Abrégé

A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

Classes IPC  ?

• H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
• H05K 1/05 - Substrat en métal isolé
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

Disclosed in the present application is a circuit board, comprising a core board and a first side board, wherein one side of the core board is provided with a plurality of first connecting pads arranged at intervals, the center distance of two adjacent first connecting pads being defined as a first center distance; the first side board covers a plurality of first connecting pads; the first side board is penetrated by a plurality of first openings, each of which comprises a first end and a second end in communication with the first end, each first connecting pad being exposed through one first end, the center distance of two adjacent second ends being defined as a second center distance, and the first center distance being greater than the second center distance; and a plurality of first electrical conductors are disposed in the first openings, one end of each first electrical conductor is electrically connected to the first connecting pad, and the end of the first electrical conductor facing away from the first connecting pad extends out of the first opening to form a first connecting portion. The circuit board provided in the present application can achieve electrical connections of fingers of an electronic component which are staggered with the first connecting pads in the thickness direction. Further provided in the present application are a manufacturing method for the circuit board, and a display module.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for packaging a chip, the chip is packaged by disposing positioning post on the surface of the carrier, and the groove matching the positioning post is formed on the surface of the chip. During melting the first solder pastes and the second solder pastes , due to the interaction between the positioning post and the groove, the chip will not be deflected due to the tension of the first solder pastes and the second solder pastes, so that a chip packaging structure meets the expected requirements. The chip packaging structure is further provided in the present disclosure.

Classes IPC  ?

• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A packaging method for a chip (30), comprising the following steps: providing a substrate (10), the substrate (10) comprising a base (11) and a plurality of first pads (13) provided on the base (11), and forming a first solder paste (15) on each first pad (13); forming positioning posts (20) on the surface of the base (11) provided with the first pads (13); providing the chip (30), the chip (30) comprising a chip body (31) and a plurality of second pads (33) provided on one surface of the chip body (31), and forming a second solder paste (35) on each second pad (33); forming grooves (32) on the surface of the chip body (31) provided with the second pads (33); accommodating the positioning columns (20) in the grooves (32), each first solder paste (15) being connected to a corresponding second solder paste (35), and melting and solidifying the first solder pastes (15) and the second solder pastes (35) to form solder balls (40) to connect the chip (30) and the substrate (10), thereby forming the chip packaging structure (100). The present application further provides the chip packaging structure (100).

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.

Classes IPC  ?

• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow electrically-conductive column (21), the circuit layer being provided on the base material layer (11), and one end of the hollow electrically-conductive column (21) being provided on the circuit layer; providing a heating element (30) in the hollow electrically-conductive column (21), the heating element (30) being electrically connected to the circuit layer; filling the hollow electrically-conductive column (21) with a thermally-conductive medium (33), the heating element (30) being immersed in the thermally-conductive medium (33); and providing an electrically-conductive cover body (40) at the other end of the hollow electrically-conductive column (21), the electrically-conductive cover body (40) sealing the hollow electrically-conductive column (21), and obtaining the circuit board assembly (100). In addition, further provided is a packaging structure (200).

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A manufacturing method for a circuit board connection structure, comprising the steps: providing a circuit board module, the circuit board module comprising a first outer circuit layer, and the first outer circuit layer comprising a plurality of welding pads; forming a first thermal release adhesive layer and an inner circuit layer on the first outer circuit layer, the first thermal release adhesive layer being located between the first outer circuit layer and the inner circuit layer; forming a second thermal release adhesive layer and a second copper foil layer on the inner circuit layer, the second thermal release adhesive layer being located between the inner circuit layer and the second copper foil layer; providing a plurality of through holes penetrating through the second copper foil layer, the second thermal release adhesive layer, the inner circuit layer and the first thermal release adhesive layer, each through hole being used for exposing a welding pad; forming a copper plating layer on the second copper foil layer, the through holes being filled with the copper plating layer to form conductive pillars; etching the copper plating layer and the second copper foil layer to form a second outer circuit layer so as to obtain an intermediate; and heating the intermediate and cleaning same, so as to remove the first thermal release adhesive layer and the second thermal release adhesive layer. The present application further provides a circuit board connection structure.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H01Q 1/36 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie
• H05K 3/42 - Trous de passage métallisés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
• H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
• H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif

Abrégé

A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Classes IPC  ?

• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/34 - Connexions soudées
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/05 - Substrat en métal isolé
• H05K 3/34 - Connexions soudées
• H05K 3/42 - Trous de passage métallisés

Abrégé

A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H01P 3/02 - Guides d'ondes; Lignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
• H01P 3/00 - Guides d'ondes; Lignes de transmission du type guide d'ondes
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 23/552 - Protection contre les radiations, p.ex. la lumière

Abrégé

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement

Abrégé

The present application provides a circuit board and a manufacturing method therefor. The manufacturing method comprises: providing a stack board, the stack board comprising a third conductive line, a second substrate, a first conductive line, a first substrate, and a second conductive line that are stacked in sequence; forming multiple through holes in the surface of the stack board along the stacking direction of the stack board; and manufacturing antenna conductors in the through holes. According to the present application, the through holes are formed in the surface of the stack board; the antenna conductors are provided in the through holes; the antenna conductors located at different layers are connected to corresponding conductive lines; and compared with a blind hole connection mode, some of the antenna conductors are directly connected by means of the conductive lines, thereby reducing loss during signal transmission. Meanwhile, the circuit board comprising an antenna structure is changed from an up-down structure to a left-right structure, such that the thickness of the board is decreased.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.

Classes IPC  ?

• H01F 27/28 - Bobines; Enroulements; Connexions conductrices

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/42 - Trous de passage métallisés

Abrégé

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/34 - Connexions soudées
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
• H01L 23/498 - Connexions électriques sur des substrats isolants
• G02B 6/10 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/05 - Substrat en métal isolé
• H05K 3/34 - Connexions soudées

Abrégé

The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H01R 12/58 - Connexions fixes pour circuits imprimés rigides ou structures similaires caractérisées par les bornes bornes pour insertion dans des trous
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Classes IPC  ?

• H04N 23/55 - Pièces optiques spécialement adaptées aux capteurs d'images électroniques; Leur montage
• H04N 23/54 - Montage de tubes analyseurs, de capteurs d'images électroniques, de bobines de déviation ou de focalisation

Abrégé

A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H01L 23/06 - Conteneurs; Scellements caractérisés par le matériau du conteneur ou par ses propriétés électriques
• H01F 27/22 - Refroidissement par conduction de chaleur à travers des éléments de remplissage solides ou en poudre
• H01F 27/29 - Bornes; Aménagements de prises
• H01F 27/32 - Isolation des bobines, des enroulements, ou de leurs éléments
• H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur

Abrégé

A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
• H05K 3/34 - Connexions soudées
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/44 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
• H01L 23/02 - Conteneurs; Scellements
• H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
• H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
• H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
• H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/552 - Protection contre les radiations, p.ex. la lumière
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A lens module (100), comprising: a substrate (10), the substrate (10) being provided with an accommodating hole (11); a photosensitive chip (20), the photosensitive chip (20) being arranged on the substrate (10) and being opposite the accommodating hole (11); a mounting support (30), the mounting support (30) being arranged on the substrate (10), the mounting support (30) being provided with a through hole (31), an inner wall of the through hole (31) extending in the direction of the central axis of the through hole (31) to form a carrying table (32), the side of the mounting support (30) close to the carrying table (32) extending outwards to form a connecting part (33), and the mounting support (30) surrounding the through hole (31) to form a plurality of layers of coils (35), capacitors (36) and resistors (37) by means of laser direct structuring (LDS), and the coils (35) being composed of a plurality of layers of surrounding inductors, which surround the through hole (31) from the inside out, on the mounting support (30); an optical filter (40), the optical filter (40) being arranged on the carrying table (32) and being accommodated in the through hole (31); a lens (50), the lens (50) being mounted in the through hole (31); and a circuit board (60), the circuit board (60) being connected to the mounting support (30) by means of the connecting part (33). Further disclosed is a manufacturing method for the lens module (100).

Classes IPC  ?

• H04N 5/225 - Caméras de télévision
• G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement

Abrégé

A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

Classes IPC  ?

• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A packaging structure, includes: a dielectric layer; at least one inner wiring layer embedded in the dielectric layer; at least two outer wiring layers arranged two sides of the at least one inner wiring layer and combined with the dielectric layer; and at least one electronic component embedded in the dielectric layer; each inner wiring layer including at least two spaced supporting pads, and each supporting pad including a main body and a protruding portion extending outward from a periphery of the main body, the packaging structure further including at least two spaced positioning pillars, and each positioning pillar correspondingly connected to one main body, each electronic component arranged between at least two positioning pillars, and an end of each electronic component being in contact with protruding portions of at least two supporting pads, thereby packaging the electronic component accurately. The present invention also needs to provide a method for manufacturing the packaging structure.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

Disclosed is an embedded circuit board (100). The embedded circuit board comprises a circuit board (10) provided with a mounting groove (101), and a plurality of components (20), wherein the plurality of components (20) are arranged in the mounting groove (101) and are electrically connected to the circuit board (10). The circuit board (10) comprises a plurality of layers of circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), and the plurality of layers of circuit substrates (11, 12, 13, 14) are arranged in a stacked manner. The embedded circuit board (100) comprises a conductive member (30), wherein the conductive member (30) is arranged in the mounting groove (101), and is electrically connected to the plurality of components (20) and the plurality of layers of circuit substrates (11, 12, 13, 14), and at least two of the components (20) are electrically connected by means of the conductive member (30), which is advantageous for the functional performance of the components and reduces wear.

Classes IPC  ?

• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

Provided in the present application is a fabrication method for a plate-to-plate connection structure. The method comprises: providing a first through hole in a first circuit board, accommodating a first connector within the first through hole by means of a first conductive paste, and connecting same to a second circuit board on which a second connector is installed, thereby implementing the connection of the two circuit boards, and reducing the height of the two circuit boards after connection, i.e., reducing the height of a plate-to-plate connection structure. Additionally, since the first connector is accommodated within the first through hole, the first connector is not prone to damage and oxidation. Further provided in the present application is a plate-to-plate connection structure fabricated by the described method.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Abrégé

A circuit board (100) and a manufacturing method therefor. The circuit board (100) comprises a substrate (10) and a plurality of conductive wires (20) arranged at intervals on the substrate (10). Each of the conductive wires (20) comprises a seed layer (22) located on one surface of the substrate (10), a first copper layer (24) located on the surface of the seed layer (22) away from the substrate (10), and a second copper layer (26) plated on one surface of the substrate (10). The second copper layer (26) covers the seed layer (22) and the first copper layer (24). The ratio of the thickness of each of the conductive wires (20) to the space between any two adjacent conductive wires (20) is greater than 1. The thickness of the second copper layer (26) in the thickness direction of the substrate (10) is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate (10).

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

A circuit board, comprising an electromagnetic shielding film, an insulating adhesive portion, a first signal line and a second signal line; the electromagnetic shielding film comprises a first surface and a second surface opposite to each other, the electromagnetic shielding film is divided into a body portion, a first bending portion, and a second bending portion, the first signal line and the second signal line are spaced apart on the first surface in a first direction, the first bending portion and the second bending portion are connected to two opposite sides of the body portion respectively in the first direction, the first bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the first signal line, the second bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the second signal line, the first bending portion and the second bending portion separate the first signal line and the second signal line from each other, and the insulating adhesive portion fills a gap between the first bending portion and the body portion and a gap between the second bending portion and the body portion. The present application further provides a method for manufacturing a circuit board.

Classes IPC  ?

• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes two outer wiring boards enclosing an inner wiring board. The inner wiring board includes a first conductive wiring layer and a first substrate layer. The first conductive wiring layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductive wiring layer and defines first through holes which expose the signal line. Each of the two outer wiring boards includes a second substrate layer and a second conductive wiring layer. The second substrate layer abuts the inner wiring board and defines second through holes aligning with the first through holes, to partially surround the signal line with air of very low dielectric constant. A method for manufacturing the flexible circuit board is also disclosed.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A package structure includes an inner wiring layer, a first dielectric layer, a first outer wiring layer, and an electronic component assembly. The first dielectric layer includes a first surface and a second surface facing away from the first surface. The inner wiring layer and the electronic component assembly are embedded into the first dielectric layer from the first surface. The first outer wiring layer is disposed on the second surface. The electronic component assembly includes a first electronic element and a second electronic element. The second electronic element is disposed close to the second surface, and an electrical connector of the second electronic element faces the second surface. The first electronic element is disposed on a side of the second electronic element facing away from the second surface, and exposed from the first surface. The first outer wiring layer electrically connects the electrical connector of the second electronic element and the inner wiring layer, respectively. A method for manufacturing the package structure is also provided.

Classes IPC  ?

• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 25/10 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/44 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
• H01L 23/02 - Conteneurs; Scellements
• H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
• H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
• H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
• H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H05K 3/34 - Connexions soudées
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A manufacturing method of a circuit board (100) comprises: providing a first single-sided circuit base board (20) comprising an insulation substrate (11) and a conductive circuit layer (13); forming, in the insulation substrate (11), multiple first conductive posts (111) electrically connected to the conductive circuit layer (13) to obtain a second single-sided circuit base board (30); providing a first adhesive layer (40), and forming multiple second conductive portions (401); providing the second single-sided circuit base board (30), and providing a through accommodation recess (31) to obtain a third single-sided circuit base board (50); providing another one of the first single-sided circuit board (20), and mounting an electronic component (14) on the conductive circuit layer (13) to obtain a patch circuit base board (60); sequentially stacking the first single-sided circuit base board (20), the first adhesive layer (40), the second single-sided circuit base board (30), and at least one of the third single-sided circuit base board (50), and the patch circuit base board (60); and laminating to obtain an intermediate product (70). Further provided is a circuit board (100). The overall manufacturing process of the invention comprises only one lamination operation, thereby alleviating circuit board warping caused by multiple lamination operations in the prior art.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method for manufacturing a circuit board with embedded conductive circuits includes providing a first circuit substrate having a first support board and a first peelable film, providing a second circuit substrate having a second support board and a second peelable film, providing an insulating layer to obtain an intermediate body, pressing the intermediate body, and removing the first support board, the first peelable film, the second support board, and the second peelable film. The first circuit substrate includes a first circuit layer. The second circuit substrate includes a second circuit layer. The first circuit layer is electrically coupled to the second circuit layer through the insulating layer.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/04 - Elimination du matériau conducteur par voie mécanique, p.ex. par poinçonnage
• H05K 3/24 - Renforcement du parcours conducteur

Abrégé

An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

An encapsulation structure (100), comprising: a dielectric layer (60); at least one inner-layer line layer (70) buried in the dielectric layer (60); at least two outer-layer line layers (80) located on two sides of the at least one inner-layer line layer (70) and combined with the dielectric layer (60); and at least one electronic element (30) buried in the dielectric layer (60). Each inner-layer line layer (70) comprises at least two support pads (71) arranged at an interval, and each support pad (71) comprises a body (713) and a protruding portion (715) that extends outwards from the periphery of the body (713). The encapsulation structure (100) further comprises at least two positioning columns (20) arranged at an interval, wherein each positioning column (20) is correspondingly connected to one body (713); and each electronic element (30) is located between the at least two positioning columns (20), and an end of each electronic element (30) is in contact with the protruding portions (715) of the at least two support pads (71), such that the electronic element (30) is precisely encapsulated. Further provided is a manufacturing method for the encapsulation structure (100).

Classes IPC  ?

• H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition

Abrégé

A transparent circuit board, comprising a conductive circuit, and a transparent insulating layer and a cover film that are stacked. The conductive circuit penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive circuit. The surface of the conductive circuit combined with the cover film is provided with a blackening layer. The surface of the conductive circuit that is not provided with the blackening layer is provided with a carbon black layer. Therefore, the light transmittance of the transparent circuit is improved. The present invention also provides a manufacturing method for the transparent circuit board.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A module-embedded multilayer circuit board includes an inner circuit board, component embedded module embedded in the through opening, a first outer circuit board, and a second outer circuit board. A through opening is defined in the inner circuit board. The component embedded module includes a top surface and side surfaces. The top surface has a length greater than that of the two side surfaces. Each component embedded module includes a component, upper circuit patterns formed on the top surface, and side circuit patterns formed on the side surface and exposed from the through opening. The first and the second outer circuit board are formed on the inner circuit board. One end of the side circuit patterns is electrically connected to the first and the second outer circuit board, the other end of the side circuit patterns is electrically connected to the component by the upper circuit patterns, respectively.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

Classes IPC  ?

• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A package structure, comprising an inner circuit layer, a first dielectric layer, a first outer circuit layer, and an electronic assembly. The first dielectric layer comprises a first surface and a second surface opposite to the first surface; the inner circuit layer and the electronic assembly are embedded in the first dielectric layer from the first surface, and the first outer circuit layer is provided on the second surface; the electronic assembly comprises a first electronic element and a second electronic element; the second electronic element is provided close to the second surface, and an electrical connection end of the second electronic element faces the second surface; the first electronic element is provided on the side of the second electronic element distant from the second surface, and the first electronic element is exposed from the first surface; the first outer circuit layer is electrically connected to the electrical connection end of the second electronic element, and the inner circuit layer. The present invention necessarily further provides a manufacturing method for the package structure.

Classes IPC  ?

• H01L 23/367 - Refroidissement facilité par la forme du dispositif

Abrégé

A circuit board includes a circuit substrate, a heat dissipation dielectric film and a ground circuit board stacked orderly. At least one conductive structure passes through the heat dissipation dielectric film to electrically connect the circuit substrate and the ground circuit board. An insulating layer is disposed on a side of the circuit substrate facing away from the heat dissipation dielectric film. The circuit board further includes at least one connecting unit. Each connecting unit passes through the insulating layer to be electrically connected to the circuit substrate. A height of each connecting unit is gradually increased from a center of the connecting unit to a periphery of the connecting unit. A method for manufacturing a circuit board is provided.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.

Classes IPC  ?

• G03F 7/095 - Matériaux photosensibles - caractérisés par des détails de structure, p.ex. supports, couches auxiliaires ayant plus d'une couche photosensible
• C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c. à d. non caractérisé par le procédé de revêtement
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• C23G 1/10 - Nettoyage ou décapage de matériaux métalliques au moyen de solutions ou de sels fondus avec des solutions acides des autres métaux lourds
• C23C 28/02 - Revêtements uniquement de matériaux métalliques
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• C23F 1/44 - Compositions pour enlever des matériaux métalliques d'un substrat métallique de composition différente
• C23F 1/02 - Gravure locale
• G03F 7/20 - Exposition; Appareillages à cet effet

Abrégé

A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur

Abrégé

A circuit board with embedded components includes an inner layer board, electronic component disposed in the inner layer circuit board, and third to sixth conductive circuit layers. The third and fourth conductive circuit layers are on opposite surfaces of the inner circuit board through first and second adhesive layers. The third conductive circuit layer and the fourth conductive circuit layer are electrically connected to the first conductive circuit layer and the second conductive circuit layer.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

A circuit board includes a substrate and at least two through holes defined in the substrate. The substrate includes a first conductive circuit layer and a second conductive circuit layer. The first conductive circuit layer and the second conductive circuit layer are respectively formed on opposite surfaces of the substrate. A number of conductive strips are formed on an inner wall of each of the at least two through holes. The number of conductive strips on the inner wall of a first one of the at least two through holes faces the number of conductive strips on the inner wall of a second one of the at least one through hole.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Classes IPC  ?

• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler

Abrégé

A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

Classes IPC  ?

• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A circuit board includes a first wiring layer and a build-up structure. The build-up structure includes at least one dielectric layer and at least one second wiring layer. Each dielectric layer and each second wiring layer are alternately arranged. The at least one dielectric layer comprises an outermost dielectric layer. The at least one second wiring layer is formed on a side of the outermost dielectric layer, and comprises an outermost second wiring layer. A portion of the first wiring layer is embedded in a side of the outermost dielectric layer facing away the outermost second wiring layer, a remaining portion of the first wiring layer protrudes from the outermost dielectric layer. A method for manufacturing a circuit board is provided.

Classes IPC  ?

• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
• H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques - Détails
• H05K 5/06 - Enveloppes scellées hermétiquement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
• H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H01L 23/427 - Refroidissement par changement d'état, p.ex. caloducs
• H01B 17/54 - Isolateurs ou corps isolants caractérisés par la forme à dispositifs de chauffage ou de réfrigération
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H01B 7/42 - Conducteurs ou câbles isolés caractérisés par la forme avec des dispositions pour la dissipation ou la conduction de la chaleur

Abrégé

A method of manufacturing a circuit board includes: a single-sided copper-clad base is provided; a plurality of grooves are defined in the base facing away from the copper-clad side for receiving electronic elements, a depth of each of the grooves is equal to a thickness of the corresponding electronic element; the electronic elements are fixed into their respective grooves; a plurality of holes are defined in the laminating member to expose the electrodes of the electronic elements; an electroplated layer is formed on the surface of the embedded body, the electroplated layer is electrically connected with the electrodes of the electronic elements. A circuit board made by the method is also provided.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 1/05 - Substrat en métal isolé
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.

Classes IPC  ?

• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/24 - Renforcement du parcours conducteur

Abrégé

A method for fabricating a sandwiched structure of silver-copper-silver functioning as a high frequency signal transmission structure includes an insulating sheet and a conductive circuit on the insulating sheet. The conductive circuit includes a silver conductive layer bonded to the insulating sheet, a copper conductive layer formed on the silver conductive layer, and a silver covering layer laid to cover top and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together enclose the copper conductive layer and the higher conductivity of the silver together with the skin effect improves high-frequency transmission efficiency of the copper.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A circuit board includes at least two circuit board units. Each of the circuit board units includes a baseboard having a conductive hole filled with an electrical conductor, and a cover layer arranged on the baseboard and defining at least one trench and at least one opening. The at least one opening exposes out the electrical conductor. A circuit pattern is embedded in the at least one trench and includes a connecting portion. The connecting portion is embedded in the opening and is electrically coupled to the electrical conductor. The at least two circuit board units are stacked. Two sides of the at least one cover layer are respectively adhered to the corresponding baseboard. Two ends of the at least one connecting portion are respectively electrically coupled to the corresponding electrical conductor and electrically coupled the two adjacent circuit patterns.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques

Abrégé

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

Classes IPC  ?

• B21D 39/00 - Utilisation de procédés permettant d'assembler des objets ou des parties d'objets, p.ex. revêtement par des tôles, autrement que par placage; Dispositifs de mandrinage des tubes
• B29L 31/18 - Echangeurs de chaleur ou leurs parties constitutives
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 23/427 - Refroidissement par changement d'état, p.ex. caloducs
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A system for tracking objects such as a printed circuit board (PCB) undergoing multiple manufacturing processes traceability system includes a coding unit, a scanning unit, and a reading unit and a database. The printed circuit board includes at least two inner copper foil substrates, subsequent substrates can be added. The coding unit marks identification and manufacturing stage codes on the inner copper foil substrate for through scanning by the scanning unit emitting X-rays. The reading unit can receive and parse the codes identified by the X-rays, and determine the previous or a next stage according to a predetermined encoding rule without risk of stage repetition or stage omission or product misplacement. The database stores standard identities and information as to manufacturing stages as a reference.

Classes IPC  ?

• H05K 13/08 - Contrôle de la fabrication des ensembles
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A printed circuit board deformable in both length and width includes a first conductive circuit layer, a second conductive circuit layer, an elastic film, and conductive via holes. The first conductive circuit layer includes first conductive circuits. First honeycomb holes are defined on the first conductive circuits. The second conductive circuit layer faces away from the first conductive circuit layer, the second conductive circuit layer comprises second conductive circuits, second honeycomb holes being defined on the second conductive circuits, each of the second honeycomb holes corresponds to one of the first honeycomb holes. The first conductive circuits are embedded in the elastic film. Each of the conductive via holes corresponds to one first honeycomb holes.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.

Classes IPC  ?

• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• G11B 5/48 - Disposition ou montage des têtes par rapport aux supports d'enregistrement
• H05K 1/05 - Substrat en métal isolé
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé
• H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

Classes IPC  ?

• H04R 25/00 - Appareils pour sourds
• H04R 9/06 - Haut-parleurs
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/02 - Circuits imprimés - Détails
• H04R 31/00 - Appareils ou procédés spécialement adaptés à la fabrication des transducteurs ou de leurs diaphragmes

Abrégé

A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.

Classes IPC  ?

• H01K 3/10 - Machines à cet effet
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/22 - Traitement secondaire des circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/42 - Trous de passage métallisés

Abrégé

An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/34 - Connexions soudées
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A method of manufacturing an embedded circuit board includes: a first adhesive coated copper is provided, which includes a first copper layer pre-formed with at least two first positioning holes and a first adhesive layer formed on a surface of the first copper layer; at least one first electronic element are adhered to the first adhesive layer, electrodes of the first electronic element face their corresponding first positioning hole; a second adhesive coated copper and a semi-cured film are provided, the first adhesive coated copper and the second adhesive coated copper are pressed on opposite surfaces of the semi-cured film, thereby embedding the first electronic elements in the semi-cured film; the first adhesive layer is partially removed to define first holes for exposing electrodes of the first electronic element; the electrodes are electrically connected with the first copper layer. A circuit board made by the method is also provided.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/05 - Substrat en métal isolé
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A method for manufacturing a flexible circuit board with resistor which is buried in the board includes steps of providing a composite board, the composite board comprising a substrate, and a physical development core layer formed on the substrate. A silver halide emulsion layer is formed on the physical development core layer and the silver halide emulsion layer is exposed. A developing solution is applied to the halide emulsion layer and washed to form a silver layer on the substrate. A conductive layer is formed on the silver layer and the conductive layer is etched, forming at least one opening. Such opening exposes a portion of the silver layer which contains a buried resistor. Different processes and materials applied in the above procedure serve to increase or decrease the resistance of the resistor as desired.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/22 - Traitement secondaire des circuits imprimés
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur

Abrégé

A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• C23G 1/10 - Nettoyage ou décapage de matériaux métalliques au moyen de solutions ou de sels fondus avec des solutions acides des autres métaux lourds
• C23C 28/02 - Revêtements uniquement de matériaux métalliques
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• C23F 1/44 - Compositions pour enlever des matériaux métalliques d'un substrat métallique de composition différente
• C23F 1/02 - Gravure locale
• G03F 7/20 - Exposition; Appareillages à cet effet
• G03F 7/095 - Matériaux photosensibles - caractérisés par des détails de structure, p.ex. supports, couches auxiliaires ayant plus d'une couche photosensible

Abrégé

A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.

Classes IPC  ?

• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

A printed circuit board includes a circuit substrate and a plurality of buffering circuits. The circuit substrate includes a substrate layer, and first and second circuit layers formed on either side of the substrate layer. The first circuit layer comprises a plurality of first conductive circuits. The second circuit layer comprises a plurality of second conductive circuits. A line width of each of the plurality of first conductive circuits is greater than a line width of each of the plurality of second conductive circuits. The plurality of buffering circuits electrically connect the first circuit layer to the second circuit layer and a line width of each of the plurality of buffering circuits is greater than the line width of each of the plurality of second conductive circuits.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• G11B 5/48 - Disposition ou montage des têtes par rapport aux supports d'enregistrement
• H05K 1/05 - Substrat en métal isolé
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• H05K 3/34 - Connexions soudées

Abrégé

A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• G06F 1/20 - Moyens de refroidissement