A circuit structure includes a first busbar, a wiring board located on the first busbar and having an open hole, a conductive raised part protruding into the open hole from the first busbar, and a first electronic component having a first connection terminal located on the wiring board. The first connection terminal is electrically connected to the raised part in the open hole.
H01R 11/01 - CONNEXIONS CONDUCTRICES DE L'ÉLECTRICITÉ; ASSOCIATION STRUCTURELLE DE PLUSIEURS ÉLÉMENTS DE CONNEXION ÉLECTRIQUE ISOLÉS LES UNS DES AUTRES; DISPOSITIFS DE COUPLAGE; COLLECTEURS DE COURANT Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p.ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
H01R 11/09 - CONNEXIONS CONDUCTRICES DE L'ÉLECTRICITÉ; ASSOCIATION STRUCTURELLE DE PLUSIEURS ÉLÉMENTS DE CONNEXION ÉLECTRIQUE ISOLÉS LES UNS DES AUTRES; DISPOSITIFS DE COUPLAGE; COLLECTEURS DE COURANT Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p.ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par caractérisés par le type des emplacements de connexion sur l'élément individuel ou par le type des connexions entre les emplacements de connexion et les organes conducteurs les emplacements de connexion étant identiques
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A redox flow battery includes a positive electrolyte containing a positive electrode active material and a negative electrolyte containing a negative electrode active material. A liquid amount of the positive electrolyte is different from a liquid amount of the negative electrolyte. Of the positive electrolyte and the negative electrolyte, a liquid amount ratio of the electrolyte larger in liquid amount to the electrolyte smaller in liquid amount is not lower than 1.05 and not higher than 5.0. A state of charge of a mixture electrolyte which is a mixture of the positive electrolyte and the negative electrolyte at a ratio equal to the liquid amount ratio is equal to or higher than 2%.
H01M 8/04082 - Dispositions pour la commande des paramètres des réactifs, p.ex. de la pression ou de la concentration
H01M 8/18 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Éléments à combustible; Leur fabrication Éléments à combustible à régénération, p.ex. batteries à flux REDOX ou éléments à combustible secondaires
A shielded twisted pair cable includes a twisted pair wire including two insulated wires that are twisted together, and a shield configured to cover the twisted pair wire. Each of the two insulated wires includes a conductor, and an insulator covering the conductor. The shield includes a first shield, a second shield, and a third shield in this order from a position closest to the twisted pair wire. The first shield includes a first resin tape with a metal foil, spirally wound around the twisted pair wire, the second shield includes a braided conductor, and the third shield includes a second resin tape with a metal foil. The metal foil of the first resin tape with the metal foil makes contact with the braided conductor, and the braided conductor makes contact with the metal foil of the second resin tape with the metal foil.
Time synchronization is performed between the vehicle-mounted device and another device that is another vehicle-mounted device based on a data propagation delay time between the vehicle-mounted device and the other device. The vehicle-mounted device includes: a processing unit configured to receive, from the other device, request information that requests time information used for updating the propagation delay time, and transmit the time information to the other device; and a detection unit configured to detect an abnormality related to time synchronization, and acquire information regarding the detected abnormality.
H04L 7/00 - Dispositions pour synchroniser le récepteur avec l'émetteur
H04L 67/12 - Protocoles spécialement adaptés aux environnements propriétaires ou de mise en réseau pour un usage spécial, p.ex. les réseaux médicaux, les réseaux de capteurs, les réseaux dans les véhicules ou les réseaux de mesure à distance
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
An energy storage module includes a plurality of cells, a first end plate, a second end plate, and a busbar module. The busbar module includes a plurality of busbars and a busbar case that holds the busbars. The busbar case includes a first end case, a second end case, and a connection portion. The first end case engages with the first end plate. The second end case is located to be separate from the first end case in the first direction, and engages with the second end plate. The connection portion connects the first end case and the second end case to each other. The connection portion includes a first expandable portion that is expandable in the first direction.
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
An optical fiber cable provided with a plurality of optical fiber cores and a sheath coating the periphery of the plurality of optical fiber cores. The number of optical fiber cores per unit area of the optical fiber cable in a cross-section of the optical fiber cable perpendicular to the longitudinal direction is larger than 6.3 cores/mm2 and smaller than or equal to 12.6 cores/mm2. The optical fiber cores each have an outer diameter of 175-185 μm inclusive.
A reactor is provided with a coil and a magnetic core. The magnetic core has a first surface made of a material mainly containing a magnetic material, and a second surface facing the first surface. The first surface has a first region with a surface property following that of the second surface.
H01F 37/00 - Inductances fixes non couvertes par le groupe
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p.ex. de poudre
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre eux; Fixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
Provided is an in-vehicle wiring module that is attached to a plurality of power storage elements that include electrode terminals, and includes a busbar that is connected to the electrode terminals, and a flexible substrate that is electrically connected to the busbar, the flexible substrate has a folded-over structures where the flexible substrate is folded along folding portions, the folded-over structure includes protrusions that protrude from outer edges of the flexible substrate in an expanded state before the flexible substrate is folded along the folding portions, and slits into which the protrusions are to be inserted, the folding portions are disposed between the protrusions and the slits of the flexible substrate in the expanded state, and, as a result of the protrusions being inserted into the slits, the flexible substrate is kept from deforming so as to return to the expanded state from a state of being folded along the folding portions.
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
B60L 50/64 - Propulsion électrique par source d'énergie intérieure au véhicule utilisant de la puissance de propulsion fournie par des batteries ou des piles à combustible utilisant de l'énergie fournie par des batteries - Détails de construction des batteries spécialement adaptées aux véhicules électriques
H01M 50/553 - Bornes spécialement adaptées aux cellules prismatiques, de type poche ou rectangulaires
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
This power supply structure 11 for a headrest 10 for supplying power to the headrest 10 attached to a seat body 13 comprises: a power supply coil 16 disposed on the seat body 13; a power receiving coil 30 disposed on the headrest 10 and receiving power from the power supply coil 16; and an elastic member 21 disposed on at least one among the seat body 13 and the headrest 10 and urging the power supply coil 16 and the power receiving coil 30 in a mutually approaching direction.
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
B60N 2/829 - Appuis-tête mobiles ou réglables coulissant verticalement caractérisés par leurs mécanismes de réglage, p.ex. moteurs électriques
B60R 16/037 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour le confort des occupants
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
10.
CUBIC BORON NITRIDE SINTERED MATERIAL AND CUTTING TOOL INCLUDING SAME
A cubic boron nitride sintered material comprises cubic boron nitride particles and a bonding material, wherein the bonding material comprises at least one first metallic element selected from the group consisting of titanium, zirconium, vanadium, niobium, hafnium, tantalum, chromium, rhenium, molybdenum, and tungsten; cobalt; and aluminum; the cubic boron nitride sintered material has a first interface region sandwiched between an interface between the cubic boron nitride particles and the bonding material, and a first virtual line passing through a point 10 nm apart from the interface to the bonding material side; and when an element that is present at the highest concentration among the first metallic elements in the first interface region is defined as a first element, an atomic concentration of the first element in the first interface region is higher than an atomic concentration of the first element in the bonding material excluding the first interface region.
C22C 29/16 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p.ex. cermets, ou d'autres composés métalliques, p.ex. oxynitrures, sulfures à base de nitrures
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
A connector 10 of the present disclosure is provided with a plurality of terminals 30, a plurality of wires 20, a plurality of sub-housings 60, 70 and a lock member 80. The terminal 30 includes a locked portion. The sub-housings 60, 70 include cavities 61, 71 for accommodating the terminals 30 and locking portions for retaining the terminals 30 by locking the locked portions from behind. The plurality of wires 20 are respectively pulled out rearward from the plurality of terminals 30. The plurality of sub-housings 60, 70 are assembled with each other with the locked portions of the terminals 30 facing in the same direction, and held in an assembled state by the lock member 80.
H01R 13/514 - Socles; Boîtiers formés comme un bloc ou un assemblage modulaire, c. à d. composés de parties coopérantes pourvues de pièces de contact ou maintenant entre elles des pièces de contact
H01R 13/432 - Fixation de manière démontable par des moyens de verrouillage situés sur des pièces de contact élastiques par une lame élastique emboutie à enclenchement brusque derrière un épaulement du socle ou du boîtier
H01R 13/58 - Moyens pour atténuer l'effort de tension sur le câble de connexion, p.ex. serre-câble
An optical connection structure including a first ferrule, a second ferrule, and an adapter is disclosed. The first ferrule includes a distal end portion where a first light incidence/emission unit is formed. The second ferrule includes a distal end portion where a second light incidence/emission unit is formed. Each first side surface of both the ferrules is provided with a recessed portion or a protruding portion, and each second side surface of both the ferrules is provided with a recessed portion or a protruding portion. The adapter has an inner surface provided with a protruding portion or a recessed portion, and a protruding portion or a recessed portion. Both the ferrules are fittable into the adapter such that the first and second light incidence/emission units are optically connected each other while the distal end portions of both the ferrules face each other at a predetermined distance separated from each other.
It is aimed to suppress a cost increase even if short-circuit patterns increase. A joint connector is provided with a male terminal fitting including a plurality of tabs arranged in parallel in a first arrangement direction and a male carrier coupling the plurality of tabs in parallel and cuttable between arbitrary adjacent ones of the tabs, and a female terminal fitting including a plurality of female connecting portions arranged in parallel in a second arrangement direction orthogonal to the first arrangement direction and a female carrier coupling the plurality of female connecting portions in parallel and cuttable between arbitrary adjacent ones of the female connecting portions. A plurality of male terminal fittings is arranged in parallel to the second arrangement direction. A plurality of female terminal fittings is arranged in parallel to the first arrangement direction with the plurality of female connecting portions connected to the plurality of tabs.
H01R 13/514 - Socles; Boîtiers formés comme un bloc ou un assemblage modulaire, c. à d. composés de parties coopérantes pourvues de pièces de contact ou maintenant entre elles des pièces de contact
H01R 31/08 - Pièces de court-circuitage pour contacts pontés dans une pièce complémentaire
It is aimed to connect a first housing and a second housing in an opposed state and detect connection of the housings. A lever-type connector includes a cam follower formed on a second housing and configured to connect the first and second housings by sliding in contact with a cam groove in a rotation process of a lever from an initial position to a connection position, a restricting pin provided on the first housing and arranged at a position deviated in a direction intersecting a connecting direction with respect to a virtual connection line, a restricting groove to be brought into sliding contact with the restricting pin, and a connection detector for allowing the lever to slide to a connection detecting position eccentric from a center of rotation only when the lever reaches the connection position and the first and second housings are connected in an opposed positional relationship.
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p.ex. moyens pour aligner ou guider, leviers, pression de gaz
H01R 13/642 - Moyens pour empêcher, bloquer ou éviter le couplage incorrect par la position ou la forme des pièces de contact
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
A reactor is provided with a coil and a magnetic core. The magnetic core includes a first core and a second core formed into a θ shape by being combined in an X direction. The first core includes a first end core part, at least a part of a middle core part, at least parts of both side core parts including a first side core part and a second side core part. The second core includes a second end core part, a remaining part of the middle core part and remaining parts of the first and second side core parts. Each of the first and second side core parts of the first core has a tip surface. A surface of the second core has facing surfaces facing the tip surfaces. The tip surface has a first chamfered portion.
A reactor is provided with a coil and a magnetic core. The magnetic core includes a first core and a second core formed into a θ shape by being combined in an X direction. The first core includes a first end core part, at least a part of a middle core part, at least parts of both side core parts including a first side core part and a second side core part. The second core includes a second end core part, a remaining part of the middle core part and remaining parts of the first and second side core parts. A relative magnetic permeability of the second core is higher than that of the first core. Each of the first and second side core parts of the first core has a tip surface. A surface of the second core has facing surfaces facing the tip surfaces.
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
H01F 37/00 - Inductances fixes non couvertes par le groupe
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p.ex. de poudre
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre eux; Fixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
A method of manufacturing a high-frequency device includes mounting a first chip having a first pillar on an upper surface thereof on a metal base, forming an insulator layer covering the first chip on the metal base, exposing an upper surface of the first pillar from the insulator layer, and forming a first wiring connected to the first pillar on the insulator layer and transmitting a high-frequency signal.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A high-frequency device includes a metal base, a dielectric substrate mounted on the metal base, an insulator layer provided on the metal base, covering the dielectric substrate, and having a dielectric constant smaller than that of the dielectric substrate, and a first line that overlaps the dielectric substrate as seen from a thickness direction of the insulator layer and is provided on an upper surface of the insulator layer to form a first microstrip line.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/21 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
A method for manufacturing an optical fiber preform includes generating glass particles from a glass raw material gas in a flame obtained by combustion of a combustible gas supplied to a burner and depositing the glass particles on an outer circumference of a silica glass pipe to form a hollow porous glass preform, inserting a rod into the silica glass pipe, transparently vitrifying the porous glass preform by heating the porous glass preform after inserting the rod to obtain a transparent glass preform, drawing out the rod from the silica glass pipe after the porous glass preform is transparently vitrified, and removing the silica glass pipe from the transparent glass preform by etching after drawing out the rod.
It is aimed to reduce a projection area of a board-side connector on a mounting surface of a circuit board. A connector device (A) is provided with a board-side connector (10), a mating connector (30) facing the board-side connector (10), an adapter (40) rockably supported in the mating connector (30), a tip part of the adapter being connected to the board-side connector (10), a first guide portion (12) and a second guide portion (21) provided on a tip part of the board-side connector (10) and having outer peripheral surfaces inclined to reduce a diameter toward a tip side, and a guided portion (50) provided on the tip part of the adapter (40) and configured to correct a position shift of the adapter (40) with respect to the board-side connector (10) by sliding in contact with the first and second guide portions (12, 21).
H01R 27/00 - Pièces de couplage adaptées à la coopération avec plusieurs pièces complémentaires dissemblables
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p.ex. moyens pour aligner ou guider, leviers, pression de gaz
21.
ONBOARD COMMUNICATION SYSTEM AND COMMUNICATION METHOD
An in-vehicle communication system includes: an optical coupler; a first in-vehicle device group composed of a plurality of in-vehicle devices connected to a first end of the optical coupler; and a second in-vehicle device group composed of a plurality of in-vehicle devices connected to a second end of the optical coupler. The in-vehicle devices in the first in-vehicle device group are communicable with the in-vehicle devices in the second in-vehicle device group via a common transmission path in the optical coupler. The in-vehicle devices in the second in-vehicle device group are communicable with the in-vehicle devices in the first in-vehicle device group via a common transmission path in the optical coupler.
An in-vehicle wiring module is configured to be attached to a plurality of electricity storage elements having electrode terminals. The in-vehicle wiring module includes busbars to be connected to the electrode terminals, flexible substrates having a first conductive path that is electrically connected to the busbars, and a rigid substrate having a second conductive path that is electrically connected to the first conductive paths. The flexible substrates overlap the rigid substrate. The flexible substrates each have a first opposing surface that is opposed to the rigid substrate. The first conductive paths each have first lands that are arranged on the first opposing surface. First slits that are open at edges of the flexible substrates are formed between the first lands of the flexible substrates. The rigid substrate has a second opposing surface that is opposed to the flexible substrates.
H01R 12/62 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
An MCF includes a plurality of cores each extending in a direction along a central axis and a cladding covering each of the plurality of cores. The cladding includes a low refractive index barrier. The low refractive index barrier includes an alkali metal element. A relative refractive index of the low refractive index barrier is lower than an average value of a relative refractive indices of the cladding overall. The core interval is set such that a total sum of the power coupling coefficients between a specific core among the plurality of cores and each of all remaining cores is 2.3×10−4/km or less.
A method of manufacturing a sintered gear includes preparing a green compact having two gear-shaped end surfaces, one on each of two sides in an axial direction of the green compact, and having a plurality of teeth on an outer peripheral surface formed between the two end surfaces; chamfering an edge of the teeth by a brush; and sintering the green compact. The brush is a wheel-type brush including a disk-shaped wheel and a bristle member radially protruding from an outer periphery of the wheel. The chamfering includes disposing the brush with respect to the green compact such that the axial direction of the green compact and an axial direction of the wheel intersect with each other; bringing a tip of the bristle member into contact with a tooth bottom edge; and relatively moving the brush in a circumferential direction of the green compact while rotating the brush.
A method for manufacturing a semiconductor device, includes forming source and drain electrodes on a semiconductor layer provided above a substrate; forming a first insulating film covering a surface of the semiconductor layer, between the source and drain electrodes, forming a second insulating film on the first insulating film, forming a mask on the second insulating film, the mask having an opening between the source and drain electrodes in a plan view viewed in a direction perpendicular to a substrate surface, forming a first gate opening in the first insulating film and forming a second gate opening in the second insulating film, by etching the first and second insulating films through the opening, and forming a gate electrode on the first and second insulating films, the gate electrode making a Schottky contact with the semiconductor layer through the first and second gate openings.
An electric deviceincludes a case, a circuit substratethat is disposed in the case, and electronic componentsthat are disposed in the case, and generate heat when energized. The caseis filled with a liquid insulating-and-cooling medium, the circuit substrateis disposed in an orientation in which the normal lines of the substrate surfaces that are the plate surfaces of the circuit substrateare horizontal, the electronic components are disposed on the lower side of the case, and at least some of the electronic componentsare immersed in the liquid insulating-and-cooling medium.
It is aimed for miniaturization. A connector device is provided with a first connector (10), a second connector (40) provided to face the first connector (10), an adapter (20) for connecting the first and second connectors (10, 40), resilient holding portions (14) formed in the first connector (10), having a shape retention force capable of holding the adapter (20) in a fixed posture with respect to the first connector (10) and being resiliently deformable, and a first guide portion (42) and second guide portions (47) for absorbing position shifts of the first and second connectors (10, 40) by inclining the adapter (20) with respect to the first connector (10) while resiliently deforming the resilient holding portions (14).
H01R 13/631 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p.ex. moyens pour aligner ou guider, leviers, pression de gaz pour l'engagement uniquement
H01R 12/91 - Dispositifs de couplage autorisant un mouvement relatif entre les pièces de couplage, p.ex. un flottement ou un auto-alignement
H01R 24/50 - Dispositifs de couplage en deux pièces, ou l'une des pièces qui coopèrent dans ces dispositifs, caractérisés par leur structure générale ayant des contacts disposés concentriquement ou coaxialement spécialement adaptés à la haute fréquence montés sur une PCB [carte de circuits imprimés]
H01R 24/54 - Pièces intermédiaires, p.ex. adaptateurs, répartiteurs ou coudes
It is aimed for miniaturization. A connector device is provided with a first connector, a second connector provided to face the first connector, an adapter for connecting the first and second connectors, posture holding portions provided on the first connector and the adapter and configured to hold the adapter in a constant posture with respect to the first connector by coming into contact with each other, a resilient holding portion provided on the adapter and configured to hold the first posture holding portion of the first connector and the movable posture holding portion of the adapter in a state in contact with each other by a resilient force, and a first guide portion and a second guide portion for correcting position shifts of the second connector and the adapter by inclining the adapter while resiliently deforming the resilient holding portion.
H01R 13/631 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p.ex. moyens pour aligner ou guider, leviers, pression de gaz pour l'engagement uniquement
H01R 12/91 - Dispositifs de couplage autorisant un mouvement relatif entre les pièces de couplage, p.ex. un flottement ou un auto-alignement
H01R 24/50 - Dispositifs de couplage en deux pièces, ou l'une des pièces qui coopèrent dans ces dispositifs, caractérisés par leur structure générale ayant des contacts disposés concentriquement ou coaxialement spécialement adaptés à la haute fréquence montés sur une PCB [carte de circuits imprimés]
H01R 24/54 - Pièces intermédiaires, p.ex. adaptateurs, répartiteurs ou coudes
An insulated electric wire includes a conductor formed of a plurality of element wires twisted together, and an insulating layer covering an outer periphery of the conductor. The insulating layer is formed of a crosslinked product of a polymer composition. The polymer composition contains, as a main component, an ethylene-based copolymer, polyethylene, or a combination of an ethylene-based copolymer and polyethylene. The crosslinked product has a gel fraction of 60% or more, and the crosslinked product has a tensile elongation of 150% or more.
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
An optical wiring includes a plurality of first set groups each including a plurality of first connecting components, a plurality of second set groups each including a plurality of second connecting components, and a receptacle which has a first end face and a second end face on an opposite side of the first end face. The first set groups are connected to the first end face side and the second set groups are connected to the second end face side. The first set groups faces the second set groups through the receptacle such that a direction in which the first connecting components are arranged and a direction in which the second connecting components are arranged are perpendicular to each other, and each of the first connecting components is optically connected to a corresponding one of the second connecting components in the receptacle.
A semiconductor device includes a metal plate having a base portion and a terminal portion separated from the base portion, a resin layer provided between the base portion and the terminal portion and so as to surround the metal plate in a planar direction, and at which an upper and a lower surface of each of the base portion and the terminal portion are exposed, a semiconductor chip mounted on the base portion, a first electrically insulating layer provided on the metal plate and the resin layer so as to cover the semiconductor chip, and one or more wires provided on the first electrically insulating layer and including at least one wire configured to electrically connect the semiconductor chip and the terminal portion to each other.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A calculation device includes a memory and a processor coupled to the memory. The processor is configured to; in an amplifier circuit including an input terminal to which a radio frequency signal is input, a transistor configured to amplify the input radio frequency signal, an output terminal from which the amplified radio frequency signal is output, and a matching circuit connected between the transistor and the output terminal, calculate a radio frequency characteristic of the amplifier circuit, if the calculated radio frequency characteristic of the amplifier circuit is a desired characteristic, calculate, at least one value of a current value and a voltage value at a predetermined portion within the equivalent circuit, and calculate, the deterioration degree of the electric characteristic of the transistor.
A cemented carbide composed of a first hard phase, a second hard phase and a binder phase, in which the first hard phase is composed of tungsten carbide particles, the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN, the second hard phase has an average particle diameter of no more than 0.1 μm, the second hard phase has a dispersity of no more than 0.7, the second hard phase has a content of no less than 0.1 vol % and no more than 15 vol %, the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, and the binder phase has a content of no less than 0.1 vol % and no more than 20 vol %.
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Masuda, Takeyoshi
Kosugi, Ryouji
Abrégé
An active region includes a first super junction layer and an element layer. The first super junction layer alternately has a first region and a second region. A peripheral region includes a second super junction layer, a termination layer, and an insulating layer. The second super junction layer alternately has a third region and a fourth region. The termination layer is provided on and in contact with the second super junction layer, and alternately has a fifth region and a sixth region. The fifth region is provided to correspond to the third region, and the sixth region is provided to correspond to the fourth region. An impurity concentration of the sixth region is larger than an impurity concentration of the fifth region and is 68 times or less as large as the impurity concentration of the fifth region.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/36 - Corps semi-conducteurs caractérisés par la concentration ou la distribution des impuretés
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
A circuit structure with a novel structure is disclosed in which a measure against arcs can be implemented with a simple structure and a reduction in size and cost can be realized. A circuit structure including: a power supply line configured to connect a battery and a load; a main relay connected to the power supply line; a pre-charge circuit including a pre-charge resistor and a pre-charge relay connected in series, and connected in parallel to the main relay; and a sub relay connected in parallel to the pre-charge resistor.
A battery wiring module is attached to a battery cell stack including a plurality of battery cells stacked and including electrode leads, to electrically connect the plurality of battery cells with each other. The battery wiring module includes: busbars having a plate shape; a flexible printed circuit board including board-side connection portions; and a protector holding the busbars and the flexible printed circuit board. The busbars include main bodies connected to the electrode leads, and busbar-side connection portions connected to the board-side connection portions. In the protector, the main bodies of the busbars, and the flexible printed circuit board are arranged perpendicularly to each other.
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
37.
VEHICLE-MOUNTED DEVICE, VEHICLE COMMUNICATION SYSTEM, AND ALGORITHM PROVISION METHOD
A vehicle-mounted device to be mounted on a first vehicle includes: a storage unit configured to store an algorithm related to traveling of the first vehicle; an acquisition unit configured to acquire driving environment information related to a driving environment of a second vehicle different from the first vehicle; and a determination unit configured to determine compatibility related to traveling between the driving environment information and the first vehicle, and determine, in accordance with a determination result of the compatibility, whether to provide the algorithm available for the first vehicle to the second vehicle.
G08G 1/0967 - Systèmes impliquant la transmission d'informations pour les grands axes de circulation, p.ex. conditions météorologiques, limites de vitesse
38.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR OPTICAL DEVICE
A method for producing a semiconductor optical device includes the steps of bonding a semiconductor chip to an SOI substrate having a waveguide, the semiconductor chip having an optical gain and including a first cladding layer, a core layer, and a second cladding layer that contain III-V group compound semiconductors and are sequentially stacked in this order, forming a covered portion with a first insulating layer on the second cladding layer, etching partway in the thickness direction the second cladding layer exposed from the first insulating film, forming a second insulating film covering from the covered portion to a part of a remaining portion of the second cladding layer, and forming a first tapered portion that is disposed on the waveguide and tapered along the extending direction of the waveguide by etching the core layer and the second cladding layer exposed from the second insulating film.
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/068 - Stabilisation des paramètres de sortie du laser
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/343 - Structure ou forme de la région active; Matériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p.ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p.ex. laser AlGaAs
A terminal block that is to be provided on a housing of a device that is to be mounted on a vehicle, the terminal block including: a seating that is to be fixed to the housing so as to close an opening of the housing; a tubular fitting that is formed on a front surface of the seating and is to be fitted to a mating connector; and a ring-shaped seal that is provided on a back surface of the seating.
A wire harness unit including: a conduction path that conducts electricity between in-vehicle devices; and a cooling tube that cools the conduction path, wherein: the conduction path has a hollow tubular conductor having conductivity, the cooling tube is more flexible than the tubular conductor and is separate from the tubular conductor, the cooling tube is connected to an end of the tubular conductor, and the tubular conductor and the cooling tube are configured to circulate a cooling medium therethrough.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
An object of the present disclosure is to provide a technique for improving the ease of attaching a door component to a door panel. A door component includes: a grommet that is attached to a door panel so as to traverse a portion of a peripheral edge; and a weather strip that is attached to the door panel so as to extend along a peripheral edge. The grommet includes a first tubular part and a second tubular part that are formed so as to be open in mutually different directions. The weather strip includes a first end part and a second end part along a longitudinal direction. The first end part of the weather strip is fitted into the first tubular part and the second end part is fitted into the second tubular part.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
B60R 16/027 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule entre des parties du véhicule mobiles l'une par rapport à l'autre, p.ex. entre le volant et la colonne de direction
B60J 10/86 - Dispositions pour l'étanchéité spécialement adaptées aux ouvrants, p.ex. aux portes disposées sur l’ouvrant
H02G 3/22 - Installations de câbles ou de lignes à travers les murs, les sols ou les plafonds, p.ex. dans les immeubles
H01B 17/58 - Tuyaux, manchons, perles isolantes ou bobines au travers desquels passe le conducteur
A wiring module is attached to an electricity storage element group including a plurality of electricity storage elements aligned. The wiring module includes: a plurality of busbars connected to electrodes of the plurality of electricity storage elements; and an insulating protector that is insulating, holds the plurality of busbars, and is attached to a case containing the electricity storage element group. The insulating protector has a positioning portion engaging with the case.
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
H01M 50/289 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs
H01M 50/296 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par les bornes des blocs de batterie
43.
MULTI-CORE FIBER MODULE AND MULTI-CORE FIBER AMPLIFIER
A multi-core fiber module includes a transmission MCF configured to be used as a transmission path for an optical signal, a connection MCF having a core arrangement similar to a core arrangement of a core of the transmission MCF, and a relay lens system interposed between the transmission MCF and the connection MCF. A relay magnification of the relay lens system is equal to a ratio of a core interval of the connection MCF to a core interval of the transmission MCF. A core at a leading end surface of the connection MCF is expanded such that a ratio between the core interval and a mode field diameter of the connection MCF is equal to a ratio between the core interval and a mode field diameter of the transmission MCF.
An optical cable according to an embodiment of present disclosure includes following features. Asheath layer contains a liquid crystal polymer forming a liquid crystal phase and an olefin resin serving as a principal component, a content of the liquid crystal polymer is 2 mass% to 30 mass% relative to the sheath layer, a major axis of the liquid crystal phase is oriented in a longitudinal direction of the sheath layer, and in a region from a surface of the sheath layer to a depth of 5% of a thickness of the sheath layer, an average ratio of a length of the liquid crystal phase in a major axis direction to a length of the liquid crystal phase in a minor axis direction is 2.0 or more.
In a conversion device, a second conversion circuit may be connected to a second coil of a transformer to perform bidirectional power conversion. Another second conversion circuit may be connected to a second coil of another transformer to perform bidirectional power conversion. A third conversion circuit may convert AC power input to another second coil of the transformer to DC power and output the DC power to a common path. Another third conversion circuit may convert AC power input to another second coil of the other transformer to DC power and output the DC power to the common path.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 7/219 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs dans une configuration en pont
B60L 53/22 - PROPULSION DES VÉHICULES À TRACTION ÉLECTRIQUE; FOURNITURE DE L'ÉNERGIE ÉLECTRIQUE À L'ÉQUIPEMENT AUXILIAIRE DES VÉHICULES À TRACTION ÉLECTRIQUE; SYSTÈMES DE FREINS ÉLECTRODYNAMIQUES POUR VÉHICULES, EN GÉNÉRAL; SUSPENSION OU LÉVITATION MAGNÉTIQUES POUR VÉHICULES; CONTRÔLE DES PARAMÈTRES DE FONCTIONNEMENT DES VÉHICULES À TRACTION ÉLECTRIQUE; DISPOSITIFS ÉLECTRIQUES DE SÉCURITÉ POUR VÉHICULES À TRACTION ÉLECTRIQUE Échange d'éléments d’emmagasinage d'énergie dans les véhicules électriques caractérisés par des convertisseurs situés dans le véhicule - Détails de structure ou aménagements des convertisseurs de charge spécialement adaptés pour recharger des véhicules électriques
B60L 58/22 - Procédés ou agencements de circuits pour surveiller ou commander des batteries ou des piles à combustible, spécialement adaptés pour des véhicules électriques pour la surveillance et la commande des batteries de plusieurs modules de batterie Équilibrage de la charge des modules de batterie
B60L 58/19 - Commutation entre la connexion en série et la connexion en parallèle des modules de batterie
When an area density of a first protrusion present in a central region is denoted by Xa, an area density of a second protrusion present in the central region is denoted by Xb, an area density of a third protrusion present in the central region is denoted by Xc, an area density of a fourth protrusion present in an outer circumferential region is denoted by Ya, an area density of a fifth protrusion present in the outer circumferential region is denoted by Yb, and an area density of a sixth protrusion present in the outer circumferential region is denoted by Yc, as viewed in a thickness direction of a silicon carbide substrate, the first protrusion and the fourth protrusion each have an area of 100 μm2 or more and less than 1,000 μm2.
A door wiring module includes: a service hole cover including a cover body part and a route indication part provided to the cover body part; and a wiring member whose route is regulated so that the wiring member passes through a first position and a second position on the cover body part. The route indication part indicates a plurality of routes each having a route length different from each other as routes of the wiring member between the first position and the second position, and a route of the wiring member is regulated so that the wiring member passes through any route selected from the plurality of routes.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H02G 3/04 - Tubes ou conduits de protection, p.ex. échelles à câbles ou goulottes de câblage
H02G 3/30 - Installations de câbles ou de lignes sur les murs, les sols ou les plafonds
48.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
National University Corporation Hokkaido University (Japon)
Inventeur(s)
Kono, Naoya
Fujiwara, Naoki
Saitoh, Kunimasa
Fujisawa, Takeshi
Sato, Takanori
Abrégé
A semiconductor optical device includes a substrate formed of silicon and having a first optical waveguide and a semiconductor element formed of a III-V compound semiconductor and having a second optical waveguide, the semiconductor element being bonded to an upper surface of the substrate. The first optical waveguide and the second optical waveguide form a directional coupler.
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/343 - Structure ou forme de la région active; Matériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p.ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p.ex. laser AlGaAs
An optical fiber is formed from silica-based glass. The optical fiber includes a core including a central axis and a cladding surrounding the core. A refractive index of the core is greater than a refractive index of the cladding. The core contains chlorine, and one or more kinds of elements selected from an element group consisting of alkali metal elements and alkaline earth metal elements. A relative refractive index difference of the core based on a refractive index of pure silica is 0.00% or greater and 0.15% or less. An average concentration of fluorine in the cladding is 1.2% or less in a mass fraction.
A connection module is configured to be accommodated inside a battery pack including an upper case and a lower case, the connection module including: a plurality of bus bars that electrically connect a device disposed on the upper case side inside the battery pack to a connector disposed on the lower case side inside the battery pack; a plurality of holders that hold the plurality of bus bars, each of the plurality of holders including bus bar holding portions; and a bracket capable of locking the plurality of holders, wherein, in a state in which the plurality of holders that hold the plurality of bus bars are locked to the bracket, the plurality of bus bars are arranged side by side in a left-right direction orthogonal to a vertical direction, a direction orthogonal to the vertical direction and intersecting the left-right direction is assumed to be a front-rear direction.
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01R 25/16 - Rails ou barres omnibus pourvus de plusieurs points de connexion pour pièces complémentaires
A connector 10 is provided with a connector housing 15 including a wire draw-out opening 20, a terminal 14 accommodated in the connector housing 15, a wire 12 connected to the terminal 14 and pulled out to outside of the connector housing 15 through the wire draw-out opening 20, and a bracket 22 made of metal for holding the wire 12 pulled out through the wire draw-out opening 20. The bracket 22 includes a first holding portion 24 and a second holding portion 26 to be fixed to each other while sandwiching and holding the wire 12 from both sides in a direction perpendicular to an axis of the wire 12, and a fixing portion 139 to the connector housing 15.
H01R 13/6592 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un câble blindé
H01R 13/595 - Moyens pour atténuer l'effort de tension sur le câble de connexion, p.ex. serre-câble des boulons agissant dans une direction transversale par rapport à celle du câble ou du fil
A connector (1) is provided with pressing portions (52C) for holding hooking portions (72) in a state butted against front locked portions (18A) and stopping a retainer (70) at an initial position in front when connection of a first housing (10) and a second housing (50) is started and allowing the hooking portions (72) to be disengaged from the front locked portions (18A) and making the retainer (70) movable from the initial position to a detection position when the connection of the first and second housings is completed, a lock arm (22) displaceable to a lock position for locking the first and second housings (10, 50) in a connected state by locking the second housing (50) and an unlock position for releasing the locking, and a holding portion (74) for suppressing a displacement of the lock arm (22) from the lock position to the unlock position in the connected state.
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japon)
Inventeur(s)
Oshiumi, Naoyuki
Hosokawa, Takehiro
Mizoguchi, Makoto
Abrégé
A metal-crosslinkable polymer composition and a metal crosslinked polymeric material having excellent curing rate and storage stability, and a metal member and a wiring harness to which the metal-crosslinkable polymer composition and the metal crosslinked polymeric material are applied. The metal-crosslinkable polymer composition includes an ingredient A which releases a metal ion when heated, and an ingredient B includes an organic polymer having a substituent group capable of forming an ionic bond with the metal ion released from the ingredient A. The metal-crosslinked polymeric material includes a crosslinked product of the metal-crosslinkable polymer composition. The metal member has a metal base member and a coating member covering a surface of the metal base member, where the coating member includes the metal-crosslinked polymeric material. The wiring harness includes the metal-crosslinked polymeric material.
A vehicle monitoring program of the present disclosure is a vehicle monitoring program for use in a vehicle-mounted device to be mounted in a vehicle, the program causing a computer included in the vehicle-mounted device to function as: a monitoring unit configured to detect an abnormality of application software used in the vehicle, and an abnormality processing unit configured to, in response to the monitoring unit detecting the abnormality of the application software, select an abnormality process for a measure against the abnormality from among a plurality of abnormality processes in accordance with an adverse effect level of the application software on safe driving of the vehicle.
G07C 5/08 - Enregistrement ou indication de données de marche autres que le temps de circulation, de fonctionnement, d'arrêt ou d'attente, avec ou sans enregistrement des temps de circulation, de fonctionnement, d'arrêt ou d'attente
55.
REDOX FLOW BATTERY SYSTEM AND METHOD FOR OPERATING REDOX FLOW BATTERY
A redox flow battery system includes a battery cell that performs charge-discharge by supplying an electrolyte; a monitor cell to which the electrolyte is supplied; a voltmeter that measures an open circuit voltage of the monitor cell; a thermometer that measures a liquid temperature of the electrolyte; and a controller that controls the charge-discharge of the battery cell based on the open circuit voltage, and the controller corrects the open circuit voltage in accordance with the liquid temperature.
H01M 8/18 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Éléments à combustible; Leur fabrication Éléments à combustible à régénération, p.ex. batteries à flux REDOX ou éléments à combustible secondaires
National University Corp Hokkaido University (Japon)
Inventeur(s)
Kawasaki, Takeshi
Igarashi, Hajime
Abrégé
A pattern generation device includes a memory and a processor coupled to the memory. The processor is configured to generate pattern data corresponding to a pattern of a metal layer based on a generation condition, determine whether the generated pattern data satisfies a predetermined condition, return to generate the pattern data when the predetermined condition is not satisfied, calculate a characteristic of the pattern or an element or circuit having the pattern when a high-frequency signal is inputted to a first portion and a high-frequency signal is outputted from a second portion by performing an electromagnetic field analysis based on the pattern data when the predetermined condition is satisfied, determine whether the calculated characteristic is within a target range, change the generation condition when the calculated characteristic is not within the target range, and return to generate the pattern data after changing the generation condition.
The MCF of the present disclosure suppresses occurrence of structural abnormality such as air bubbles in the vicinity of a boundary between a marker and a cladding. The MCF includes a glass optical fiber including a plurality of cores, a marker, and a cladding, and a resin coating. On a cross section of the MCF, centers of the plurality of cores and a center of the marker constitute a plane figure having a rotational symmetry of order 1 with respect to a center of the cross section. Moreover, on the cross section, the marker is disposed so as to be located on a circumference of a circle having a center coinciding with the center of the cross section and having the circumference passing through the respective centers of the plurality of cores.
An amplifier circuit includes a first cascode transistor and a second cascade transistor, the first cascade transistor being electrically connected between a first transistor and a first load circuit, the second cascode transistor being electrically connected between a second transistor and a second load circuit. The amplifier circuit includes a first shunt transistor and a second shunt transistor, the first shunt transistor being electrically connected between the first transistor and a first emitter-follower circuit, the second shunt transistor being electrically connected between the second transistor and a second emitter-follower circuit. A differential current signal includes a first differential current and a second differential current, the first differential current flowing through the first cascode transistor and the second cascode transistor, and a second differential current flowing through the first shunt transistor and the second shunt transistor.
H03F 1/22 - Modifications des amplificateurs pour réduire l'influence défavorable de l'impédance interne des éléments amplificateurs par utilisation de couplage dit "cascode", c. à d. étage avec cathode ou émetteur à la masse suivi d'un étage avec grille ou base à la masse respectivement
H03F 1/26 - Modifications des amplificateurs pour réduire l'influence du bruit provoqué par les éléments amplificateurs
A method for manufacturing an optical fiber includes applying a first resin composition, forming a primary resin layer, applying a second resin composition, and forming a secondary resin layer. An ultraviolet LED used a light source in the forming the primary resin layer and the forming the secondary resin layer. In the forming the primary resin layer, an effective power consumption represented by formula (1) is 0.056 kWs or more and 0.230 kWs or less,
A method for manufacturing an optical fiber includes applying a first resin composition, forming a primary resin layer, applying a second resin composition, and forming a secondary resin layer. An ultraviolet LED used a light source in the forming the primary resin layer and the forming the secondary resin layer. In the forming the primary resin layer, an effective power consumption represented by formula (1) is 0.056 kWs or more and 0.230 kWs or less,
∑
n
=
1
N
Bn
·
∅
n
·
tn
(
1
)
A method for manufacturing an optical fiber includes applying a first resin composition, forming a primary resin layer, applying a second resin composition, and forming a secondary resin layer. An ultraviolet LED used a light source in the forming the primary resin layer and the forming the secondary resin layer. In the forming the primary resin layer, an effective power consumption represented by formula (1) is 0.056 kWs or more and 0.230 kWs or less,
∑
n
=
1
N
Bn
·
∅
n
·
tn
(
1
)
where N is a number of light sources, Bn [kW] is a rated power of an n-th light source, φn is a predetermined rate of power of the n-th light source, and tn [s] is an irradiation time of the n-th light source.
An output circuit includes: an inductor, an amplifier circuit that outputs an output signal via the inductor, an output terminal that outputs the output signal to an outside, a voltage divider circuit including a series circuit constituted by a first capacitive element and a second capacitive element connected in series to the first capacitive element, the series circuit generating a first voltage-divided signal by dividing a voltage of the output signal, a first band-adjusting element having a resistance component for generating a first band-adjusted signal by adjusting frequency characteristics of the first voltage-divided signal, and a first peak detection circuit that detects a peak voltage of the first band-adjusted signal and output a first peak voltage in accordance with the detected peak voltage.
-- An electromagnetic shield connector is provided with a terminal-equipped shielded cable formed by mounting a terminal on an end of a shielded cable, an insulating inner housing including a first terminal fitting opening and a first wire insertion opening and configured to accommodate the terminal of the terminal-equipped shielded cable, a shield sleeve to be connected to a shield member of the shielded cable on the shielded cable and to be externally mounted on the shielded cable further on the side of the shielded cable than the terminal, an outer housing made of conductive metal, including a second terminal fitting opening and a second wire insertion opening, configured to accommodate the inner housing and to be connected to the shield sleeve, and a grounding portion provided on the outer housing and connectable to an external grounding member.
H01R 13/6592 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un câble blindé
H01R 13/6582 - Structure du blindage avec des moyens élastiques destinés à venir en contact avec le connecteur correspondant
H01R 13/64 - Moyens pour empêcher, bloquer ou éviter le couplage incorrect
H01R 13/405 - Fixation d'une manière non démontable, p.ex. par moulage, rivetage
62.
WIRE INSPECTION SYSTEM, WIRE INSPECTION METHOD, AND ELECTRIC WIRE
A wire inspection system has a memory unit which stores response signals obtained through wire inspection at a first time point for a plurality of electric wires constituting a wire group identifying individual electric wires, an inspection unit which performs the wire inspection on a subject electric wire selected from the wire group at a second time point later than the first time point, and an analysis unit which compares, for the subject electric wire, the response signal at the first time point retrieved from the memory unit, with the response signal obtained by the inspection unit at the second time point, and, if a difference exists between the two response signals, judges that damage exists on the subject electric wire.
Sumitomo Electric Device Innovations, Inc. (Japon)
Sumitomo Electric Industries, Ltd. (Japon)
Inventeur(s)
Oki, Kazushige
Yoshimura, Satoshi
Ishii, Kuniyuki
Kawamura, Masanobu
Abrégé
An optical device according to one embodiment includes an optical element, a sleeve including a receptacle portion and an insertion portion, and a base having a lower plate having a main surface with the optical element being mounted thereon and a side wall having a hole with the insertion portion of the sleeve optically coupled with the optical element inserted into the hole. A step difference at a position lower than the main surface is formed at a lower position of the hole in the side wall.
A silicon carbide epitaxial substrate according to the present disclosure includes: a silicon carbide substrate; a first silicon carbide epitaxial layer disposed on the silicon carbide substrate; and a second silicon carbide epitaxial layer disposed on the first silicon carbide epitaxial layer. When an area density of first particles in the first silicon carbide epitaxial layer is defined as a first area density and an area density of second particles in the second silicon carbide epitaxial layer is defined as a second area density, a value determined by dividing the first area density by the second area density is more than 0.5 and less than 1. The first particles and the second particles each have a maximum diameter of 2 μm to 50 μm.
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
A first connector 10 configured to be attached to a connection object 40 that includes a plurality of contact lines 42 exposed at a tip of the connection object 40 and a ground portion 43 covering part of the plurality of contact lines 42, comprises: a first insulator 20 including a holding portion 24 configured to hold the connection object 40 in a state of accommodating the tip; and a first metal member 30 attached to the first insulator 20, wherein the first metal member 30 includes: a first base portion 31 that is plate-shaped; a first contact portion 32 configured to extend from the first base portion 31 toward the tip and contact the plurality of contact lines 42; and a second contact portion 33 configured to be located more on a side opposite to the tip than the first contact portion 32 and contact the ground portion 43.
H01R 13/6597 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un contact du connecteur
A super junction layer alternately has a first region and a second region. An element layer is provided above the super junction layer. The first region has a first portion and a second portion located between the first portion and a first main surface. The second region has a third portion in contact with the first portion and a fourth portion in contact with the second portion and located between the third portion and the first main surface. In a cross section perpendicular to the second main surface and parallel to a direction from the first region toward the second region, a width of the second portion is larger than a width of the first portion, a width of the fourth portion is smaller than a width of the third portion.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01M 50/298 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par le câblage des blocs de batterie
H01M 50/516 - Procédés pour interconnecter les batteries ou cellules adjacentes par soudage, brasage ou brasage tendre
The present invention prevents shield terminal backlash within a housing. The present invention comprises: a shield terminal (20) of a form in which an inner conductor (21) and a dielectric (23) are surrounded by an outer conductor (24); and a housing (10) in which the shield terminal (20) is accommodated. The housing (10) has a hood portion (16) that surrounds the front end portion of the shield terminal (20) with a space therebetween. The housing (10) has formed therein a cylindrical holding portion (18) that holds the outer peripheral portion of the front end portion of the shield terminal (20) within the hood portion (16).
The present invention suppresses shield terminal backlash within a housing. This shield connector comprises: a shield terminal (30) of a form in which an inner conductor (31) and a dielectric (33) are surrounded by an outer conductor (34); and a housing (10) in which the shield terminal (30) is accommodated. The housing (10) has a hood portion (17) that surrounds the front end portion of the shield terminal (30) with a space therebetween. The housing (10) has formed therein an elastic contact portion (20) that elastically contacts the outer peripheral surface of the shield terminal (30).
A resin composition includes a phenoxy resin as a principal component. The phenoxy resin has a weight-average molecular weight of 40,000 or more. The phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy and a second structural unit derived from a bisphenol epoxy other than the bisphenol S phenoxy. A content ratio of the first structural unit in the phenoxy resin is 20 mol% to 80 mol% relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.
C08G 65/40 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols à partir des phénols et d'autres composés
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08J 9/42 - Imprégnation avec des composés macromoléculaires
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
An optical fiber cable includes a plurality of optical fibers, a plurality of water-absorbent fibers, and a sheath covering a periphery of the plurality of optical fibers and the plurality of water-absorbent fibers. A ratio of areas of the water-absorbent fibers to an area of an accommodating portion in an inner side of the sheath in a cross section orthogonal to a longitudinal direction of the optical fiber cable is 1% or more and 5% or less, and a maximum value of an area of a gap portion surrounded by the optical fibers in the cross section is 1.0 mm2 or less.
Provided is a technology that is able to set the charge voltage of an auxiliary power source to reflect the temperature state during a period in which the vehicle is stopped. A vehicular backup device includes a charge/discharge circuit, a temperature detection unit, and a control unit. The control unit causes the charge/discharge circuit to perform an operation such that the charge voltage of an auxiliary power source achieves a target voltage on condition that a start switch of the vehicle is ON. The control unit sets the target voltage based on the temperature detected by the temperature detection unit when the start switch is OFF.
B60R 16/033 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique caractérisé par l'utilisation de cellules électriques ou de batteries
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
An optical sensor includes a support film, a thermoelectric conversion material portion, a heat sink, a light absorption film, a first electrode, and a second electrode. The thermoelectric conversion material portion includes a plurality of first material layers and a plurality of second material layers. The support film includes a first layer arranged on the heat sink side in a thickness direction and configured with a phononic structure having a large number of holes, and an insulating second layer arranged on the first layer and in contact with the thermoelectric conversion material portion.
H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c. à d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
An object of the present disclosure is to provide a technology that makes it possible to turn a wire to three or more different directions using one type of cover member. A connector component includes a connector housing in which a cavity is formed, and a cover member that is selectively mounted to the connector housing in one mounting orientation out of three or more different mounting orientations to turn a wire extending from the cavity to a direction corresponding to the one mounting orientation. The cover member includes a restricting portion that restricts the wire and a mounting portion that is integrally formed with the restricting portion and mounted to the connector housing. The cover member is mounted to the connector housing in a mounting orientation corresponding to a combination of a locking portion and a lock catch portion that are locked to each other.
A ferrule includes: a tip surface; an opening portion provided on a side opposite to the tip surface in a first direction intersecting the tip surface; a plurality of fiber grooves extending along the first direction and arranged along a second direction intersecting the first direction between the tip surface and the opening portion, the plurality of fiber grooves being capable of respectively supporting a plurality of optical fibers; and a plurality of lenses respectively disposed on extension lines of the plurality of fiber grooves. The fiber groove has a first fiber groove portion for positioning the optical fiber with respect to the lens and a second fiber groove portion for introducing the optical fiber into the first fiber groove portion. The first fiber groove portion is disposed closer to the lens than the second fiber groove portion in the first direction.
A multicore cable includes a plurality of covered wires having a lubricant powder provided on surfaces thereof, and an outer sheath layer covering outer surfaces of the plurality of covered wires. The outer surfaces of the plurality of covered wires, and the outer sheath layer, make contact with one another via the lubricant powder. A coverage of the outer surfaces of the plurality of covered wires by the lubricant powder is greater than or equal to 15%.
H01B 7/18 - Protection contre les dommages provoqués par des facteurs extérieurs, p.ex. gaines ou armatures par l'usure, la contrainte mécanique ou la pression
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.
A wiring module is included in a power storage module including a plurality of power storage elements each having electrode terminals and is connected to the power storage elements. The wiring module includes a flexible FPC including a first conductive path and a circuit board including a second conductive path that is electrically connected to the first conductive path. The FPC includes a main body portion and a circuit connecting portion that extends from the main body portion and is overlaid on the circuit board. The first conductive path includes a first land included in the circuit connecting portion. The second conductive path includes a second land that is electrically connected to the first land. The connected portion between the first land and the second land is covered by a covering portion constituted by a resin having insulating properties.
H05K 1/14 - Association structurale de plusieurs circuits imprimés
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
80.
RESIN COMPOSITION, OPTICAL FIBER, AND METHOD FOR PRODUCING OPTICAL FIBER
A resin composition for secondary coating of an optical fiber contains a photopolymerizable compound and a photopolymerization initiator, wherein the photopolymerizable compound contains: a urethane (meth)acrylate that is a reaction product of a polyol having a number average molecular weight of 300 or more and 1200 or less, a diisocyanate, and a hydroxyl group-containing (meth)acrylate; a bisphenol skeleton-containing (meth)acrylate; and a monofunctional (meth)acrylate in which a glass transition temperature of a homopolymer of the monofunctional (meth)acrylate is −60° C. or more and 15° C. or less; and when the resin composition is ultraviolet-cured under conditions of an accumulated amount of light of 1000 mJ/cm2 and an illumination of 1000 mW/cm2 to form a resin film, the Young's modulus of the resin film is 1200 MPa or more and 3000 MPa or less at 23° C., and the glass transition temperature of the resin film is 70° C. or more and 105° C. or less.
C08J 3/28 - Traitement par ondes énergétiques ou par rayonnement de particules
C08F 120/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C09D 133/10 - Homopolymères ou copolymères d'esters de l'acide méthacrylique
A semiconductor device including: a substrate; a channel layer that is provided on the substrate and that includes Ga and N; and a barrier layer that is provided on the channel layer and includes a first surface that faces the channel layer and a second surface opposite to the first surface, the barrier layer containing Al, N, and at least one of Ga or In; wherein an average value of an Al composition in the barrier layer is 30% or more, and wherein in an Al composition profile in the barrier layer, a slope of a first straight line connecting a first point and a second point is 20%/nm or more and 65%/nm or less.
H01L 29/10 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode ne transportant pas le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
82.
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.
A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.
An optical fiber cable includes optical fiber ribbons and a sheath covering a periphery of the plurality of optical fiber ribbons. Each of the optical fiber ribbon includes optical fibers, and a connected portion and a non-connected portion are intermittently provided in the longitudinal direction. Each optical fiber includes a glass fiber and a coating portion. A ratio of an inner diameter to an outer diameter of the sheath is 0.75 or more. A ratio of a total area of glasses in an optical fiber ribbon accommodating portion to an area of the optical fiber ribbon accommodating portion is 15% or more and 25% or less, the number of the optical fibers in the optical fiber cable is 3000 or more, and the outer diameter of the sheath is 50 mm or less.
A cutting tool includes a substrate and a coating film, wherein the coating film has a first layer formed from a plurality of hard grains, the hard grains are made of TiSiCN having a cubic crystal structure, the hard grains have a lamellar structure in which a layer having a relatively high silicon concentration and a layer having a relatively low silicon concentration are alternately stacked, and a maximum value of percentage of number ASi of silicon atoms to a sum of the number ASi of silicon atoms and number ATi of titanium atoms in a grain boundary region between the hard grains, {ASi/(ASi+ATi)}×100, is larger than an average value of percentage of number BSi of silicon atoms to a sum of the number BSi of silicon atoms and number BTi of titanium atoms in the first layer, {BSi/(BSi+BTi)}×100.
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c. à d. procédés de dépôt chimique en phase vapeur (CVD) caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
A differential signal represented by a voltage difference between two signals that propagate through two signal lines is input to a signal processing circuit from a connector. A first suppressing circuit and a second suppressing circuit suppress peak values of the two signals. A DC removing circuit removes DC components of the two signals. A common mode choke coil (noise removing circuit) removes common mode noise included in the two signals. The DC removing circuit and the noise removing circuit are disposed between the first suppressing circuit and the second suppressing circuits. If the voltage of the signal line is a first threshold voltage, a current flows through a first suppressing device (first connection device). If the voltage of the signal line is a second threshold voltage, a current flows through a second suppressing device (second connection device). The second threshold voltage is less than the first threshold voltage.
A power distribution module including: a power line connecting between a battery and a load; a main relay connected to the power line; an active fuse connected to the power line on the battery side relative to the main relay; a first voltage converter connected to the power line on the load side relative to the main relay; an abnormality detection unit configured to detect an abnormality of the power line; and a first driving/control wiring extending from the first voltage converter and connected to the active fuse, wherein a first control unit mounted on the first voltage converter transmits a control signal for disconnecting the active fuse when the abnormality detection unit detects an abnormality of the power line, and the active fuse is disconnected.
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
B60L 3/00 - Dispositifs électriques de sécurité sur véhicules propulsés électriquement; Contrôle des paramètres de fonctionnement, p.ex. de la vitesse, de la décélération ou de la consommation d’énergie
A wire harness unit including: a conduction path that conducts electricity between in-vehicle devices; and a cooling tube that cools the conduction path, wherein: the conduction path has a hollow tubular conductor having conductivity, and a first insulating layer covered by the tubular conductor, the cooling tube is configured to circulate a refrigerant therethrough and is separate from the tubular conductor, and the cooling tube passes through the first insulating layer.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
This terminal-equipped electric wire for a charging inlet comprises: an electric wire that has a conductor and an insulation coating; and a terminal that is connected to the conductor exposed on the end part of the electric wire. The insulation coating has an olefin resin as the main component thereof. The terminal-equipped electric wire further comprises: heat-shrinkable tubing that covers a region spanning from a site where the conductor and the terminal are connected to the insulation coating; and a primer layer that is provided between the inner peripheral surface of the heat-shrinkable tubing and the outer peripheral surface of the terminal. The inner peripheral surface of the heat-shrinkable tubing and the outer peripheral surface of the insulation coating are in direct contact.
H01R 4/72 - Isolation des connexions utilisant un manchon isolant rétractable à chaud
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c. à d. se touchant l'un l'autre; Moyens pour réaliser ou maintenir de tels contacts; Connexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
H01R 11/12 - Pièces d'extrémité se terminant par un œillet, un crochet ou une fourchette
90.
OPTICAL FIBER CONNECTION COMPONENT AND METHOD FOR MANUFACTURING OPTICAL FIBER CONNECTION COMPONENT
A method for manufacturing an optical fiber connecter includes preparing optical fiber including a glass fiber and a resin coating portion covering the glass fiber, mounting the optical fiber on a first optical fiber holder, adjusting an azimuth around a central axis for the optical fiber, bonding the glass fiber to the first optical fiber holder, mounting the glass fiber on a second optical fiber holder, bonding the glass fiber to the second optical fiber holder, and grinding end faces of the glass fiber and an the second optical fiber holder so that the end face of the glass fiber is flush with the end face of the second optical fiber holder.
A vehicle anomaly detection device is used in a vehicle power system. The vehicle anomaly detection device includes a target wiring portion and an anomaly detection unit. The target wiring portion constitutes at least a portion of the inter-storage power path and is a target for anomaly detection. The anomaly detection unit performs a predetermined anomaly check operation on the target wiring portion and detects an anomaly in the target wiring portion based on the result of the anomaly check operation.
B60R 16/033 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique caractérisé par l'utilisation de cellules électriques ou de batteries
G01R 31/58 - Test de lignes, de câbles ou de conducteurs
92.
BENDING-IMPARTING DEVICE FOR MEASURING BENDING LOSS, AND BENDING TEST DEVICE
A bending applying device includes three mandrels and applies bending to an optical fiber by winding the optical fiber onto the mandrels. The mandrels are alternately arranged at predetermined intervals such that outer circumferences of adjacent mandrels in a longitudinal direction of the optical fiber face each other in a non-contact manner. A diameter of the optical fiber is D, a radius of the mandrel is r, an interval between the adjacent mandrels in the first direction is 2r + d, a direction orthogonal to the first direction is a second direction, an interval between the adjacent mandrels in the second direction is s, and an angle θ between the second direction and a common internal tangent of the adjacent mandrels is 0 degrees or more and 45 degrees or less, and the formed angle θ satisfies following formula.
A bending applying device includes three mandrels and applies bending to an optical fiber by winding the optical fiber onto the mandrels. The mandrels are alternately arranged at predetermined intervals such that outer circumferences of adjacent mandrels in a longitudinal direction of the optical fiber face each other in a non-contact manner. A diameter of the optical fiber is D, a radius of the mandrel is r, an interval between the adjacent mandrels in the first direction is 2r + d, a direction orthogonal to the first direction is a second direction, an interval between the adjacent mandrels in the second direction is s, and an angle θ between the second direction and a common internal tangent of the adjacent mandrels is 0 degrees or more and 45 degrees or less, and the formed angle θ satisfies following formula.
d
+
D
+
4
r
d
−
D
+
s
2
=
2
r
+
D
2
tan
θ
+
s
cos
θ
This connector unit 1 is provided with a plurality of coupled sub connectors 10, wherein the sub-connectors 10 are each provided with a lower housing 20 and an upper cover 40, and the upper cover 40 is configured to be slidable between a main closed position and a provisional closed position and to be pivotable between the provisional closed position and an open position. One among the lower housing 20 and the upper cover 40 comprises: a pivoting permitted part 51A that permits pivoting when the upper cover 40 is at the provisional closed position; and a pivoting restriction part 51B that restricts pivoting when the upper cover 40 is at the main closed position. One sub connector 10A is provided with a movement restriction part 45 that restricts a slide movement of the upper cover 40 provided to another sub connector 10B from the main closed position to the provisional closed position.
H01R 13/506 - Socles; Boîtiers composés de différentes pièces assemblées par enclenchement réciproque des pièces
H01R 13/514 - Socles; Boîtiers formés comme un bloc ou un assemblage modulaire, c. à d. composés de parties coopérantes pourvues de pièces de contact ou maintenant entre elles des pièces de contact
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
The purpose of the present invention is to make it possible to easily attach an elastic water-stop member to a wiring member. The present invention is a wiring module (10) comprising a wiring member (20), and an elastic water-stop member (30) formed with a through-housing section (32) capable of housing a portion, in the longitudinal direction, of the wiring member, wherein the elastic water-stop member has a slit (36) formed from an outer peripheral portion thereof to the through-housing section, and the slit is kept closed in a state in which the portion in the longitudinal direction of the wiring member is housed in the through-housing section.
A connector 10 is provided with a terminal 20 to be connected to a front end part of a wire 11 extending in a front-rear direction, a connector housing 40 including an accommodating portion 41 for accommodating the terminal 20, and a rear holder 50 to be mounted on a rear end part of the connector housing 40. The rear holder 50 is formed with an insertion hole 61 extending along an extending direction of the wire between a communication opening 61A communicating with the accommodating portion 41 and a rear opening 61B open to outside in a rear end part of the rear holder 50. A guiding inclined surface 62 for reducing a hole diameter of the insertion hole 61 toward the communication opening 61A is provided on a wall surface of the insertion hole 61.
A method of manufacturing a semiconductor device includes: forming an electron transit layer; forming an electron supply layer; forming a protective film; forming a zinc oxide film; forming a sacrifice layer; forming a first opening and a second opening in the sacrifice layer and the zinc oxide film; forming a third opening connecting to the first opening and a fourth opening connecting to the second opening; forming, by acid treatment using a weakly acidic solution, a first gap in a first portion exposed to the first opening of the zinc oxide film, and a second gap in a second portion exposed to the second opening of the zinc oxide film; forming, after the acid treatment, a source region on a bottom surface of the third opening and a drain region on a bottom surface of the fourth opening; and removing the zinc oxide film.
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
A cemented carbide including tungsten carbide grains and a binder phase, in which a total content of the tungsten carbide grains and the binder phase in the cemented carbide is no less than 80 vol %, a content of the binder phase in the cemented carbide is no less than 0.1 vol % and no more than 20 vol %, in a histogram showing distribution of orientation differences between adjacent pairs each consisting of two of the tungsten carbide grains adjacent to each other in the cemented carbide, a first peak is present in a class of the orientation differences of no less than 29.5° and less than 30.5°.
The purpose of the present invention is to provide a technology which can increase the versatility of a wiring module in which a grommet is provided to a wiring member. The wiring module comprises: a wiring member connecting a vehicle body and a door panel; and a grommet attached to the wiring member. The grommet includes a base part fixed to a fixed position with respect to the door panel. The wiring member includes a first segment, and a second segment which is positioned more on the vehicle body side than the first segment and is covered by the base part. The first segment of the wiring member is covered by a protective part which can be deformed by bending and/or deformed by expansion/contraction.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H02G 3/04 - Tubes ou conduits de protection, p.ex. échelles à câbles ou goulottes de câblage
H02G 3/22 - Installations de câbles ou de lignes à travers les murs, les sols ou les plafonds, p.ex. dans les immeubles
A shielded flat cable includes multiple conductors arrayed in parallel along a first plane, a resin insulating layer including first and second resin insulating layers that cover the conductors, the first plane being sandwiched between the first and second resin insulating layers, a shield layer that covers an outer surface of the resin insulating layer and that includes an adhesive, and a pair of flame-retardant resin films that cover an outer surface of the shield layer. The pair of resin films have a first bonding section and a second bonding section where the pair of resin films are bonded to each other. The outer surface of the shield layer has a first portion that contacts the first bonding section and a second portion that contacts the second bonding section. The shield layer has a third bonding section where the adhesive is bonded to each other.
H01B 7/295 - Protection contre les dommages provoqués par des facteurs extérieurs, p.ex. gaines ou armatures par des températures extrêmes ou par les flammes en utilisant un matériau résistant aux flammes
A wire cover is to be mounted on a rear side in a connecting direction of a connector to be connected to a mating connector. The connector includes a plurality of female terminals disposed apart from each other in a lateral direction and a plurality of wires connected to the respective female terminals and pulled out from the rear side in the connecting direction. The wire cover includes a housing having an insertion opening through which the plurality of wires are inserted and a draw-out opening through which the plurality of wires inserted through the insertion opening are drawn out rightward, and an assisting member for assisting three-dimensional bending of the respective wires inside the housing. The respective wires are three-dimensionally bent inside the housing and drawn out through the draw-out opening by being assisted by the assisting member.
brevets
