates a lower surface of the pad body and the surface of the insulating layer and is filled with the protective layer.
A method for manufacturing a wiring substrate includes forming a resin insulating layer on a first conductor layer such that the resin insulating layer covers the first conductor layer, applying a roughening treatment on a surface of the resin insulating layer on the opposite side with respect to the first conductor layer, forming an opening in the resin insulating layer after the roughening treatment on the surface of the resin insulating layer such that the opening penetrates through the resin insulating layer and exposes a portion of the first conductor layer, and forming a second conductor layer on the surface of the resin insulating layer such that the second conductor layer is formed in contact with the surface of the resin insulating layer and that a via conductor is formed in the opening of the resin insulating layer.
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.
A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/04 - Elimination du matériau conducteur par voie mécanique, p.ex. par poinçonnage
H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
Provided are: a coil substrate, with which a withstand voltage is secured and a motor having stable performance can be obtained; a motor coil substrate formed using the coil substrate; and a motor formed using the motor coil substrate. A coil substrate comprises: a flexible substrate having a first surface and a second surface on the side opposite the first surface; and a plurality of coils formed by coil-shaped wires provided on the first surface and coil-shaped wires provided on the second surface. The plurality of coils each include an Nth coil which forms an Nth phase (N=1, 2 ...), and an N+1th coil which forms an N+1th phase that differs from the Nth phase. The N+1th coil is disposed adjacent to the Nth coil. The inter-wire distance between the wires that constitutes the Nth coil and the wires that constitutes the N+1th coil is greater than the inter-wire distance between the wires that constitute the Nth coils, and greater than the inter-wire distance between the wires that constitute the N+1th coils.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
99.
Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrate
In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder.
C09D 5/14 - Peintures contenant des biocides, p.ex. fongicides, insecticides ou pesticides
C09D 7/63 - Adjuvants non macromoléculaires organiques
C08F 2/20 - Polymérisation en suspension utilisant des agents de dispersion macromoléculaires
C08F 2/48 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
The present invention provides a coil board with which a withstand voltage can be ensured and a motor with consistent performance can be obtained, a coil board for motor use formed using the coil board, and a motor formed using the coil board for motor use. A coil board according to an embodiment includes: a flexible board having a first surface and a second surface opposite the first surface; and a coil formed by coil-shaped wiring provided on the first surface and coil-shaped wiring provided on the second surface. The spacing of the wiring on the first surface is wider than the spacing of the wiring on the second surface.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H01F 5/04 - Dispositions des connexions électriques aux bobines, p.ex. fils de connexion
