The present disclosure relates to a method for manufacturing a semiconductor device, the method comprising: a first laminate production step for producing a first laminate including a semiconductor wafer, a resin layer including a resin that becomes a low-molecular resin as a result of a reaction with water, and a base material layer; a second laminate production step for producing a second laminate by polishing the rear surface of the semiconductor wafer of the first laminate; and a third laminate production step for producing a third laminate by which the base material layer of the second laminate is eliminated, the third laminate including the semiconductor wafer with the polished rear surface and the resin layer.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
The present invention discloses a method for manufacturing a semiconductor device. This method for manufacturing a semiconductor device comprises: a first laminate formation step for forming a first laminate in which a semiconductor wafer, a resin layer including a resin that becomes a lower-molecular-weight resin when irradiated with light, and a base layer are provided in the stated order; a second laminate formation step for forming a second laminate by polishing the rear surface of the semiconductor wafer of the first laminate; and a third laminate formation step for forming a third laminate by removing the base layer from the second laminate, the third laminate including the resin layer and the semiconductor wafer with the polished rear surface.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
The present disclosure relates to a method for producing a semiconductor device, the method comprising: a resin film formation step in which a resin film is formed on a semiconductor wafer, the resin film containing a resin that is decreased in the molecular weight through a reaction with water; a production step of a semiconductor chip with a resin film piece, in which an individualized semiconductor chip with a resin film piece is produced by dicing the semiconductor wafer, on which the resin film has been formed, with use of a dicing blade; and a resin film piece removal step in which the resin film piece is removed from the semiconductor chip with a resin film piece by causing the resin in the resin film piece of the semiconductor chip with a resin film piece to react with water.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
4.
THIN WIRING MEMBER PRODUCTION METHOD, THIN WIRING MEMBER, AND WIRING BOARD PRODUCTION METHOD
Disclosed is a method for producing a plurality of thin wiring members. This thin wiring member production method comprises: a step for producing, on a first carrier, a wiring layer that has a plurality of wiring parts which correspond to a plurality of thin wiring members and an insulating part that exists in the periphery of the plurality of wiring parts; a step for cutting the wiring layer such that each has at least one of the plurality of wiring parts; a step for affixing a second carrier to a second surface of the wiring layer that is opposite to the first surface on which the first carrier is provided; a step for peeling the first carrier from the wiring layer; a step for forming, with laser light, a modification region to become the starting point of a fracture, in an inner region of the second carrier which corresponds to a site at which the wiring layer was cut; and a step for expanding, in a planar direction, the second carrier in which the modification region was formed to divide the second carrier into a plurality of carrier parts.
The present disclosure relates to a resin film-forming material comprising a compound A that includes two or more first groups and has an ester bond and a compound B that includes two or more second groups capable of forming a bond with the first group and can form a resin including an ester bond and a basic functional group via a reaction with the compound A.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
6.
COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL
A coating liquid that contains: emulsified particles including a binder resin and a non-ionic emulsifier; aerogel particles; a water-soluble polymer having a hydrophobic group; and a liquid medium.
The present invention pertains to: a prepreg which contains a fiber base material and a resin composition containing (A) a thermosetting resin and (B) a spherical zinc molybdate, and in which the weight per unit area of the fiber base material is 50 g/m2 or more; and a laminated plate, a printed wiring board, and a semiconductor package, in all of which the prepreg is used.
C08J 5/10 - Renforcement des composés macromoléculaires avec des matériaux fibreux en vrac ou en nappes caractérisé par les additifs utilisés dans le mélange de polymères
C08K 3/105 - Composés contenant des métaux des groupes 1 à 3 ou des groupes 11 à 13 de la classification périodique
C08K 3/11 - Composés contenant des métaux des groupes 4 à 10 ou des groupes 14 à 16 de la classification périodique
C08L 63/00 - Compositions contenant des résines époxy; Compositions contenant des dérivés des résines époxy
C08L 79/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement de l'azote, avec ou sans oxygène ou carbone, non prévues dans les groupes
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
The present invention discloses a method for producing a semiconductor device. The method for producing a semiconductor device comprises: a resin film formation step for forming, on a semiconductor wafer, a resin film including a resin which is subjected to reduction in molecular weight when irradiated with light; a resin-film-piece-attached semiconductor chip creation step for dicing, by means of a dicing blade, the semiconductor wafer having the resin film formed thereon, and creating resin-film-piece-attached semiconductor chips which are formed into individual pieces; and a resin-film-piece removal step for irradiating resin film pieces on the resin-film-piece-attached semiconductor chips with light, and removing the resin film pieces from the resin-film-piece attached semiconductor chips.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
A coating liquid that contains: emulsified particles including a binder resin; aerogel particles; a water-soluble polymer having a hydrophobic group; and a liquid medium; wherein the content of chloride ions is 50 mass ppm or less, and the content of sulfate ions is 50 mass ppm or less.
This coating liquid comprises: emulsified particles that contain a binder resin; aerogel particles; a hydrophobic group-bearing water-soluble polymer; and a liquid medium. Said binder resin contains a structural unit derived from a first monomer for which the Tg of the homopolymer is less than 0°C.
The present invention relates to a prepreg containing a thermosetting resin composition and a fiber base material, the prepreg having one surface, and another surface on the opposite side from the one surface. The prepreg comprises, starting from at least either of the one surface and the another surface as a starting point, toward the surface on the opposite side from the surface serving as the starting point, in the stated order: a first region that constitutes the surface of the prepreg serving as the starting point and that contains a thermosetting resin composition; and a second region that contains a thermosetting resin composition that differs from the thermosetting resin composition contained in the first region. The storage modulus E'(1) at 260°C of a cured product of the thermosetting resin composition contained in the first region is lower than the storage modulus E'(2) at 260°C of a cured product of the thermosetting resin composition contained in the second region.
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p.ex. fabrication des "prepregs"
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08K 3/00 - Emploi de substances inorganiques en tant qu'adjuvants
Provided is photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in the given order, wherein the number of particles having a diameter of at least 0.8 μm measured on the barrier layer-side surface of the support film is 100 or less per 0.0225 mm2.
G03F 7/09 - Matériaux photosensibles - caractérisés par des détails de structure, p.ex. supports, couches auxiliaires
G03F 7/11 - Matériaux photosensibles - caractérisés par des détails de structure, p.ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p.ex. couches d'ancrage
13.
RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND CURED PRODUCT OF RESIN COMPOSITION
Disclosed is a method for producing a resin composition. This method for producing a resin composition comprises: a step in which a polyimide resin is obtained by causing a reaction between a tetracarboxylic acid dianhydride and a polyamine in an organic solvent; and a step in which a resin composition containing a polymaleimide resin and an organic solvent is obtained by causing a reaction between the polyimide resin and maleic acid anhydride. The polyamide includes a dimer diamine. The organic solvent includes an aromatic hydrocarbon solvent which has an aromatic hydrocarbon ring, while having a boiling point of 150°C to 200°C.
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
14.
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in the stated order, wherein the number of particles having a diameter of at least 0.8 μm as measured on the barrier layer-side surface of the support film is at most 100 per 0.0225 mm2.
The present disclosure relates to a photosensitive resin composition for a permanent resist, the composition containing: (A) acid-modified vinyl group-containing resin; (B) epoxy compound; (C) photopolymerization initiator; (D) photopolymerizable compound; and (F) inorganic filler, wherein the equivalent ratio of epoxy groups in (B) epoxy compound to carboxy groups in (A) acid-modified vinyl group-containing resin is 1.25-7.5, and (F) inorganic filler includes silica filler with vinyl groups derived from a vinylsilane compound.
Disclosed is a method for producing a resin composition. The method for producing a resin composition includes: a step of obtaining a polyimide resin by reacting tetracarboxylic dianhydride and a polyamine in an organic solvent; and a step of obtaining a resin composition containing a polymalemide resin and an organic solvent by reacting maleic anhydride with the polyimide resin. The polyamine includes dimer diamines. The organic solvent includes 1,2,4-trimethylbenzene.
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
Disclosed is a method for providing a structure This method for producing a structure includes: a first step for preparing a first structure which comprises a first adherend, a second adherend, and an adhesive part that bonds the first adherend to the second adherend, wherein the adhesive part contains a cured product of a curable composition containing a compound A having two or more thiol groups, a compound B having two or more functional groups able to react with thiol groups, and a photo-radical generator, and the compound A and/or the compound B have a disulfide bond in the molecule; and a second step for obtaining a second structure by heating the first structure so as to volatilize at least a part of the photo-radical generator contained in the adhesive part.
This fluorine-containing ether compound is represented by the following formula. R122-R222-R322-R2x22-R4(In the formula, x represents an integer of 1 or 2; R2represents a perfluoropolyether chain; R3is represented by formula (2); and R1and R4 each represent a terminal group which has 1 to 4 polar groups and 1 to 50 carbon atoms.)
C07C 43/13 - Ethers saturés contenant des groupes hydroxyle ou O-métal
C07C 43/178 - Ethers non saturés contenant des groupes hydroxyle ou O-métal
C07C 43/23 - Ethers une liaison sur l'oxygène de la fonction éther étant sur un atome de carbone d'un cycle aromatique à six chaînons contenant des groupes hydroxyle ou O-métal
C07C 233/18 - Amides d'acides carboxyliques ayant des atomes de carbone de groupes carboxamide liés à des atomes d'hydrogène ou à des atomes de carbone acycliques ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un radical hydrocarboné substitué par des atomes d'oxygène liés par des liaisons simples avec le radical hydrocarboné substitué lié à l'atome d'azote du groupe carboxamide par un atome de carbone acyclique ayant l'atome de carbone du groupe carboxamide lié à un atome d'hydrogène ou à un atome de carbone d'un squelette carboné acyclique saturé
C07C 255/13 - Nitriles d'acides carboxyliques ayant des groupes cyano liés à des atomes de carbone acycliques contenant des groupes cyano et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné acyclique saturé contenant des groupes cyano et des groupes hydroxy éthérifiés liés au squelette carboné
C10M 105/54 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé organique non macromoléculaire contenant des halogènes contenant du carbone, de l'hydrogène, des halogènes et de l'oxygène
G11B 5/725 - Revêtements protecteurs, p.ex. antistatiques contenant un lubrifiant
This method for manufacturing a semiconductor device includes: a step for bonding a laminate that includes a back grinding tape, which includes a base material and an adhesive layer formed on the base material, and a glue layer formed on the adhesive layer, from the adhesive agent layer side onto a side where there are provided electrodes of a semiconductor wafer that has a plurality of the electrodes on one main surface; a step for polishing and thinning the semiconductor wafer; a step for dicing the thinned semiconductor wafer and the adhesive agent layer to form individual adhesive agent layer-attached semiconductor chips; and a step for electrically connecting the electrodes of one adhesive agent layer-attached semiconductor chip to the electrodes of another semiconductor chip or to electrodes of a wiring circuit board, wherein the semiconductor wafer and the laminate have circular shapes in a plan view, and the diameter A of the semiconductor wafer and the diameter X of the laminate in a plan view satisfy the following equation (1). (1): A < X ≤ A + 5 mm
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
20.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING
This method for manufacturing a semiconductor device includes: a step for sticking a laminate which includes a back grind tape that includes a base material and a glue layer formed on the base material, and an adhesive layer formed on the glue layer, from the adhesive layer side onto a side where an electrode of a semiconductor wafer is provided; a step for grinding and thinning the semiconductor wafer; a step for dicing the thinned semiconductor wafer and the adhesive agent layer to form individual adhesive layer-attached semiconductor chips; and a step for electrically connecting an electrode of one adhesive layer-attached semiconductor chip to an electrode of another adhesive layer-attached semiconductor chip or of a wiring circuit board, wherein the semiconductor wafer and the laminate have a circular shape in a plan view, and the diameter A of the semiconductor wafer and the diameter X of the laminate in a plan view satisfy the following equation (1). (1): A - 1.5mm ≤ X < A
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
21.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM
This fluorine-containing ether compound is represented by the following formula. R122-R222-R322-R2x22-R4(x is 1 or 2. R2is a perfluoropolyether chain. R3is represented by formula (2). R1and R4 are terminal groups having 1-50 carbon atoms and having 1-4 polar groups. In formula (2), a1 and a2 are 0 to 5.b is 0 or 1. Y is an acyclic saturated hydrocarbon group having 2-8 carbon atoms.)
C07C 43/13 - Ethers saturés contenant des groupes hydroxyle ou O-métal
C07C 43/178 - Ethers non saturés contenant des groupes hydroxyle ou O-métal
C07C 43/23 - Ethers une liaison sur l'oxygène de la fonction éther étant sur un atome de carbone d'un cycle aromatique à six chaînons contenant des groupes hydroxyle ou O-métal
C07C 233/18 - Amides d'acides carboxyliques ayant des atomes de carbone de groupes carboxamide liés à des atomes d'hydrogène ou à des atomes de carbone acycliques ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un radical hydrocarboné substitué par des atomes d'oxygène liés par des liaisons simples avec le radical hydrocarboné substitué lié à l'atome d'azote du groupe carboxamide par un atome de carbone acyclique ayant l'atome de carbone du groupe carboxamide lié à un atome d'hydrogène ou à un atome de carbone d'un squelette carboné acyclique saturé
C07C 255/13 - Nitriles d'acides carboxyliques ayant des groupes cyano liés à des atomes de carbone acycliques contenant des groupes cyano et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné acyclique saturé contenant des groupes cyano et des groupes hydroxy éthérifiés liés au squelette carboné
C10M 107/38 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé macromoléculaire contenant des halogènes
G11B 5/725 - Revêtements protecteurs, p.ex. antistatiques contenant un lubrifiant
This foam molded product comprises a plurality of foam molded products having a foam portion in which a first skin layer, a foam layer, and a second skin layer are laminated together in this order.
B29C 44/00 - Moulage par pression interne engendrée dans la matière, p.ex. par gonflage ou par moussage
B29C 45/00 - Moulage par injection, c. à d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule fermé; Appareils à cet effet
B29C 45/56 - Moyens pour plastifier ou homogénéiser la matière à mouler ou pour la forcer dans le moule utilisant des éléments de moules mobiles pendant ou après l'injection, p.ex. pour le moulage par injection-pressage
B60J 5/10 - Portes disposées à l'arrière du véhicule
[Problem] To provide a laminate with excellent thermal durability, and a laminate production method. [Solution] A laminate, etc., comprising a first resin layer, a first conductive layer, an insulation layer, a second conductive layer, and a second resin layer in the stated order, in which the first resin layer has a housing section.
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
24.
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND CONDUCTIVE LAMINATE
This laminate comprises, in the following order, a first resin layer, a first conductive layer, an insulating layer, a second conductive layer, and a second resin layer, wherein the first resin layer has an accommodation section, and the first conductive layer is disposed inside the accommodation section of the first resin layer. This conductive laminate comprises, in the following order, a first conductive layer, an insulating layer, and a second conductive layer, and comprises adhesion layers respectively between the first conductive layer and the insulating layer and between the second conductive layer and the insulating layer.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
25.
IMAGE PROCESSING METHOD AND IMAGE PROCESSING PROGRAM
The present invention makes it possible to acquire a spheroid region with high accuracy from an image that includes a spheroid having a non-uniform contour as an object to be imaged. An image processing method according to the present invention comprises: an image acquisition step for acquiring an image including a spheroid as an object to be imaged; a binarization step for obtaining a binarized image by binarizing the acquired image; a region segmentation step for obtaining a candidate spheroid region by performing region segmentation on the binarized image; and an ellipse fitting step for applying ellipse fitting to the candidate spheroid region.
The composite particles contain a copolymer and a tackifier, wherein: the copolymer has a first structural unit derived from monomer (a1) and a second structural unit derived from monomer (a2); the monomer (a1) is a nonionic compound having only one ethylenically unsaturated bond; and the monomer (a2) is a compound having a carboxy group and only one ethylenically unsaturated bond.
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principale; Compositions contenant des dérivés de tels polymères
H01M 4/13 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication
Provided is a design assistance device which uses a machine-learning model in which a correspondence relation between design condition information about a material for blending a plurality of raw materials and the characteristic information about the material has been trained, and assists in designing the material for blending the plurality of raw materials, wherein the design assistance device comprises: a raw material information storage unit which is configured to store the names of and a plurality of pieces of attribute information about a plurality of registered raw materials; a registration reception unit which is configured to receive inputs of the name of and attribute information about a raw material to be newly registered and store the inputs in the raw material information storage unit; and a feature amount generation unit which is configured to generate feature amounts, which can be input to the machine-learning model, of the raw material from the pieces of attribute information about the plurality of raw materials, the pieces of attribute information being stored in the raw material information storage unit and selected as the design condition information.
G16C 60/00 - Science informatique des matériaux, c. à d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
Provided are an information search device, a method, and a program which acquire a link to unstructured data matched to structure data. The information search device comprises: a graph drawing unit which performs drawing as the structured data; a graph extraction range acquisition unit which extracts one or a plurality of data points in the drawn graph; and an in-graph extraction range data acquisition unit which acquires a table including the structured data including the extracted data points and the link to the unstructured data.
G06F 3/0481 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] fondées sur des propriétés spécifiques de l’objet d’interaction affiché ou sur un environnement basé sur les métaphores, p.ex. interaction avec des éléments du bureau telles les fenêtres ou les icônes, ou avec l’aide d’un curseur changeant de comport
G06F 16/248 - Présentation des résultats de requêtes
29.
FILM-FORM ADHESIVE, ADHESIVE FILM, INTEGRATED DICING/DIE BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a film-form adhesive configured from a resin composition that has thermal curing properties and contains a filler, the film-form adhesive being of a single-layer structure that has a first surface and a second surface, wherein the film-form adhesive has a region in which the filler content decreases from the second-surface side toward the first-surface side, the region being near the first surface of the film-form adhesive.
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, o; Adhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
30.
FILM-LIKE ADHESIVE AGENT, ADHESIVE FILM, DICING/DIE-BONDING INTEGRATED FILM, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
This film-like adhesive agent is formed of a resin composition having thermosetting properties and containing a filler, and has a single-layer structure including a first surface and a second surface. The film-like adhesive agent has a region A which is near the first surface and in which the contained amount of the filler decreases from the second surface side toward the first surface side, and a region B in which the contained amount of the filler does not substantially change in a direction toward the first surface side from the second surface side of the film-like adhesive agent. When the film-like adhesive agent is cured by heating, formula (1) is satisfied where a (nm) represents the thickness of the region A of the film-like adhesive agent after heat curing, and b (Pa) represents the elastic modulus of the region B, and c (Pa) represents the elastic modulus of mica. (1): a × (b/c) > 50
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, o; Adhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
31.
METHOD FOR PRODUCING PROTECTED GLYCOSIDE DERIVATIVE
Provided is a method for producing a protected glycoside in which a phenol compound is bonded to the anomeric position of a saccharide and other hydroxyl groups in the saccharide are protected, the method comprising reacting a saccharide, in which all hydroxyl groups of the saccharide are protected by protecting groups and protecting groups for the hydroxyl group at the 1-position and the hydroxyl group at the 2-position are acyl groups, and a phenol compound in the presence of at least one type of catalyst selected from the group consisting of trifluoromethanesulfonic acid and copper (II) trifluoromethanesulfonate.
Disclosed is a resin member including: a resin component which develops adhesive properties due to being irradiated with light; and a light radical generating agent. The storage modulus at 25°C of the resin member is 400 kPa or more. The storage modulus at 25°C of the resin member after being irradiated with exposure light of 30 J/cm2 is 200 kPa or less.
The present disclosure relates to a resin material which contains a compound A that has a (meth)acryloyl group, a compound B that has two or more thiol groups, and photoradical generator that has a 5% weight loss temperature of 200°C or more, wherein: the compound A contains a compound A-1 that has three or more (meth)acryloyl groups; and at least one of the compound A and the compound B has a disulfide bond.
Disclosed is a resin material. The resin material contains a compound A having two or more isocyanate groups, a compound B having two or more thiol groups, and a photoradical generator having a 5% weight loss temperature of 200°C or more. At least one of compound A and compound B has a disulfide bond in the molecule.
Provided is a mold release film including a mold release layer and a base material layer, the elongation rate at break of the mold release layer being 120% or greater, and the average thickness of the mold release layer being 5 μm or greater.
B29C 43/18 - Moulage par pressage, c. à d. en appliquant une pression externe pour faire couler la matière à mouler; Appareils à cet effet pour la fabrication d'objets de longueur définie, c. à d. d'objets séparés en incorporant des parties ou des couches préformées, p.ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 45/02 - Moulage par transfert, c. à d. en transférant par un piston le volume déterminé de matière à mouler d'une cavité de charge à une cavité de moulage
B29C 45/14 - Moulage par injection, c. à d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule fermé; Appareils à cet effet en incorporant des parties ou des couches préformées, p.ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
37.
METHOD FOR PRODUCING CATALYST FOR VINYL ACETATE PRODUCTION AND METHOD FOR PRODUCING VINYL ACETATE
A method for producing a catalyst for vinyl acetate production comprising a support, copper, palladium, gold, and an acetic acid salt, the method comprising, in the following order, step 1, in which an alkali solution is infiltrated into the support, step 2, in which the support is brought into contact and impregnated with a solution in which a copper-containing compound, a palladium-containing compound, and a gold-containing compound are contained in excess with respect to desired deposition amounts of the catalyst components, step 3, in which, after the catalyst components have been deposited in the desired deposition amounts, the support is separated from the solution, step 4, in which the support is brought into contact with water or an aqueous solution each having a pH of 7.0-11.5, step 5, in which a reduction treatment is conducted, and step 6, in which the acetic acid salt is deposited on the support.
B01J 31/28 - Catalyseurs contenant des hydrures, des complexes de coordination ou des composés organiques contenant en outre des composés métalliques inorganiques non prévus dans les groupes du groupe du platine, du cuivre ou du groupe du fer
B01J 37/02 - Imprégnation, revêtement ou précipitation
C07C 67/055 - Préparation d'esters d'acides carboxyliques par réaction d'acides carboxyliques ou d'anhydrides symétriques sur des liaisons carbone-carbone non saturées avec oxydation en présence des métaux du groupe du platine ou de leurs composés
A method for manufacturing a catalyst for manufacture of vinyl acetate, the catalyst containing a carrier, copper, palladium, gold, and an acetate, wherein the method comprises, in the following order: step 1) a step for impregnating the carrier with an alkaline solution; step 2) a step for contact-impregnating the carrier with a solution that contains a copper-containing compound, a palladium-containing compound, and a gold-containing compound, the amount of the solution exceeding a desired amount of carried catalyst components; step 3) a step for separating the carrier from the solution once the desired amount of carried catalyst components is carried by the carrier; step 4) a step for performing reduction treatment; and step 5) a step for causing the carrier to carry the acetate.
B01J 31/28 - Catalyseurs contenant des hydrures, des complexes de coordination ou des composés organiques contenant en outre des composés métalliques inorganiques non prévus dans les groupes du groupe du platine, du cuivre ou du groupe du fer
B01J 37/02 - Imprégnation, revêtement ou précipitation
C07C 67/055 - Préparation d'esters d'acides carboxyliques par réaction d'acides carboxyliques ou d'anhydrides symétriques sur des liaisons carbone-carbone non saturées avec oxydation en présence des métaux du groupe du platine ou de leurs composés
Provided is a method for producing a glycoside having such a structure that a phenolic compound is bound to the anomeric position in a sugar, the method comprising a step (1) for reacting a peracetylated sugar with a phenolic compound in the presence of an acid catalyst and a step (2) for directly adding a deacetylating agent and a deacetylation solvent selected from the group consisting of water and an alcohol to a reaction mixture produced in the step (1) to perform a deacetylation reaction.
Provided is a polymerizable composition containing a polymerizable compound, said polymerizable composition comprising: (A) a borate anion; and (B) at least one selected from the group consisting of aromatic carboxylic acids having two or more hydroxy groups, salts of the aromatic carboxylic acids, and hydrates of the aromatic carboxylic acids.
An adhesive agent composition comprising: a radical-polymerizable compound; a radical polymerization initiator; a compound having a nitrogen-containing aromatic heterocyclic ring; and particles containing at least one metal compound selected from the group consisting of metal hydroxides and metal oxides.
This simulation method comprises: preparing a simulation model of a semiconductor device including a substrate, an element, a connecting part which electrically connects the substrate and the element, and a reinforcing material which is disposed on a peripheral part of the element; and calculating an amount of strain applied to the connection part in the simulation model.
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 23/28 - Capsulations, p.ex. couches de capsulation, revêtements
43.
LAMINATED FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
This laminated film comprises in the order given: an adhesive layer containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having two carboxyl groups; a pressure-sensitive adhesive layer; and a base material layer, wherein the flux compound contains at least one compound selected from the group consisting of compounds having an aromatic ring, compounds having an aliphatic ring, and compounds for which the number of constituent atoms in the main chain is 4, 6, 8 or more.
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
44.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, STRUCTURE, AND SEMICONDUCTOR DEVICE
Disclosed is a method for manufacturing a semiconductor device. This method for manufacturing a semiconductor device comprises the steps for: preparing a structure that has an interposer that including a first main surface and a second main surface opposite to the first main surface and having formed therein a groove portion dividing the first main surface into a plurality of regions, and a plurality of semiconductor elements arranged at least one by one on each region; sealing at least a part of each of the plurality of semiconductor elements with a sealing member in such a manner that the sealing member is arranged in at least the groove portion; grinding the interposer from the second main surface toward the first main surface so as to expose the sealing member arranged in the groove portion; and dividing the structure into a plurality of individual regions by cutting the sealing member along the groove portion, to acquire a plurality of semiconductor devices.
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
45.
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND STRUCTURE
The present invention discloses a method for producing a semiconductor device. This method for producing a semiconductor device comprises: a step for preparing a structure that comprises an interposer which has a first main surface and a second main surface that is opposite to the first main surface, while being provided with a plurality of grooves that divide the first main surface into a plurality of mounting regions, and a plurality of semiconductor elements, at least one of which is arranged on each mounting region, with the grooves including at least two grooves that are parallel to each other; a step in which at least a part of each one of the plurality of semiconductor elements is sealed with a sealing material such that the sealing material is arranged at least in the plurality of grooves; a step in which the interposer is polished from the second main surface toward the first main surface so that the sealing material arranged in the plurality of grooves is exposed; and a step in which a plurality of semiconductor devices are obtained by cutting the sealing material along the grooves, thereby separating the plurality of regions of the structure into individual pieces.
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
46.
ELECTRODE MATERIAL, ELECTRODE FOR ENERGY STORAGE DEVICES, AND ENERGY STORAGE DEVICE
An electrode material containing composite particles that include: particles which include a substance capable of occluding and releasing alkali metal ions; and a coating portion which covers at least a portion of the surfaces of the particles and includes a polymer material and a conduction aid.
H01M 4/13 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p.ex. liants, charges
47.
ELECTRODE MATERIAL, ELECTRODE FOR ENERGY STORAGE DEVICES, AND ENERGY STORAGE DEVICE
An electrode material containing composite particles that include: particles A which include a substance capable of occluding and releasing alkali metal ions; and particles B which have an aspect ratio of 10 or higher.
H01M 4/13 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p.ex. liants, charges
48.
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND STRUCTURE
This semiconductor device production method is for preparing a structure 200 including: an interposer 60 divided into a plurality of installation areas 65 by groove sections 61 formed therein; and semiconductor elements 202a, 202b arranged on the individual installation areas 65. The semiconductor element 202a is a processor, and the semiconductor element 202a is memory. Each of the groove sections 61 includes two parallel grooves 61a. The semiconductor elements 202a, 202b are sealed in the structure 200 so that a sealing material 80b enters into each of the grooves 61a. The rear surface of the interposer 60 is polished so as to expose the sealing material 80b that has entered into each of the grooves 61a. The sealing material 80b is subsequently cut along the groove sections 61 and a plurality of semiconductor devices 201 are obtained. This method makes it possible to eliminate blade changes and improve production efficiency because only the sealing material 80b is cut when dividing into individual pieces.
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
49.
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, STRUCTURE, AND SEMICONDUCTOR DEVICE
In this semiconductor device manufacturing method, first a structure 200 is prepared, said structure 200 having an interposer 60, in which a plurality of groove sections 61 for dividing a front surface into a plurality of placement regions 65 are formed, and semiconductor elements 202a, 202b that are positioned on each of the placement regions 65. The semiconductor elements 202a are processors, and the semiconductor elements 202b are memory. In this structure 200, an encapsulant 8 encapsulates the semiconductor elements 202a, 202b so as to penetrate into each groove section 61. A back surface of the interposer 60 is then polished so as to expose the encapsulant 8 that has penetrated into each groove section 61. Afterward, dicing is performed by cutting the encapsulant 8 along the groove sections 61, to obtain a plurality of semiconductor devices 201. With this method, only the encapsulant 8 is cut during dicing, and thus a blade change can be omitted and manufacturing efficiency can be increased.
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
The present invention provides a method for producing a hydrogen fluoride adsorbent that has a high hydrogen fluoride adsorption capacity. This method for producing a hydrogen fluoride adsorbent comprises: an adsorption step in which a hydrogen fluoride-containing gas that contains hydrogen fluoride and a diluent gas for diluting the hydrogen fluoride, with the hydrogen fluoride concentration being 0.5% by volume to 60% by volume, is brought into contact with a metal fluoride, thereby having the hydrogen fluoride in the hydrogen fluoride-containing gas adsorbed on the metal fluoride so that the proportion of the hydrogen fluoride in the metal fluoride, on which the hydrogen fluoride is adsorbed, is 2% by mass to 25% by mass; and a desorption step in which the metal fluoride, on which hydrogen fluoride has been adsorbed in the adsorption step, is heated at a temperature of 240°C or less in a heat treatment atmosphere gas, thereby having the adsorbed hydrogen fluoride desorbed from the metal fluoride.
B01J 20/04 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtration; Absorbants ou adsorbants pour la chromatographie; Procédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant des composés des métaux alcalins, des métaux alcalino-terreux ou du magnésium
B01J 2/00 - Procédés ou dispositifs pour la granulation de substances, en général; Traitement de matériaux particulaires leur permettant de s'écouler librement, en général, p.ex. en les rendant hydrophobes
B01J 20/30 - Procédés de préparation, de régénération ou de réactivation
Provided is a method for manufacturing a semiconductor package such as CoWoS-L, the method including: preparing an intermediate structure having a base material with a first main surface and a second main surface on the rear side of the first main surface, and a rewiring layer provided on the first main surface and having an insulating resin layer and wiring, the base material having a resin part that includes a through-hole penetrating from the first main surface to the second main surface, and the rewiring layer forming a trench having a bottom surface where the through-hole is exposed; and cutting the through-hole along the trench to thereby form a plurality of wiring structures having split base materials.
Disclosed is a method for manufacturing a semiconductor package of InFO-L or the like, the method comprising: preparing an intermediate structure that comprises a base material having a first main surface and a second main surface on the back side thereof, and a rewiring layer that is provided on the first main surface and includes an insulating resin layer and wiring, the base material having a resin portion including a through-portion penetrating through the base material from the first main surface to the second main surface, and the rewiring layer forming a trench with a bottom surface on which the through-portion is exposed; and cutting the through-portion along the trench to form a plurality of wiring structures having the base material divided by the cutting.
Disclosed is a method for manufacturing a semiconductor package, the method comprising: preparing an intermediate structure that has a base material having a first main surface and a second main surface on a back side of the first main surface, and a re-wiring layer having an insulating resin layer and a wiring line, the base material having a resin portion that includes a through-hole passing from the first main surface to the second main surface, and the wiring layer forming a trench having a bottom surface exposed by the through-hole; and cutting a through-hole along the trench and forming a plurality of wiring line structures having a base material divided by the cutting.
The present invention discloses a method for manufacturing an electronic component, the method comprising: preparing an intermediate structure comprising a substrate having a first main surface and a second main surface on the rear side of the first main surface and a wiring layer provided on the first main surface and having an insulating resin layer and wiring, the substrate having a resin portion including a penetration portion extending through the substrate from the first main surface to the second main surface, the wiring layer forming a trench having a bottom surface where the penetration portion is exposed; and cutting the penetration portion along the trench to form a plurality of wiring structures having the substrate divided through the cutting.
Provided is a method for producing iodine heptafluoride, whereby it becomes possible to produce iodine heptafluoride having a reduced iodine gas content with high yield. The method for producing iodine heptafluoride comprises: a preparation step for preparing a liquid mixture containing iodine pentafluoride and hydrogen fluoride, in which the content of hydrogen fluoride is 0.1% by mass to 20% by mass inclusive relative to the content of iodine pentafluoride; a vaporization step for mixing a fluorine gas with the liquid mixture to vaporize the liquid mixture, thereby producing a raw material mixture gas containing a iodine pentafluoride gas, a hydrogen fluoride gas and a fluorine gas; and a reaction step for reacting the raw material mixture gas in the presence of a catalyst to produce iodine heptafluoride.
Provided is a fluorine-containing ether compound represented by the following formula. R122-R2a22-R3a22-R2b22-R3b22-R2c22-R3c22-R2d22-R4(R2a, R2b, R2c,and R2dare perfluoropolyether chains. R3a, R3b, and R3care divalent linking groups having at least one polar group. At least one among R3a, R3b, and R3c222O-. R1and R4 are C1-C50 terminal groups having at least one polar group, and may be the same as or different from each other.)
C07C 43/13 - Ethers saturés contenant des groupes hydroxyle ou O-métal
B32B 33/00 - Produits stratifiés caractérisés par des propriétés particulières ou des caractéristiques de surface particulières, p.ex. par des revêtements de surface particuliers; Produits stratifiés conçus pour des buts particuliers non couverts par une seule autre classe
C07C 41/03 - Préparation d'éthers à partir d'oxiranes par réaction d'un cycle oxirane avec un groupe hydroxyle
C10M 105/54 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé organique non macromoléculaire contenant des halogènes contenant du carbone, de l'hydrogène, des halogènes et de l'oxygène
C10N 30/00 - Propriétés physiques ou chimiques particulières améliorées par l'additif caractérisant la composition lubrifiante, p.ex. additifs multifonctionnels
C10N 30/12 - Inhibition de la corrosion, p.ex. agents antirouille, agents anticorrosifs
C10N 40/18 - Usages électriques ou magnétiques en relation avec des enregistrements sur bandes ou disques magnétiques
57.
ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHODS FOR PRODUCING SAME
An adhesive film for circuit connection comprising a first adhesive layer having thermosettability, conductive particles partially embedded in one side of the first adhesive layer, and a second adhesive layer that has thermosettability and contacts one side of the first adhesive layer, the embedding rate of conductive particles in the first adhesive layer being 30-90% and the ratio of the flow rate of the second adhesive layer to the flow rate of the first adhesive layer being 1.20-4.00.
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01R 11/01 - CONNEXIONS CONDUCTRICES DE L'ÉLECTRICITÉ; ASSOCIATION STRUCTURELLE DE PLUSIEURS ÉLÉMENTS DE CONNEXION ÉLECTRIQUE ISOLÉS LES UNS DES AUTRES; DISPOSITIFS DE COUPLAGE; COLLECTEURS DE COURANT Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p.ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
58.
CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS
A connected body of metal materials having an overlapping portion where an end A of a metal material A and an end B of a metal material B are overlapped via a film composed mainly of a thermoplastic resin, wherein the film is one that has been melted and solidified at the overlapping portion.
B29C 65/42 - Application d'une matière plastique fondue, p.ex. application d'un "hot melt" entre des éléments pré-assemblés
B29C 65/64 - Assemblage d'un élément en matière autre que plastique avec un élément en matière plastique, p.ex. à force
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B65H 37/04 - Appareils délivrant des articles ou des bandes, comportant des dispositifs pour exécuter des opérations auxiliaires particulières pour fixer ensemble des articles ou des bandes, p.ex. par adhésifs, piqûre ou brochage
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
C09J 171/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
59.
PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Provided is a protective sheet for semiconductor processing. The protective sheet can accurately follow irregularities on an adherend surface and adhere thereto and can be peeled without leaving paste after irradiation with active energy rays, even when the irregularities on the surface are large (large bump height) and also after undergoing a step for conducting high temperature treatment at 200°C, for example. This protective sheet for semiconductor processing has a base material, an intermediate layer, and an adhesive layer, wherein the intermediate layer and the adhesive layer are provided above one principal surface of the base material in the stated order; the intermediate layer is a cured product of a resin composition that contains a cross-linking agent (B1) and a (meth)acrylic resin (A1) containing no ethylenically unsaturated group; the adhesive layer is a cured product of an adhesive composition that contains an ethylenically unsaturated group-containing (meth)acrylic resin (A2), a cross-linking agent (B2), and a photopolymerization initiator (C); and the ethylenically unsaturated group-containing (meth)acrylic resin (A2) is an adduct in which an epoxy group-containing ethylenically unsaturated compound (a2-3) is added to a copolymer of a monomer group (M2) that contains an alkyl (meth)acrylate (a2-1) and a carboxylic group-containing ethylenically unsaturated compound (a2-2).
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
60.
PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a protective sheet for semiconductor processing, the protective sheet comprising a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic resin (A1) not containing an ethylenically unsaturated group, and a crosslinking agent (B1), and the adhesive layer is a cured product of an adhesive composition comprising an ethylenically unsaturated group-containing (meth)acrylic resin (A2), a crosslinking agent (B2), and a photopolymerization initiator (C). The (meth)acrylic resin (A1) not containing an ethylenically unsaturated group has a plurality of functional groups that react with functional groups of the crosslinking agent (B1), and the ethylenically unsaturated group-containing (meth)acrylic resin (A2) has a plurality of functional groups that react with functional groups of the crosslinking agent (B2). The ethylenically unsaturated group-containing (meth)acrylic resin (A2) is an adduct of an epoxy group-containing ethylenically unsaturated compound (a2-3) added to a copolymer of a monomer group (M2) containing an alkyl(meth)acrylate (a2-1) and a carboxyl group-containing ethylenically unsaturated compound (a2-2).
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
One aspect of the present disclosure relates to a modified styrene elastomer having, on a side chain, an N-substituted succinimide group containing a phenolic hydroxyl group, an isocyanate group, a blocked isocyanate group, a maleimide group, or a benzoxazine group.
C08F 8/30 - Introduction d'atomes d'azote ou de groupes contenant de l'azote
C08F 297/04 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique en polymérisant des monomères vinylaromatiques et des diènes conjugués
62.
MALEIMIDE-MODIFIED STYRENIC ELASTOMER, AND METHOD FOR PRODUCING MALEIMIDE-MODIFIED STYRENIC ELASTOMER
The present disclosure relates to: a maleimide-modified styrenic elastomer which is obtained by reacting a modified styrenic elastomer having a group represented by formula (1), a diamine compound, and maleic anhydride, and which has a group represented by the following formula (3) (in the formulae, A1 represents a residue of a diamine compound, and * represents a bonding portion.); and a method for producing a maleimide-modified styrenic elastomer.
The present invention performs local search, which tends to lead to a local solution, while maintaining initial value dependency. This material designing device comprises: a peripheral composition generation unit configured to generate a peripheral composition in which each of factors included in a composition candidate for a target substance is varied in a predetermined search range; a property prediction unit configured to predict the material properties of the target substance on the basis of the peripheral composition; a composition candidate updating unit configured to update the composition candidate with a peripheral composition if the peripheral composition improves the material properties; a search range expanding unit configured to expand the search range in the absence of the peripheral composition that improves the material properties; and a factor exchange unit configured to exchange the factors of the composition candidate when the search range exceeds a predetermined range.
G16C 60/00 - Science informatique des matériaux, c. à d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
The present disclosure relates to a resin composition that contains a thermosetting resin and a modified styrene elastomer having an N-substituted succinimide group in a side chain.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08C 19/22 - Incorporation d'atomes d'azote dans la molécule
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone; Compositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
One aspect of the present disclosure relates to a modified styrene-based elastomer having, in a side chain thereof, an N-substituted succinimide group containing a fluorine atom or a phosphorus atom.
C08F 8/32 - Introduction d'atomes d'azote ou de groupes contenant de l'azote par réaction avec des amines
C08F 8/40 - Introduction d'atomes de phosphore ou de groupes contenant du phosphore
C08F 8/42 - Introduction d'atomes métalliques ou de groupes contenant des atomes métalliques
C08F 297/04 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique en polymérisant des monomères vinylaromatiques et des diènes conjugués
66.
JOINED OBJECT PRODUCTION METHOD, JOINED OBJECT, AND ELECTRIC/ELECTRONIC COMPONENT
A method for producing a joined object that is formed through joining of a columnar base material A, a thermoplastic film B, and a resin C in this sequence, said method sequentially comprising: step 1 for circumferentially winding the thermoplastic film B around at least a portion of the outer circumference of the columnar base material A; and step 2 for sealing the thermoplastic film B by joining, through insert molding, the resin C with the portion of the columnar base material A in which the thermoplastic film B has been wound.
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer containing conductive particles and a thermoplastic resin; and a second adhesive layer provided on the first adhesive layer. The thermoplastic resin includes a resin in which at least some of hydroxy groups in a phenoxy resin are modified with a group represented by formula (1) or formula (1A). [In formula (1), R1represents a hydrogen atom or a methyl group, x represents an integer of 2-6, and y represents an integer of 1-6. * represents a bonding position that is bonded to an oxygen atom derived from a hydroxy group.] [In formula (1A), R1, x, y, and * have the same meanings as above. *1 and *2 each represent a bonding position that is bonded to a carbon atom of another radically polymerizable group.]
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
C09J 171/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
H01R 11/01 - CONNEXIONS CONDUCTRICES DE L'ÉLECTRICITÉ; ASSOCIATION STRUCTURELLE DE PLUSIEURS ÉLÉMENTS DE CONNEXION ÉLECTRIQUE ISOLÉS LES UNS DES AUTRES; DISPOSITIFS DE COUPLAGE; COLLECTEURS DE COURANT Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p.ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
68.
POLYMER EMULSION, AND SINGLE-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, TWO-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, COATING MATERIAL, RESIN CURED FILM, AND COATING FILM USING SAID POLYMER EMULSION
Provided are: a polymer emulsion having excellent preservation stability; and a thermosetting resin composition and the like that contain said polymer emulsion and that have excellent curability at a low temperature. The present invention contains a polymer emulsion (B) that contains water and a polymer (A) including a structural unit (A-1) represented by formula (1). [In formula (1), R1represents a hydrogen atom or a methyl group, R2represents a linear or branched aliphatic saturated hydrocarbon group having 1-20 carbon atoms and a valence of 2-4, and optionally having an ether bond, or an aromatic hydrocarbon group or an alicyclic hydrocarbon group having 6-20 carbon atoms and a valence of 2, and optionally having a urethane bond, R3represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or a cycloalkyl group or an arylalkyl group having 6-20 carbon atoms, R4 represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or a cycloalkyl group or an arylalkyl group having 6-20 carbon atoms, and n represents 1 or 2.]
C08F 220/36 - Esters contenant de l'azote contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C09D 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
The present invention provides a method for producing a wiring board, the method comprising: a step for forming a resist layer on a seed layer that contains a metal and is arranged on a main surface of a substrate; a step for exposing the resist layer to light and developing the resist layer so as to provide the resist layer with a pattern that comprises an opening from which the seed layer is exposed; and a step for forming a copper plating layer on the seed layer, which is exposed in the opening, by means of electrolytic plating. The copper plating layer is formed so that the BP occupancy, which is the occupancy of a black part in the width direction of the copper plating layer, the black part being observed in a cross-section of a metal part that contains the seed layer and the copper plating layer, is 45% or less. The resist layer is selected. The BP occupancy is a value that is determined by a method that comprises a calculation of the BP occupancy by the formula.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
This non-aqueous secondary battery binder polymer has a first structural unit derived from a monomer (a1), a second structural unit derived from a monomer (a2) and a third structural unit derived from a monomer (a3). The monomer (a1) is a non-ionic compound having only one ethylenically unsaturated bond. The monomer (a2) is a compound which has a carboxyl group and has only one ethylenically unsaturated bond. The monomer (a3) is a polyrotaxane having: cyclic molecules each having a cyclic skeleton to which a group having an ethylenically unsaturated bond is bonded; and a chain-like molecule which passes through open parts of the cyclic molecules and has a stopper group at both terminals.
H01M 4/13 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication
The present invention provides a polishing liquid which contains: abrasive grains; an ether compound which has at least one group that is selected from the group consisting of a carboxy group and a carboxylate group; and water. The present invention also provides a polishing liquid set which is obtained by separating the constituents of the above-described polishing liquid into a first liquid and a second liquid for storage, so that the first liquid contains the abrasive grains and water, while the second liquid contains water and the ether compound which has at least one group that is selected from the group consisting of a carboxy group and a carboxylate group. The present invention also provides a polishing method which comprises a step for polishing a surface to be polished with use of the above-described polishing liquid, the surface to be polished containing silicon oxide.
Provided is a method for manufacturing a wiring board, said method comprising: providing a resist layer on a seed layer that includes a metal and that is provided on a main surface of a board; exposing the resist layer to light and developing the same so as to form, on the resist layer, a pattern including an opening from which the seed layer is exposed; and using electrolytic plating to form, on the seed layer exposed in the opening, a copper plating layer including a part having a width of less than 10 μm. The copper plating layer is formed such that a BP occupancy, which is the percent occupied, in the width direction of the copper plating layer, by a black part as observed in a cross section of a metal part including the seed layer and the copper plating layer, is 45% or less. The resist layer is selected. The BP occupancy is a value determined by a method including calculating the BP occupancy by the following expression (expression 1).
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
73.
METHOD FOR MANUFACTURING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, AND METHOD FOR MANUFACTURING LITHIUM-ION SECONDARY BATTERY
In the present invention, a method for manufacturing a negative electrode material for a lithium-ion secondary battery comprises: (a) a step of obtaining a mixture that includes a graphitizable aggregate and a graphitizable binder; (b) a step of molding the mixture to obtain a molded article; (c) a step of graphitizing the molded article to obtain a graphitized article; and (d) a step of pulverizing the graphitized article to obtain a pulverized article, wherein the binder includes an aqueous binder that contains a macromolecular compound that has water solubility or water absorbency.
A negative electrode material for a lithium ion secondary battery, said negative electrode material including graphite particles, wherein the graphite particles satisfy conditions in which, with regard to an R value which is the intensity ratio Id/Ig of the intensity Ig of the maximum peak in the range 1580 cm–1to 1620 cm–1and the intensity Id of the maximum peak in the range 1300 cm–1to 1400 cm–1in a Raman spectrum obtained through Raman spectroscopy, the percentage of particles for which R≥0.2 is greater than or equal to 10% by number, and the average value of the half-value width of Id in the R-value top 10 spectrum is less than or equal to 60 cm–1.
The present invention comprises: a rewiring layer; an electronic circuit chip and an optical circuit chip disposed on the rewiring layer; and a first sealing layer for sealing the electronic circuit chip and the optical circuit chip, wherein the first sealing layer has an opening on a side opposite from the rewiring layer side of the first sealing layer, the position of the opening and the position of the optical circuit chip overlapping at least partially.
A method for producing a (meth)acrylic resin having an ethylenically unsaturated group comprising a step (i) that reversible addition-fragmentation chain transfer (RAFT) polymerizes a raw material monomer group (M) containing a hydroxy group-containing (meth)acrylate (m-1) and an alkyl (meth)acrylate (m-2) to obtain a copolymer (A-0) and a step (ii) that adds an isocyanate group-containing ethylenically unsaturated compound (a) to some of the side chain hydroxy groups of the copolymer (A-0) to obtain a (meth)acrylic resin.
C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
C09J 175/00 - Adhésifs à base de polyurées ou de polyuréthanes; Adhésifs à base de dérivés de tels polymères
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
77.
PHOTOSENSITIVE RESIN COMPOSITION, RESIN CURED FILM AND IMAGE DISPLAY ELEMENT
Provided are a photosensitive resin composition and a photosensitive coloring composition which exhibit excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient hardness and solvent resistance. This photosensitive resin composition contains a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D). The resin (A) is a product of an addition reaction between: a hydroxyl group-containing (meth)acrylic resin (a-0); a compound (a-4) having an isocyanate group and an ethylenically unsaturated group; and a polybasic acid or anhydride thereof (a-5). Component (a-0) is a copolymer that contains a structural unit derived from a hydroxyl group-containing (meth)acrylate (m-1) and a structural unit derived from a (meth)acrylate (m-2) having one or more groups selected from the group consisting of an active methylene group, an active methine group, an epoxy group, an oxetanyl group, a blocked isocyanate group and a silyl group.
A thermosetting resin composition containing (A) a thermosetting resin, (B) an ethylenically unsaturated monomer, (C) an ethylenically unsaturated group-containing phosphoric acid ester compound, (D) a low shrinkage agent, (E) an inorganic filler, and (F) a thermal polymerization initiator.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08F 283/01 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polyesters non saturés
79.
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METHOD, SUBSTRATE SELECTION METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE SUBSTRATE OR PRINTED CIRCUIT BOARD
This resist pattern inspection method comprises an appearance inspection step for inspecting the appearance of a resist pattern on the basis of light emitted from a substrate whereon the resist pattern is formed. This resist pattern manufacturing method comprises: a resist pattern formation step for forming a resist pattern on a substrate; and a light-emitting material adhering step for adhering a light-emitting material to a surface of a conductor of the substrate. This substrate selection method comprises: the appearance inspection step for inspecting the appearance of the resist pattern on the basis of the light emitted from the substrate whereon the resist pattern is formed; and an evaluation step for evaluating the resist pattern on the basis of the appearance inspection in the appearance inspection step. This manufacturing method for a semiconductor package substrate or a printed circuit board comprises a conductor pattern formation step for forming a conductor pattern by etching or plating the substrate, the resist pattern of the substrate having been evaluated in the substrate selection method as meeting a standard.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
80.
CHARACTERISTICS PREDICTION DEVICE, CHARACTERISTICS PREDICTION METHOD, AND PROGRAM
The present invention visualizes the relationship between a design condition and a characteristics prediction value of an objective substance to facilitate easy understanding thereof. The present invention includes: a reference design determination unit configured to determine a reference design condition representing a design condition for an objective substance to be produced using two or more materials; a peripheral design generation unit configured to generate a plurality of peripheral design conditions in which any one of design values is varied from that of the reference design condition; a characteristics prediction unit configured to predict two or more characteristic values of each of the peripheral design conditions; and a visualization unit configured to arrange symbols corresponding to the peripheral design conditions, on a plane with a design value and a first characteristic value as axes, by means of color representation corresponding to a second characteristic value.
G16C 60/00 - Science informatique des matériaux, c. à d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
81.
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND EXPANDABLE TAPE
The present invention discloses a method for producing a semiconductor device. This method for producing a semiconductor device comprises: a step A for selecting an expandable tape (tape) which is provided with a base material film and an adhesive layer including a non-ultraviolet curable adhesive and in which the 90° peel strength of the adhesive layer with respect to a stainless plate is greater than the 180° peel strength thereof; a step B for preparing a laminated body provided with the tape and a plurality of semiconductor chips (chips) having first main surfaces and second main surfaces; a step C for widening gaps between the plurality of chips by expanding the tape while heating the same; and a step D for transferring the plurality of chips on the adhesive layer of another tape of the same type as that of said tape and separating the tape at a separation angle of 90° or more with respect to the first main surfaces of the plurality of chips. The step C and the step D are repeated at least once.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
82.
DESIGN ASSISTANCE DEVICE, DESIGN ASSISTANCE METHOD, AND DESIGN ASSISTANCE PROGRAM
This design assistance device is provided with: a data acquisition unit that acquires a plurality of performance data sets each comprising a design parameter group and observation values of a plurality of characteristic items of a product or the like; a model construction unit that constructs, on the basis of the performance data sets, a prediction model for predicting the observation values of the characteristic items on the basis of the design parameter group; a target value acquisition unit that acquires target values for the observation values of the characteristic items; a score function construction unit for constructing a score function including at least a target attainment probability term indicating an overall achievement probability that is a probability at which the target values of all the the characteristic items are achieved and which is calculated using the design parameter group as a variable on the basis of the prediction model; a target attainment probability acquisition unit that acquires the overall attainment probability by optimizing the score function; and an output unit that outputs the overall attainment probability.
This release film includes a release layer and a base layer, the release layer containing two or more polymers, and fulfilling the criteria in at least one of (1) to (4). (1) The release layer has a plurality of regions having different component ratios, and when performing Raman spectroscopy in the plurality of different regions, different peak intensities are shown in at least a portion of the plurality of different regions. (2) The surface of the release layer is formed with recesses and projections, and when Raman spectroscopy is performed on the projections and recesses, at least some of the projections and at least some of the recesses show different peak intensities. (3) The difference in the SP value of at least two polymers is 0.3 or greater. (4) At least one polymer is a nitrile-group-containing (meth)acrylic polymer.
A mold release film according to the present invention comprises a mold release layer and a base material layer, the mold release layer containing two or more polymers and satisfying at least one of (1) to (4). (1) The mold release layer includes a plurality of regions having different component ratios, and when the Raman spectroscopic measurements are performed for the plurality of different regions, different peak intensities are exhibited in at least some of the plurality of different regions. (2) The surface of the mold release layer has a recessed and protruding shape, and when the Raman spectroscopic measurements are performed for the protrusions and recesses, different peak intensities are exhibited in at least some of the protrusions and at least some of the recesses. (3) The difference in SP values of the at least two polymers is 0.3 or greater. (4) At least one polymer is a nitrile group-containing (meth)acrylic polymer.
A connected body of metal materials obtained by matching a cross-section A of a flat metal material A and a cross-section B of a flat metal material B, covering at least part of the opposing portion, which is a region spanning both the edge portion A of the metal material A and the edge portion B of the metal material B, with a film that includes a layer composed mainly of a thermoplastic resin, and connecting the metal material A and the metal material B, wherein the film is one that has been melted and solidified on the opposing portion.
B29C 65/42 - Application d'une matière plastique fondue, p.ex. application d'un "hot melt" entre des éléments pré-assemblés
B29C 65/64 - Assemblage d'un élément en matière autre que plastique avec un élément en matière plastique, p.ex. à force
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B65H 37/04 - Appareils délivrant des articles ou des bandes, comportant des dispositifs pour exécuter des opérations auxiliaires particulières pour fixer ensemble des articles ou des bandes, p.ex. par adhésifs, piqûre ou brochage
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
C09J 171/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
86.
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METHOD, SUBSTRATE SELECTION METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE SUBSTRATE OR PRINTED CIRCUIT BOARD
This resist pattern inspection method comprises an appearance inspection step for inspecting the appearance of a resist pattern on the basis of light emitted from a substrate whereon the resist pattern is formed. The resist pattern manufacturing method comprises: a resist pattern formation step for forming a resist pattern on a substrate; and a light-emitting material impregnation step for impregnating the resist pattern with a light-emitting material after the resist pattern formation step. The substrate selection method comprises: the appearance inspection step for inspecting the appearance of the resist pattern on the basis of the light emitted from the substrate whereon the resist pattern is formed; and an evaluation step for evaluating the resist pattern on the basis of the appearance inspection in the appearance inspection step. The manufacturing method for a semiconductor package substrate or a printed circuit board comprises a conductor pattern formation step for forming a conductor pattern by etching or plating the substrate, the resist pattern of the substrate having been evaluated in the substrate selection method as meeting a standard.
Disclosed is a film for temporary fixing, the film being used for temporarily fixing a semiconductor member and a support member. The film for temporary fixing contains an ultraviolet absorbing agent having a hydroxyl group, a thermosetting resin having a functional group that can react with the hydroxyl group, and a thermoplastic resin.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
88.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM
This fluorine-containing ether compound is represented by the following formula. R122-R222-R322-R2x22-R4(x represents an integer of 1 or 2, R2represents a perfluoropolyether chain, at least one of the x-number of R3is represented by formula (2-1) or (2-2), and R1and R4are each a terminal group which has 2-4 polar groups, in which the number of carbon atoms located at the shortest distance for carbon atoms bound to adjacent ones of the polar groups is 1-9, and which has an oxygen atom to be bound to a methylene group that is bound to R2.)
C07C 43/13 - Ethers saturés contenant des groupes hydroxyle ou O-métal
C07C 233/18 - Amides d'acides carboxyliques ayant des atomes de carbone de groupes carboxamide liés à des atomes d'hydrogène ou à des atomes de carbone acycliques ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un radical hydrocarboné substitué par des atomes d'oxygène liés par des liaisons simples avec le radical hydrocarboné substitué lié à l'atome d'azote du groupe carboxamide par un atome de carbone acyclique ayant l'atome de carbone du groupe carboxamide lié à un atome d'hydrogène ou à un atome de carbone d'un squelette carboné acyclique saturé
C07C 235/60 - Amides d'acides carboxyliques, le squelette carboné de la partie acide étant substitué de plus par des atomes d'oxygène ayant des atomes de carbone de groupes carboxamide liés à des atomes de carbone de cycles aromatiques à six chaînons et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné avec des atomes de carbone de groupes carboxamide et des atomes d'oxygène, liés par des liaisons simples, liés à des atomes de carbone du même cycle aromatique à six chaînons non condensé avec des atomes de carbone de groupes carboxamide et des atomes d'oxygène, liés par des liaisons simples, liés en position ortho à des atomes de carbone du même cycle aromatique à six chaînons non condensé ayant les atomes d'azote des groupes carboxamide liés à des atomes d'hydrogène ou à des atomes de carbone acycliques
C07C 255/15 - Nitriles d'acides carboxyliques ayant des groupes cyano liés à des atomes de carbone acycliques contenant des groupes cyano et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné acyclique non saturé
C07C 255/54 - Nitriles d'acides carboxyliques ayant des groupes cyano liés à des atomes de carbone de cycles aromatiques à six chaînons d'un squelette carboné contenant des groupes cyano et des groupes hydroxy éthérifiés liés au squelette carboné
G11B 5/725 - Revêtements protecteurs, p.ex. antistatiques contenant un lubrifiant
G11B 5/84 - Procédés ou appareils spécialement adaptés à la fabrication de supports d'enregistrement
C10M 107/38 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé macromoléculaire contenant des halogènes
C10N 20/04 - Poids moléculaire; Répartition du poids moléculaire
C10N 30/00 - Propriétés physiques ou chimiques particulières améliorées par l'additif caractérisant la composition lubrifiante, p.ex. additifs multifonctionnels
C10N 40/18 - Usages électriques ou magnétiques en relation avec des enregistrements sur bandes ou disques magnétiques
89.
PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Provided is a prepreg capable of developing dimensional stability of a substrate (laminated plate). Also provided are a laminated plate, a printed wiring board, and a semiconductor package obtained using the prepreg. Specifically, provided are a prepreg and the like, the prepreg having one fibrous base material and a thermosetting resin composition or a semicured product thereof, wherein the thermosetting resin composition contains a thermosetting resin (A) and an inorganic filler (B), and the prepreg has a highly filled region in which the content of the inorganic filler (B) is 45% by volume or more and a poorly filled region in which the content of the inorganic filler (B) is less than 45% by volume.
B29B 11/16 - Fabrication de préformes caractérisées par la structure ou la composition comprenant des charges ou des agents de renforcement
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08K 3/013 - Charges, pigments ou agents de renforcement
Provided are: an asphalt emulsion composition comprising a sulfur-copolymerized chloroprene, asphalt, and water; a method for producing the same; and a latex composition for asphalt modification comprising water and a sulfur-copolymerized chloroprene latex.
A thermally conductive sheet comprising a thermally conductive layer containing at least on kind of graphite particles (A) selected from the group consisting of scale shaped particles, ellipsoidal particles, and rod shaped particles, in which, the face direction in the case of a scale shaped particle, the longitudinal axis direction in the case of an ellipsoidal particles and the longitudinal axis direction in the case of a rod shaped particle, is oriented in the thickness direction of the thermally conductive layer, said thermally conductive sheet containing a metal component having a melting point of 200°C or less.
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
92.
LIQUID THERMALLY CONDUCTIVE MATERIAL, COMBINATION OF ELEMENTS FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET, THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET
A liquid thermally conductive material having a thermal conductivity rate of 5W/(m・K), for forming a liquid layer by being applied on at least one part of a thermally conductive layer containing thermally conductive particles.
An information processing device for assisting with the creation of an Ising model, the information processing device comprising: an input reception unit that receives input of an objective function obtained by formulating composite material properties corresponding to the composition thereof, and constraint conditions on the composition; and a data creation unit that creates an Ising model whereby an annealing optimization machine finds an optimal solution of a composition that satisfies a constraint expression and has optimal properties, wherein the constraint conditions on the composition include, for each substance group constituting the composite material, a condition regarding the number of substances in said substance group to be mixed into the composite material and include, for each substance included in the substance group, a condition regarding the amount of said substance, and the constraint expression is formulated such that a solution is not calculated to be an optimal solution of composition when at least one among the condition regarding the number of substances to be mixed and the condition regarding the amount of substance is not satisfied.
A maleimide resin according to the present invention is formed by reacting a tetracarboxylic acid dianhydride (a1), an amine (a2), and maleic anhydride (a3), the amine (a2) including a dimer diamine and a secondary amine that is not a dimer diamine, and at least one of the tetracarboxylic acid dianhydride (a1) and the amine (a2) including a compound that has a fluorene skeleton.
C08G 73/12 - Précurseurs de polyimides non saturés
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
95.
LIQUID THERMALLY CONDUCTIVE MATERIAL, COMBINATION OF MEMBERS FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET, THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET
A liquid thermally conductive material that has a thermal conductivity of 5 W/(m•K) or more and that is for forming a liquid layer by being applied on at least a part of a thermally conductive layer containing thermally conductive particles.
A thermally conductive sheet is provided with: a thermally conductive layer containing at least one kind of graphite particles (A) selected from the group consisting of scale shaped particles, ellipsoidal particles, and rod shaped particles, in which the face direction in the case of a scale-like particle, the longitudinal axis direction in the case of an ellipsoidal particle, and the longitudinal axis direction in the case of a rod shaped particle, is oriented in the thickness direction of said thermally conductive layer; and an adhesive layer containing a resin component and a thermally conductive filler, wherein said adhesive layer is located on at least one part of the main face of the thermally conductive layer.
Provided is a polymaleimide resin obtained by reacting a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and a maleic anhydride (a4), wherein the diamine (a2) contains a dimer diamine.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
98.
HEAT TRANSFER SHEET, HEAT DISSIPATION DEVICE, AND METHOD FOR PRODUCING HEAT TRANSFER SHEET
The present invention provides a heat transfer sheet which comprises a heat transfer layer that contains at least one kind of graphite particles (A) selected from the group consisting of scale-like particles, ellipsoidal particles and rod-like particles, wherein the surface direction in the case of the scale-like particles, the major axis direction in the case of the ellipsoidal particles, and the major axis direction in the case of the rod-like particles, are oriented in the thickness direction. This heat transfer sheet contains a metal component that has a melting point of 200°C or less.
The present invention analyzes the classification of a defect on the basis of an image having captured the defect. This defect analysis device comprises: a model storage unit for storing a feature extraction model that is generated by performing learning on the basis of learning data obtained by adding information indicating classifications of flaws to defect images having captured therein flaws generated on the surface of an object, and that extracts, from an input image, an image feature quantity with which the distance between similar images becomes small; a representative point determination unit for determining representative points for the respective classifications on the basis of the image feature quantity extracted from the defect image by using the feature extraction model; and a relationship visualization unit for outputting information indicating the relationship between the classifications on the basis of the distances between the representative points.
G06V 10/762 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant le regroupement, p.ex. de visages similaires sur les réseaux sociaux
100.
CERIUM-BASED ABRASIVE MATERIAL, POLISHING LIQUID, POLISHING LIQUID PRODUCTION METHOD, AND GLASS POLISHING METHOD
A cerium-based abrasive material containing composite rare earth abrasive material particles that contain lanthanum and cerium, wherein the cerium oxide content is at least 55.0 mass% of the total rare earth oxide (TREO) content, and the amount of dissolved lanthanum in a liquid mixture obtained by inserting 10 g of the cerium-based abrasive material and 40 g of pure water, as slurry components, and 130 g of zirconia beads having a particle diameter of 1 mm, as beads, into a 100 mL polyethylene container subjecting the cerium-based polishing material to a pulverization treatment for 30 minutes with a container rotation speed of 210 rpm using a ball mill stand is 40 mg/L or less.
C01F 17/241 - Composés ne contenant que des métaux des terres rares comme l'élément métallique le seul anion étant oxyde ou hydroxyde contenant plusieurs métaux des terres rares, p.ex. NdPrO3 ou LaNdPrO3
C09G 1/02 - Compositions de produits à polir contenant des abrasifs ou agents de polissage
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