Abrégé

A valuable metal recovery method includes: recovering a battery slag from lithium ion battery waste; adding an acid to the battery slag; adding a sulfur compound the leachate; filtering the first processed product to obtain a first processed filtrate; adding a sulfur compound to the first processed filtrate; filtering the second processed product to obtain a second processed filtrate; adding calcium hydroxide to the second processed filtrate; filtering the third processed product to obtain a third processed filtrate; adding sodium carbonate to the third processed filtrate; filtering the processed product; heating the fourth processed filtrate; blowing carbon dioxide or adding a carbonate; and filtering the processed product, wherein a pH of the second processed product is higher than a pH of the first processed product, and a pH of the third processed product is higher than the pH of the second processed product.

Classes IPC  ?

• H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
• C22B 1/16 - Frittage; Agglomération
• C22B 1/24 - Agglutination; Briquetage
• C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
• C22B 3/22 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par des procédés physiques, p.ex. par filtration, par des moyens magnétiques
• C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p.ex. des rognures, pour produire des métaux non ferreux ou leurs composés
• C22B 21/00 - Obtention de l'aluminium
• C22B 26/12 - Obtention du lithium

Abrégé

The coating film includes a laminated structure including at least one first layer and at least one second layer alternately disposed. The or each first layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlxTi1-x-y-zMy)BzN, where M is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.100≤x≤0.640, 0.001≤y≤0.100, and 0.060≤z≤0.400. The or each second layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlpCr1-p-q-rM′q)BrN, where M′ is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.650≤p≤0.900, 0.000≤q≤0.100, and 0.000≤r≤0.050.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier

Abrégé

This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.

Classes IPC  ?

• C22C 9/01 - Alliages à base de cuivre avec l'aluminium comme second constituant majeur
• B22D 11/00 - Coulée continue des métaux, c. à d. en longueur indéfinie
• C22C 1/02 - Fabrication des alliages non ferreux par fusion
• C22C 9/00 - Alliages à base de cuivre
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• C23C 14/34 - Pulvérisation cathodique
• H01J 37/34 - Tubes à décharge en atmosphère gazeuse fonctionnant par pulvérisation cathodique

Abrégé

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is set to 2.0 or less, and a length percentage of the small tilt grain boundary and the subgrain boundary with respect to all grain boundaries is set to 80% or less in terms of partition fraction.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages

Abrégé

A polyimide resin composition includes a polyimide resin and a filler dispersed in the polyimide resin, in which the polyimide resin has a dicarboxylic acid group or an acid anhydride group of the dicarboxylic acid group at both ends, and the filler includes at least one inorganic compound selected from the group consisting of aluminum oxide, aluminum hydroxide, magnesium oxide, and magnesium hydroxide on a surface thereof.

Classes IPC  ?

• C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
• C08K 3/22 - Oxydes; Hydroxydes de métaux
• C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
• H05K 1/05 - Substrat en métal isolé

Abrégé

This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers

Classes IPC  ?

• C07C 323/12 - Thiols, sulfures, hydropolysulfures ou polysulfures substitués par des halogènes, des atomes d'oxygène ou d'azote ou par des atomes de soufre ne faisant pas partie de groupes thio contenant des groupes thio et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné ayant les atomes de soufre des groupes thio liés à des atomes de carbone acycliques du squelette carboné le squelette carboné étant acyclique et saturé
• C25D 3/56 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages

Abrégé

To improve performance. A negative electrode material is a negative electrode material for a battery, and includes carbon, tungsten trioxide, and silicon particles (33) including silicon, and in the silicon particles (33), a ratio of the amount of Si in Si2p derived from elemental silicon to the amount of Si in Si2p derived from SiO2 in a surface layer is 3 or more, on an atomic concentration basis, as measured by X-ray photoelectron spectroscopy.

Classes IPC  ?

• H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
• H01M 4/48 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques
• H01M 4/583 - Matériau carboné, p.ex. composés au graphite d'intercalation ou CFx
• H01M 10/052 - Accumulateurs au lithium
• H01M 4/02 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif

Abrégé

A cutting insert has a multi-stage columnar shape with an insert central axis as a center, the cutting insert including: a head portion having a circular cutting edge with the insert central axis as a center, a shaft portion disposed on a lower side of the head portion in an insert axial direction along the insert central axis and having a smaller outer diameter dimension than the head portion; a step portion configured to connect the head portion and the shaft portion; and an index portion disposed over a part of the step portion and a part of the head portion and recessed inward in an insert radial direction from an outer peripheral surface of each of the step portion and the head portion, in which a plurality of the index portions are arranged in an insert circumferential direction, and each of the index portions has a planar alignment surface.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier

Abrégé

This flat conductive plate provided with an insulating film includes a flat conductive plate which is a punched product, and an insulating film which coats at least a part of the flat conductive plate, the insulating film is an electrodeposited film, the insulating film includes a polyamide-imide resin and a fluorine-based resin, an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less, a relative permittivity at 25° C. is in a range of 2.2 or more and 2.8 or less, and an average film thickness is in a range of 5 μm or more and 100 μm or less.

Classes IPC  ?

• C09D 5/44 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produits; Apprêts en pâte pour des applications électrophorétiques
• C25D 13/14 - Tubes; Anneaux; Corps creux
• H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
• H01B 13/06 - Isolation des conducteurs ou des câbles

Abrégé

A cBN sintered compact includes a binder phase that contains a Ti—Al alloy containing at least one of the Si, Mg, and Zn elements, Ti2CN, TiB2, AlN, and Al2O3; the ratio ITi2CN/ITiAl is 2.0 or more and 30.0 or less, wherein ITi2CN represents the intensity of the Ti2CN peak appearing at 2θ from 41.9° to 42.2° and ITiAl represents the intensity of the Ti—Al alloy peak appearing at 2θ from 39.0° to 39.3° in XRD; and, in the mapped image of each element of Ti, Al, Si, Mg, and Zn by Auger electron spectroscopy, the ratio STiAlM/STiAl, is 0.05 or more and 0.98 or less wherein STiAlM represents the average area of the portions wherein Ti, Al and at least one selected from the group consisting of Si, Mg, and Zn overlap and STiAl represents the average area of the portions where Ti and Al overlap.

Classes IPC  ?

• C22C 26/00 - Alliages contenant du diamant

Abrégé

Free-cutting copper alloy comprises Cu: more than 59.7% but less than 64.7%, Si: more than 0.60% but less than 1.30%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.001% but less than 0.10 mass %, and P: more than 0.001% but less than 0.15%, with remainder being Zn and unavoidable impurities, wherein total amount of Fe, Mn, Co, and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, 56.7≤Cu−4.7×Si+0.5×Pb+0.5×Bi−0.5×P≤59.7 and 0.003≤Pb+Bi<0.25 are satisfied, 0.02≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.003≤Pb+Bi<0.08, 0.01≤Bi/(Pb+Bi)≤0.40 or 0.85≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.08≤Pb+Bi<0.13.

Classes IPC  ?

• C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages

Abrégé

A Li recovery method includes: an acid leaching step of adding an acid to a battery slag to produce a leachate; a first addition step of adding a Ca content to the leachate to produce a first processed product; a post-first-addition filtration step of filtering the first processed product to be separated into a first processing filtrate and a first processing residue; a second addition step of adding sodium carbonate to the first processing filtrate to produce a second processed product; a post-second-addition filtration step of filtering the second processed product to be separated into a second processing filtrate and a second processing residue; heating the second processing filtrate; blowing carbon dioxide into the heated second processing filtrate to produce a third processed product; and a post-carbonation filtration step of filtering the third processed product to be separated into a third processing filtrate and a third processing residue.

Classes IPC  ?

• H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
• C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p.ex. des rognures, pour produire des métaux non ferreux ou leurs composés
• C22B 26/12 - Obtention du lithium

Abrégé

Tungsten trioxide is appropriately disposed on the surface of carbon. A negative-electrode material is a negative-electrode material for a battery and contains amorphous carbon and tungsten trioxide provided on the surface of the amorphous carbon.

Classes IPC  ?

• H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
• H01M 4/48 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques
• H01M 4/587 - Matériau carboné, p.ex. composés au graphite d'intercalation ou CFx pour insérer ou intercaler des métaux légers

Abrégé

There is provided a method for producing a carbon material, including a carbon generation step of causing carbon dioxide to react with a reducing agent to generate carbon, in which, as the reducing agent, an oxygen-deficient iron oxide represented by Fe3O4-δ (where δ is 1 or more and less than 4), which is obtained by reducing magnetite while maintaining a crystal structure, or an oxygen-completely deficient iron (δ=4) which is obtained by completely reducing magnetite is used.

Classes IPC  ?

• C01B 32/15 - Matières carbonées nanométriques

Abrégé

There is provided a method for recovering lead from copper smelting dust according to the present invention includes an alkali leaching step of leaching lead contained in copper smelting dust with an alkali solution, a step of performing a solid liquid separation on a post-leaching solution and a leaching residue after the alkali leaching step, a neutralization step of adding an acid to the separated post-leaching solution to precipitate a lead, and a step of recovering a precipitate containing the lead by performing a solid liquid separation.

Classes IPC  ?

• C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
• C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p.ex. des rognures, pour produire des métaux non ferreux ou leurs composés
• C22B 7/02 - Mise en œuvre des cendres folles

Abrégé

Provided is a clamping tool for attaching a cutting insert to a holder or detaching a cutting insert from a holder, the cutting insert including a head portion having a circular cutting edge and a shaft portion, the clamping tool including: a first jaw portion configured to be locked to the holder; and an operation lever configured to be connected to the first jaw portion, in which the first jaw portion has a locking portion configured to be locked to the holder, and a first pressing portion configured to push the head portion downward and fit the shaft portion into a shaft hole portion of the holder when the operation lever is rotationally moved in a first direction using the locking portion as a fulcrum.

Classes IPC  ?

• B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p.ex. pouvant être fixés par des brides

Abrégé

A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.

Classes IPC  ?

• C25D 3/60 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'étain

Abrégé

The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.

Classes IPC  ?

• C09D 5/44 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produits; Apprêts en pâte pour des applications électrophorétiques

Abrégé

A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50° C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m·K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.

Classes IPC  ?

• H01M 50/383 - Moyens pare-flammes ou moyens de prévention de l’allumage
• H01M 50/202 - Boîtiers ou cadres autour du boîtier primaire d’une seule cellule ou d’une seule batterie
• H01M 50/227 - Matériau organique
• H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
• H01M 50/233 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p.ex. dimensions
• H01M 50/229 - Matériau composite constitué d'un mélange de matériaux organiques et inorganiques
• H01M 50/222 - Matériau inorganique
• C08L 81/02 - Polythio-éthers; Polythioéther-polyéthers
• C08L 77/06 - Polyamides dérivés des polyamines et des acides polycarboxyliques
• C08L 71/12 - Oxydes de polyphénylène
• C08L 67/02 - Polyesters dérivés des acides dicarboxyliques et des composés dihydroxylés

Abrégé

A surface-coated cutting tool includes a coating layer having a laminated structure that includes first sublayers and second sublayers having a cubic crystal structure and has an average thickness of 0.5 to 8 μm, the bottommost and topmost sublayers being both first sublayers; the first sublayer has an average thickness of 0.1 to 2 μm and a composition (Al1−xCrx)N, where x=0.20 to the second sublayer has an average thickness of 0.1 to 2 μm, has a composition (Al1-a-bCraSib)N where a=0.20 to 0.60, b=0.01 to 0.20, and has a repeated variation in Si content with an average interval of 1 to 100 nm between local minima and local maxima, the average local maximum and minimum are each within a specific range; and the diffraction peaks of the 111 and 200 diffraction peaks each have a predetermined full width at half maximum and a peak intensity.

Classes IPC  ?

• C04B 35/622 - Procédés de mise en forme; Traitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques
• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
• C04B 35/581 - Produits céramiques mis en forme, caractérisés par leur composition; Compositions céramiques; Traitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure d'aluminium
• C04B 35/58 - Produits céramiques mis en forme, caractérisés par leur composition; Compositions céramiques; Traitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures

Abrégé

This aluminum powder mixture is obtained by mixing a starting material powder, which is composed of pure aluminum or an aluminum alloy, with 5% by mass to 30% by mass of an aluminum alloy powder that has a lower melting point than the pure aluminum or the aluminum alloy. The aluminum alloy powder is composed of an aluminum alloy which has a composition that contains 5% by mass to 20% by mass of at least one of Si and Cu, and 0.2% by mass to 2.0% by mass of Mg, with a balance of aluminum and unavoidable impurities. Consequently, sintering among the aluminum powders is accelerated and it is possible to obtain an aluminum sintered body that has a higher density and a high electrical conductivity as well as obtaining a high thermal conductivity.

Classes IPC  ?

• B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
• B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
• B22F 3/10 - Frittage seul
• B22F 3/16 - Compactage et frittage par des opérations successives ou répétées
• B33Y 10/00 - Procédés de fabrication additive
• B22F 10/14 - Formation d’un corps vert par projection de liant sur un lit de poudre
• B22F 10/64 - Traitement de pièces ou d'articles après leur formation par des moyens thermiques
• B33Y 40/20 - Posttraitement, p.ex. durcissement, revêtement ou polissage
• C22C 21/02 - Alliages à base d'aluminium avec le silicium comme second constituant majeur
• C22C 21/16 - Alliages à base d'aluminium avec le cuivre comme second constituant majeur avec du magnésium
• C22C 21/14 - Alliages à base d'aluminium avec le cuivre comme second constituant majeur avec du silicium

Abrégé

A heatsink-integrated insulating circuit board includes a heat sink including a radiating fin, an insulating resin layer formed on a top plate part of the heat sink, and a circuit layer arranged on one surface of the insulating resin layer. An angle θ formed between an end of the metal piece and a surface of the insulating resin layer is set to be 70° or more and 110° or less. Root-mean-square heights Sq1 and Rq1 in bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece, and root-mean-square heights Sq2 and Rq1 in regions other than the bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece have a relationship of Sq1>Sq2 or Rq1>Rq2.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

In this slit copper material, a purity of Cu is 99.96% by mass or greater, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, and an average value of orientation densities at φ2=5°, in a range of φ1=0° to 90°, and at Φ=0° in a plate center portion is 2.0 or greater and less than 30.0.

Classes IPC  ?

• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• C22F 1/02 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid en atmosphère neutre ou contrôlée ou dans le vide

Abrégé

This zirconium-containing nitride powder has a composition represented by the following General Formula (I). (Zr, X, Y) (N, O) . . . (I). In General Formula (I), X represents at least one element selected from the group consisting of Dy, Er, Gd, Ho, Lu, Nd, Pr, Sc, Sm, Tb, and Tm, Y represents an element symbol of yttrium, an amount of Y is 0 mol or greater with respect to 1 mol of a total amount of Zr, X, and Y, N represents nitrogen, O represents oxygen, and an amount of oxygen is 0 mol or greater with respect to 1 mol of a total amount of nitrogen and oxygen.

Classes IPC  ?

• C01B 21/076 - Composés binaires de l'azote avec les métaux, le silicium ou le bore avec le titane ou le zirconium
• C08K 3/11 - Composés contenant des métaux des groupes 4 à 10 ou des groupes 14 à 16 de la classification périodique

Abrégé

This grooving tool includes a cutting insert, a holder, and a coolant flow path. The holder includes an insert mounting seat, and jaw parts that are disposed on an upper side and a lower side of the insert mounting seat and fix the cutting insert. The jaw part forms a curved shape as viewed from a tool distal end side, and has a thickness that is decreased as a distance from the insert mounting seat is increased. The coolant flow path includes a jaw part flow path extending through an inside of the jaw part, and the jaw part flow path includes a guide flow path section that has a vertically elongated shape with a dimension a in the vertical direction larger than a dimension b in the tool width direction in a channel cross section, and an ejection flow path section that has a laterally elongated shape

Classes IPC  ?

• B23C 3/28 - Rainurage des pièces
• B23C 5/20 - Outils de fraisage caractérisés par des particularités physiques autres que la forme à taillants ou dents amovibles

Abrégé

A wiper insert includes three first corner portions and three second corner portions which are alternately aligned on a polygonal surface in an insert circumferential direction. A cutting edge has a first cutting edge that performs a finishing operation on a work material, and a second cutting edge. An outer peripheral surface has a first flank face, a second flank face, and a first restraint surface disposed outward from the second cutting edge in an insert radial direction. When viewed in an insert axial direction, an insert shape is rotationally symmetrical by 180° around a rotation center axis passing through the second corner portion adjacent to a first side of a predetermined first corner portion in the insert circumferential direction and an insert center axis.

Classes IPC  ?

• B23C 5/20 - Outils de fraisage caractérisés par des particularités physiques autres que la forme à taillants ou dents amovibles
• B23C 5/06 - Fraises à surface, c. à d. fraises n'ayant qu'une surface de coupe pratiquement plate, ou principalement une telle surface
• B23C 5/22 - Dispositifs pour la fixation des taillants ou des dents

Abrégé

The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

Classes IPC  ?

• C25D 3/60 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'étain

Abrégé

In production of a solid electrolyte member, the amount or kinds of sulfides used as raw materials are reduced. A method of producing a solid electrolyte member is a method of producing a solid electrolyte member based on sulfide, the method including: a preparation step (S10) of preparing an aggregate of starting materials, in which the starting materials include elemental sulfur, and a non-sulfide raw material that is at least one of an element as an elemental substance other than sulfur that constitutes the solid electrolyte member, and a compound of elements other than sulfur that constitute the solid electrolyte member; and a forming step (S12) of heating the aggregate of starting materials to form the solid electrolyte member. The non-sulfide raw material contains no elements other than elements except sulfur that constitute the solid electrolyte member, except inevitable impurities.

Classes IPC  ?

• H01M 10/0562 - Matériaux solides

Abrégé

A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages

Abrégé

There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

What is provided is a method for separating cobalt and nickel including: a crushing and sorting step of crushing and classifying the lithium ion secondary battery to obtain an electrode material containing at least cobalt, nickel, copper, and lithium; a leaching step of immersing the electrode material in a processing liquid containing sulfuric acid and hydrogen peroxide to obtain a leachate; a copper separation step of adding a hydrogen sulfide compound to the leachate with stirring and subsequently carrying out solid-liquid separation to obtain an eluate containing cobalt and nickel and a residue containing copper sulfide; and a cobalt/nickel separation step of adding an alkali metal hydroxide to the eluate to adjust a pH and subsequently, adding a hydrogen sulfide compound with stirring and carrying out solid-liquid separation to obtain a precipitate containing cobalt sulfide and nickel sulfide and a residual liquid containing lithium.

Classes IPC  ?

• C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
• H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
• C22B 23/00 - Obtention du nickel ou du cobalt
• C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p.ex. des rognures, pour produire des métaux non ferreux ou leurs composés
• C22B 3/44 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par des procédés chimiques
• C22B 3/22 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par des procédés physiques, p.ex. par filtration, par des moyens magnétiques
• C22B 3/40 - Mélanges

Abrégé

The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y2O3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S1−S2)/S1]×100 (1). However, in the expression (1), S1 is an area of the film and S2 is an area of a pore portion in the film.

Classes IPC  ?

• C23C 18/12 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement; Dépôt par contact par décomposition thermique caractérisée par le dépôt sur des matériaux inorganiques, autres que des matériaux métalliques

Abrégé

A slit copper material, a purity of Cu is comprises 99.96% by mass or greater of Cu. In this slit copper material, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, a ratio B/A of an average crystal grain size B in a plate surface layer portion to an average crystal grain size A in a plate center portion is in a range of 0.80 or greater and 1.20 or less, and the average crystal grain size A in the plate center portion is 25 μm or less.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22C 1/03 - Fabrication des alliages non ferreux par fusion utilisant des alliages-mères
• C22F 1/02 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid en atmosphère neutre ou contrôlée ou dans le vide
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages

Abrégé

A method of recovering cobalt and nickel includes the steps of: adding alkaline to an acidic solution containing aluminum together with cobalt and nickel, adjusting pH of the acidic solution to 5 to 7, and converting the cobalt, the nickel and the aluminum into hydroxides thereof; recovering the hydroxides by solid-liquid separation, mixing the recovered hydroxides with an alkaline solution, and leaching aluminum contained in the hydroxides under a liquid condition of pH 8 or more; and recovering a cobalt hydroxide and a nickel hydroxide that aluminum is separated therefrom by solid-separation on a leachate.

Classes IPC  ?

• C01G 51/04 - Oxydes; Hydroxydes
• C01G 53/04 - Oxydes; Hydroxydes
• C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
• C22B 3/08 - Acide sulfurique
• C22B 3/12 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques alcalines
• C22B 3/22 - Traitement ou purification de solutions, p.ex. de solutions obtenues par lixiviation par des procédés physiques, p.ex. par filtration, par des moyens magnétiques
• C22B 21/00 - Obtention de l'aluminium
• H01M 10/54 - Récupération des parties utiles des accumulateurs usagés

Abrégé

A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 μm or more and 20.0 μm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.

Classes IPC  ?

• H01R 43/16 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour la fabrication des pièces de contact, p.ex. par découpage et pliage
• C25D 7/06 - Fils; Bandes; Feuilles
• C25D 3/64 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'argent

Abrégé

A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.

Classes IPC  ?

• C25D 5/10 - Dépôt de plusieurs couches du même métal ou de métaux différents
• C25D 3/60 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'étain
• C25D 3/56 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages
• C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
• C25D 7/06 - Fils; Bandes; Feuilles
• H01R 4/18 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c. à d. se touchant l'un l'autre; Moyens pour réaliser ou maintenir de tels contacts; Connexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation effectuées uniquement par torsion, enroulage, pliage, sertissage ou autre déformation permanente par sertissage

Abrégé

A chip discharging flute is formed in a tip outer peripheral portion of a drill body rotated around an axis in a drill rotation direction. A cutting edge is formed in an intersection ridgeline portion between a wall surface of the chip discharging flute facing the drill rotation direction and a tip flank. The cutting edge includes a main cutting edge portion extending from an inner peripheral side toward an outer peripheral side of the drill body, and a cutting edge shoulder portion extending from an outer peripheral end of the main cutting edge portion to an outer periphery of the drill body, and is subjected to honing. Compared to the outer peripheral end of the main cutting edge portion, in an outer peripheral end of the cutting edge shoulder portion, a true rake angle is increased on a negative rake angle side, and a size of the honing decreases.

Classes IPC  ?

• B23B 51/02 - Forets hélicoïdaux

Abrégé

This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages

Abrégé

This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200° C. or higher. The residual stress ratio RSG at 180° C. for 30 hours is 20% or greater. The ratio RSG/RSB at 180° C. for 30 hours is greater than 1.0.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
• C09K 5/14 - Substances solides, p.ex. pulvérulentes ou granuleuses

Abrégé

This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, in which among the inevitable impurities, a S amount is 10 mass ppm or less, a P amount is 10 mass ppm or less, a Se amount is 5 mass ppm or less, a Te amount is 5 mass ppm or less, an Sb amount is 5 mass ppm or less, a Bi amount is 5 mass ppm or less, an As amount is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater, and a residual stress ratio at 150° C. for 1000 hours is 20% or greater.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c. à d. non caractérisé par le procédé de revêtement
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages

Abrégé

A copper alloy plastically-worked material comprises Mg in the amount of greater than 10 mass ppm and 100 mass ppm or less and a balance of Cu and inevitable impurities, that comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less, the electrical conductivity is 97% IACS or greater. The tensile strength is 200 MPa or greater. The heat-resistant temperature is 150° C. or higher.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
• C21D 8/06 - Modification des propriétés physiques par déformation en combinaison avec, ou suivie par, un traitement thermique pendant la fabrication de barres ou de fils

Abrégé

A CO2 separation/recover method in cement production exhaust gas has a step of harmful component removal that removes an acidic component and a harmful component from exhaust gas discharged from a cement production facility; and a step of CO2 separation and recover that separates and recovers CO2 by bringing the exhaust gas from which the acidic component and the harmful component are removed into contact with a CO2 absorption material, so that the acidic component and the harmful component are removed before separating and recovering CO2, resulting in deterioration of the absorbing ability of the CO2 absorption material being suppressed; and the cement production exhaust gas can be appropriately disposed.

Classes IPC  ?

• B01D 53/14 - SÉPARATION Épuration chimique ou biologique des gaz résiduaires, p.ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par absorption
• B01D 53/62 - Oxydes de carbone
• B01D 53/26 - Séchage des gaz ou vapeurs

Abrégé

Generating methane by adding hydrogen to CO2 in exhaust gas discharged a from cement production facility or CO2 that is separated and recovered from the exhaust gas, and using the methane as an alternative fuel to fossil fuel such as coal, petroleum, natural gas and the like, by methanation of CO2 in the exhaust gas from the cement production facility that includes exhaust gas originated from lime stone not from the fossil oil and effectively utilizing it, it is possible to reduce usage of the fossil fuel, suppress CO2 originated from energy, and improve an effect of reducing greenhouse gas.

Classes IPC  ?

• C04B 7/36 - Fabrication des ciments hydrauliques en général
• C04B 7/44 - Cuisson; Fusion
• C07C 1/12 - Préparation d'hydrocarbures à partir d'un ou plusieurs composés, aucun d'eux n'étant un hydrocarbure à partir d'oxydes de carbone à partir d'anhydride carbonique avec de l'hydrogène

Abrégé

There is provided a manufacturing method for an insulating resin circuit substrate, which is a manufacturing method for an insulating resin circuit substrate which includes an insulating resin layer composed of a polyimide resin and a circuit layer consisting of metal pieces disposed in a circuit pattern shape on one surface of the insulating resin layer. The manufacturing method includes a temporary fixing step of pressurizing the metal pieces toward the resin sheet material while heating the metal pieces to temporarily fix the metal pieces and a joining step of disposing a cushion material on a side of the metal pieces which are temporarily fixed and pressurizing the metal pieces and the resin sheet material in a laminating direction, while heating the metal pieces and the resin sheet material, to join the resin sheet material and the metal pieces.

Classes IPC  ?

• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif

Abrégé

A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 μm from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.

Classes IPC  ?

• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques

Abrégé

A cBN sinter comprising cubic boron nitride grains and a binder phase, the binder phase comprising Ti2CN and TiAl3, wherein the ratio ITi2CN/ITiAl3 of the peak intensity ITi2CN of Ti2CN appearing at 2θ=41.9° to 42.2° to the peak intensity ITiAl3 of TiAl3 appearing at 2θ=39.0° to 39.3° is in a range of 2.0 to 30.0 in an XRD measurement.

Classes IPC  ?

• C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur composition; Compositions céramiques; Traitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique
• C04B 35/626 - Préparation ou traitement des poudres individuellement ou par fournées
• C04B 35/645 - Frittage sous pression
• C04B 35/65 - Frittage par réaction de compositions contenant un métal libre ou du silicium libre

Abrégé

There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: CuxSe(1−y)TeyMz, There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: CuxSe(1−y)TeyMz, 1.95≤x<2.05,0≤y≤0.1,0.002≤z≤0.03.

Classes IPC  ?

• C01B 19/00 - Sélénium; Tellure; Leurs composés
• H10N 10/852 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques comprenant du tellure, du sélénium ou du soufre

Abrégé

A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

Classes IPC  ?

• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

A negative electrode material is a negative electrode material for a battery, and the material includes carbon, tungsten trioxide formed on the surface of the carbon, and silicon formed on the surface of the carbon.

Classes IPC  ?

• H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
• H01M 4/583 - Matériau carboné, p.ex. composés au graphite d'intercalation ou CFx
• H01M 4/485 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques d'oxydes ou d'hydroxydes mixtes pour insérer ou intercaler des métaux légers, p.ex. LiTi2O4 ou LiTi2OxFy
• H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
• H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p.ex. batteries à insertion ou intercalation de lithium dans les deux électrodes; Batteries à l'ion lithium

Abrégé

A cBN sinter comprising cubic boron nitride grains and a binder phase, the binder phase comprising Ti2CN and Co2B, wherein the ratio ITi2CN/ICo2B of a peak intensity ITi2CN assigned to Ti2CN appearing at 2θ = 41.9° to 42.2° to a peak intensity ITiAl3 assigned to Co2B appearing at 2θ = 45.7° to 45.9° is in a range of 0.5 and 2.0 in an XRD measurement.

Classes IPC  ?

• C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur composition; Compositions céramiques; Traitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique

Abrégé

A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/µm or more and 100% by mass/µm or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.

Classes IPC  ?

• C25D 5/50 - Post-traitement des surfaces revêtues de métaux par voie électrolytique par traitement thermique
• C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
• B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal
• B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
• C25D 3/30 - Dépôt électrochimique; Bains utilisés à partir de solutions d'étain

Abrégé

A titanium substrate of the present invention includes a substrate main body formed of titanium or a titanium alloy, in which a Magneli phase titanium oxide film formed of a Magneli phase titanium oxide represented by a chemical formula TinO2n-1 (4≤n≤10) is formed on a surface of the substrate main body and a BET value of the substrate main body on which the Magneli phase titanium oxide film is formed is 0.1 m2/g or less.

Classes IPC  ?

• C25B 11/063 - Métal valve, c. à d. dont l’oxyde est semi-conducteur, p.ex. titane
• C25B 11/031 - PROCÉDÉS ÉLECTROLYTIQUES OU ÉLECTROPHORÉTIQUES POUR LA PRODUCTION DE COMPOSÉS ORGANIQUES OU MINÉRAUX, OU DE NON-MÉTAUX; APPAREILLAGES À CET EFFET Électrodes; Leur fabrication non prévue ailleurs caractérisées par la configuration ou la forme perforées ou foraminées Électrodes poreuses
• C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau

Abrégé

A method for producing lithium sulfide includes: a preparation process (step S12) at which a raw material and a reducing agent are charged into a furnace, the raw material being mainly composed of lithium sulfate having a property of weight loss of 5% or more to 25% or less upon heating to 120° C.; and a temperature raising process (step S14) at which the raw material and the reducing agent are heated in the furnace to raise the temperature.

Classes IPC  ?

• C01B 17/26 - Préparation par réduction avec du charbon

Abrégé

A heat exchanger having an outer tube through which a heating or cooling medium flows, a heat source that heats or cools the outer tube at a middle position at the exterior, and a heat-exchange part which can perform a heat exchange between the heating or cooling medium flows in the outer tube and the heat source; the heat-exchange part is provided with a porous body in a cylindrical shape being in close contact with an inner peripheral surface of the outer tube, at least one inside channel that is formed inside the porous body, and at least one valve that opens and closes the inside channel; and continuous pores that communicate with both ends of the flow direction of the heating or cooling medium and through which the heating or cooling medium can flow are formed.

Classes IPC  ?

• F28F 13/00 - Dispositions pour modifier le transfert de chaleur, p.ex. accroissement, diminution
• F28D 1/04 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source d avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec canalisations tubulaires
• F28D 7/10 - Appareils échangeurs de chaleur comportant des ensembles de canalisations tubulaires fixes pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation les canalisations étant disposées l'une dans l'autre, p.ex. concentriquement

Abrégé

An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.

Classes IPC  ?

• H05K 3/44 - Fabrication de circuits à âme métallique isolée
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

A surface coated cutting tool comprises: a tool substrate and a coating layer on a surface of the tool substrate; wherein the coating layer comprises a lower layer, an intermediate layer, and an upper layer, in sequence from the tool substrate toward the surface of the tool. The lower layer comprises an A layer having an average composition represented by formula: (Al1-xCrx)N, where x is 0.20 to 0.60; the intermediate layer comprises a B layer having an average composition represented by formula: (Al1-a-bCraSib)N, where a is 0.20 to 0.60 and b is 0.01 to 0.20; and the upper layer comprises a C layer having an average composition represented by formula: (Ti1-α-βSiαWβ)N where α is 0.01 to 0.20 and β is 0.01 to 0.10; and the upper layer has a repeated variation in W level with an average interval of 1 nm to 100 nm between adjacent local maxima and minima.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
• C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement

Abrégé

A member for a plasma processing apparatus includes a base material and a heat transfer layer provided on one surface of the base material, and the heat transfer layer contains at least one of a fluorine-based resin and a fluorine-based elastomer.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces

Abrégé

A pure copper sheet has a composition including 99.96 mass% or more of Cu, 9.0 mass ppm or more and less than 100.0 mass ppm of a total content of Ag, Sn, and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 µm or more, the pure copper sheet has crystals in which crystal planes parallel to the rolled surface are a {022} plane, a {002} plane, a {113} plane, a {111} plane, and a {133} plane, and diffraction peak intensities of the individual crystal planes that are obtained by X-ray diffraction measurement by a 2θ/θ method on the rolled surface satisfy I {022}/(I {022} + I {002} + I {113} + I {111} + I {133}) ≤ 0.15, I {002}/I {111} ≥ 10.0, and I {002}/I {113} ≥ 15.0.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé

Abrégé

A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.

Classes IPC  ?

• C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
• C25D 3/46 - Dépôt électrochimique; Bains utilisés à partir de solutions d'argent
• C25D 3/12 - Dépôt électrochimique; Bains utilisés à partir de solutions de nickel ou de cobalt
• H01R 13/03 - Contacts caractérisés par le matériau, p.ex. matériaux de plaquage ou de revêtement
• C25D 3/56 - Dépôt électrochimique; Bains utilisés à partir de solutions d'alliages
• C25D 5/16 - Dépôt de couches d'épaisseur variable

Abrégé

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, and, in a case where a measurement area of 1 mm2 or more is measured by an EBSD method at measurement intervals of 5 μm steps, a measurement point where a CI value analyzed with data analysis software OIM is 0.1 or less is excluded, and a boundary where an orientation angle between adjacent pixels is 5° or more is regarded as a crystal grain boundary, a Kernel average misorientation (KAM) value is 1.50 or less.

Classes IPC  ?

• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• C22C 9/00 - Alliages à base de cuivre

Abrégé

An antimicrobial member includes a substrate, an underlayer deposited on the substrate, and a copper layer formed on a surface of the underlayer which is on a side opposite to the substrate and arranged as an outermost layer, in which the copper layer is formed of copper or a copper alloy, the underlayer is formed of a metal oxide, and the substrate is formed of a flexible resin material. It is preferable that no cracking is confirmed after carrying out a bending test 100 times under a condition where a radius of curvature is 6 mm.

Classes IPC  ?

• A01N 25/34 - Formes façonnées, p.ex. feuilles, non prévues dans l'un quelconque des autres sous-groupes du présent groupe principal
• A61L 2/238 - Métaux ou alliages, p.ex. métaux oligodynamiques
• A01N 59/20 - Cuivre
• A01P 1/00 - Désinfectants; Composés antimicrobiens ou leurs mélanges

Abrégé

When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/05 - Substrat en métal isolé
• C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques

Abrégé

A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100° C. or higher and 150° C. or lower, the insulating layer contains a resin, and a relationship between a thickness t (μm) of the insulating layer and an elastic modulus E (GPa) of the insulating layer at 100° C. satisfies a following formula (1). A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100° C. or higher and 150° C. or lower, the insulating layer contains a resin, and a relationship between a thickness t (μm) of the insulating layer and an elastic modulus E (GPa) of the insulating layer at 100° C. satisfies a following formula (1). 10

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A metal base substrate of the present invention includes a metal substrate, an insulating layer, and a circuit layer, which are laminated in this order, in which the insulating layer contains an insulating resin and an inorganic filler, and an elastic modulus (unit: GPa) at 100° C. of the insulating layer, an elastic modulus (unit: GPa) at 100° C. of the circuit layer, a thickness (unit: μm) of the insulating layer, a thickness (unit: μm) of the circuit layer, and a thickness (unit: μm) of the metal substrate are set so as to satisfy predetermined formulae.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé

Abrégé

Provided is a heat flow switching element that has a larger change in thermal conductivity, has excellent thermal responsiveness, and is capable of directly detecting a temperature change. The heat flow switching element according to the present invention includes: a heat flow control element part 10 including an N-type semiconductor layer 3, an insulator layer 4 laminated on the N-type semiconductor layer, and a P-type semiconductor layer 5 laminated on the insulator layer; and thermosensitive element parts 11A and 11B joined to the heat flow control element part. In addition, the thermosensitive element parts include: a thin-film thermistor portion made of a thermistor material; and a pair of counter electrodes formed facing each other on an upper side and/or a lower side of the thin-film thermistor portion, and the thin-film thermistor portion is laminated on an upper side and/or a lower side of the heat flow control element part.

Classes IPC  ?

• G01K 1/16 - Dispositions particulières pour conduire la chaleur de l'objet à l'élément sensible
• G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p.ex. une thermistance
• G01K 17/06 - Mesure d'une quantité de chaleur transportée par des milieux en écoulement, p.ex. dans les systèmes de chauffage
• H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c. à d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température

Abrégé

A black material of the present invention consists of a zirconium nitride powder containing yttrium. The amount of the yttrium is 1.0% by mass to 12.0% by mass with respect to a total 100% by mass of the zirconium nitride powder and the yttrium. In a transmission spectrum obtained from a dispersion in which the concentration of the zirconium nitride powder containing yttrium is 50 ppm, assuming that the light transmittance at a wavelength of 550 nm is denoted by X1, and the light transmittance at a wavelength of 365 nm is denoted by X2, X1 is 7.5% or less, X2 is 25% or more, and X2/X1 is 3.5 or more.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• C01G 25/00 - Composés du zirconium

Abrégé

Provided is a surface-coated cutting tool including a complex carbonitride layer on the tool body, wherein a ratio of crystal grains having a NaCl type face-centered cubic structure is 80 area % or more, xavg and yavg satisfy 0.60≤xavg≤0.90 and 0.000≤yavg≤0.050, respectively, a composition of the Ti—Al complex carbonitride layer being represented by (Ti1-xAlx)(CyN1-y), the xavg being an average of x that is an Al content in a total content of Al and Ti, and the yavg being an average of y that is a C content in a total content of C and N, the crystal grains having the NaCl type face-centered cubic structure include crystal grains in which the x repeatedly increases and decreases, the crystal grains include 10 to 40 area % of crystal grains G1 having an average distance of 40 to 160 nm and crystal grains Gs having an average distance of 1 to 7 nm.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
• C23C 16/36 - Carbo-nitrures

Abrégé

A method for manufacturing a cutting tool includes: the cutting tool comprising a tool body made of a sintered alloy, a hard coating which is disposed on an outer surface of the tool body and has at least a layer formed of any of a carbide, a nitride, and a carbonitride, or a composite compound thereof, and a cutting edge which is formed at a ridge portion of the tool body and includes a portion of the hard coating located at the ridge portion, a laser peening step of directly irradiating the hard coating with a pulsed laser having a pulse width of 100 ps or less to apply compressive residual stress to the hard coating and a surface region of the tool body.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
• B23K 26/0622 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture

Abrégé

This punched-workpiece with the insulating film includes a punched-workpiece having a cut surface, a plating layer formed on at least the cut surface of the punched-workpiece, and an insulating film formed on the surface of the plating layer.

Classes IPC  ?

• C25D 9/02 - Revêtement électrolytique autrement qu'avec des métaux avec des matières organiques
• C25D 21/02 - Chauffage ou refroidissement
• C25D 3/38 - Dépôt électrochimique; Bains utilisés à partir de solutions de cuivre

Abrégé

Provided is an inorganic filler powder (3) having a structure in which at least a portion of the surface of inorganic particles (1) having a particle size of 1 μm or more is covered with inorganic microparticles (2) having a particle size of 10 nm or more and less than 0.1 μm, in which the coverage ratio of the surface of the inorganic particles (1) by the inorganic microparticles (2) is 30% or greater.

Classes IPC  ?

• C01F 7/44 - Déshydratation de l’oxyde ou de l'hydroxyde d'aluminium, c. à d. toutes les conversions d'une forme en une autre impliquant une perte d’eau
• C09C 1/40 - Composés de l'aluminium

Abrégé

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: µm) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H05K 1/02 - Circuits imprimés - Détails
• B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal

Abrégé

A surface coated cutting tool includes a tool substrate; and a hard coating layer on the tool substrate. The hard coating layer includes, in sequence from the tool substrate toward a surface of the tool, a titanium carbonitride inner layer, a titanium nitride lower intermediate layer, a titanium carbonitride upper intermediate layer, a titanium oxycarbonitride bonding auxiliary layer, and an aluminum oxide outer layer. Titanium nitride grain boundaries in the lower intermediate layer and titanium carbonitride grain boundaries in the upper intermediate layer are continuous from titanium carbonitride grain boundaries in the inner layer. The texture coefficient TC(422) of titanium carbonitride in the inner layer and the upper intermediate layer is 3.0 or more, and the texture coefficient TC(0 0 12) of α-aluminum oxide in the outer layer is 5.0 or more.

Classes IPC  ?

• B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
• C23C 16/40 - Oxydes
• C23C 16/36 - Carbo-nitrures
• C23C 16/30 - Dépôt de composés, de mélanges ou de solutions solides, p.ex. borures, carbures, nitrures
• C23C 16/02 - Pré-traitement du matériau à revêtir

Abrégé

A heat-exchange pipe that is excellent in heat-exchange property in which a metal porous body is not easily dropped off form a metal pipe; which is provided with the metal pipe and the metal porous body made by joining a plurality of metal fibers bonded to an inner-wall surface of the metal pipe; at least some of the metal fibers in the metal porous body are partially bonded to the inner-wall surface of the metal pipe along a length direction, bended on the inner-wall surface of the metal pipe, and extend to leave from the inner-wall surface.

Classes IPC  ?

• F28F 13/00 - Dispositions pour modifier le transfert de chaleur, p.ex. accroissement, diminution
• F28F 21/08 - Structure des appareils échangeurs de chaleur caractérisée par l'emploi de matériaux spécifiés de métal
• B22F 7/00 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage

Abrégé

A bonded body is a bonded body in which a first metal member is bonded to a second metal member, where the first metal member is formed of a material having a hardness higher than that of the second metal member. The bonded body has a structure in which the second metal member is inserted into a protruded and recessed portion formed on a bonding surface of the first metal member, and the bonded body has a region in which the first metal member is in direct contact with the second metal member, and a gap between the first metal member and the second metal member is filled with a resin material.

Classes IPC  ?

• B32B 3/30 - Produits stratifiés caractérisés essentiellement par le fait qu'une des couches comporte des discontinuités ou des rugosités externes ou internes, ou bien qu'une des couches est de forme générale non plane; Produits stratifiés caractérisés essentiellement par des particularismes de forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p.ex. des gorges, des nervures
• B32B 7/022 - Propriétés mécaniques
• B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique

Abrégé

There is provided a thermoelectric conversion material in which a first layer containing Mg2SixSn1-x (here, 0

Classes IPC  ?

• H10N 10/855 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques comprenant des composés contenant du bore, du carbone, de l'oxygène ou de l'azote
• H10N 10/851 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques
• H10N 10/01 - Fabrication ou traitement

Abrégé

Any metal having a low α-ray emission, the metal being any one of tin, silver, copper, zinc, or indium, wherein an emission of an α-ray after heating the metal at 100° C. in an atmosphere for six hours is 0.002 cph/cm2 or less. Any metal of tin, silver, copper, zinc and indium each including lead as an impurity is dissolved to prepare a hydrosulfate aqueous solution of the metal and lead sulfate is precipitated and removed in the solution. The lead sulfate is precipitated in the hydrosulfate aqueous solution by adding a lead nitrate aqueous solution including lead having an α-ray emission of 10 cph/cm2 or less to the hydrosulfate aqueous solution, from which the lead sulfate has been removed, and, at the same time, the solution is circulated while removing the lead sulfate to electrowinning the metal using the hydrosulfate aqueous solution as an electrolytic solution.

Classes IPC  ?

• C22C 13/00 - Alliages à base d'étain
• B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
• C22B 13/08 - Séparation des métaux du plomb par précipitation, p.ex. procédé Parkes
• C22B 25/08 - Affinage
• C25C 1/12 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions du cuivre
• C25C 1/14 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions de l'étain
• C25C 1/16 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions du zinc, du cadmium ou du mercure
• C25C 1/20 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux nobles
• C25C 1/22 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux non prévus dans les groupes

Abrégé

In an insulating circuit substrate, aluminum sheets formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate and, in the aluminum sheets, Cu is solid-solubilized at a bonding interface with the ceramic substrate and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 μm in a thickness direction from the bonding interface to the aluminum sheets side is 0.30 or more and 0.85 or less.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is 2.0 or less, and an average crystal grain size of the crystal grains on the rolled surface after a pressure heat treatment performed under conditions of a pressure of 0.6 MPa, a heating temperature of 850° C., and a retention time at the heating temperature of 90 minutes is 500 μm or less.

Classes IPC  ?

• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• C22C 9/00 - Alliages à base de cuivre
• B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
• B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
• B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre

Abrégé

An infrared shielding film is an infrared shielding film including: an organic binder; and a plurality of tin-doped indium oxide particles (ITO particles) dispersed in the organic binder, in which the average center-to-center distance between adjacent particles of the ITO particles is in a range of 9 nm or more and 36 nm or less, the ratio of the average center-to-center distance between the adjacent particles to the average primary particle diameter of the ITO particles is in a range of 1.05 or more and 1.20 or less, and a roughness Ra of a film surface is in a range of 4 nm or more and 50 nm or less.

Classes IPC  ?

• G02B 5/20 - Filtres
• C08J 5/18 - Fabrication de bandes ou de feuilles
• C08K 3/22 - Oxydes; Hydroxydes de métaux
• G02B 5/26 - Filtres réfléchissants

Abrégé

Provided is a method of manufacturing an electrode plate for a plasma processing apparatus for forming a plurality of gas holes having a straight portion exceeding 12 mm in length in a thickness direction of an electrode plate main body in a penetrating state and in parallel to each other, the method including: a prepared hole forming step of forming a prepared hole with a diameter of 50% or more and 80% or less of a diameter of a hole forming the straight portion with a first drill from one surface of the electrode plate main body; and a straight portion forming step of forming the straight portion to overlap the prepared hole with a second drill.

Classes IPC  ?

• H01J 9/02 - Fabrication des électrodes ou des systèmes d'électrodes
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse

Abrégé

A thermoelectric conversion module is formed by arranging, on one surface, a plurality of thermoelectric conversion element pairs in which an n-type thermoelectric conversion element and a p-type thermoelectric conversion element are connected by interposing an electrode plate, and connecting the plurality of the thermoelectric conversion element pairs in series; and the thermoelectric conversion module has a first output terminal provided on one thermoelectric conversion element pair arranged at one end side of the plurality of the thermoelectric conversion element pairs connected in series, a second output terminal provided on the other thermoelectric conversion element pair arranged at the other end side of the plurality of the thermoelectric conversion element pairs connected in series, and an intermediate output terminal provided at any position between the thermoelectric conversion element pair arranged at the one end side and the thermoelectric conversion element pair arranged at the other end side.

Classes IPC  ?

• H01L 35/32 - DISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS - Détails fonctionnant exclusivement par effet Peltier ou effet Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
• H01L 35/06 - Jonctions amovibles, p.ex. utilisant un ressort

Abrégé

Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.

Classes IPC  ?

• C08K 9/04 - Ingrédients traités par des substances organiques
• C08K 5/07 - Aldéhydes; Cétones
• C08K 3/08 - Métaux
• B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
• H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages

Abrégé

This heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L2|, a ratio P/Cmax between a maximum curvature Cmax(l/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/Cmax>60.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails

Abrégé

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

Classes IPC  ?

• C09J 1/00 - Adhésifs à base de constituants inorganiques
• C09J 11/08 - Additifs macromoléculaires
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/06 - Additifs non macromoléculaires organiques

Abrégé

This thermoelectric conversion structure has a heat source and a thermoelectric conversion module installed at the heat source, where the thermoelectric conversion module has a plurality of thermoelectric conversion elements, a first electrode portion disposed on one end side of the thermoelectric conversion elements, and a second electrode portion disposed on the other end side of the thermoelectric conversion elements, and has a structure in which the plurality of thermoelectric conversion elements are electrically connected to each other via the first electrode portion and the second electrode portion, and at least a first electrode portion side of the thermoelectric conversion module, facing a heat source direction, has a structure that is free of fixation and free of restraint.

Classes IPC  ?

• H01L 35/32 - DISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS - Détails fonctionnant exclusivement par effet Peltier ou effet Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif

Abrégé

Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/μm or more and 5 mass %/μm or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages

Abrégé

This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.

Classes IPC  ?

• C25D 3/32 - Dépôt électrochimique; Bains utilisés à partir de solutions d'étain caractérisé par les constituants organiques utilisés pour le bain
• C25D 5/50 - Post-traitement des surfaces revêtues de métaux par voie électrolytique par traitement thermique
• C25D 5/00 - Dépôt électrochimique caractérisé par le procédé; Prétraitement ou post-traitement des pièces
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A thermoelectric conversion material includes Mg2SixSn1−x (where 0.3≤X≤1) and a boride containing one or two or more metals selected from titanium, zirconium, and hafnium. Further, it is preferable that the boride is one or two or more selected from TiB2, ZrB2, and HfB2.

Classes IPC  ?

• H01L 35/22 - Emploi d'un matériau spécifié pour les bras de la jonction utilisant des compositions inorganiques comprenant des composés contenant du bore, du carbone, de l'oxygène ou de l'azote
• H01L 35/10 - Connexions des fils

Abrégé

A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower, and an electrical conductivity of 15% IACS or higher and 20% IACS or lower.

Classes IPC  ?

• C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
• H01R 13/03 - Contacts caractérisés par le matériau, p.ex. matériaux de plaquage ou de revêtement
• H01R 13/11 - Alvéoles élastiques

Abrégé

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/μm.

Classes IPC  ?

• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
• B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
• B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
• B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
• B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
• B32B 37/18 - Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification impliquant uniquement l'assemblage de feuilles ou de panneaux individualisés

Abrégé

A method of producing copper oxide powder includes a high-purity copper acidic solution preparation step (S01) of preparing an acidic solution containing 99.99% by mass or more of copper regarding metal components as 100% by mass, an organic acid salt addition step (S02) of adding an organic acid salt to this high-purity copper acidic solution, an organic acid copper production step (S03) of generating an organic acid copper by reacting the added organic acid salt with copper ions, an organic acid copper recovery step (S04) of recovering the obtained organic acid copper, and a heating step (S05) of forming copper oxide powder by heating the recovered organic acid copper, in which the organic acid forming the organic acid salt has 10 or less carbon atoms, and copper oxide powder.

Classes IPC  ?

• C25D 3/38 - Dépôt électrochimique; Bains utilisés à partir de solutions de cuivre
• C01G 3/02 - Oxydes; Hydroxydes

Abrégé

The present invention provides a fine silicon powder and the like including fine silicon particles having a microscopically measured particle diameter of 1 μm or more and an average circularity determined in accordance with Formula (1) of 0.93 or more, in which an average particle diameter based on volume, which is measured by a laser diffraction scattering method, is in a range of 0.8 μm or more and 8.0 μm or less, an average particle diameter based on number, which is measured by the laser diffraction scattering method, is in a range of 0.100 μm or more and 0.150 μm or less, and a specific surface area, which is measured by a BET method, is in a range of 4.0 m2/g or more and 10 m2/g or less. Circularity=(4×π×projected area of particle)1/2/peripheral length of particle (1).

Classes IPC  ?

• C01B 33/02 - Silicium

Abrégé

According to the present invention, there is provided a copper/ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf/μm2 or more and 150 mgf/μm2 or less, the region being from 10 μm to 50 μm with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and the average value of KAM values is 3.0 or less.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22C 1/04 - Fabrication des alliages non ferreux par métallurgie des poudres
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages

Abrégé

In a ceramic/copper/graphene assembly, a ceramic member, a copper member formed of copper or a copper alloy, and a graphene-containing carbonaceous member containing a graphene aggregate are joined. At a joining interface between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metals selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.

Classes IPC  ?

• B32B 7/10 - Liaison entre couches au moins une des couches ayant des propriétés inter-réactives
• B32B 7/03 - Produits stratifiés caractérisés par la relation entre les couches; Produits stratifiés caractérisés par l’orientation relative des éléments caractéristiques entre les couches, ou par les valeurs relatives d’un paramètre mesurable entre les couches, c. à d. produits comprenant des couches ayant des propriétés physiqu; Produits stratifiés caractérisés par la jonction entre les couches concernant l’orientation des éléments caractéristiques
• B32B 15/16 - Produits stratifiés composés essentiellement de métal adjacent à une couche particulaire
• B32B 37/14 - Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches
• B32B 37/24 - Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches avec au moins une couche qui ne présente pas de cohésion avant la stratification, p.ex. constituée de matériau granulaire projeté sur un substrat
• B32B 37/10 - Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par la technique de pressage, p.ex. faisant usage de l'action directe du vide ou d'un fluide sous pression

Abrégé

This transistor sensor includes a substrate, a channel layer provided over one surface of the substrate, and a solid electrolyte layer provided between the substrate and the channel layer or over a surface of the channel layer on an opposite side to the substrate side, in which the channel layer includes an inorganic semiconductor, the solid electrolyte layer includes an inorganic solid electrolyte, and at least a portion of either one or both of the channel layer and the solid electrolyte layer includes an exposed portion exposed to outside.

Classes IPC  ?

• C12Q 1/6825 - Détecteurs faisant intervenir la détection d’acides nucléiques
• G01N 27/414 - Transistors à effet de champ sensibles aux ions ou chimiques, c. à d. ISFETS ou CHEMFETS

Abrégé

A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.

Classes IPC  ?

• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

This pure copper plate or sheet contains 99.96% by mass or greater of Cu, in which when an average crystal grain size of crystal grains in a rolled surface is represented by X μm and an amount of Ag is represented by Y mass ppm, an expression of 1×10−8≤X−3Y−1≤1×10−5 is satisfied, and when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NFJE and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NFJ2, an expression of 0.30<(NFJ2/(1−NFJ3))0.5≤0.48 is satisfied.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages

Abrégé

A rubber molded body is provided that is attachable to an outer circumference of one or more lithium ion secondary battery cells each having a safety valve or an exhaust hole in a manner that the safety valve or the exhaust hole is at least covered with the rubber molded body. The rubber molded body is further characterized in that a thermal conductivity measured by a unidirectional heat flux stationary comparison method pursuant to JIS H7903: 2008 (measured at 33° C.) is less than 1.0 W/m·K, a portion that covers the safety valve or the exhaust hole has a thickness greater than or equal to 0.3 mm and less than-or equal to 10.0 mm, and a surface hardness measured with a type A durometer pursuant to JIS K6253 is greater than or equal to 50 and less than or equal to 90.

Classes IPC  ?

• C08K 3/36 - Silice
• C08K 9/06 - Ingrédients traités par des substances organiques par des composés contenant du silicium

Abrégé

A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, an average crystal grain size is in a range of 10 μm or more and 100 μm or less, an electrical conductivity is 90% IACS or more, and a residual stress rate is 50% or more at 150° C. after 1000 hours.

Classes IPC  ?

• C22C 9/00 - Alliages à base de cuivre
• H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
• C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c. à d. non caractérisé par le procédé de revêtement
• C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages