Provided in the present application is a three-dimensional memory, comprising: a stacked layer, which is located on a semiconductor layer; a storage channel structure, which penetrates through the stacked layer and comprises a first channel layer; a selective gate structure, which is located on the side of the stacked layer that faces away from the semiconductor layer; a selective channel structure, which penetrates through the selective gate structure and comprises an insulating layer and a second channel layer that are arranged from outside to inside; and a barrier layer, which comprises: a first barrier portion located on the end face of the insulating layer that is close to the semiconductor layer; and a second barrier portion located on the surface of the insulating layer that faces away from the second channel layer. The barrier layer provided in the three-dimensional memory in the embodiments of the present application can effectively prevent the diffusion of impurity particles doped in a conductive layer to a gate dielectric layer, such that the quality of the gate dielectric layer is ensured, thereby facilitating control over the stability of a TSG transistor.
H01L 21/822 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels pour produire des dispositifs, p.ex. des circuits intégrés, consistant chacun en une pluralité de composants le substrat étant un semi-conducteur, en utilisant une technologie au silicium
H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
2.
THREE-DIMENSIONAL MEMORY, MANUFACTURING METHOD THEREFOR, AND MEMORY SYSTEM
Provided in the present application are a three-dimensional memory and a manufacturing method therefor. The three-dimensional memory comprises: a stacked layer, located on a semiconductor layer; a memory channel structure, penetrating through the stacked layer and comprising a first channel layer; a selective gate structure, located on the side of the stacked layer facing away from the semiconductor layer; and a selective channel structure, penetrating through the selective gate structure, and comprising a barrier layer and a second channel layer which are arranged from outside to inside. The barrier layer arranged in the three-dimensional memory in some embodiments of the present application can effectively prevent impurity particles doped in a conductive layer from diffusing to a gate dielectric layer, thereby ensuring the quality of the gate dielectric layer, and facilitating controlling the stability of TSG transistors.
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
3.
THREE-DIMENSIONAL MEMORY AND MANUFACTURING METHOD THEREFOR, AND MEMORY SYSTEM
Provided in the present application are a three-dimensional memory and a manufacturing method therefor. The three-dimensional memory comprises: a stacked layer, located on a semiconductor layer; a memory channel structure, passing through the stacked layer and comprising a first channel layer; and a selective gate structure, located on the side of the stacked layer facing away from the semiconductor layer; and a selective channel structure, passing through the selective gate structure, and comprising a second channel layer, wherein a first end portion of the first channel layer away from the semiconductor layer is in contact with a second end portion of the second channel layer close to the semiconductor layer. The first channel layer and the second channel layer of the three-dimensional memory provided in the present application can be in direct contact connection, thereby avoiding lead-in channel plugging, and ameliorating the problem of programming interference.
H10B 41/35 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire avec un transistor de sélection de cellules, p.ex. NON-ET
H10B 41/30 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire
H10B 41/23 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés
H10B 41/20 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur
H10B 41/10 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la configuration vue du dessus
4.
MEMORY DEVICE, OPERATING METHOD THEREOF, AND MEMORY SYSTEM
A memory device includes at least one memory cell array block and a control logic. The memory cell array block includes multiple layers of memory cells and word line layers provided corresponding to individual layers of memory cells. The memory cell array block is divided into at least two memory cell array subblocks, each memory cell array subblock comprising a number of layers of memory cells and word line layers provided corresponding to individual layers of memory cells. The control logic is coupled to the memory cell array block, and configured to: erase, read or program the memory cell array block using a block mode or a subblock mode, and when the memory cell array block is erased, read, or programmed under the subblock mode, determine, at least based on a state of one of the two memory cell array subblocks, an operation strategy of the other memory cell array subblock.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
5.
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
In certain aspects, a method for forming a three-dimensional (3D) memory device is disclosed. A stack structure including interleaved first dielectric layers and second dielectric layers is formed. Channel structures extending through the first dielectric layers and the second dielectric layers in a first region of the stack structure are formed. All the second dielectric layers in the first region and parts of the second dielectric layers in a second region of the stack structure are replaced with conductive layers. Word line pick-up structures extending through the first dielectric layers and remainders of the second dielectric layers in the second region of the stack structure are formed at different depths, such that the word line pick-up structures are electrically connected to the conductive layers, respectively, in the second region of the stack structure.
In certain aspects, a three-dimensional (3D) memory device includes channel structures in a first region, word line pick-up structures in a dielectric portion of a second region, and word lines each extending in the first region and a conductive portion of the second region. The first region and the second region are arranged in a first direction. The dielectric portion and the conductive portion of the second region are arranged in a second direction perpendicular to the first direction. The word lines are discontinuous in the dielectric portion of the second region and are electrically connected to the word line pick-up structures, respectively.
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
7.
MEMORY DEVICE, OPERATING METHOD THEREOF, SYSTEM, AND STORAGE MEDIUM
A memory device, an operating method thereof, a system, and a non-transitory tangible storage medium are disclosed. The memory device includes a source line (SL), a bit line (BL), a memory string, a word line, a select line and a peripheral circuit. The memory string includes a memory cell and a select transistor including a storage layer. The word line is coupled to the memory cell. The select line is coupled to the select transistor. The peripheral circuit is coupled to the SL, the BL, the select line, and the word line. The peripheral circuit is configured to: apply a first voltage to the select line; and apply a second voltage to the SL and/or the BL, in which a first peak level of the first voltage is greater than a second peak level of second voltage.
G11C 16/20 - Initialisation; Présélection de données; Identification de puces
G11C 16/12 - Circuits de commutation de la tension de programmation
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
8.
WORD-LINE-PICKUP STRUCTURE AND METHOD FOR FORMING THE SAME
A memory device, having a plurality of first-word-lines, each first-word-line having a first portion, a second portion, and a third portion; a plurality of second-word-lines, each second-word-line having a first portion, a second portion, and a third portion; and a memory array having a first side, a second side laterally opposite the first side, and a third side. The first portions of each first-word-line and each second-word-line are spaced apart from their respective third portions. The second portion of each first-word-line and the second portion of each second-word-line are non-parallel and non-co-linear with their respective first portions and third portions. Each first-word-line is disposed such that its second portion is adjacent to the first side, and each second-word-line is disposed such that its second portion is adjacent to the second side. The memory device further has a plurality of first-side-word-line-pickup-structures, and a plurality of second-side-word-line-pickup-structures.
Three-dimensional (3D) memory devices and fabricating methods are disclosed. A disclosed 3D memory device comprises a first semiconductor structure comprising: an array of first-type through stack structures in a first region and an array of second-type through stack structures in a second region, and a slit structure separating the array of first-type through stack structures from the array of second-type through stack structures. The 3D memory device further comprises a second semiconductor structure comprising, a first periphery circuit and a second periphery circuit at different levels. The second semiconductor structure and the first semiconductor structure are bonded together, such that the first periphery circuit is located between the second periphery circuit and the first semiconductor structure.
H10B 43/40 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région de circuit périphérique
H10B 51/40 - Dispositifs de RAM ferro-électrique [FeRAM] comprenant des transistors ferro-électriques de mémoire caractérisés par la région de circuit périphérique
H10B 53/40 - Dispositifs RAM ferro-électrique [FeRAM] comprenant des condensateurs ferro-électriques de mémoire caractérisés par la région de circuit périphérique
H10B 80/00 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif de mémoire couvert par la présente sous-classe
10.
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
Three-dimensional (3D) memory devices and fabricating methods are disclosed. A disclosed 3D memory device comprises: a first semiconductor structure, comprising: an array of first type through stack structures in a first region of a memory stack; an array of second type through stack structures in a second region of the memory stack; a semiconductor layer including a first portion on the array of first type through stack structures and a second portion on the array of second type through stack structures; multiple vias each penetrating the semiconductor layer and in contact with a corresponding one of the first type through stack structures or the array of second type through stack structures; and a slit structure separating the array of first type through stack structures from the array of second type through stack structures, and separating the first portion of the semiconductor layer from the second portion of the semiconductor layer.
H10B 43/40 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région de circuit périphérique
H10B 51/40 - Dispositifs de RAM ferro-électrique [FeRAM] comprenant des transistors ferro-électriques de mémoire caractérisés par la région de circuit périphérique
H10B 53/40 - Dispositifs RAM ferro-électrique [FeRAM] comprenant des condensateurs ferro-électriques de mémoire caractérisés par la région de circuit périphérique
H10B 80/00 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif de mémoire couvert par la présente sous-classe
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
11.
MEMORY DEVICE, MEMORY SYSTEM, AND OPERATING METHOD THEREOF
A memory device, a memory system, and a method thereof are provided. In the method, an N-th programming pulse is applied to a word line coupled to memory cells of the memory device each with a target programming state being an i-th programming state. A first sub-verification and an M-th second sub-verification are performed on the memory cells to obtain a first sub-result and an M-th second sub-result, respectively. Based on the M-th second sub-result, a subset of the memory cells is determined to be programmed with an (N+1) -th programming pulse. Then, the (N+1) -th programming pulse is applied to the word line. After applying the (N+1) -th programming pulse to the word line, the memory cells are determined to be successfully programmed to the i-th programming state based on the first sub-result indicating that a number of failed bits in the first sub-verification is less than a first preset value.
A memory device includes a memory array and a peripheral circuit coupled to the memory array. The memory array includes a vertical transistor having a first terminal and a second terminal, a storage unit having a first end coupled to the first terminal of the vertical transistor, and a bit line coupled to the second terminal of the vertical transistor. The vertical transistor includes a semiconductor body extending in a first direction, and a gate structure coupled to at least one side of the semiconductor body. The vertical transistor is disposed between the bit line and the storage unit along the first direction.
H10B 12/00 - Mémoires dynamiques à accès aléatoire [DRAM]
G11C 7/12 - Circuits de commande de lignes de bits, p.ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
H01L 21/822 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels pour produire des dispositifs, p.ex. des circuits intégrés, consistant chacun en une pluralité de composants le substrat étant un semi-conducteur, en utilisant une technologie au silicium
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
H10B 63/10 - Dispositifs RAM à changement de phase [PCRAM, PRAM]
H10B 63/00 - Dispositifs de mémoire par changement de résistance, p.ex. dispositifs RAM résistifs [ReRAM]
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/528 - Configuration de la structure d'interconnexion
13.
SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME
A semiconductor structure and method for manufacturing thereof are provided. The semiconductor structure includes a vertical transistor. The vertical transistor includes a semiconductor body extending in a first direction. The semiconductor body includes a source/drain at one end of the semiconductor body. The vertical transistor also includes a gate structure coupled to at least one side of the semiconductor body. The gate structure includes a gate dielectric and a gate electrode. The vertical transistor further includes a silicide. At least part of the silicide is above the source/drain. An area of the silicide is larger than an area of a first surface of the source/drain. The first surface is vertical to the first direction.
A memory device, a memory system, and a program operation method are disclosed. In one example, at an ithprogramming loop, in response to determining that index i is greater than or equal to a first preset value and less than an initial verification loop number corresponding to a target state of memory cells in the memory device, an ith programming inhibition operation may be performed on the memory cells of the target state. Index i may be a positive integer, and the initial verification loop number may indicate a programming loop number that starts a verification operation corresponding to the target state of the memory cells.
A semiconductor device and methods for forming the same are provided. The method includes: forming a plurality of first trenches having a first width during forming a plurality of grooves having a second width less than the first width, each of the plurality of first trenches and the plurality of grooves extending laterally along a first lateral direction and vertically in an upper portion of a semiconductor layer, the plurality of first trenches and the plurality of grooves being alternatively arranged along a second lateral direction different from the first lateral direction; forming a spacer in each groove, where the spacer is laterally extending along the first lateral direction; and forming two disconnected conductive structures in each first trench, the disconnected conductive structures laterally extending in parallel along the first lateral direction.
A semiconductor device and methods for forming the same are provided. The semiconductor device includes an array of vertical transistors. Each transistor includes a semiconductor body extending in a vertical direction, and a gate structure located adjacent to a sidewall of the semiconductor body. The gate structures of each row of vertical transistors are connected with each other and extend along a first lateral direction to form a word line. A first word line of a first row of vertical transistors is located at a first side of the semiconductor bodies of the first row of vertical transistors along a second lateral direction perpendicular to the first lateral direction; and a second word line of a second row of vertical transistors adjacent to the first row of vertical transistors is located at a second side of the semiconductor bodies of the second row of vertical transistors along the second lateral direction.
A three-dimensional memory device having vertical transistors and a method for forming the same are disclosed. In an example, the memory device includes an array of memory cells each including a vertical transistor. Along a first direction, one of the vertical transistors is arranged between two of separation structures in a plan view. Each of the separation structures includes a protrusion, and the separation structure and a corresponding protrusion are integral. The memory device also includes a plurality of bit lines that include at least one conductive layer. The at least one conductive layer is arranged between two protrusions of the two separation structures and on the one of vertical transistors to couple one of the bit lines with the one of the vertical transistors.
Three-dimensional (3D) semiconductor devices and fabricating methods are provided. In some implementations, a 3D semiconductor device includes: an array of vertical transistors each comprising a semiconductor body extending in a vertical direction; a plurality of word lines each extending in a first lateral direction, wherein each word line is shared by a row of the vertical transistors arranged along the first lateral direction; and a plurality of bit lines each extending in a second lateral direction perpendicular to the first lateral direction; wherein the semiconductor bodies are further arranged along a third lateral direction different from the first lateral direction and the second lateral direction.
A memory device includes a memory array including memory blocks, and a control circuit coupled to the memory array. The control circuit is configured to when multi-pass program operations are performed, during a non-last pass program of the memory cells in a first memory sub-block of a first memory block, determine verify loop counts of verify operations after programming the memory cells in the first memory sub-block of the first memory block to one or more first target program states; and when programming the memory cells in a second memory sub-block of the first memory block to the one or more first target program states using the same program and verify conditions as for the first memory sub-block of the first memory block, during the non-last pass program, not perform at least the verify operation corresponding to the last of the verify loop counts.
G11C 16/10 - Circuits de programmation ou d'entrée de données
G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p.ex. FAMOS
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
20.
THREE-DIMENSIONAL MEMORY AND PREPARATION METHOD THEREFOR, STORAGE SYSTEM, AND ELECTRONIC DEVICE
The present disclosure relates to the technical field of semiconductor chips. Provided are a three-dimensional memory and a preparation method therefor, a storage system, and an electronic device. The three-dimensional memory comprises a stacked structure, an etching stop layer, a protective layer and a plurality of connecting columns, wherein the stacked structure comprises gate layers and dielectric layers, which are alternately arranged; the stacked structure comprises a plurality of steps; the etching stop layer is arranged on each step; the protective layer covers the stacked structure and the etching stop layer; and each connecting column penetrates the protective layer and the etching stop layer on the corresponding step and is electrically connected to the gate layer of the corresponding step.
H10B 41/35 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire avec un transistor de sélection de cellules, p.ex. NON-ET
21.
THREE-DIMENSIONAL MEMORY AND PREPARATION METHOD THEREFOR, STORAGE SYSTEM, AND ELECTRONIC DEVICE
The present disclosure provides a three-dimensional memory and a preparation method therefor, a storage medium, and an electronic device. The three-dimensional memory comprises a stacked structure, a plurality of first stop portions arranged along a first direction, a protective layer, and a plurality of contact columns. The stacked structure comprises a step structure, and the step structure comprises a plurality of staircase structures arranged along the first direction and having different heights along a second direction. The plurality of first stop portions are located on a plurality of steps of at least one staircase structure. The protective layer covers the step structure and the first stop portions, and the protective layer is at least partially located between the first stop portions and steps adjacent to the first stop portions. The contact columns pass through the protective layer and the first stop portions, and are connected to gate layers in the steps corresponding to the first stop portions.
H10B 51/50 - Dispositifs de RAM ferro-électrique [FeRAM] comprenant des transistors ferro-électriques de mémoire caractérisés par la région limite entre la région noyau et la région de circuit périphérique
22.
PAGE BUFFER, MEMORY DEVICE, AND METHOD FOR PROGRAMMING THEREOF
A page buffer includes a first charge/discharge circuit and a second charge/discharge circuit coupled to a bit line. The first charge/discharge circuit is configured to store first bit line forcing information and apply a first bit line forcing voltage to the bit line based on the first bit line forcing information. The second charge/discharge circuit coupled to the bit line and configured to store a second bit line forcing information, and apply a second bit line forcing voltage, different from the first bit line forcing voltage, to the bit line based on the second bit line forcing information. The first bit line forcing voltage and the second bit line forcing voltage are both higher than a programming bit line voltage and lower than a programming-inhabit bit line voltage.
G11C 16/10 - Circuits de programmation ou d'entrée de données
G11C 7/12 - Circuits de commande de lignes de bits, p.ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
23.
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
A method for forming a 3D memory device is provided. The method comprises forming an array wafer including a core array region, a staircase region, and a periphery region. Forming the array wafer includes forming an alternating dielectric stack on a first substrate, forming a plurality of channel structures in the alternating dielectric stack in the core array region, each channel structure including a functional layer and a channel layer, forming a staircase structure in the staircase region, and forming a plurality of dummy channel structures. The method further comprises bonding a CMOS wafer to the array wafer; and removing the first substrate; removing a portion of functional layer of each channel structure to expose channel layer, and doping the exposed portion of the channel layer.
H01L 27/11548 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région limite entre la région noyau et la région de circuit périphérique
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H01L 27/11575 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région limite entre la région noyau et la région de circuit périphérique
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
24.
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
A three-dimensional memory device includes memory arrays stacking in a first direction. Each of the memory arrays includes a stack structure including interleaved conductive layers and first dielectric layers extending in a second direction perpendicular to the first direction and a third direction perpendicular to the first direction and the second direction. The conductive layers include word lines and a drain select gate line, and the drain select gate line is separated by a second dielectric layer in the second direction.
H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
25.
METHOD FOR PROGRAMMING MEMORY DEVICE, MEMORY DEVICE AND MEMORY SYSTEM
G11C 11/56 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments d'emmagasinage comportant plus de deux états stables représentés par des échelons, p.ex. de tension, de courant, de phase, de fréquence
26.
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
Embodiments of three-dimensional memory devices are disclosed. A disclosed memory structure can comprises a memory cell, a bit line contact coupled to the memory cell, a bit line coupled to the bit line contact, a source line contact coupled to the memory cell, and a source line coupled to the source line contact. The memory cell comprises a cylindrical body having a cylindrical shape, an insulating layer surrounding the cylindrical body, a word line contact surrounding a first portion of the insulating layer, the word line contact coupled to a word line, and a plurality of plate line contact segments surrounding a second portion of the insulating layer, the plurality of plate line contact segments coupled to a common plate line.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
G11C 11/401 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules nécessitant un rafraîchissement ou une régénération de la charge, c. à d. cellules dynamiques
A method for discharging a memory device after an erase operation. The method comprises grounding a source line of the memory device; and switching on a discharge transistor to connect a bit line of the memory device to the source line by maintaining a constant voltage difference between a gate terminal of the discharge transistor and the source line. The method also includes comparing an electrical potential of the source line with a first predetermined value; and floating the gate terminal of the discharge transistor when the electrical potential of the source line is lower than the first predetermined value.
Provided in the embodiments of the present disclosure are a memory and a control method therefor. The memory comprises: a storage array which comprises a plurality of storage surfaces, each storage surface comprising storage blocks consisting of storage cells; and a peripheral circuit which is connected to the storage array and configured to be capable of controlling the plurality of storage surfaces to perform an asynchronous operation. The peripheral circuit comprises at least one state machine; each state machine is arranged corresponding to at least one of the plurality of storage surfaces; the state machine is connected to a memory interface and can receive in parallel from the memory interface a control command related to the asynchronous operation corresponding to each storage surface; each state machine can independently process the control command received thereby, so as to obtain control information of the corresponding storage surface.
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p.ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]; Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]
G06F 13/16 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus de mémoire
A semiconductor device is provided. For example, the semiconductor device can include a plurality of transistors that are arranged in an array in an X-Y plane. Each of the transistors can include a channel extending in Z direction. The semiconductor device can further include a plurality of word lines. Each of the word lines can electrically connect neighboring some of the transistors that are arranged in a column in X direction at lateral walls of the channels thereof. The semiconductor device can further include one or more electromagnetic shielding elements. At least one of the electromagnetic shielding elements can be disposed between neighboring two of the transistors that are disposed in a row in Y direction.
A method for debugging of flash memory devices using NAND self-verification, comprising: programming a selected page of the NAND flash memory device according to first and second programming data. The selected page can include a plurality of memory cells corresponding to a word line. The programming of the selected page can include a plurality of programming operations and a plurality of verifying operations. Ones of the pluralities of verifying operations can be performed after corresponding ones of the pluralities of programming operations to determine whether programmed memory cells of the selected page have threshold voltage levels according to the first or second programming data. The method can also include performing self-verification on the selected page to determine whether data stored at the selected page was overwritten and generating a fail indication upon determining that the data stored at the selected page was overwritten.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
31.
DATA PROTECTION IN NAND MEMORY USING INTERNAL FIRMWARE TO PERFORM SELF-VERIFICATION
A method of data protection for a NAND memory includes programming a selected page of the NAND flash memory device according to programming data. The programming of the selected page can include a plurality of programming operations and a plurality of verifying operations, with ones of the plurality of verifying operations performed after corresponding ones of the plurality of programming operations to determine whether programmed memory cells of the selected page have threshold voltage levels according to the programming data. The method can also include determining a completion of the programming of the selected page based on each of the plurality of verification operations returning a pass result. The method can also include performing, after the determining, a read operation on the selected page by the NAND flash memory device to self-verify data stored at the selected page according to the programming data.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p.ex. FAMOS
32.
MEMORY DEVICE, MEMORY SYSTEM, AND METHOD OF OPERATING THE SAME
A peripheral circuit of a memory device includes page buffers. Each page buffer includes a main latch, a bias latch, (N-1) data latches, and a cache latch coupled to a data path. The peripheral circuit is further configured to: in the process of programming a first physical page, disable a bit line bias function to release the bias latch to replace one of N page latches to perform a programming verification of memory states; release one of the N page latches to cache program data of one of the N logical pages of a second physical page; and in the process of programming the first physical page, store the program data of the one of the N logical pages of the second physical page in a released page latch.
A method of data protection for a NAND memory includes programming first and second pages of a NAND flash memory device according to programming data such that data stored in the first and second pages are redundant. The programming of the first and second pages includes a plurality of programming operations using a plurality of programming voltages and a plurality of verifying operations to determine whether programmed memory cells of the first page have threshold voltage levels according to the programming data. The method also includes determining a completion of the programming of the first and second pages based on each of the plurality of verification operations returning a pass result. The method also includes performing, after the determining, a read operation on the second page by the NAND flash memory device to self-verify the data stored at the second page.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
G11C 16/10 - Circuits de programmation ou d'entrée de données
34.
MEMORY DEVICE, MEMORY SYSTEM, AND METHOD OF OPERATING THE SAME
A peripheral circuit of a memory device is configured to: in the process of programming a first physical page, perform a programming verification to a programming corresponding to the 2 (N-M)th memory state; when the program verification of the 2 (N-M)th memory state is passed, identifiers corresponding to the 1st to 2 (N-M)th memory states stored by the main latch are made different from those corresponding to the 2 (N-M)+1st to 2 N th memory states; release at least one of the N page latches to cache program data of at least one logical page of the N logical pages of a second physical page; and the programming data of one logical page in the N logical pages of the second physical page is stored in a released page latch, where M is an integer greater than or equal to 1 and less than or equal to (N-2).
In certain aspects, a semiconductor device includes a substrate, a first trench isolation in the substrate, a first doped region formed below the first trench isolation, a second doped region formed in the substrate, and a first gate structure formed adjacent to the second doped region. The first doped region is an ion implantation region, and a distance between the first doped region and the second doped region is equal to or more than 0.6 μm.
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
36.
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
A memory system, a semiconductor device and fabrication method for the semiconductor device are provided. The semiconductor device includes a memory stack with gate layers and insulating layers, and the gate layers and the insulating layers are stacked alternatingly. The semiconductor device also includes a first channel structure formed in a first channel hole in the memory stack. The first channel structure includes a channel plug in connection with a channel layer of the first channel structure. The semiconductor device also includes an isolation stack including a landing liner layer and an isolation layer. A first portion of the landing liner layer is laid on the channel plug. The semiconductor device includes a first contact structure formed in the isolation stack. The first contact structure is connected to the channel plug via an opening in the first portion of the landing liner layer.
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
37.
TESTING APPARATUS, TESTING METHOD, AND TESTING MACHINE
Provided are an apparatus and method for testing solid state drives. The apparatus comprises: a test board, which comprises test ports; a first positioning portion, which is arranged on the test board; and an adapter box, which comprises: a box body, which is used for detachably installing a plurality of solid state drives to be tested; and a second positioning portion, which is arranged on the box body and is suited to match with the first positioning portion, so as to allow the plurality of solid state drives to be tested to form communication connections with the test ports.
G11C 29/56 - Vérification du fonctionnement correct des mémoires; Test de mémoires lors d'opération en mode de veille ou hors-ligne Équipements externes pour test de mémoires statiques, p.ex. équipement de test automatique [ATE]; Interfaces correspondantes
B07C 5/34 - Tri en fonction d'autres propriétés particulières
38.
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
According to an aspect of the disclosure, a semiconductor device is provided. The semiconductor device includes one or more bottom select gate (BSG) layers positioned over a substrate, a plurality of word line layers positioned over the one or more BSG layers, and a plurality of insulating layers positioned on the substrate. The plurality of insulating layers is disposed on surfaces of the substrate, the one or more BSG layers, and the plurality of word line layers. The semiconductor device includes a first dielectric structure extending from the substrate and through the one or more BSG layers, and a second dielectric structure extending from the first dielectric structure and through the plurality of word line layers.
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
39.
MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
The present disclosure provides a memory system packaging structure and fabrication methods. The memory system packaging structure includes memory modules, a memory controller, a redistribution layer electrically connected to the memory controller, a plastic encapsulation layer encapsulating the memory modules and the memory controller, and one or more connecting pillars extending in the vertical direction and configured for providing electric power to the memory modules. Each memory module includes memory dies stacked in a vertical direction. Each connecting pillar includes a first portion being in physical contact with one of the memory dies and a second portion being in physical contact with the redistribution layer.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 23/485 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées formées de structures en couches comprenant des couches conductrices et isolantes, p.ex. contacts planaires
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
40.
BARRIER LAYERS FOR WORD LINE CONTACTS IN THREE-DIMENSIONAL NAND MEMORY AND FABRICATION METHODS THEREOF
The present disclosure provides a method for forming a three-dimensional memory device. The method includes disposing an alternating dielectric stack on a substrate in a first direction perpendicular to the substrate; and forming a staircase structure and a dividing wall in the alternating dielectric stack. The staircase structure and the dividing wall extend in a second direction parallel to the substrate, and the dividing wall is adjacent to the staircase structure. The method also includes forming, sequentially on the staircase structure, a first barrier layer and a second barrier layer different from the first barrier layer. The method further includes forming a gate line slit (GLS) opening in the dividing wall. The GLS opening penetrates through the alternating dielectric stack in the first direction and is distant from the second barrier layer in a third direction that is parallel to the substrate and is perpendicular to the second direction.
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
41.
SYSTEM AND METHOD FOR DEFRAGMENTATION OF MEMORY DEVICE
In certain aspects, the memory controller includes a controller memory for storing a logical-to-physical (L2P) address mapping table corresponding to a file, and a controller processor configured to control a memory device, receive a mapping update command, and update the L2P address mapping table according to the mapping update command by replacing original logical addresses of logical block address (LBA) segments of the file with new continuous logical addresses of a merged LBA segment of the file, and changing an original mapping relation between the original logical addresses of the LBA segment of the file and physical addresses of the file, to a new mapping relation between the new continuous logical addresses of the merged LBA segment of the file and the physical addresses of the file.
Provided in the present application are a three-dimensional memory and a manufacturing method therefor, and a storage system. The memory comprises: a bottom selection gate structure; a laminated structure, which is arranged on the bottom selection gate structure and comprises a channel layer which extends in the laminated structure in a first direction of the thickness of the laminated structure, wherein the channel layer has impurities of a first conductivity type; a top selection gate structure, which is arranged on the laminated structure, wherein at least one of the bottom selection gate structure and the top selection gate structure comprises a semiconductor structure, which extends in the first direction and is connected to the channel layer, and has impurities of a second conductivity type, which is opposite to the first conductivity type of the impurities. In the memory provided in the present application, a semiconductor structure, which has impurities of a conductivity type opposite to the conductivity type of impurities in a channel layer, is provided in a selection gate structure, such that a PN junction barrier capacitor can be formed in a connection circuit, which is connected to the channel layer. Therefore, the width of a spatial charge area in the capacitor can be modulated according to requirements of erasing, programming and reading operations, the connection speed of the channel layer is controlled, and the turning-on/turning-off performance of the three-dimensional memory is optimized.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
43.
THREE-DIMENSIONAL MEMORY DEVICE WITH DIVIDED DRAIN SELECT GATE LINES AND METHOD FOR FORMING THE SAME
A memory device includes a stack structure over a substrate, a channel structure extending in the stack structure, and a dielectric layer over the channel structure. The dielectric layer includes a first material. The memory device may also include a drain-select gate (DSG) cut structure extending through the dielectric layer. The DSG cut structure includes a second material different from the first material.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
A memory device includes an array of memory cells in a plurality of memory strings and arranged in a plurality of rows of memory cells. The memory device also includes a plurality of word lines respectively coupled to the plurality of rows of memory cells, and a peripheral circuit coupled to the plurality of word lines and configured to perform a read operation on a selected row of memory cells of the plurality of rows of memory cells. The selected row of memory cells is coupled to a selected word line, wherein the peripheral circuit is configured to apply a word line voltage on each of the plurality of word lines and determine a highest threshold voltage of the plurality of rows of memory cells based on a change of a word line capacitance loading in response to the word line voltage.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
G11C 16/26 - Circuits de détection ou de lecture; Circuits de sortie de données
G11C 8/08 - Circuits de commande de lignes de mots, p.ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, pour lignes de mots
G11C 7/12 - Circuits de commande de lignes de bits, p.ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
The present disclosure is directed to a memory structure including a staircase structure. The staircase structure can include a bottom select gate, a plate line formed above the bottom select gate, and a word line formed above the plate line. The pillar can extend through the bottom select gate, the plate line, and the word line. The memory structure can also include a source structure formed under the pillar and a drain cap formed above the pillar. The memory structure can further include a bit line formed above the drain cap.
A method for determining wafer flatness and fabricating a semiconductor device, includes storing a first wafer expansion of a first wafer that is collected along a first direction parallel to a working surface of the first wafer during a lithography process. The lithography process is for patterning structures on the working surface of the first wafer. Before a fabrication step with a wafer flatness requirement, a wafer flatness of the first wafer is determined based on the first wafer expansion collected during the lithography process using a flatness prediction model that is configured to predict the wafer flatness. A layer is deposited on a back side of the first wafer with a thickness that is based on the determined wafer flatness of the first wafer.
A method for analyzing integrated circuits, includes: performing a first resistor capacitor (RC) extraction process on a power-receiving circuit and producing a first RC model; scanning a netlist of a power distribution network, the power distribution network electrically connected to the power-receiving circuit; determining a selection of circuit elements of the power distribution network based on a predetermined criteria; performing a second RC extraction process on the selection of circuit elements and producing a second RC model; performing a simulation process on the power-receiving circuit and the power distribution network using the first and second RC models.
G06F 30/33 - Vérification de la conception, p.ex. simulation fonctionnelle ou vérification du modèle
G06F 30/327 - Synthèse logique; Synthèse de comportement, p.ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p.ex. FAMOS
48.
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING LASER ANNEALING
Aspects of the disclosure provide a semiconductor device and a method to manufacture the semiconductor device. A channel hole is formed in a stack including alternating first layers and second layers. The stack is formed over a substrate of the semiconductor device. A gate dielectric layer and a channel layer are sequentially formed in the channel hole. Laser annealing is performed on the channel layer using laser light. An incidence angle of the laser light on an upper surface of the channel layer causes a total internal reflection to occur at an interface between the channel layer and the gate dielectric layer and an interface between the channel layer and an insulating layer that is adjacent to the channel layer.
H01L 21/268 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée les radiations étant électromagnétiques, p.ex. des rayons laser
49.
MEMORY DEVICE, MEMORY SYSTEM, AND READ OPERATION METHOD THEREOF
Upon determining that a first read operation on one memory cell of a plurality of memory cells has failed, a second read operation on the memory cell is started. In the second read operation, a second pass voltage is applied to first unselected word lines, and a first pass voltage is applied to second unselected word lines. The first unselected word lines include one or more word lines adjacent to a selected word line, and the second unselected word lines include remaining unselected word lines. The selected word line corresponds to the memory cell to be read. The first pass voltage includes a voltage applied to the first unselected word lines in the first read operation. The second pass voltage is higher than the first pass voltage.
A memory device includes a memory cell array and peripheral circuits. The memory cell array may include one or more first memory cells configured to store first type data, and one or more second memory cells configured to store second type data. The peripheral circuits may be coupled to the memory cell array and configured to perform a first program operation on the one or more first memory cells, perform the first program operation on the one or more second memory cells, and perform a second program operation on the one or more first memory cells. A first storage time corresponding to the first type data is longer than a second storage time corresponding to the second type data.
G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
51.
DEVICE HAVING PAGE BUFFER, MEMORY SYSTEM, AND METHOD OF OPERATING THE SAME
In one aspect, a page buffer includes a first latch configured to store program verification information; a second latch configured to store first bit line forced information; and a dynamic latch configured to store second bit line forced information. The first bit line forced information is different from the second bit line forced information. The dynamic latch includes a control switch coupled to the second latch. And the dynamic latch is configured to store information through a capacitor to which the control switch is coupled.
A three-dimensional (3D) memory device includes a plurality of memory stacks arranged along a first direction, and a dummy block structure disposed between two adjacent memory stacks. Each memory stack includes a plurality of first conductive layers and a plurality of first dielectric layers alternately stacked along a second direction perpendicular to the first direction. A channel structure extends through the plurality of first conductive layers and the plurality of first dielectric layers along the second direction. A first isolation structure is disposed between the dummy block structure and one of the plurality of memory stacks. A substrate is disposed under the plurality of memory stacks, the dummy block structure, and the first isolation structure. A second isolation structure is disposed in the substrate extending along the second direction.
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
53.
VERTICAL MEMORY DEVICES AND METHODS FOR OPERATING THE SAME
This disclosure is directed to methods for performing operations on a memory device. The memory device can include a bottom select gate, a plate line above the bottom select gate, a word line above the plate line, a pillar extending through the bottom select gate, the plate line, and the word line, a source line under the pillar, a drain cap above the pillar and a bit line formed above the drain cap. The method can include applying a first positive voltage bias to the bottom select gate and applying a second positive voltage bias to the word line. The method can also include applying a third positive voltage bias to the bit line after the word line reaches the second positive voltage bias. The method can further include applying a ground voltage to the word line and applying the ground voltage to the bit line.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
The present application provides a three-dimensional memory and a preparation method therefor. The preparation method for the three-dimensional memory comprises: forming, on one side of a substrate, a laminated structure comprising dummy gate layers and interlayer insulation layers that are stacked, every adjacent dummy gate layer and interlayer insulation layer forming a plurality of steps, and at least part of the interlayer insulation layer of each step being exposed; forming a buffer layer covering each step; removing the part of the buffer layer covering the sidewall of each step so as to form a plurality of spacing slots; forming a dielectric layer filling each spacing slot and covering each step; and forming contact holes running through the dielectric layer and the buffer layer and extending to the dummy gate layer furthest from the substrate.
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
55.
THREE-DIMENSIONAL MEMORY AND PREPARATION METHOD THEREFOR
A three-dimensional memory and a preparation method therefor. The method comprises: forming, on a substrate (110), a stacked structure (120) comprising dielectric layers (121) and sacrificial layers (122) that are alternately stacked; forming a gate line slit (161) running through the stacked structure (120); and etching, via the gate line slit (161), part of the dielectric layers (121) and sacrificial layers (122) close to the gate line slit (161) so as to form a groove (162), wherein the bottom of the groove (162) is located in the sacrificial layer (122), and in the direction perpendicular to the substrate (110), the minimum value of the size of the groove (162) is greater than or equal to the size of the corresponding sacrificial layer (122). According to the three-dimensional memory prepared by the method, the problems of short circuiting of a gate layer (166) and circuit breaking of the gate layer (166) are avoided to a certain extent, and the reliability of the memory is improved.
H01L 27/11565 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la configuration vue du dessus
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
56.
THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD FOR ENHANCED RELIABILITY
Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a dielectric stack over a substrate, forming a functional layer and a semiconductor channel through the dielectric stack, forming a conductor/insulator stack based on the dielectric stack, and forming memory cells through the conductor/insulator stack. Each memory cell includes a portion of the functional layer and the semiconductor channel. At least one of the functional layer and the semiconductor channel includes a certain amount of deuterium elements.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
57.
THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF
Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a layer stack, a channel hole, a blocking layer, a charge trap layer, a tunnel insulation layer, and a channel layer. The surface region of the charge trap layer includes a carbon region that contains a certain amount of carbon elements.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
58.
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING SELF-ALIGNED MULTIPLE PATTERNING AND AIRGAPS
Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a conductor/insulator stack (146) over a substrate (110), configuring memory cells through the conductor/insulator stack (146), forming a conductive layer (1751), removing a portion of the conductive layer (1751) to form an opening in the conductive layer, depositing a dielectric material (1756) in a space of the opening, and forming an airgap (1757) in the space.
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
Embodiments of the present application provide a wafer bonding device and method. The wafer bonding method comprises: determining a first position parameter of a first alignment mark on a first wafer by using a transmissive light beam; determining a second position parameter of a second alignment mark on a second wafer by using the transmissive light beam, wherein the transmissive light beam penetrates through the first wafer and/or the second wafer; according to the first position parameter and the second position parameter, adjusting the relative position of the first wafer and the second wafer by using the transmissive light beam, so that the relative position of the first alignment mark and the second alignment mark satisfies a predetermined bonding condition; and bonding the first wafer to the second wafer.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
Embodiments of the present application provide a wafer bonding device and method. The wafer bonding method comprises: determining a first position parameter of a first alignment mark on a first wafer by using a first type of light beam; determining a second position parameter of a second alignment mark on a second wafer by using the first type of light beam; moving the first wafer and the second wafer to relative positions according to the first position parameter and the second position parameter, so that the first alignment mark and the second alignment mark are aligned for the first time; adjusting the relative positions of the first wafer and the second wafer by using a second type of light beam, so that the first alignment mark and the second alignment mark are aligned for the second time; and bonding the first wafer and the second wafer.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
A semiconductor device includes a semiconductor substrate, a doped region formed in the semiconductor substrate, a source/drain formed in the doped region, a conductive pad formed on the source/drain, a gate dielectric layer disposed over the semiconductor substrate and the doped region exposing the conductive pad, a gate formed on the gate dielectric layer, an insulation layer formed over the gate, the gate dielectric layer, and the conductive pad, and a contact formed in the insulation layer in electric contact with the conductive pad.
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
62.
METHODS FOR THERMAL TREATMENT OF A SEMICONDUCTOR LAYER IN SEMICONDUCTOR DEVICE
Methods for thermal treatment on a semiconductor device is disclosed. One method includes obtaining a pattern of a treatment area having amorphous silicon, aligning a laser beam with the treatment area, the laser beam in a focused laser spot having a spot area equal to or greater than the treatment area, and performing a laser anneal on the treatment area by emitting the laser beam towards the treatment area for a treatment period.
H01L 21/268 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée les radiations étant électromagnétiques, p.ex. des rayons laser
63.
THREE-DIMENSIONAL MEMORY DEVICE HAVING STAIRCASE STRUCTURE AND METHOD FOR FORMING THE SAME
A three-dimensional (3D) memory device includes interleaved conductive layers and dielectric layers. Edges of the conductive layers and dielectric layers define a plurality of stairs. The 3D memory device may also include a plurality of landing structures each disposed on a respective conductive layer at a respective stair. Each of the landing structures comprises a first layer of a first material and a second layer of a second material. The first layer is over the second layer. The second material is different from the first material.
H01L 27/11575 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région limite entre la région noyau et la région de circuit périphérique
According to an aspect of the disclosure, a method of controlling bow of a substrate is provided. In the method, a substrate is provided on which a dielectric layer is formed. The substrate has a bow with respect to a reference plane. The bow of the substrate is adjusted by performing an annealing process on the substrate. The annealing process includes one of a first process condition and a second process condition. The first process condition induces a tensile stress on the substrate to cause the substrate to bow upward with respect to the reference plane. The second process condition induces a compressive stress on the substrate to cause the substrate to bow downward with respect to the reference plane.
H01L 21/324 - Traitement thermique pour modifier les propriétés des corps semi-conducteurs, p.ex. recuit, frittage
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
65.
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THEREOF
In certain aspects, a memory device includes a vertical transistor, a storage unit, and a bit line. The vertical transistor includes a semiconductor body extending in a first direction. The semiconductor body includes a doped source, a doped drain, and a channel portion. The storage unit is coupled to a first terminal. The first terminal is one of the source and the drain. The bit line extends in a second direction perpendicular to the first direction and in contact with a second terminal. The second terminal is another one of the source and the drain that is formed on one or some sides, but not all sides, of a protrusion of the semiconductor body. The bit line is separated from the channel portion of the semiconductor body by the second terminal.
G11C 11/401 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules nécessitant un rafraîchissement ou une régénération de la charge, c. à d. cellules dynamiques
The present application provides a three-dimensional memory and a preparation method therefor. The preparation method comprises: forming a first stacked structure on a substrate; forming a bottom portion selection gate notch that penetrates the first stacked structure, and forming a first sacrificial layer in the bottom portion selection gate notch; forming a second stacked structure that covers the first sacrificial layer and the first stacked structure, the first stacked structure and the second stacked structure each comprising dielectric layers and gate sacrificial layers which are alternately stacked; and replacing the first sacrificial layer with a first conductive layer and replacing the gate sacrificial layer with a gate conductive layer; from the side of the first stacked structure far from the second stacked structure, forming a trench that exposes the first conductive layer; and replacing the first conductive layer with an insulating layer by means of the trench.
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
A method for semiconductor device fabrication, includes forming a vertical structure in a stack of layers with an end in a first layer by processing on a first side of a first die. The first layer has a better etch selectivity to the stack of layers than a second layer (S310). The method further includes replacing the first layer with the second layer by processing on a second side of the first die that is opposite to the first side (S320).
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
In certain aspects, a memory device includes memory strings each including a drain select gate (DSG) transistor and memory cells, and a peripheral circuit coupled to the memory strings. The peripheral circuit is configured to, in a program/verify cycle, program a target memory cell of the memory cells in a select memory string of the memory strings, and after programming the target memory cell, verify the target memory cell using one or more verify voltages including an initial verify voltage. The peripheral circuit is also configured to compare the initial verify voltage with a threshold verify voltage so as to obtain a comparing result, and control, at least based on the comparing result, the DSG transistor in an unselect memory string of the memory strings between programming and verifying the targe memory cell.
A waveform driving device (212) for a tester channel (210) includes a waveform generator (404), a bit map register (402), and an output logic circuit (406). The waveform generator (404) is configured to generate a waveform signal based on a driving source signal. The bit map register (402) is configured to store a bit map associated with the tester channel (210). The output logic circuit (406) is coupled to the bit map register (402) and the waveform generator (404), and configured to control an output of the waveform signal through the tester channel (210) based on a bit control signal from the bit map.
A semiconductor device including a first die (D1) is provided. The first die (D1) includes a first stack of layers (110) including a semiconductor layer (111) on a backside of the first die (D1). A second stack of layers (120) is formed that includes gate layers (123) and first insulating layers (121) alternatingly stacked on a face side of the first die (D1). The face side is opposite to the backside. A vertical structure includes a first portion (131) disposed in the first stack of layers (110) and a second portion (132) extending through the second stack of layers (120). The first portion (131) has a different dimension than the second portion (132) in a direction parallel to a main surface of the first die (D1).
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/11568 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire
71.
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME
In certain aspects, a memory device includes a vertical transistor, a storage unit, and a bit line. The vertical transistor includes a semiconductor body extending in a first direction. The semiconductor body includes a doped source, a doped drain, and a channel portion. The storage unit is coupled to a first terminal. The first terminal is one of the source and the drain. The bit line extends in a second direction perpendicular to the first direction and in contact with a second terminal. The second terminal is another one of the source and the drain that is formed on all sides of a protrusion of the semiconductor body. The bit line is separated from the channel portion of the semiconductor body by the second terminal.
In certain aspects, a memory device includes a vertical transistor including a semiconductor body extending in a first direction, a stack structure including interleaved dielectric layers and conductive layers each extending perpendicularly to the first direction, an electrode layer including a conductive material and coupled to a first end of the semiconductor body, and a storage layer over the electrode layer. The electrode layer and the storage layer extend in the first direction through the stack structure.
In certain aspects, a memory device includes a vertical transistor, a storage unit, a bit line, and a body line. The vertical transistor includes a semiconductor body extending in a first direction. The semiconductor body includes a doped source, a doped drain, and a channel portion. The storage unit is coupled to a first terminal. The first terminal is one of the source and the drain. The bit line extends in a second direction perpendicular to the first direction and coupled to a second terminal. The second terminal is another one of the source and the drain. The body line is coupled to the channel portion of the semiconductor body.
In certain aspects, a memory device includes an array of memory cells, a plurality of word lines, and a plurality of slit structures. Each memory cell includes a vertical transistor, and a storage unit coupled to the vertical transistor. The array of memory cells is arranged in rows in a first direction and columns in a second direction. Two adjacent rows of the memory cells are staggered with one another, and two adjacent columns of the memory cells are staggered with one another in a plan view. Each word line extends in the second direction. Each slit structure extends in the second direction and separating two adjacent word lines of the plurality of word lines in the first direction.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
75.
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
In certain aspects, a three-dimensional (3D) memory device includes a single crystalline silicon layer, a polysilicon layer, a transistor in contact with the single crystalline silicon layer, and a channel structure in contact with the polysilicon layer. The polysilicon layer and the single crystalline silicon layer are nonoverlapping and at least partially noncoplanar.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11573 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région de circuit périphérique
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
76.
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
In certain aspects, a method for forming a three-dimensional (3D) memory device is disclosed. A transistor is formed in a first region on a first side of a single crystalline silicon substrate. A step layer is formed in a second region on the first side of the single crystalline silicon substrate. A channel structure extending through a stack structure and in contact with the step layer is formed. The stack structure includes interleaved dielectric layers and conductive layers on the step layer. Part of the single crystalline silicon substrate that is in the second region is removed from a second side opposite to the first side of the single crystalline silicon substrate to expose the step layer from the second side.
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/18 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants présentant un effet de supraconductivité
77.
DATA PROTECTION METHOD FOR MEMORY, AND STORAGE APPARATUS THEREFOR
A RAID-based method capable of recovering data lost in a storage block in a memory, and a storage apparatus therefor. The memory comprises a plurality of storage blocks. The method comprises: generating check code data of a check factor on the basis of storage data of a plurality of valid storage blocks among a plurality of storage blocks; configuring, in the check factor, a first plurality of address pointers for the plurality of storage blocks; and providing a second plurality of address pointers in each of the valid storage blocks, wherein each of the second plurality of address pointers in each of the valid storage blocks points to another corresponding valid storage block, and the first plurality of address pointers and the second plurality of address pointers of the plurality of valid storage blocks can jointly form an address chain that covers all the valid storage blocks of the plurality of valid storage blocks.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G11C 29/42 - Dispositifs de vérification de réponse utilisant des codes correcteurs d'erreurs [ECC] ou un contrôle de parité
78.
DATA PROTECTION METHOD FOR MEMORY, AND STORAGE APPARATUS THEREOF
A method capable of protecting data stored in a memory on the basis of an RAID, and a storage apparatus thereof. The memory comprises a plurality of storage modules, wherein each storage module comprises a first storage block and a second storage block. The method comprises: during the programming process of a memory, generating a first check code on the basis of stored data in a corresponding first storage block of each storage module of a plurality of storage modules, and generating a second check code on the basis of stored data in a corresponding second storage block of each storage module of the plurality of storage modules (S410); and after the programming process of the memory, generating an additional check code on the basis of the first check code and the second check code, wherein the additional check code is used for restoring data in one storage block among the first storage blocks and the second storage blocks of the plurality of storage modules (S420).
Three-dimensional (3D) memory devices and methods for forming the same are disclosed. In certain aspects, a 3D memory device includes a stack structure containing a core region and a staircase region, a channel structure extending through the stack structure in the core region, and a first support structure extending through the stack structure in the staircase region. The first support structure includes a first portion extending along a first direction and a second portion protruding from the first portion along a second direction perpendicular to the first direction.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11565 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la configuration vue du dessus
A semiconductor device includes a first die including a first stack of layers in a first region on a backside of the first die and a second stack of layers in a second region on the backside of the first die. The first stack of layers has a smaller number of different layers than the second stack of layers. A contact structure is formed in the first region on the backside of the first die. The contact structure extends through the first stack of layers and is configured to conductively connect a first conductive structure on a face side of the first die with a second conductive structure on the backside of the first die. The face side is opposite to the backside.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/11575 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région limite entre la région noyau et la région de circuit périphérique
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
81.
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
A three-dimensional (3D) memory devices and fabricating methods thereof are disclosed. A disclosed 3D memory device can comprise an alternating conductive/dielectric stack on a substrate, a plurality of channel structures (250) in the alternating conductive/dielectric stack, and a plurality of gate line slit (GLS) structures (230,240) in the alternating conductive/dielectric stack. Each GLS structure can include a plurality of first type GLS portions (242) penetrating the alternating conductive/dielectric stack, and a plurality of second type GLS portions (244) in an upper portion of the alternating conductive/dielectric stack.
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
82.
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
In a method for fabricating a semiconductor device, a stack of alternating insulating layers and sacrificial layers are formed over a substrate. A staircase having a plurality of steps are formed in the stack, where each of the plurality of steps has a tread and a riser and further includes a respective pair of the insulating layer and the sacrificial layer over the insulating layer of the respective step. A dielectric layer is formed along the treads and risers of the plurality of steps. The dielectric layer is doped with one or a combination of carbon, phosphorous, boron, arsenic, and oxygen. The sacrificial layers are further replaced with a conductive material to form word line layers that are arranged between the insulating layers. A plurality of word line contacts are formed to extend from the word line layers of the plurality of steps, and further extend through the dielectric layer.
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/11524 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
83.
THREE-DIMENSIONAL MEMORY AND MANUFACTURING METHOD THEREFOR
The present disclosure relates to a three-dimensional memory and a manufacturing method therefor. The method comprises: forming a memory chip on a first substrate; providing a semiconductor layer on the memory chip; forming a contact passing through the semiconductor layer; and forming a first peripheral circuit chip on the basis of the semiconductor layer, the first peripheral circuit chip being electrically connected to the memory chip by means of the contact.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
84.
MEMORY, OPERATING METHOD THEREFOR, AND MEMORY SYSTEM
Embodiments of the present application provide a memory, an operating method therefor, and a memory system. The operation of the memory comprises: simultaneously performing a programming operation on at least two storage planes among a plurality of storage planes of the memory by using a multi-plane programming mode; and when it is determined that there is a storage plane with abnormal programming among the at least two storage planes, continuing to perform the programming operation on each storage plane among the at least two storage planes in sequence by using a single-plane programming mode.
G11C 16/26 - Circuits de détection ou de lecture; Circuits de sortie de données
G11C 16/16 - Circuits pour effacer électriquement, p.ex. circuits de commutation de la tension d'effacement pour effacer des blocs, p.ex. des réseaux, des mots, des groupes
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
85.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Disclosed are a semiconductor device and a manufacturing method therefor, the method comprising: firstly, providing a substrate comprising a first device region and a second device region; forming a first isolation structure in the substrate in the first device region, and forming a second isolation structure in the substrate in the second device region; next, performing ion implantation on the first isolation structure; and then performing etchback on the first isolation structure and the second isolation structure to form a first recess in the first isolation structure and a second recess in the second isolation structure.
Disclosed are a semiconductor device and a preparation method therefor. A substrate of a first device region is first etched to form at least one first trench, and then the first device region and a substrate of a second device region are etched, so that a first isolation groove is correspondingly formed at the position of the first trench and a second isolation groove is formed at the second device region. The depth of the first isolation groove is greater than the depth of the second isolation groove.
A power-down test method for firmware of a memory system, a memory system, a computer device, a computer readable storage medium, and a power-down test system. The power-down test method comprises: triggering a power-down test at a plurality of preset logic points of firmware to be tested.
The present invention provides a semiconductor structure and a preparation method therefor. The semiconductor structure comprises: a substrate; a first metal layer disposed on the substrate, the first metal layer comprising a plurality of first metal wires, and the plurality of first metal wires being arranged at intervals; a hollow dielectric layer disposed on the substrate, the hollow dielectric layer being located between the first metal wires; and a dielectric landing layer disposed between the first metal layer and the hollow dielectric layer and between part of the substrate and the hollow dielectric layer.
Provided in the present application is a preparation method for a 3D memory. The preparation method comprises: forming a laminated structure on a substrate; forming a channel structure, a dummy channel structure and a gate line slit structure, which penetrate the laminated structure and extend into the substrate, wherein the channel structure comprises a channel layer and a functional layer; removing the substrate to expose a first side of the laminated structure; forming, on the first side of the laminated structure, a protective layer for the exposed channel structure; and removing at least part of the functional layer in an exposed portion of the channel structure, and then removing the protective layer. The preparation method for a 3D memory provided in the present application is conducive to reducing the risk of short-circuiting and electricity leakage of a conductive layer of a gate electrode caused after a gap or a hole is filled with a semiconductor material during the process of forming a semiconductor layer, thereby facilitating an improvement in the reliability of a 3D memory after same has been prepared.
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/1157 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
90.
LOADING LOGICAL TO PHYSICAL MAPPING TABLE TO CACHE OF MEMORY CONTROLLER
A method for loading an L2P table to a cache of a memory controller, comprising: if it is determined, according to the currently obtained L2P table, that the address values of a plurality of target physical addresses corresponding to a plurality of target logical addresses in the L2P table are consecutive (S101), selecting one of the plurality of target physical addresses as a reference physical address, and setting a reference physical address offset according to the address values of the remaining target physical addresses (S102), and storing, in a cache, the reference physical address and the reference physical address offset as a mapping relation between the plurality of target logical addresses and the plurality of target physical addresses corresponding thereto (S103).
Aspects of the disclosure provide a semiconductor device. In some examples, the semiconductor device includes a first die. The first die incudes a silicon layer, and first circuit structures formed in a region of the silicon layer. Further, in an example, the first die includes a first wall structure configured to form a first loop that encloses the region, and the first wall structure extends through the silicon layer. In another example, the first die includes first wall structures configured to surround the region, and the first wall structures extend through the silicon layer.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
92.
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD, AND THREE-DIMENSIONAL MEMORY
Disclosed are a semiconductor structure, a manufacturing method, and a three-dimensional memory. The manufacturing method for the semiconductor structure comprises: providing a substrate; performing ion doping; forming at least one first recess and second recess; forming a first dielectric layer and a second dielectric layer, the thickness of the first dielectric layer being greater than the thickness of the second dielectric layer; and forming a first gate and a second gate, and forming a source and a drain on two sides of each of the first gate and the second gate.
H01L 27/11529 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région de circuit périphérique de régions de mémoire comprenant des transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11573 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région de circuit périphérique
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
93.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE AND THREE-DIMENSIONAL MEMORY
Disclosed in the present invention are a method for manufacturing a semiconductor device, and a semiconductor device and a three-dimensional memory. The method comprises: forming a shallow-trench-isolation trench in a substrate, wherein the shallow-trench-isolation trench is located on a peripheral side of an active region of the substrate; forming a bottom isolation layer in the shallow-trench-isolation trench; forming a gate structure on a channel region of the substrate; and forming a hard insulating layer on a side wall of the active region, so that the hard insulating layer covers a source region and a drain region of the substrate.
The present invention provides a semiconductor device and a method for manufacturing same, a three-dimensional storage apparatus, and a storage system. The semiconductor device comprises: a substrate, the substrate comprising a first region and a second region, and a groove being formed in the first region; a first shallow-trench-isolation structure and a second shallow-trench-isolation structure, which are respectively located in the first region and the second region; and a first gate oxide layer, which is located on the groove, and a second gate oxide layer, which is located in the second region and on the second shallow-trench-isolation structure.
H01L 27/11529 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par la région de circuit périphérique de régions de mémoire comprenant des transistors de sélection de cellules, p.ex. NON-ET
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
95.
METHODS FOR FORMING DIELECTRIC LAYER IN FORMING SEMICONDUCTOR DEVICE
Methods for forming a 3D memory device are provided. A method includes the following operations. A stack structure is formed in a staircase region and an array region. A dielectric material layer is formed over the array region and the staircase region. An etch mask layer is coated over the dielectric material layer. The etch mask layer, on a first surface away from the dielectric material layer, is planarized. The dielectric material layer and a remaining portion of the etch mask layer are etched to form a dielectric layer over the staircase region and the array region.
H01L 27/11551 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/11575 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la région limite entre la région noyau et la région de circuit périphérique
96.
THREE-DIMENSIONAL MEMORY AND MANUFACTURING METHOD THEREFOR
The present application provides a three-dimensional memory and a manufacturing method therefor. The three-dimensional memory comprises: a stacked structure, which comprises a first stacked layer and a second stacked layer, wherein the first stacked layer comprises control gate layers and first dielectric layers, which are alternately stacked in the same direction of stacking, the second stacked layer comprises top select gate layers and second dielectric layers, which are alternately stacked; a plurality of channel structures, each of which runs through the stacked structure, and comprises a charge storage layer, wherein the charge storage layer comprises a plurality of charge storage parts, which are arranged at intervals in the direction of stacking, the charge storage parts being arranged between adjacent first dielectric layers; and at least one isolation structure, which runs through the top select gate layers and is located between adjacent channel structures. By means of the three-dimensional memory and the manufacturing method therefor provided in the embodiments of the present application, a process window of a top select gate cut can remain unchanged, such that a storage density loss is reduced.
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/11563 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM
In certain aspects, a method for controlling wafer stress is disclosed. A semiconductor film is formed on a backside of a wafer. The wafer is deformed by stress associated with a front-side semiconductor structure on a front side of the wafer opposite to the backside of the wafer. A laser application region of the semiconductor film is determined. A laser anneal process is performed in the laser application region of the semiconductor film.
H01L 21/324 - Traitement thermique pour modifier les propriétés des corps semi-conducteurs, p.ex. recuit, frittage
H01L 27/11578 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur
Aspects of the disclosure provide a semiconductor device and a method to fabricate the semiconductor device. The semiconductor device includes a first die comprising a first contact structure formed on a face side of the first die. The semiconductor device includes a first semiconductor structure and a first pad structure that are disposed on a back side of the first die. The first semiconductor structure is conductively connected with the first contact structure from the back side of the first die and the first pad structure is conductively coupled with the first semiconductor structure. An end of the first contact structure protrudes into the first semiconductor structure without connecting to the first pad structure. The first die and a second die can be bonded face-to-face.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de structures soudées
99.
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME
In certain aspects, a three-dimensional (3D) memory device includes a first semiconductor structure, a second semiconductor structure, a third semiconductor structure, a first bonding interface between the first semiconductor structure and the second semiconductor structure, and a second bonding interface between the second semiconductor structure and the third semiconductor structure. The first semiconductor structure includes a peripheral circuit. The second semiconductor structure includes a first array of memory cells. The third semiconductor structure includes a second array of memory cells. Each of the memory cells of the first and second arrays includes a vertical transistor extending in a first direction, and a storage unit coupled to the vertical transistor. The first array of memory cells is coupled to the peripheral circuit across the first bonding interface. The second array of memory cells is coupled to the peripheral circuit across the first bonding interface and the second bonding interfaces.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 21/98 - Assemblage de dispositifs consistant en composants à l'état solide formés dans ou sur un substrat commun; Assemblage de dispositifs à circuit intégré
100.
SYSTEM AND APPARATUS FOR REDUNDANT ARRAY OF INDEPENDENT DISKS STRIPING AGAINST PROGRAMMING FAILURES
A system includes a memory device for storing memory data. The memory device includes an array of memory cells and a plurality of word lines arranged in a plurality of rows and coupled to the array of memory cells. The system also includes a memory controller, having a processor and a memory, operatively coupled to the array of memory cells. The system further includes a host, having another processor and another memory, operatively coupled to the memory controller. The other processor of the host is configured to perform a first RAID encode operation on memory data to form first parity data. The processor of the memory controller is configured to receive the first parity data and the memory data, and perform a second RAID encode operation on the first parity data and the memory data to form second parity data.
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