Method of forming an isolation structure might include forming a first conductive region in a first section of a semiconductor material, forming a first trench in a second section of the semiconductor material adjacent a first side of the first section of the semiconductor material and forming a second trench in a third section of the semiconductor material adjacent a second side of the first section of the semiconductor material, extending the first and second trenches to a depth below the first conductive region and removing a portion of the first section of the semiconductor material overlying the first conductive region, forming second and third conductive regions in the semiconductor material below bottoms of the first and second trenches, respectively, and forming a dielectric material overlying the first conductive region and filling the first and second trenches.
H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H10B 41/35 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire avec un transistor de sélection de cellules, p.ex. NON-ET
H10B 41/41 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région de circuit périphérique de régions de mémoire comprenant un transistor de sélection de cellules, p.ex. NON-ET
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H10B 43/35 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
H10B 43/40 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région de circuit périphérique
2.
REDUNDANCY-BASED ERROR DETECTION IN A MEMORY DEVICE
Methods, systems, and devices for redundancy-based error detection in a memory device are described. A memory device may read multiple copies of a codeword from memory and generate for each codeword copy an error detection bit that indicates whether the memory device detected an error in that codeword. Additionally, the memory device may compare the codeword copies and generate one or more match bits that indicate whether corresponding portions of the codewords match. Using a combination of the error detection bits and the match bits, the memory device may determine the error status of each codeword.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G06F 11/07 - Réaction à l'apparition d'un défaut, p.ex. tolérance de certains défauts
3.
PROVIDING RECOVERED DATA TO A NEW MEMORY CELL AT A MEMORY SUB-SYSTEM BASED ON AN UNSUCCESSFUL ERROR CORRECTION OPERATION
At least one data of a set of data stored at a memory cell of a memory component is determined to be associated with an unsuccessful error correction operation. A determination is made as to whether a programming operation associated with the set of data stored at the memory cell has completed. The at least one data of the set of data stored at the memory cell that is associated with the unsuccessful error correction operation is recovered in response to determining that the programming operation has completed. Another memory cell of the memory component is identified in response to recovering the at least one data of the set of data stored at the memory cell that is associated with the unsuccessful error correction operation. The set of data including the recovered at least one data is provided to the other memory cell of the memory component.
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G06F 11/14 - Détection ou correction d'erreur dans les données par redondance dans les opérations, p.ex. en utilisant différentes séquences d'opérations aboutissant au même résultat
G11C 29/52 - Protection du contenu des mémoires; Détection d'erreurs dans le contenu des mémoires
4.
APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE THEREOF
According to one or more embodiments of the disclosure, an apparatus comprising a metal layer and a redistribution layer on the metal layer is provided. The redistribution layer includes an insulating layer, a via, and a redistribution metal layer. The via is in the insulating layer and has a rectangular shape in a plan view. The redistribution metal layer has a first thickness on a shorter side of the rectangular shape of the via and a second thickness on a longer side of the rectangular shape of the via. The second thickness is greater than the first thickness.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
5.
OPEN TRANSLATION UNIT MANAGEMENT USING AN ADAPTIVE READ THRESHOLD
A read operation is performed on a set of memory cells addressable by a first wordline (WL), wherein the set of memory cells is comprised by an open translation unit (TU_of memory cells of a memory device. Respective threshold voltage offset bins for each WL of a second plurality of WLs coupled to respective sets of memory cells comprised by the open TU are determined based on a threshold voltage offset bin associated with the first WL. Respective default threshold voltages for each WL of the first plurality of WLs are updated based on the respective threshold voltage offset bins for each WL of the second plurality of WLs.
Methods, systems, and devices for programming power management circuits in a system are described. An apparatus may include a set of one or more power management circuits configured to provide one or more operating voltages for the apparatus. The apparatus may also include an interface coupled with a controller via a bus. The apparatus may include a first switching circuit configured to isolate the bus from the controller and to couple the bus with a second switching circuit. The second switching circuit may be configured to isolate the set of one or more power management circuits from the controller and to couple the set of one or more power management circuits with the first switching circuit.
G06F 1/3234 - Gestion de l’alimentation, c. à d. passage en mode d’économie d’énergie amorcé par événements Économie d’énergie caractérisée par l'action entreprise
In some implementations, a memory device may detect power up and may identify, based on detecting the power up, a plurality of blocks of the memory device for which a power up based refresh determination is to be performed. The memory device may perform the power up based refresh determination on the plurality of blocks. The memory device may determine whether a block, of the plurality of blocks, satisfies at least one of an age condition that is based on a difference between a current time and an opening time associated with opening the block for programming, or a temperature condition that is based on a difference between a current temperature and an opening temperature associated with the block at the opening time. The memory device may selectively refresh the block based on determining whether the block satisfies at least one of the age condition or the temperature condition.
A device includes an amplifying device that when in operation transmits a data signal and a reference signal to a decision feedback equalizer (DFE) circuit. The amplifying device includes a variable gain amplifier (VGA) that when in operation generates the reference signal as having a predetermined gain relative to a received input signal and a continuous-time linear equalizer (CTLE) that operate to mitigate inter-symbol interference (IR) on the data signal from a data stream comprising the data signal. The device further includes correction circuitry coupled to the amplifying device, wherein the correction circuitry when in operation mitigates variation in the predetermined gain of the VGA or variation in an output common-mode voltage of the VGA.
Methods, systems, and devices for video stream augmentation using a deep learning device are described. A machine learning device of a vehicle may augment a video stream received from cameras of the vehicle and may output the augmented video stream to a display component of the vehicle. For example, a camera of the vehicle may record a video stream of and a sensor of the vehicle may detect information about an environment associated with the vehicle. The camera and sensor may transmit the video stream and information, respectively, to the machine learning device, which may process and modify the video stream based on parameters of the video stream and/or the information. The machine learning device may transmit the modified video streams to the display component, and the display component may display aspects of the modified video stream on a display of the vehicle, such as a rearview mirror.
G06V 10/77 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p.ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]; Séparation aveugle de source
B60R 1/12 - Ensembles de miroirs combinés avec d'autres objets, p.ex. pendules
B60R 1/22 - Dispositions de visualisation en temps réel pour les conducteurs ou les passagers utilisant des systèmes de capture d'images optiques, p.ex. des caméras ou des systèmes vidéo spécialement adaptés pour être utilisés dans ou sur des véhicules pour visualiser une zone extérieure au véhicule, p.ex. l’extérieur du véhicule
G01S 7/48 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe
G01S 17/08 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G06V 10/60 - Extraction de caractéristiques d’images ou de vidéos relative aux propriétés luminescentes, p.ex. utilisant un modèle de réflectance ou d’éclairage
G06V 20/40 - RECONNAISSANCE OU COMPRÉHENSION D’IMAGES OU DE VIDÉOS Éléments spécifiques à la scène dans le contenu vidéo
G06V 20/58 - Reconnaissance d’objets en mouvement ou d’obstacles, p.ex. véhicules ou piétons; Reconnaissance des objets de la circulation, p.ex. signalisation routière, feux de signalisation ou routes
H04N 7/18 - Systèmes de télévision en circuit fermé [CCTV], c. à d. systèmes dans lesquels le signal vidéo n'est pas diffusé
10.
METHODS AND SYSTEMS FOR HANDLING DATA RECEIVED BY A STATE MACHINE ENGINE
A data analysis system to analyze data. The data analysis system includes a data buffer configured to receive data to be analyzed. The data analysis system also includes a state machine lattice. The state machine lattice includes multiple data analysis elements and each data analysis element includes multiple memory cells configured to analyze at least a portion of the data and to output a result of the analysis. The data analysis system includes a buffer interface configured to receive the data from the data buffer and to provide the data to the state machine lattice.
G06F 12/0875 - Adressage d’un niveau de mémoire dans lequel l’accès aux données ou aux blocs de données désirés nécessite des moyens d’adressage associatif, p.ex. mémoires cache avec mémoire cache dédiée, p.ex. instruction ou pile
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 9/448 - Paradigmes d’exécution, p.ex. implémentation de paradigmes de programmation
An exemplary memory controller includes a refresh manager circuit configured to provide a refresh command to a memory system via a command and address bus to initiate a refresh operation at a bank of the memory system. In response to provision of the refresh command, the refresh manager circuit is further configured to issue a bank status command to the host to indicate that the bank of the memory system has switched to unavailable.
Methods, systems, and devices for staggered horizontal cell architecture for memory devices are described. Generally, the described techniques provide for a memory device that supports staggered cell architectures and techniques to manufacture the memory device. The memory device may include a stack of materials including alternating layers of dielectric and conductive material. The memory device may include one or more staircase structures coupled with the stack of layers. The memory device may include access lines, such as bit lines, that are staggered according to a pattern, such as a serpentine pattern of dielectric fill surrounding the access lines. The memory device may include a set of repeatable structures that may be interlaced in a staggered configuration. The repeatable structure may include two fins extending in opposite directions and coupled to a respective staircase structure.
A computer having a plurality of accounts and a storage device having a host interface, a controller, non-volatile storage media, and firmware. An account is configured with at least a predetermined speed in accessing the non-volatile storage media by allocating a number of input/output submission queues in the buffer area of the host. The number can be determined from a ratio between the predetermined speed configured for the account and a saturated speed of the storage device with sufficient submission queues. Data access requests from the account are evenly distributed to the submission queues allocated for the exclusive use by the account; and the controller, configured via the firmware, processes with equal priority the submission queues configured for the storage device. Thus, the account can have at least the predetermined speed in accessing the non-volatile storage media, regardless of how other accounts access the storage device.
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 12/06 - Adressage d'un bloc physique de transfert, p.ex. par adresse de base, adressage de modules, extension de l'espace d'adresse, spécialisation de mémoire
Disclosed is a system comprising a memory device and a processing device, operatively coupled with the memory device, to perform operations including identifying a group of memory cells corresponding to a first range of logical block addresses (LBAs). The operations performed by the processing device further include receiving a memory access command with respect to the group of memory cells. The operations performed by the processing device further include responsive to determining that a data structure associated with the group of memory cells references a second range of LBAs, blocking the memory access command; responsive to determining that the first range of LBAs does not include each LBA of the second range of LBAs, performing, on the group of memory cells, a trim operation; and responsive to determining that the data structure indicates the completion of the trim operation, performing a memory access operation specified by the memory access command.
Methods, systems, and devices for single-crystal transistors for memory devices are described. In some examples, a cavity may be formed through at least a portion of one or more dielectric materials, which may be deposited above a deck of memory cells. The cavity may include a taper, such as a taper toward a point, or a taper having an included angle that is within a range, or a taper from a cross-sectional area to some fraction of the cross-sectional area, among other examples. A semiconductor material may be deposited in the cavity and above the one or more dielectric materials, and formed in a single crystalline arrangement based on heating and cooling the deposited semiconductor material. One or more portions of a transistor, such as a channel portion of a transistor, may be formed at least in part by doping the single crystalline arrangement of the semiconductor material.
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/10 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode ne transportant pas le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
16.
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
An interposer includes an upper surface for coupling to a chip, a lower surface for coupling to a package substrate, and redistribution layers between the upper surface and the lower surface and including routed conductive lines. A respective one of the routed conductive lines extend between a first location and a second location and includes two or more traces extending substantially in parallel between the first location and the second location. Related devices and methods are also described.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.
Apparatuses, machine-readable media, and methods related to vehicle diagnosis and repair are described. Receiving vehicle status information from a control panel and/or on board diagnostic (OBD) unit of a vehicle at a vehicle diagnosis and repair too can provide valuable information to an owner and/or user of a vehicle. Computing devices (e.g., mobile devices and/or modules having a computing device) can be configured to run an application (e.g., a vehicle diagnosis and repair tool) to determine whether a vehicle needs to be repaired or serviced according to examples of the present disclosure. The vehicle diagnosis and repair tool can receive vehicle status information, determine the repairs and/or service that the vehicle needs, and initiate the vehicle repairs and/or service.
G07C 5/00 - Enregistrement ou indication du fonctionnement de véhicules
G07C 5/08 - Enregistrement ou indication de données de marche autres que le temps de circulation, de fonctionnement, d'arrêt ou d'attente, avec ou sans enregistrement des temps de circulation, de fonctionnement, d'arrêt ou d'attente
19.
SCHEDULING OF READ OPERATIONS AND WRITE OPERATIONS BASED ON A DATA BUS MODE
A data bus coupled to a plurality of memory devices is determined to be in a read mode. Responsive to determining that the data bus is in the read mode, a particular read operation identified in a particular memory queue of memory queues that include identifiers of one or more write operations and identifiers of one or more read operations is determined. The particular memory queue includes a highest number of read operations for a memory device of the memory devices. The particular read operation is transmitted from the particular memory queue over the data bus.
Methods, systems, and devices for plasma-doped trenches for memory are described. A method for forming a memory device with plasma-doped trenches may include forming a stack of materials having alternating layers of polysilicon and oxide materials. A trench may be etched in the stack and doped using a plasma doping process. In some examples, the trench may be doped by applying Boron fluoride, diborane, methane, or Boron and Carbon Hydride gases diluted with Hydrogen (H2) or Helium to the sidewalls and bottom surface of the trench, which may dope portions of the polysilicon material with Boron, Carbon, Fluorine, Helium, or Hydrogen.
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H01L 23/535 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions internes, p.ex. structures d'interconnexions enterrées
21.
IMPROVED MEMORY PERFORMANCE USING MEMORY ACCESS COMMAND QUEUES IN MEMORY DEVICES
Systems and methods are disclosed including a controller and a memory device comprising a first plane and a second plane where each plane is associated with a respective queue maintained by the controller. The local media controller is configured to perform operations comprising storing, in a first queue associated with the first plane, a first plurality of memory access commands; storing, in a second queue associated with the second plane, a second plurality of memory access commands; and processing the first plurality of memory access commands from the first queue and the second plurality of memory access commands from the second queue.
The present disclosure relates to providing multiple error correction code protection levels in memory. One device includes an array of memory cells and an operating circuit for managing operation of the array. The operating circuit comprises an encoding unit configured to generate a codeword for a first error correction code (ECC) protection level and a second ECC protection level, and decoding unit configured to perform an ECC operation on the codeword at the first ECC protection level and the second ECC protection level. The codeword comprises payload data stored in a plurality of memory cells of the array, and parity data associated with the payload data stored in parity cells of the array.
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
23.
Array of Memory Cells, Methods Used in Forming an Array of Memory Cells, Methods Used in Forming an Array of Vertical Transistors, Methods Used in Forming an Array of Vertical Transistors, and Methods Used in Forming an Array of Capacitors
A method used in forming an array of memory cells comprises forming a vertical stack comprising transistor material directly above and directly against a first capacitor electrode material. A mask is used to subtractively etch both the transistor material and thereafter the first capacitor electrode material to form a plurality of pillars that individually comprise the transistor material and the first capacitor electrode material. Capacitors are formed that individually comprise the first capacitor electrode material of individual of the pillars. Vertical transistors are formed above the capacitors that individually comprise the transistor material of the individual pillars. Other aspects and embodiments are disclosed, including structure independent of method.
H10B 12/00 - Mémoires dynamiques à accès aléatoire [DRAM]
G11C 11/22 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des éléments ferro-électriques
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H10B 53/30 - Dispositifs RAM ferro-électrique [FeRAM] comprenant des condensateurs ferro-électriques de mémoire caractérisés par la région noyau de mémoire
H10B 53/40 - Dispositifs RAM ferro-électrique [FeRAM] comprenant des condensateurs ferro-électriques de mémoire caractérisés par la région de circuit périphérique
24.
DYNAMIC MEMORY REFRESH INTERVAL TO REDUCE BANDWIDTH PENALTY
A dynamic memory system having multiple memory regions respectively storing multiple types of data. A controller coupled to the dynamic memory system via a communication channel and operatively to: monitor usage of a communication bandwidth of the communication channel; determine to reduce memory bandwidth penalty caused by refreshing the dynamic memory system; and in response, reduce a refresh rate of at least one of the memory regions based on a type of data stored in the respective memory region.
Methods, systems, and devices for switch and hold biasing for memory cell imprint recovery are described. A memory device may be configured to perform an imprint recovery procedure that includes applying one or more recovery pulses to memory cells, where each recovery pulse is associated with a voltage polarity and includes a first portion with a first voltage magnitude and a second portion with a second voltage magnitude that is lower than the first voltage magnitude. In some examples, the first voltage magnitude may correspond to a voltage that imposes a saturation polarization on a memory cell (e.g., on a ferroelectric capacitor, a polarization corresponding to the associated voltage polarity) and the second voltage magnitude may correspond to a voltage magnitude that is high enough to maintain the saturation polarization (e.g., to prevent a reduction of polarization) of the memory cell.
A set of submission queues associated with a host system is identified. A first set of internal queues and a second set of internal queues is generated based on the set of submission queues. Responsive to fetching a first memory access command pending in a submission queue of the set of submission queues, a first internal queue of the first set of internal queues is populated. Responsive to processing the first memory access command from the first internal queue of the first set of internal queues, a second internal queue of the second set of internal queues is populated. Responsive to completion of the first memory access command from the second internal queue of the second set of internal queues, an indication of the completion of the first memory access command is returned to the host system.
Systems, apparatuses, and methods for transmission failure feedback associated with a memory device are described. A memory device may detect errors in received data and transmit an indication of the error when detected. The memory device may receive data and checksum information for the data from a controller. The memory device may generate a checksum for the received data and may detect transmission errors. The memory device may transmit an indication of detected errors to the controller, and the indication may be transmitted using a line that is different than an error detection code (EDC) line. A low-speed tracking clock signal may also be transmitted by the memory device over a line different than the EDC line. The memory device may transmit a generated checksum to the controller with a time offset applied to the checksum signaled over the EDC line.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G11C 29/42 - Dispositifs de vérification de réponse utilisant des codes correcteurs d'erreurs [ECC] ou un contrôle de parité
A multi-interface memory can include a memory package that includes a memory device and host interfaces coupled to the memory device. Each of the host interfaces is configured to operate according to a different protocol. The memory package can be coupled to a host via one or more of the host interfaces. More than one of the host interfaces can share a contact.
A microelectronic device comprises a stack structure comprising a stack structure comprising a vertically alternating sequence of conductive structures and insulative structures arranged in tiers, the stack structure divided into block structures separated from one another by slot structures, strings of memory cells vertically extending through the block structures of the stack structure, the strings of memory cells individually comprising a channel material vertically extending through the stack structure, an additional stack structure vertically overlying the stack structure and comprising a vertical sequence of additional conductive structures and additional insulative structures arranged in additional tiers, first pillars extending through the additional stack structure and vertically overlying the strings of memory cells, each of the first pillars horizontally offset from a center of a corresponding string of memory cells, second pillars extending through the additional stack structure and vertically overlying the strings of memory cells, and additional slot structures comprising a dielectric material extending through at least a portion of the additional stack structure and sub-dividing each of the block structures into sub-block structures, the additional slot structures horizontally neighboring the first pillars. Related microelectronic devices, electronic systems, and methods are also described.
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
30.
METHODS OF FORMING ELECTRONIC DEVICES INCLUDING RECESSED CONDUCTIVE STRUCTURES AND RELATED SYSTEMS
An electronic device comprises a stack structure comprising vertically alternating insulative structures and conductive structures arranged in tiers, pillars extending vertically through the stack structure, and a barrier material overlying the stack structure. The electronic device comprises a first insulative material extending through the barrier material and into an upper tier portion of the stack structure, and a second insulative material laterally adjacent to the first insulative material and laterally adjacent to at least some of the conductive structures in the upper tier portion of the stack structure. At least a portion of the second insulative material is in vertical alignment with the barrier material. Additional electronic devices and related methods and systems are also disclosed.
H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
G11C 11/56 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments d'emmagasinage comportant plus de deux états stables représentés par des échelons, p.ex. de tension, de courant, de phase, de fréquence
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
31.
ERROR DETECTION, CORRECTION, AND MEDIA MANAGEMENT ON A DRAM DEVICE
In a memory controller system, a system and method to identify memory errors which may require soft package repair or hard package repair to rows of DRAM memory. When data is written to a row of DRAM, the data is immediately and automatically read back and scanned for bit errors. If bit errors are identified, the data is corrected and written back to the same memory location. The memory location is re-read. If bit errors are again identified, the memory location is marked for soft or hard repair. If, upon rereading the memory location, additional bit errors are identified, a historical record of memory errors is reviewed to determine if bit errors have occurred previously at the same memory location. If yes, the memory location is again marked for a soft post package repair or a hard post package repair.
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers in the memory blocks. The channel-material strings directly electrically couple to conductor material of the conductor tier. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises a laterally-outer insulative lining extending longitudinally-along the immediately-laterally-adjacent memory-blocks. The laterally-outer insulative lining has its lowest surface between a top and a bottom of the lowest conductive tier. The laterally-outer insulative lining has its highest surface at or below a lowest surface of the next-lowest conductive tier. Laterally-inner insulating material extends longitudinally-along the immediately-laterally-adjacent memory blocks laterally-inward of the laterally-outer insulative lining. An interface is between the laterally-outer insulative lining and the laterally-inner insulating material. Methods are also disclosed.
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
A decoding operation is performed by altering at least one bit of the bit string from a first value to a second value and applying a bit mask to each bit of the bit string that is not altered from the first value to the second value. The decoding operation further includes writing an indication corresponding to a quantity of bits that have been altered from the first value to the second value to an array of memory cells, wherein the indication corresponds to a quantity of errors contained in the bit string, determining that the quantity of errors for the bit string has reached a threshold quantity of errors, and refraining from performing a subsequent operation to alter at least the one bit of the bit string, or a different bit of the bit string, or both, from the first value to the second value in response to determining that the quantity of errors for the bit string has reached the threshold quantity of errors.
H03M 13/11 - Détection d'erreurs ou correction d'erreurs transmises par redondance dans la représentation des données, c.à d. mots de code contenant plus de chiffres que les mots source utilisant un codage par blocs, c.à d. un nombre prédéterminé de bits de contrôle ajouté à un nombre prédéterminé de bits d'information utilisant plusieurs bits de parité
H03M 13/00 - Codage, décodage ou conversion de code pour détecter ou corriger des erreurs; Hypothèses de base sur la théorie du codage; Limites de codage; Méthodes d'évaluation de la probabilité d'erreur; Modèles de canaux; Simulation ou test des codes
H03M 13/15 - Codes cycliques, c. à d. décalages cycliques de mots de code produisant d'autres mots de code, p.ex. codes définis par un générateur polynomial, codes de Bose-Chaudhuri-Hocquenghen [BCH]
34.
ENHANCED VALLEY TRACKING WITH TRIM SETTING UPDATES IN A MEMORY DEVICE
Control logic in a memory device receives a request to perform a read operation to read data from a memory array of a memory device, the request comprising an indication of a segment of the memory array where the data is stored, and performs a first coarse valley tracking calibration operation on the segment of the memory array. The control logic further configures a read voltage level and one or more parameters associated with the read operation based on a result of the first coarse valley tracking calibration operation and performs a second fine valley tracking calibration operation on the segment of the memory array using the configured read voltage level and the configured one or more parameters.
G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p.ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits
Systems, apparatuses, and methods related to transferring data to a memory device based on importance are described. A memory apparatus includes a first memory device, a second memory device having a lower write latency than the first memory device, and a controller coupled to the first memory device and second memory device via a compute express link (CXL) interface. The controller is configured to assign an importance level to a write request based on data associated with the write request, a hierarchy of importance levels for different data types, and the second memory device having a lower write latency than the first memory device. The controller is further configured to transfer the data to the first memory device in response to the assigned importance level having a first value and transfer the data to the second memory device in response to the assigned importance level having a second value.
A request to perform a data operation associated with at least one memory unit in a plurality of memory units of a memory device is received. The at least one memory unit includes a first group of memory cells, each memory cell supporting a specified number of charge levels such that each memory cell having the specified charge level represents a non-integer number of bits. The first group of memory cells represents a first sequence of bits based on a first sequence of charge levels formed by the first group of memory cells. The data operation is performed with respect to the at least one memory unit based on a mapping stored on the system. The mapping assigns an individual sequence of charge levels from an individual group cell to an individual sequence of bits represented by the individual group of memory cells.
A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.
G11C 29/42 - Dispositifs de vérification de réponse utilisant des codes correcteurs d'erreurs [ECC] ou un contrôle de parité
G11C 29/12 - Dispositions intégrées pour les tests, p.ex. auto-test intégré [BIST]
G11C 29/20 - Dispositifs pour la génération d'adresses; Dispositifs pour l'accès aux mémoires, p.ex. détails de circuits d'adressage utilisant des compteurs ou des registres à décalage à rétroaction linéaire [LFSR]
G11C 29/44 - Indication ou identification d'erreurs, p.ex. pour la réparation
38.
VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN 3D MEMORY
Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices and storage nodes. The horizontally oriented access devices having a first source/drain regions and a second source drain regions separated by silicon (Si) channel regions. A digit line having a global digit line (GDL) contact is formed in a trench adjacent to the first source/drain regions. In one example, the digit line is electrically isolated from a neighboring digit line at the bottom of the trench. In another example, the digit line is formed continuously along a bottom surface of trench to form shared digit lines between horizontal access devices, in two separate arrays, on opposing second vertical surfaces. The memory cells have horizontally oriented storage nodes coupled to the second source/drain regions and vertical digit lines coupled to the first source/drain regions.
Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices and storage nodes formed in tiers. And, more particularly, to multiple, alternating silicon germanium (SiGe) and single crystalline silicon (Si) in different thicknesses to form tiers in which to form the horizontal access devices in vertical three-dimensional (3D) memory. The horizontally oriented access devices can have a first source/drain regions and a second source drain regions separated by single crystalline silicon (Si) channel regions. The single crystalline silicon (Si) channel regions can include a dielectric material to provide support structure to the single crystalline channel regions when forming the horizontal access devices in vertical three-dimensional (3D) memory. Horizontally oriented access lines can connect to gate structures opposing the channel regions. Vertical digit lines coupled to the first source/drain regions.
In a memory controller system, a system and method to identify memory errors which may require soft package repair or hard package repair to rows of DRAM memory. When data is written to a row of DRAM, the data is immediately and automatically read back and scanned for bit errors. If bit errors are identified, the data is corrected and written back to the same memory location. The memory location is re-read. If bit errors are again identified, the memory location is marked for soft or hard repair. If, upon rereading the memory location, additional bit errors are identified, a historical record of memory errors is reviewed to determine if bit errors have occurred previously at the same memory location. If yes, the memory location is again marked for a soft post package repair or a hard post package repair.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
In a compute express link (CXL) memory controller system, a system and method to identify memory errors which may require soft package repair or hard package repair to rows of DRAM memory. When data is written to a row of DRAM, the data is immediately and automatically read back and scanned for bit errors. If bit errors are identified, steps are taken to determine if the memory location requires no repair, soft repair, or hard repair. The data is corrected and written back to a new memory location which is memory-mapped to the original location, thus effecting the soft- or hard-repair. The present system and method does not repair the entire row of memory, but only repairs the specific die(s) that exhibit memory error in the row.
Methods, systems, and devices for counter management for memory systems are described. A memory system may include circuitry configured to test localized counters of the memory system, where the circuitry may be configured to test a set of memory cells storing a value of the counter. During testing, the memory system may activate a row of memory cells a quantity of times, and the circuitry may increment a test counter associated with a subset of the set of memory cells for each activation to determine whether the subset is associated with an error. If a flag generated by the circuitry indicating a test count does not match an expected value, there may be an error associated with the subset. The circuitry may be operable to configure one or more multiplexers to refrain from using the subset to store the value of the counter based on the flag.
Semiconductor devices are disclosed. A semiconductor device may include a hybrid transistor configured in a vertical orientation. The hybrid transistor may include a gate electrode, a drain material, a source material, and a channel material operatively coupled between the drain material and the source material. The source material and the drain material include a first material and the channel material includes a second, different material.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01L 29/49 - Electrodes du type métal-isolant-semi-conducteur
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H10N 70/00 - Dispositifs à l’état solide sans barrière de potentiel ni de surface, spécialement adaptés au redressement, à l'amplification, à la production d'oscillations ou à la commutation
H10N 70/20 - Dispositifs de commutation multistables, p.ex. memristors
Methods, systems, and devices for testing operations for memory systems are described. A memory system may include a first circuit and a second circuit configured to test one or more counters tracking the quantity of activates to respective rows of memory cells. In some examples, the memory system may initiate an operation to validate a counter of the memory system. The first circuit may determine if a value of the counter is correct by comparing a set of counter bits representing the value of the counter to a set of parity bits. Subsequently, the second circuit may determine if the counter is incrementing correctly in accordance with a set quantity of activates to the corresponding row of memory cells. If the first circuit or the second circuit detect an error associated with the counter, the memory system may discard the row of memory cells associated with the faulty counter.
Methods, systems, and devices related to generating, by a pseudorandom binary sequence (PRBS) generator of a memory module, a PRBS comprising a first plurality of bits corresponding to a plurality of cycles of a clock signal of the memory module subsequent to a current cycle of the clock signal. Generation of the PRBS can be based on an intermediate PRBS comprising a second plurality of bits corresponding to the current cycle of the clock signal. During each respective cycle of the clock signal, a respective subset of the PRBS can be communicated from the PRBS generator to a memory device of the memory module. Each respective subset of the PRBS comprises a quantity of bits based on a frequency of a data strobe signal of the memory device relative to a frequency of the clock signal.
H03K 3/84 - Génération d'impulsions ayant une distribution statistique prédéterminée d'un paramètre, p.ex. générateurs d'impulsions aléatoires
H03K 19/21 - Circuits OU EXCLUSIF, c. à d. donnant un signal de sortie si un signal n'existe qu'à une seule entrée; Circuits à COÏNCIDENCES, c. à d. ne donnant un signal de sortie que si tous les signaux d'entrée sont identiques
A method includes determining a quantity of errors for a bit string based on a quantity of bits having a logical value of one within the bit string and writing an indication corresponding to the quantity of errors for the bit string to an array of memory cells. The method can further include determining that the quantity of errors for the bit string has reached a threshold quantity of errors and refraining from performing a subsequent operation to determine the quantity of errors for the bit string in response to determining that the quantity of errors for the bit string has reached the threshold quantity of errors.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G06F 7/501 - Semi-additionneurs ou additionneurs complets, c. à d. cellules élémentaires d'addition pour une position
G06F 11/07 - Réaction à l'apparition d'un défaut, p.ex. tolérance de certains défauts
47.
CUSTOM COMPUTE CORES IN INTEGRATED CIRCUIT DEVICES
A system includes a processor and a hardware accelerator coupled to the processor. The hardware accelerator includes data analysis elements configured to analyze a data stream based on configuration data and to output a result, and an integrated circuit device that includes a DMA engine that writes input data to and read output data from the data analysis elements, one or more preprocessing cores that receive the input data from the DMA engine prior to the DMA engine writing the input data to the one or more data analysis elements and perform custom preprocessing functions on the input data, and one or more post-processing cores that receive the output data from the DMA engine after the output data is read from the data analysis elements but prior to the output data being output to the processor and perform custom post-processing functions on the output data.
G06F 13/28 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus d'entrée/sortie utilisant le transfert par rafale, p.ex. acces direct à la mémoire, vol de cycle
G06F 13/10 - Commande par programme pour dispositifs périphériques
According to one or more embodiments of the disclosure, an alignment-overlay mark is provided. The alignment-overlay mark includes a pair of first marks and a plurality of second marks. The first marks extend in a first direction and are arranged in parallel to each other in a second direction. The second direction is perpendicular to the first direction. The second marks are between the first marks, extend in the second direction and are arranged in parallel to each other in the first direction.
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p.ex. marques de repérage, schémas de test
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
The disclosed embodiments include a memory array configured to store a membrane potential and a synaptic connection identifier of each of a plurality of neurons, a plurality of processors coupled to the memory array, the plurality of processors configured to: immediately perform a search and match operation in the memory array upon receiving a spike message identifying relevant synaptic connections in the memory array, generate a bitmask signifying a first source neuron identifier having a match to a second source neuron identifier in the memory array, perform a synaptic integration and a long-time depression computation on a subset of spike messages including the first spike message, update membrane potentials of the plurality of neurons upon receiving an indication that all the spike messages identified in a barrier message have been received in the memory array, generate a new spike message, and transmit the new spike message to a network.
G06N 3/063 - Réalisation physique, c. à d. mise en œuvre matérielle de réseaux neuronaux, de neurones ou de parties de neurone utilisant des moyens électroniques
A memory device includes a command interface configured to receive write commands from a host device. Additionally, the memory device includes an input buffer configured to buffer a strobe signal from the host device. Furthermore, the memory device includes a first ripple counter and a second ripple counter. The memory device includes command handling circuitry configured to alternatingly start the first ripple counter and the second ripple counter in response to consecutive write commands. The command handling circuitry and/or the first and second ripple counters are configured to suppress a reset of the input buffer if either the first ripple counter or the second ripple counter has not reached a threshold and is still counting.
A microelectronic device includes a stack structure including a block region and a non-block region. The block region includes blocks separated from one another in a first horizontal direction by insulative slot structures and each including a vertically alternating sequence of conductive material and insulative material arranged in tiers. At least one of the blocks has stadium structures individually including staircase structures having steps comprising edges of some of the tiers. The non-block region neighbors the block region in the first horizontal direction. The non-block region includes additional stadium structures individually terminating at a relatively higher vertical position within the stack structure than at least one of the stadium structures at least partially within boundaries thereof in a second horizontal direction orthogonal to the first horizontal direction. Related memory devices, electronic systems, and methods are also described.
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/535 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions internes, p.ex. structures d'interconnexions enterrées
A memory device may be used to implement a Bloom filter. In some examples, the memory device may include a memory array to perform a multiply-accumulate operation to implement the Bloom filter. The memory device may store multiple portions of a reference genetic sequence in the memory array and compare the portions of the reference genetic sequence to a read sequence in parallel by performing the multiply-accumulate operation. The results of the multiply-accumulate operation between the read sequence and the portions of the reference genetic sequence may be used to determine where the read sequence aligns to the reference sequence.
Methods, systems, and devices for read disturb management for memory are described. In some instances, data may be read from a first page of a virtual block of a memory system. If the data includes one or more errors, the memory system may read data from a second page of the virtual block and determine whether one or more errors exist in the data. The memory system may continue reading pages of the virtual block until a page includes no (or relatively few errors). The memory system may then refresh the pages.
A method to enhance images, including: receiving, in an image processing logic circuit in an integrated circuit device, first data representative of an input image; generating, by the image processing logic circuit, input data for an inference logic circuit in the integrated circuit device; generating, by the inference logic circuit, a column of bits from the input data; performing, by the inference logic circuit using memory cells in the integrated circuit device having threshold voltages programmed to represent at least one weight matrix, operations of multiplication and accumulation, via reading concurrently rows of the memory cells selected according to the column of bits; generating, by the inference logic circuit, output data based on results of the operations multiplication and accumulation; and generating, by the image processing logic circuit using the output data, second data representative of an output image enhanced from the input image.
H04N 5/3745 - Capteurs adressés, p.ex. capteurs MOS ou CMOS ayant des composants supplémentaires incorporés au sein d'un pixel ou connectés à un groupe de pixels au sein d'une matrice de capteurs, p.ex. mémoires, convertisseurs A/N, amplificateurs de pixels, circuits communs ou composants communs
H04N 5/357 - Traitement du bruit, p.ex. détection, correction, réduction ou élimination du bruit
H04N 5/369 - Transformation d'informations lumineuses ou analogues en informations électriques utilisant des capteurs d'images à l'état solide [capteurs SSIS] circuits associés à cette dernière
55.
Image Compression using Integrated Circuit Devices having Analog Inference Capability
A method in an integrated circuit device to compress images, including: generating, by an image processing logic circuit and based on first data representative of an input image, input data; generating, by an inference logic circuit and based on the input data, a column of inputs; converting, by the inference logic circuit using voltage drivers connected to wordlines and memory cells storing a weight matrix, and into output currents of the memory cells summed in bitlines, results of bitwise multiplications of bits in the column of inputs and bits stored in the memory cells in a form of threshold voltages of the memory cells; digitizing currents summed in the bitlines to obtain column outputs; generating, by the inference logic circuit, output data based on the column outputs; and generating, using the output data, second data representative of an output image compressed from the input image.
H04N 5/341 - Extraction de données de pixels provenant d'un capteur d'images en agissant sur les circuits de balayage, p.ex. en modifiant le nombre de pixels ayant été échantillonnés ou à échantillonner
56.
Surveillance Cameras Implemented using Integrated Circuit Devices having Analog Inference Capability
A surveillance camera having: an image sensing pixel array operable to generate first data representative of an input image; a memory cell array having memory cells, wherein threshold voltages of the memory cells are programmable in a first mode to store weight matrices and programmable in a second mode to store second data representative of an output image generated from the input image; voltage drivers; current digitizers; an inference logic circuit operable to perform operations of multiplication and accumulation using the voltage drivers, the current digitizers, and a first portion of the memory cells programmed in the first mode to store the weight matrices used in generation of the output image; a transceiver; and a microprocessor configured to use the transceiver to communicate, to a computer system, a report identifying the output image stored in the memory cell array.
An integrated circuit device having a memory cell array with first layers of memory cells configured for operations of multiplication and accumulation. Each pair of closest layers among the first layers are configured to be separate by at least one layer in second layers of memory cells, where access to, or usages of, the second layers can be restricted or limited to prevent activities in the second layers from corrupting the weight programming in the first layers.
H04N 5/3745 - Capteurs adressés, p.ex. capteurs MOS ou CMOS ayant des composants supplémentaires incorporés au sein d'un pixel ou connectés à un groupe de pixels au sein d'une matrice de capteurs, p.ex. mémoires, convertisseurs A/N, amplificateurs de pixels, circuits communs ou composants communs
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
H04N 5/369 - Transformation d'informations lumineuses ou analogues en informations électriques utilisant des capteurs d'images à l'état solide [capteurs SSIS] circuits associés à cette dernière
A method for a digital camera adaptable to monitor a scene to detect a condition of interest to a user. The digital camera can program, in a first mode, first memory cells according to first weight matrices to classify images captured by the digital camera. Second memory cells are programmed in a second mode to store data representative of the images. The digital camera can perform operations of multiplication and accumulation using the first memory cells to compute first classifications of the images. In response to mismatches between the first classifications and second classifications identified by the user for the images, the digital camera can execute instructions to determine second weight matrices and program, in the first mode, third memory cells, according to the second weight matrices for improved capability in detecting the condition represented by image classifications in a predetermined category.
H04N 5/3745 - Capteurs adressés, p.ex. capteurs MOS ou CMOS ayant des composants supplémentaires incorporés au sein d'un pixel ou connectés à un groupe de pixels au sein d'une matrice de capteurs, p.ex. mémoires, convertisseurs A/N, amplificateurs de pixels, circuits communs ou composants communs
G06V 10/764 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant la classification, p.ex. des objets vidéo
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
G06V 10/94 - Architectures logicielles ou matérielles spécialement adaptées à la compréhension d’images ou de vidéos
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p.ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 11/54 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments simulateurs de cellules biologiques, p.ex. neurone
59.
ADAPTIVE PRE-READ MANAGEMENT IN MULTI-PASS PROGRAMMING
Exemplary methods, apparatuses, and systems include an adaptive pre-read manager for controlling pre-reads of the memory device. The adaptive pre-read manager receives a first set of data bits for programming to memory. The adaptive pre-read manager performing a first pass of programming including a first subset of data bits from the set of data bits. The adaptive pre-read manager compares a set of threshold operating differences to a set of differences between multiple operating conditions during the first pass of programming and current operating conditions. The adaptive pre-read manager performs an internal pre-read of the programmed first subset of data bits. The adaptive pre-read manager performs a second pass of programming using the internal pre-read and a second subset of data bits from the first set of data bits.
An apparatus includes a TM control circuit that is configured to receive address information corresponding to a TM function and compare the address information with an authorized TM list stored in a memory of the apparatus to determine if there is a match. If there is a match, a latch load signal pulse is output. A TM latch circuit programs one or more latches based on the address information and based on the latch load signal pulse. The TM latch circuit decodes information in the one or more latches and, based on the decoded information, outputs a test mode signal to turn on test mode operations in circuits associated with the TM function. The apparatus includes a plurality of TM functions for testing various features of the apparatus and the authorized TM list identifies which of the plurality of TM functions has been authorized for customer use.
G11C 7/24 - Circuits de protection ou de sécurité pour cellules de mémoire, p.ex. dispositions pour empêcher la lecture ou l'écriture par inadvertance; Cellules d'état; Cellules de test
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p.ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 17/16 - Mémoires mortes programmables une seule fois; Mémoires semi-permanentes, p.ex. cartes d'information pouvant être replacées à la main dans lesquelles le contenu est déterminé en établissant, en rompant ou en modifiant sélectivement les liaisons de connexion par une modification définitive de l'état des éléments de couplage, p.ex. mémoires PROM utilisant des liaisons électriquement fusibles
61.
MANAGEMENT OF ERROR-HANDLING FLOWS IN MEMORY DEVICES USING PROBABILITY DATA STRUCTURE
Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including running sample data through each of a set of error-handling operations performed on data residing in a segment of the memory device in an existing order associated with a workload; obtaining error recovery data as a result of running the sample data; and determining an optimized order of the set of error-handling operations based on probability of error recovery and latency data, wherein the probability of error recovery is based on the error recovery data, and wherein the optimized order comprises an adjustment to an order of one or more error-handling operations of the set of error-handling operations in the existing order.
Methods, apparatuses, and systems related to embedded metal pads are described. An example semiconductor device includes a dielectric material, a metal pad having side surface, where a lower portion of the side surface is embedded in the dielectric material, a mask material on a portion of a surface of the dielectric material, an upper portion of the side surface of the metal pad, and a portion of a top surface of the metal pad and a contact pillar on a second portion of the top surface of metal pad, the contact pillar comprising a metal pillar and a pillar bump.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
63.
BUILT-IN SELF-TEST BURST PATTERNS BASED ON ARCHITECTURE OF MEMORY
Methods, systems, and devices related to built-in self-test burst patterns based on architecture of memory. A controller can be coupled to a memory device. The controller can include built-in self-test (BIST) circuitry. The BIST circuitry can include registers configured to store respective write burst patterns and read burst patterns based on an architecture of the memory device.
Methods, systems, and devices related to built-in self-test (BIST) circuitry of a controller. The controller can be coupled to multiple memory devices. The BIST circuitry can include registers configured to store burst patterns. The BIST circuitry can perform a BIST operation on the memory devices contemporaneously and using the number of burst patterns.
Methods, apparatuses, and systems related to an over-sculpted storage node are described. An example method includes forming an opening in a pattern of materials. The method further includes performing an etch to over-sculpt the opening. The method further includes depositing a storage node material in the over-sculpted opening to form an over-sculpted storage node. The method further includes performing an etch to remove portions of the pattern of materials. The method further includes performing an etch on the storage node material to trim the over-sculpted storage node.
Multiple copies of a stored data are sensed from a subset of memory cells of an array of memory cells into a plurality of latch elements in a page buffer coupled to the array of memory cells. Two or more latch elements are selected by enabling a respective select line of each of the two or more latch elements. An output data is determined based on a sensing of the conducting line driven by the two or more latch elements.
A method for an autonomous vehicle includes: controlling at least one system of the vehicle by a host system; automatically collecting, by a memory device, data generated by the at least one system, where the data is collected by the memory device independently of control by the host system; and storing the data in the memory device.
G07C 5/08 - Enregistrement ou indication de données de marche autres que le temps de circulation, de fonctionnement, d'arrêt ou d'attente, avec ou sans enregistrement des temps de circulation, de fonctionnement, d'arrêt ou d'attente
B60W 50/02 - COMMANDE CONJUGUÉE DE PLUSIEURS SOUS-ENSEMBLES D'UN VÉHICULE, DE FONCTION OU DE TYPE DIFFÉRENTS; SYSTÈMES DE COMMANDE SPÉCIALEMENT ADAPTÉS AUX VÉHICULES HYBRIDES; SYSTÈMES D'AIDE À LA CONDUITE DE VÉHICULES ROUTIERS, NON LIÉS À LA COMMANDE D'UN SOUS-ENSEMBLE PARTICULIER - Détails des systèmes d'aide à la conduite des véhicules routiers qui ne sont pas liés à la commande d'un sous-ensemble particulier pour préserver la sécurité en cas de défaillance du système d'aide à la conduite, p.ex. en diagnostiquant ou en palliant à un dysfonctionnement
G05D 1/00 - Commande de la position, du cap, de l'altitude ou de l'attitude des véhicules terrestres, aquatiques, aériens ou spatiaux, p.ex. pilote automatique
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G07C 5/00 - Enregistrement ou indication du fonctionnement de véhicules
A processing device in a memory sub-system retrieves an input/output (IO) instruction of a plurality of IO instructions from an IO instruction memory in the memory sub-system, the IO instruction comprising a first number of bits. The processing device further generates an IO vector based on the IO instruction, the IO vector comprising a second number of bits, wherein the second number of bits is greater than the first number of bits. In addition, the processing device causes a plurality of IO signals, based on the IO vector, to be driven on a signal communication bus to a memory device in the memory sub-system, wherein the plurality of IO signals comprises a number of signals equal to the second number of bits of the IO vector.
Systems, methods, and apparatus related to a multi-level error correction architecture used for copying data in memory devices. In one approach, user data is stored in the first partition of a non-volatile memory. First error correction code data is generated for the user data and stored with the user data in the first partition. Second error correction code data is generated for the user data and stored outside the first partition. The second error correction code data provides an increased error correcting capability that is compatible with the error correction algorithm used with the first error correction code data. A copyback operation is used to copy the user data and the first error correction code, but not the second error correction code, to a second partition of the non-volatile memory. The second error correction code can be selectively used if there is a need to recover portions of the user data stored in the first partition.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
H03M 13/29 - Codage, décodage ou conversion de code pour détecter ou corriger des erreurs; Hypothèses de base sur la théorie du codage; Limites de codage; Méthodes d'évaluation de la probabilité d'erreur; Modèles de canaux; Simulation ou test des codes combinant plusieurs codes ou structures de codes, p.ex. codes de produits, codes de produits généralisés, codes concaténés, codes interne et externe
Systems, apparatuses, and methods related to memory access statistics monitoring are described. A host is configured to map pages of memory for applications to a number of memory devices coupled thereto. A first memory device comprises a monitoring component configured to monitor access statistics of pages of memory mapped to the first memory device. A second memory device does not include a monitoring component capable of monitoring access statistics of pages of memory mapped thereto. The host is configured to map a portion of pages of memory for an application to the first memory device in order to obtain access statistics corresponding to the portion of pages of memory upon execution of the application despite there being space available on the second memory device and adjust mappings of the pages of memory for the application based on the obtained access statistics corresponding to the portion of pages.
A system comprises a memory device including a plurality of management units and a processing device. The processing device is operatively coupled with the memory device and configured to place the plurality of management units into a first protective state by erasing the plurality of management units, identify a cursor satisfying a cursor definition, identify a subset of the plurality of management units based on a location, on the memory device, referenced by the cursor, and place a selected management unit of the subset of the plurality of management units into a second protective state by programming a protective data pattern to the selected management unit.
Devices and techniques for self-scheduling threads in a programmable atomic unit are described herein. When it is determined that an instruction will not complete within a threshold prior to insertion into a pipeline of the processor, a thread identifier (ID) can be passed with the instruction. Here, the thread ID corresponds to a thread of the instruction. When a response to completion of the instruction is received that includes the thread ID, the thread is rescheduled using the thread ID in the response.
G06F 9/48 - Lancement de programmes; Commutation de programmes, p.ex. par interruption
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
73.
CONNECTIVITY IN COARSE GRAINED RECONFIGURABLE ARCHITECTURE
A reconfigurable compute fabric can include multiple nodes, and each node can include multiple tiles with respective processing and storage elements. The tiles can be arranged in an array or grid and can be communicatively coupled. In an example, the tiles can be arranged in a one-dimensional array and each tile can be coupled to its respective adjacent neighbor tiles using a direct bus coupling. Each tile can be further coupled to at least one non-adjacent neighbor tile that is one tile, or device space, away using a passthrough bus. The passthrough bus can extend through intervening tiles.
Systems and methods for a semiconductor device having a front-end-of-line structure are provided. The semiconductor device may include a dielectric material having a backside formed on a front side of a semiconductor substrate material and a front side, and an interconnect structure extending through the dielectric material. The interconnect structure may be electrically connected to a semiconductor memory array proximate the front side of the dielectric material. The semiconductor device may further have an insulating material encasing at least a portion of the semiconductor memory array and an opening created during back-end-of-line processing through which the active contact surface at the backside of the interconnect structure is exposed for electrical connection.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A system and method for a memory sub-system to reduce latency by prefetching data blocks and preloading them into host memory of a host system. An example system including a memory device and a processing device, operatively coupled with the memory device, to perform operations including: receiving a request of a host system to access a data block in the memory device; determining the data block stored in a first buffer in host memory is related to a set of one or more data blocks stored at the memory device; and storing the set of one or more data blocks in a second buffer in the host memory, wherein the first buffer is controlled by the host system and the second buffer is controlled by a memory sub-system.
G06F 12/0862 - Adressage d’un niveau de mémoire dans lequel l’accès aux données ou aux blocs de données désirés nécessite des moyens d’adressage associatif, p.ex. mémoires cache avec pré-lecture
76.
DATA INTEGRITY PROTECTION FOR RELOCATING DATA IN A MEMORY SYSTEM
Methods, apparatuses, and systems related to data management and security in a memory device are described. Data may be stored in a memory system, and as part of an operation to move data from one region to another in the memory system, the data may be validated using one or more hash functions. For example, a memory device may compute a hash value of some stored data, and use the hash value to validate another version of that stored data in the process of writing the other version stored data to a region of the memory system. The memory device may store another hash that is generated from the hash of the stored data and a record of transactions such that transactions are identifiable; the sequence of transactions within the memory system may also be identifiable. Hashes of transactions may be stored throughout the memory system or among memory systems.
H04L 9/06 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité l'appareil de chiffrement utilisant des registres à décalage ou des mémoires pour le codage par blocs, p.ex. système DES
77.
ENHANCED WRITE PERFORMANCE UTILIZING PROGRAM INTERLEAVE
A system includes a memory and a processing device, operatively coupled to the memory, to perform operations including initiating a write operation to write data to a first multiple level cell (XLC) storage including a first XLC block and a second XLC storage including a second XLC block, and causing a first portion of the data to be written to a first number of pages of the first XLC block and a second portion of the data to be written to a second number of pages of the second XLC block using page level interleave. The first number of pages and the second number of pages are defined by an interleave mix including an interleave ratio between a first XLC write mode and a second XLC write mode.
Disclosed in some examples are methods, systems, and machine readable mediums that provide increased bandwidth caches to process requests more efficiently for more than a single address at a time. This increased bandwidth allows for multiple cache operations to be performed in parallel. In some examples, to achieve this bandwidth increase, multiple copies of the hit logic are used in conjunction with dividing the cache into two or more segments with each segment storing values from different addresses. In some examples, the hit logic may detect hits for each segment. That is, the hit logic does not correspond to a particular cache segment. Each address value may be serviced by any of the plurality of hit logic units.
G06F 12/0811 - Systèmes de mémoire cache multi-utilisateurs, multiprocesseurs ou multitraitement avec hiérarchies de mémoires cache multi-niveaux
G06F 12/02 - Adressage ou affectation; Réadressage
G06F 12/06 - Adressage d'un bloc physique de transfert, p.ex. par adresse de base, adressage de modules, extension de l'espace d'adresse, spécialisation de mémoire
G06F 13/16 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus de mémoire
79.
Methods of Forming One or More Covered Voids in a Semiconductor Substrate, Methods of Forming Field Effect Transistors, Methods of Forming Semiconductor-on-Insulator Substrates, Methods of Forming a Span Comprising Silicon Dioxide, Methods of Cooling Semiconductor Devices, Methods of Forming Electromagnetic Radiation Emitters and Conduits, Methods of Forming Imager Systems, Methods of Forming Nanofluidic Channels, Fluorimetry Methods, and Integrated Circuitry
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for distributing coolant, for guiding electromagnetic radiation, or for separation and/or characterization of materials. Some embodiments include constructions having micro-structures therein which correspond to voids, conduits, insulative structures, semiconductor structures or conductive structures.
A system includes a memory device and a processing device communicatively coupled to the memory device. The processing device is to write data to a number of groups of memory cells of the memory device in a physically non-contiguous manner. The processing device is further to track a sequence in which the number of groups of memory cells were written with the data. In response to a trigger event, the processing device is further to identify at least a portion of the number of groups of memory cells having data received over a predefined period preceding the trigger event based at least in part on the tracked sequence.
A memory device may be used to implement a Bloom filter. In some examples, the memory device may include a memory array to perform a multiply-accumulate operation to implement the Bloom filter. The memory device may store multiple portions of a reference genetic sequence in the memory array and compare the portions of the reference genetic sequence to a read sequence in parallel by performing the multiply-accumulate operation. The results of the multiply-accumulate operation between the read sequence and the portions of the reference genetic sequence may be used to determine where the read sequence aligns to the reference sequence.
G11C 7/16 - Emmagasinage de signaux analogiques dans des mémoires numériques utilisant une disposition comprenant des convertisseurs analogiques/numériques [A/N], des mémoires numériques et des convertisseurs numériques/analogiques [N/A]
G16B 30/10 - Alignement de séquence; Recherche d’homologie
82.
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYSTEMS, AND METHODS
A microelectronic device is disclosed, comprising a base structure comprising: active regions individually comprising semiconductor material; and isolation regions horizontally alternating with the active regions and individually comprising insulative material; a transistor structure comprising: a channel within one of the active regions of the base structure and horizontally interposed between two of the isolation regions; a gate dielectric structure including a high-k material above the channel; a gate electrode stack on the gate dielectric structure and comprising: diffusion prevention material on the gate dielectric structure and partially horizontally overlapping the channel, an opening in the diffusion prevention material horizontally centered about a horizontal centerline of the channel and having a smaller horizontal dimension than the channel; a conductive material comprising lanthanum on the diffusion prevention material and substantially filling the opening.
An apparatus includes: a plurality of capacitors each including first and second conductive portions and a dielectric portion therebetween; a first conductive structure containing the plurality of capacitors therein, and electrically coupled to the second conductive portions of the plurality of capacitors; a second conductive structure on a top surface of the first conductive structure; and a third conductive structure on a top surface of the second conductive structure.
Methods, systems, and devices for access circuitry structures for three-dimensional (3D) memory arrays are described. A memory device may include levels of memory cells over a substrate. To support accessing memory cells at respective levels, the memory device may include a conductive pillar extending through the levels of memory cells and coupled with one or more memory cells at respective levels of memory cells. The memory device may include a bit line and a contact that is configured to couple the bit line with the conductive pillar. The conductive pillar may be formed such that it extends into a portion of the contact, and a contact resistance between the conductive pillar and the bit line may be based on the conductive pillar extending into the portion of the contact.
H01L 23/535 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions internes, p.ex. structures d'interconnexions enterrées
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 27/11556 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec grilles flottantes caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
85.
Balance Accuracy and Power Consumption in Integrated Circuit Devices having Analog Inference Capability
A method to balance computation accuracy and energy consumption, including: programming thresholds voltages of first memory cells to store first weight matrices representative of a first artificial neural network; programming thresholds voltages of second memory cells to store second weight matrices representative of a second artificial neural network smaller than the first artificial neural network, where both the first artificial neural network and the second artificial neural network are operable to provide at least one common functionality in processing each of the inputs; selecting configurations of using the first memory cells, or the second memory cells, or both in processing a sequence of inputs; and performing, according to the configurations, operations of multiplication and accumulation using the first memory cells, and the second memory cells in computations of the first artificial neural network and the second artificial neural network in processing the sequence of the inputs.
G06V 10/94 - Architectures logicielles ou matérielles spécialement adaptées à la compréhension d’images ou de vidéos
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
G06N 3/063 - Réalisation physique, c. à d. mise en œuvre matérielle de réseaux neuronaux, de neurones ou de parties de neurone utilisant des moyens électroniques
G06V 10/774 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p.ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]; Séparation aveugle de source méthodes de Bootstrap, p.ex. "bagging” ou “boosting”
G06V 10/776 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p.ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]; Séparation aveugle de source Évaluation des performances
G06V 10/778 - Apprentissage de profils actif, p.ex. apprentissage en ligne des caractéristiques d’images ou de vidéos
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
H04N 5/374 - Capteurs adressés, p.ex. capteurs MOS ou CMOS
An integrated circuit device including: a first integrated circuit die having an image sensing pixel array; a second integrated circuit die having an image processing logic circuit and an inference logic circuit; and a third integrated circuit die having a memory cell array. The second integrated circuit die and the third integrated circuit die are connected via a direct bond interconnect. The inference logic circuit is configured to process an image from the image sensing pixel array via multiplication and accumulation operations based on memory cells in the memory cell array having threshold voltages programmed to store data in multiplications and output currents from the memory cells connected to lines in summations.
H04N 5/3745 - Capteurs adressés, p.ex. capteurs MOS ou CMOS ayant des composants supplémentaires incorporés au sein d'un pixel ou connectés à un groupe de pixels au sein d'une matrice de capteurs, p.ex. mémoires, convertisseurs A/N, amplificateurs de pixels, circuits communs ou composants communs
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A method of artificial neural network computations, including: receiving image data having pixel values; generating, from the pixel values, a column of inputs to a set of artificial neurons; identifying a region of memory cells of the integrated circuit device having threshold voltages programmed to represent a weight matrix for the set of artificial neurons; instructing voltage drivers in the integrated circuit device to apply voltages to the region of memory cells according to the column of inputs; obtaining, based on the region of memory cells responsive to the applied voltages, a first column of data from an operation of multiplication and accumulation applied on the weight matrix and the column of inputs; and applying activation functions of the set of artificial neurons to the first column of data to generate a second column of data representative of outputs of the set of artificial neuron.
H04N 5/3745 - Capteurs adressés, p.ex. capteurs MOS ou CMOS ayant des composants supplémentaires incorporés au sein d'un pixel ou connectés à un groupe de pixels au sein d'une matrice de capteurs, p.ex. mémoires, convertisseurs A/N, amplificateurs de pixels, circuits communs ou composants communs
G06N 3/063 - Réalisation physique, c. à d. mise en œuvre matérielle de réseaux neuronaux, de neurones ou de parties de neurone utilisant des moyens électroniques
H04N 5/369 - Transformation d'informations lumineuses ou analogues en informations électriques utilisant des capteurs d'images à l'état solide [capteurs SSIS] circuits associés à cette dernière
H04N 5/378 - Circuits de lecture, p.ex. circuits d’échantillonnage double corrélé [CDS], amplificateurs de sortie ou convertisseurs A/N
88.
Redundant Computations using Integrated Circuit Devices having Analog Inference Capability
A device configured with redundant computations to improve reliability of using memory cells to perform operations of multiplication and accumulation. The device can have a memory cell array and a logic circuit. Each respective memory cell in the memory cell array has a threshold voltage programmable in a first mode to perform operations of multiplication and accumulation and programmable in a second mode, different from the first mode, to store data. The memory cell array has a plurality of regions operable in parallel to perform redundant operations of multiplication and accumulation. The logic circuit is configured to compare a plurality of results, generated from the redundant operations of multiplication and accumulation performed using the plurality of regions respectively, to select an output result from the plurality of results.
G06N 3/063 - Réalisation physique, c. à d. mise en œuvre matérielle de réseaux neuronaux, de neurones ou de parties de neurone utilisant des moyens électroniques
89.
Model Inversion in Integrated Circuit Devices having Analog Inference Capability
A device having a memory cell array configured with inverted weight data for operations of multiplication and accumulation. Each respective memory cell in the memory cell array has a threshold voltage programmable in a first mode to perform operations of multiplication and accumulation. The memory cell array has a plurality of regions operable in parallel to perform operations of multiplication and accumulation. The plurality of regions include a first region and a second region. At least a second portion of weight bits stored in the second region is an inverted version of a first portion of weight bits stored in the first region. The device includes a logic circuit configured to adjust a computation result of multiplication and accumulation generated using the second region to account for weight inversion and generate an output result based on a plurality of results generated using the plurality of regions respectively.
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p.ex. circuits de commande E/S de données, mémoires tampon de données E/S
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
G11C 7/12 - Circuits de commande de lignes de bits, p.ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
90.
Weight Calibration Check for Integrated Circuit Devices having Analog Inference Capability
An integrated circuit device having a mechanism to check calibration of memory cells configured to perform operations of multiplication and accumulation. The integrated circuit device programs, in a first mode, threshold voltages of first memory cells in a memory cell array to store weight data, and programs, in a second mode, threshold voltages of second memory cells in the memory cell array to store a first result of applying an operation of multiplication and accumulation to a sample input and the weight data. During a calibration check, the integrated circuit device performs the operation using the first memory cells to obtain a second result, and compares the first result, retrieved from the second memory cells, and the second result to determine whether calibration of output current characteristics of the first memory cells programmed in the first mode is corrupted.
G11C 16/12 - Circuits de commutation de la tension de programmation
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
G11C 16/24 - Circuits de commande de lignes de bits
G11C 16/26 - Circuits de détection ou de lecture; Circuits de sortie de données
A memory device for extending addressable array space by incorporating virtual and physical memory arrays is disclosed. When extra storage space beyond a physical memory array is needed by a controller of the memory device, the storage space may be provided by extending the address space using a virtual array. The memory device incorporates the use of an extra row address bit to increase the addressable space, whereby the extra bit is utilized to address virtual rows in the virtual array. Spare or redundant physical memory elements utilized for memory repair may be programmed to a virtual address space for the virtual memory array. When a memory device operation is activated, the extra row address bit is set to high, and the virtual row address matches with a spare or redundant memory element, the virtual row in the virtual array space is activated for performance of the operation.
Methods, systems, and devices for loading data in a tiered memory system are described. A respective allocation of computing resources may be determined for each node in a cluster, where at least one of the nodes may include multiple memory tiers, and a data set to be processed by the nodes may be analyzed. Based on the allocation of computing resources and the analysis of the data set, respective data processing instructions indicating respective portions of the data set to be processed by respective nodes may be generated and sent to the respective nodes. The respective data processing instructions may also indicate a respective distribution of subsets of the respective portions of the data set across the multiple memory tiers at the respective nodes.
G06F 12/0862 - Adressage d’un niveau de mémoire dans lequel l’accès aux données ou aux blocs de données désirés nécessite des moyens d’adressage associatif, p.ex. mémoires cache avec pré-lecture
93.
READ LEVEL COMPENSATION FOR PARTIALLY PROGRAMMED BLOCKS OF MEMORY DEVICES
A system can include a memory device containing blocks made up of wordlines respectively connected to sets of memory cells, and a processing device, operatively coupled with the memory device to perform operations including responsive to receiving a read request that specifies a block, determining a value of a metric reflective of a number of programmed wordlines of the block. The operations can also include responsive to determining, based on the value of the metric, that the block is in a partially programmed state, identifying a read voltage offset corresponding to the value of the metric, and performing, using the read voltage offset, a read operation responsive to the read request.
G11C 16/26 - Circuits de détection ou de lecture; Circuits de sortie de données
G11C 16/08 - Circuits d'adressage; Décodeurs; Circuits de commande de lignes de mots
G11C 16/16 - Circuits pour effacer électriquement, p.ex. circuits de commutation de la tension d'effacement pour effacer des blocs, p.ex. des réseaux, des mots, des groupes
94.
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
An interface shim layer for a tightly-coupled random access memory device is disclosed. The interface shim layer redirects and coalesces integrated channels and connections between a stacked plurality of memory die and an application specific integrated circuit and directly connects to the memory die and to the application specific integrated circuit. A passive version of the interface shim layer incorporates a plurality of routing layers to facilitate routing of signals to and from the stacked plurality of memory die and the application specific integrated circuit. An active version of the interface shim layer incorporates separate physical interfaces for both the stacked plurality of memory die and the application specific integrated circuit to facilitate routing. The active version of the interface shim layer may further incorporate memory controller functions, built-in self-test circuits, among other capabilities that are migratable into the active interface shim layer.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
95.
MATRIX FORMATION FOR PERFORMING COMPUTATIONAL OPERATIONS IN MEMORY
Apparatuses, methods, and systems for matrix formation for performing computational operations in memory are included. An embodiment includes a memory having a plurality of levels, wherein each of the plurality of levels includes a plurality of memory cells, voltage circuitry configured to apply sub-threshold voltages to the memory cells of each respective level, a plurality of sense lines, sense circuitry coupled to the plurality of sense lines, wherein the sense circuitry coupled to each respective sense line is configured to sense a state for each of the number of memory cells coupled to that respective sense line responsive to the voltage circuitry applying the sub-threshold voltages to the memory cells of each respective level, and processing circuitry configured to utilize the states for each of the memory cells to form a matrix and perform computational operations on data stored in the memory using the matrix.
Systems, apparatuses, and methods related to conversion of access data based on memory device size are described herein. An example apparatus can include a memory device, a mode register, an address decoder, and a memory controller. The memory device can include an array of memory cells. The memory controller can cause performance of a memory access. Performance of the memory access can include receiving access data associated with a first memory device size to access data stored in the memory device. The memory device can be a second memory device size. Performance of the memory access can further include accessing the data in the memory device that is the second memory device size using the access data.
An apparatus can include memory devices and a memory controller coupled to the memory devices via memory channels. The memory channels can disable a first memory channel associated with a first memory die in a respective memory chip of a memory device and perform a memory operation via a second memory channel involving a second memory die in the respective memory chip.
Methods, systems, and devices for techniques for indicating a write link error are described. The method may include a memory device receiving, from a host device, a write command, data, and a first set of error control bits for the data. The memory device may determine that the data includes an uncorrectable error using the first set of error control bits and generate a second set of error control bits for the data based on determining that the data includes the uncorrectable error. Further, the method may include the memory device storing the data and the second set of error control bits in a memory device and transmitting, to the host device, the data and an indication that the data received from the host device included the uncorrectable error based on the second set of error control bits.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
G06F 11/07 - Réaction à l'apparition d'un défaut, p.ex. tolérance de certains défauts
Methods, systems, and devices for a light hibernation mode for memory are described. A memory system may include volatile memory and non-volatile memory and may be configured to operate according to a first mode of operation (e.g., associated with relatively high power consumption), a light hibernation mode (e.g., a second mode associated with decreased power consumption in comparison to the first mode), and a full hibernation mode (e.g., a third mode of operation associated with decreased power consumption in comparison to the light hibernation mode). While operating according to the light hibernation mode, the memory system may maintain a greater quantity of data in the volatile memory relative to the full hibernation mode, which may avoid at least some power consumption related to data transfers between the volatile memory and non-volatile memory that may occur in connection with entering and exiting the full hibernation mode.
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 1/324 - Gestion de l’alimentation, c. à d. passage en mode d’économie d’énergie amorcé par événements Économie d’énergie caractérisée par l'action entreprise par réduction de la fréquence d’horloge
100.
ELECTRONIC DEVICES INCLUDING A METAL SILICIDE MATERIAL OVER A SOURCE CONTACT, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS OF FORMING
An electronic device includes a source contact adjacent to a source stack, the source stack including one or more conductive materials, tiers of alternating conductive material and dielectric materials adjacent to the source contact, pillars extending vertically through the tiers and the source contact and at least partially into the source contact, a fill material extending vertically through the tiers to the source contact, and a metal silicide material between the fill material and an upper surface of the source contact. Related devices, systems, and methods are also disclosed.
H01L 27/11582 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par des agencements tridimensionnels, p.ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. canaux en forme de U
H01L 21/285 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un gaz ou d'une vapeur, p.ex. condensation
H01L 27/11565 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs avec isolateurs de grille à piégeage de charge, p.ex. MNOS ou NROM caractérisées par la configuration vue du dessus