Abrégé

Disclosed in the present application is a circuit board, comprising a core board and a first side board, wherein one side of the core board is provided with a plurality of first connecting pads arranged at intervals, the center distance of two adjacent first connecting pads being defined as a first center distance; the first side board covers a plurality of first connecting pads; the first side board is penetrated by a plurality of first openings, each of which comprises a first end and a second end in communication with the first end, each first connecting pad being exposed through one first end, the center distance of two adjacent second ends being defined as a second center distance, and the first center distance being greater than the second center distance; and a plurality of first electrical conductors are disposed in the first openings, one end of each first electrical conductor is electrically connected to the first connecting pad, and the end of the first electrical conductor facing away from the first connecting pad extends out of the first opening to form a first connecting portion. The circuit board provided in the present application can achieve electrical connections of fingers of an electronic component which are staggered with the first connecting pads in the thickness direction. Further provided in the present application are a manufacturing method for the circuit board, and a display module.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A packaging method for a chip (30), comprising the following steps: providing a substrate (10), the substrate (10) comprising a base (11) and a plurality of first pads (13) provided on the base (11), and forming a first solder paste (15) on each first pad (13); forming positioning posts (20) on the surface of the base (11) provided with the first pads (13); providing the chip (30), the chip (30) comprising a chip body (31) and a plurality of second pads (33) provided on one surface of the chip body (31), and forming a second solder paste (35) on each second pad (33); forming grooves (32) on the surface of the chip body (31) provided with the second pads (33); accommodating the positioning columns (20) in the grooves (32), each first solder paste (15) being connected to a corresponding second solder paste (35), and melting and solidifying the first solder pastes (15) and the second solder pastes (35) to form solder balls (40) to connect the chip (30) and the substrate (10), thereby forming the chip packaging structure (100). The present application further provides the chip packaging structure (100).

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow electrically-conductive column (21), the circuit layer being provided on the base material layer (11), and one end of the hollow electrically-conductive column (21) being provided on the circuit layer; providing a heating element (30) in the hollow electrically-conductive column (21), the heating element (30) being electrically connected to the circuit layer; filling the hollow electrically-conductive column (21) with a thermally-conductive medium (33), the heating element (30) being immersed in the thermally-conductive medium (33); and providing an electrically-conductive cover body (40) at the other end of the hollow electrically-conductive column (21), the electrically-conductive cover body (40) sealing the hollow electrically-conductive column (21), and obtaining the circuit board assembly (100). In addition, further provided is a packaging structure (200).

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A manufacturing method for a circuit board connection structure, comprising the steps: providing a circuit board module, the circuit board module comprising a first outer circuit layer, and the first outer circuit layer comprising a plurality of welding pads; forming a first thermal release adhesive layer and an inner circuit layer on the first outer circuit layer, the first thermal release adhesive layer being located between the first outer circuit layer and the inner circuit layer; forming a second thermal release adhesive layer and a second copper foil layer on the inner circuit layer, the second thermal release adhesive layer being located between the inner circuit layer and the second copper foil layer; providing a plurality of through holes penetrating through the second copper foil layer, the second thermal release adhesive layer, the inner circuit layer and the first thermal release adhesive layer, each through hole being used for exposing a welding pad; forming a copper plating layer on the second copper foil layer, the through holes being filled with the copper plating layer to form conductive pillars; etching the copper plating layer and the second copper foil layer to form a second outer circuit layer so as to obtain an intermediate; and heating the intermediate and cleaning same, so as to remove the first thermal release adhesive layer and the second thermal release adhesive layer. The present application further provides a circuit board connection structure.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

The present application provides a circuit board and a manufacturing method therefor. The manufacturing method comprises: providing a stack board, the stack board comprising a third conductive line, a second substrate, a first conductive line, a first substrate, and a second conductive line that are stacked in sequence; forming multiple through holes in the surface of the stack board along the stacking direction of the stack board; and manufacturing antenna conductors in the through holes. According to the present application, the through holes are formed in the surface of the stack board; the antenna conductors are provided in the through holes; the antenna conductors located at different layers are connected to corresponding conductive lines; and compared with a blind hole connection mode, some of the antenna conductors are directly connected by means of the conductive lines, thereby reducing loss during signal transmission. Meanwhile, the circuit board comprising an antenna structure is changed from an up-down structure to a left-right structure, such that the thickness of the board is decreased.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.

Classes IPC  ?

• H01F 27/28 - Bobines; Enroulements; Connexions conductrices

Abrégé

A lens module (100), comprising: a substrate (10), the substrate (10) being provided with an accommodating hole (11); a photosensitive chip (20), the photosensitive chip (20) being arranged on the substrate (10) and being opposite the accommodating hole (11); a mounting support (30), the mounting support (30) being arranged on the substrate (10), the mounting support (30) being provided with a through hole (31), an inner wall of the through hole (31) extending in the direction of the central axis of the through hole (31) to form a carrying table (32), the side of the mounting support (30) close to the carrying table (32) extending outwards to form a connecting part (33), and the mounting support (30) surrounding the through hole (31) to form a plurality of layers of coils (35), capacitors (36) and resistors (37) by means of laser direct structuring (LDS), and the coils (35) being composed of a plurality of layers of surrounding inductors, which surround the through hole (31) from the inside out, on the mounting support (30); an optical filter (40), the optical filter (40) being arranged on the carrying table (32) and being accommodated in the through hole (31); a lens (50), the lens (50) being mounted in the through hole (31); and a circuit board (60), the circuit board (60) being connected to the mounting support (30) by means of the connecting part (33). Further disclosed is a manufacturing method for the lens module (100).

Classes IPC  ?

• H04N 5/225 - Caméras de télévision
• G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement

Abrégé

Disclosed is an embedded circuit board (100). The embedded circuit board comprises a circuit board (10) provided with a mounting groove (101), and a plurality of components (20), wherein the plurality of components (20) are arranged in the mounting groove (101) and are electrically connected to the circuit board (10). The circuit board (10) comprises a plurality of layers of circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), and the plurality of layers of circuit substrates (11, 12, 13, 14) are arranged in a stacked manner. The embedded circuit board (100) comprises a conductive member (30), wherein the conductive member (30) is arranged in the mounting groove (101), and is electrically connected to the plurality of components (20) and the plurality of layers of circuit substrates (11, 12, 13, 14), and at least two of the components (20) are electrically connected by means of the conductive member (30), which is advantageous for the functional performance of the components and reduces wear.

Classes IPC  ?

• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

Provided in the present application is a fabrication method for a plate-to-plate connection structure. The method comprises: providing a first through hole in a first circuit board, accommodating a first connector within the first through hole by means of a first conductive paste, and connecting same to a second circuit board on which a second connector is installed, thereby implementing the connection of the two circuit boards, and reducing the height of the two circuit boards after connection, i.e., reducing the height of a plate-to-plate connection structure. Additionally, since the first connector is accommodated within the first through hole, the first connector is not prone to damage and oxidation. Further provided in the present application is a plate-to-plate connection structure fabricated by the described method.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Abrégé

A circuit board (100) and a manufacturing method therefor. The circuit board (100) comprises a substrate (10) and a plurality of conductive wires (20) arranged at intervals on the substrate (10). Each of the conductive wires (20) comprises a seed layer (22) located on one surface of the substrate (10), a first copper layer (24) located on the surface of the seed layer (22) away from the substrate (10), and a second copper layer (26) plated on one surface of the substrate (10). The second copper layer (26) covers the seed layer (22) and the first copper layer (24). The ratio of the thickness of each of the conductive wires (20) to the space between any two adjacent conductive wires (20) is greater than 1. The thickness of the second copper layer (26) in the thickness direction of the substrate (10) is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate (10).

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A circuit board, comprising an electromagnetic shielding film, an insulating adhesive portion, a first signal line and a second signal line; the electromagnetic shielding film comprises a first surface and a second surface opposite to each other, the electromagnetic shielding film is divided into a body portion, a first bending portion, and a second bending portion, the first signal line and the second signal line are spaced apart on the first surface in a first direction, the first bending portion and the second bending portion are connected to two opposite sides of the body portion respectively in the first direction, the first bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the first signal line, the second bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the second signal line, the first bending portion and the second bending portion separate the first signal line and the second signal line from each other, and the insulating adhesive portion fills a gap between the first bending portion and the body portion and a gap between the second bending portion and the body portion. The present application further provides a method for manufacturing a circuit board.

Classes IPC  ?

• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A manufacturing method of a circuit board (100) comprises: providing a first single-sided circuit base board (20) comprising an insulation substrate (11) and a conductive circuit layer (13); forming, in the insulation substrate (11), multiple first conductive posts (111) electrically connected to the conductive circuit layer (13) to obtain a second single-sided circuit base board (30); providing a first adhesive layer (40), and forming multiple second conductive portions (401); providing the second single-sided circuit base board (30), and providing a through accommodation recess (31) to obtain a third single-sided circuit base board (50); providing another one of the first single-sided circuit board (20), and mounting an electronic component (14) on the conductive circuit layer (13) to obtain a patch circuit base board (60); sequentially stacking the first single-sided circuit base board (20), the first adhesive layer (40), the second single-sided circuit base board (30), and at least one of the third single-sided circuit base board (50), and the patch circuit base board (60); and laminating to obtain an intermediate product (70). Further provided is a circuit board (100). The overall manufacturing process of the invention comprises only one lamination operation, thereby alleviating circuit board warping caused by multiple lamination operations in the prior art.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

An encapsulation structure (100), comprising: a dielectric layer (60); at least one inner-layer line layer (70) buried in the dielectric layer (60); at least two outer-layer line layers (80) located on two sides of the at least one inner-layer line layer (70) and combined with the dielectric layer (60); and at least one electronic element (30) buried in the dielectric layer (60). Each inner-layer line layer (70) comprises at least two support pads (71) arranged at an interval, and each support pad (71) comprises a body (713) and a protruding portion (715) that extends outwards from the periphery of the body (713). The encapsulation structure (100) further comprises at least two positioning columns (20) arranged at an interval, wherein each positioning column (20) is correspondingly connected to one body (713); and each electronic element (30) is located between the at least two positioning columns (20), and an end of each electronic element (30) is in contact with the protruding portions (715) of the at least two support pads (71), such that the electronic element (30) is precisely encapsulated. Further provided is a manufacturing method for the encapsulation structure (100).

Classes IPC  ?

• H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition

Abrégé

A transparent circuit board, comprising a conductive circuit, and a transparent insulating layer and a cover film that are stacked. The conductive circuit penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive circuit. The surface of the conductive circuit combined with the cover film is provided with a blackening layer. The surface of the conductive circuit that is not provided with the blackening layer is provided with a carbon black layer. Therefore, the light transmittance of the transparent circuit is improved. The present invention also provides a manufacturing method for the transparent circuit board.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A package structure, comprising an inner circuit layer, a first dielectric layer, a first outer circuit layer, and an electronic assembly. The first dielectric layer comprises a first surface and a second surface opposite to the first surface; the inner circuit layer and the electronic assembly are embedded in the first dielectric layer from the first surface, and the first outer circuit layer is provided on the second surface; the electronic assembly comprises a first electronic element and a second electronic element; the second electronic element is provided close to the second surface, and an electrical connection end of the second electronic element faces the second surface; the first electronic element is provided on the side of the second electronic element distant from the second surface, and the first electronic element is exposed from the first surface; the first outer circuit layer is electrically connected to the electrical connection end of the second electronic element, and the inner circuit layer. The present invention necessarily further provides a manufacturing method for the package structure.

Classes IPC  ?

• H01L 23/367 - Refroidissement facilité par la forme du dispositif