An integrated circuit includes a front-end interface, a back-end interface, a controller, and arbiter circuitry. The front-end interface communicates with a remote host over a front-end fabric. The back-end interface communicates with nonvolatile memory (NVM) subsystems over a back-end fabric. The controller is coupled between the front-end interface and the back-end interface. The controller receives commands from the remote host for the NVM subsystems, and stores the commands in queue pairs associated with the NVM subsystems. The arbiter circuitry receives data for the queue pairs, and selects a command from a first queue pair of the queue pairs based on a comparison of the data to one or more thresholds. The selected command is outputted to one or more of the NVM subsystems.
Methods and apparatus relating to transmission on physical channels, such as in networks on chips (NoCs) or between chiplets, are provided. One example apparatus generally includes a higher bandwidth client; a lower bandwidth client; a first destination; a second destination; and multiple physical channels coupled between the higher bandwidth client, the lower bandwidth client, the first destination, and the second destination, wherein the higher bandwidth client is configured to send first traffic, aggregated across the multiple physical channels, to the first destination and wherein the lower bandwidth client is configured to send second traffic, concurrently with sending the first traffic, from the lower bandwidth client, dispersed over two or more of the multiple physical channels, to the second destination.
H04L 49/109 - TRANSMISSION D'INFORMATION NUMÉRIQUE, p.ex. COMMUNICATION TÉLÉGRAPHIQUE Éléments de commutation de paquets caractérisés par la construction de la matrice de commutation intégrés sur micropuce, p.ex. interrupteurs sur puce
Methods and apparatus relating to transmission on physical channels, such as in networks on chips (NoCs) or between chiplets, are provided. One example apparatus generally includes a higher bandwidth client; a lower bandwidth client; a first destination; a second destination; and multiple physical channels coupled between the higher bandwidth client, the lower bandwidth client, the first destination, and the second destination, wherein the higher bandwidth client is configured to send first traffic, aggregated across the multiple physical channels, to the first destination and wherein the lower bandwidth client is configured to send second traffic, concurrently with sending the first traffic, from the lower bandwidth client, dispersed over two or more of the multiple physical channels, to the second destination.
Approaches for logic compaction include inputting an optimization directive that specifies one of area optimization or speed optimization to a synthesis tool executing on a computer processor. The synthesis tool identifies a multiplier and/or an adder specified in a circuit design and synthesizing the multiplier into logic having LUT-to-LUT connections between LUTs on separate slices of a programmable integrated circuit (IC) in response to the optimization directive specifying speed optimization. The synthesis tool synthesizes the multiplier and/or adder into logic having LUT-carry connections between LUTs and carry logic within a single slice of the programmable IC in response to the optimization directive specifying area optimization. The method includes implementing a circuit on the programmable IC from the logic having LUT-carry connections in response to the optimization directive specifying area optimization.
G06F 7/506 - Addition; Soustraction en mode parallèle binaire, c. à d. ayant un circuit de maniement de chiffre différent pour chaque position avec génération simultanée de retenue pour plusieurs étages ou propagation simultanée de retenue sur plusieurs étages
G06F 30/327 - Synthèse logique; Synthèse de comportement, p.ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
G06F 30/34 - Conception de circuits pour circuits reconfigurables, p.ex. réseaux de portes programmables [FPGA] ou circuits logiques programmables [PLD]
G06F 7/533 - Réduction du nombre d'étapes ou d'étages d'itération, p.ex. utilisant l'algorithme de Booth, sommation logarithmique, parité-imparité
G06F 7/57 - Unités arithmétiques et logiques [UAL], c. à d. dispositions ou dispositifs pour accomplir plusieurs des opérations couvertes par les groupes ou pour accomplir des opérations logiques
5.
PROGRAMMABLE NON-LINEAR ACTIVATION ENGINE FOR NEURAL NETWORK ACCELERATION
A programmable, non-linear (PNL) activation engine for a neural network is capable of receiving input data within a circuit. In response to receiving an instruction corresponding to the input data, the PNL activation engine is capable of selecting a first non-linear activation function from a plurality of non-linear activation functions by decoding the instruction. The PNL activation engine is capable of fetching a first set of coefficients corresponding to the first non-linear activation function from a memory. The PNL activation engine is capable of performing a polynomial approximation of the first non-linear activation function on the input data using the first set of coefficients. The PNL activation engine is capable of outputting a result from the polynomial approximation of the first non-linear activation function.
Receiver circuitry for an input/output device includes first stage circuitry and second stage. The first stage circuitry has a first input to receive an input signal, voltage adjustment circuitry, and differential amplifier circuitry. The first stage circuitry is coupled to the first input and has a transistor pair to receive the input signal, and adjust a voltage value of the input signal to generate an adjusted signal. The differential amplifier circuitry receives the adjusted signal and a reference signal, and generates a first differential signal and a second differential signal. The second stage circuitry receives the first differential signal and the second differential signal, and generates an output signal based on the first differential signal and the second differential signal.
Static and automatic realization of inter-basic block burst transfers for high-level synthesis can include generating an intermediate representation of a design specified in a high-level programming language, wherein the intermediate representation is specified as a control flow graph, and detecting a plurality of basic blocks in the control flow graph. A determination can be made that plurality of basic blocks represent a plurality of consecutive memory accesses. A sequential access object specifying the plurality of consecutive memory accesses of the plurality of basic blocks is generated. A hardware description language (HDL) version of the design is generated, wherein the plurality of consecutive memory accesses are designated in the HDL version for implementation in hardware using a burst mode.
Examples described herein provide for determining a recipe for identifying from which buckets integrated circuit chips are taken to form units of a multi-chip apparatus. In an example, a method uses a processor-based system and uses a Markov Decision Process. Buckets are defined based on respective characteristics of manufactured chips. Each of the manufactured chips is binned into a respective one of the buckets based on the characteristic of the respective manufactured chip. A recipe for identifying from which of the buckets to take one or more of the manufactured chips to incorporate into respective ones of the units of the multi-chip apparatus is generated.
G01R 31/28 - Test de circuits électroniques, p.ex. à l'aide d'un traceur de signaux
G06F 30/34 - Conception de circuits pour circuits reconfigurables, p.ex. réseaux de portes programmables [FPGA] ou circuits logiques programmables [PLD]
A machine learning-based process includes identifying a first set of features that includes features of a reference implementation of a circuit design and features of a synthesized version of a modified version of the circuit design. A first classification model is applied to the first set of features, and the first classification model indicates a full implementation flow or an incremental implementation flow. The full implementation flow is performed on the synthesized version of the modified version in response to the first classification model indicating the full implementation flow, and the incremental implementation flow is performed on the synthesized version of the modified version in response to the first classification model indicating the incremental implementation flow. The full and incremental implementation flows generate implementation data that is suitable for making an integrated circuit (IC).
G06F 30/327 - Synthèse logique; Synthèse de comportement, p.ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
G06F 30/31 - Saisie informatique, p.ex. éditeurs spécifiquement adaptés à la conception de circuits
Embodiments herein describe wrapping non-safety compliant hardware resources with error detection checking to satisfy a safety standard. Doing so permits non-safety compliant hardware to be used to perform one or more tasks in a system that, as a whole, satisfies a particular safety standard (e.g., one of the ASIL QM, A, B, C, and D grades).
G07C 5/00 - Enregistrement ou indication du fonctionnement de véhicules
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
H04W 4/48 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p.ex. communication véhicule-piétons pour la communication dans le véhicule
11.
METHOD AND SYSTEM FOR BUILDING HARDWARE IMAGES FROM HETEROGENEOUS DESIGNS FOR ELETRONIC SYSTEMS
Automatically generating a hardware image based on programming model types includes determining by a design tool, types of programming models used in specifications of blocks of a circuit design, in response to a user control input to generate a hardware image to configure a programmable integrated circuit (IC). The design tool can generate a model-type compiler script for each of the types of programming models. Each compiler script initiates compilation of blocks having specifications based on one of the types of programming model into an accelerator representation. The design tool can generate a build script configured to execute the compiler scripts and link the accelerator representations into linked accelerator representations. Execution of the build script builds a hardware image from the linked accelerator representations for configuring the programmable IC to implement a circuit according to the circuit design.
An integrated circuit includes an interposer and a die coupled to the interposer. The die includes a first data processing engine (DPE) array and a second DPE array. The first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs. The second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs. The integrated circuit includes one or more other dies having a first die interface coupled to, and configured to communicate with, the first DPE interface via the interposer and a second die interface coupled to, and configured to communicate with, the second DPE interface via the interposer.
A System-on-Chip includes a data processing engine array. The data processing engine array includes a plurality of data processing engines organized in a grid. The plurality of data processing engines are partitioned into at least a first partition and a second partition. The first partition includes one or more first data processing engines of the plurality of data processing engines. The second partition includes one or more second data processing engines of the plurality of data processing engines. Each partition is configured to implement an application that executes independently of the other partition.
H03K 19/17728 - Blocs logiques reconfigurables, p.ex. tables de consultation
H03K 19/17736 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de routage
14.
METHOD FOR SUPPORTING MULTIPLE CONCURRENT PLUGINS IN A PROGRAMMABLE INTEGRATED CIRCUIT
Techniques and apparatus for dynamically modifying a kernel (and associated user-specified circuitry) for a dynamic region of a programmable integrated circuit (IC) without affecting (e.g., while allowing) operation of other kernels ((and other associated user-specified circuitry) in the programmable IC. Dynamically modifying a kernel may include, for example, unloading an existing kernel, loading a new kernel, or replacing a first kernel with a second kernel). In the case of networking (e.g., in a data center application) where the programmable IC may be part of a hardware acceleration card (e.g., a network interface card (NIC)), the kernel may be user code referred to as a “plugin.”
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
H03K 19/17756 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de configuration pour la configuration partielle ou la reconfiguration partielle
H03K 19/1776 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de configuration pour les mémoires
15.
WRAPPING NON-SAFETY COMPLIANT HARDWARE RESOURCES WITH ERROR DETECTION CHECKING TO SATISFY A SAFETY STANDARD
Embodiments herein describe wrapping non-safety compliant hardware resources with error detection checking to satisfy a safety standard. Doing so permits non-safety compliant hardware to be used to perform one or more tasks in a system that, as a whole, satisfies a particular safety standard (e.g., one of the ASIL QM, A, B, C, and D grades).
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p.ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
G05B 19/042 - Commande à programme autre que la commande numérique, c.à d. dans des automatismes à séquence ou dans des automates à logique utilisant des processeurs numériques
G06F 21/64 - Protection de l’intégrité des données, p.ex. par sommes de contrôle, certificats ou signatures
G06F 21/72 - Protection de composants spécifiques internes ou périphériques, où la protection d'un composant mène à la protection de tout le calculateur pour assurer la sécurité du calcul ou du traitement de l’information dans les circuits de cryptographie
G06F 21/85 - Protection des dispositifs de saisie, d’affichage de données ou d’interconnexion dispositifs d’interconnexion, p.ex. les dispositifs connectés à un bus ou les dispositifs en ligne
H04L 9/32 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité comprenant des moyens pour vérifier l'identité ou l'autorisation d'un utilisateur du système
H04W 4/48 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p.ex. communication véhicule-piétons pour la communication dans le véhicule
H04W 12/106 - Intégrité des paquets ou des messages
16.
Data flow graph refinement using range set information for improved synthesis
Implementing a circuit design within an integrated circuit can include converting the circuit design, specified in a hardware description language, into a data flow graph and creating range set data structures in a memory. The range set data structures correspond to nodes of the data flow graph. Each range set data structure can be initialized with a range of values the corresponding node can take as specified by the circuit design. The method can include determining actual values the nodes are capable of taking by propagating the values through the data flow graph. The range set data structures are updated to store the actual values for the corresponding nodes. The method also can include modifying a selected node of the data flow graph based on the actual values stored in the range set data structure of the selected node and semantics of the selected node.
An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.
Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.
H01L 23/427 - Refroidissement par changement d'état, p.ex. caloducs
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 23/16 - Matériaux de remplissage ou pièces auxiliaires dans le conteneur, p.ex. anneaux de centrage
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
A chip package and method for fabricating the same are provided that includes an off-die inductor. The off-die inductor is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The redistribution layer is connected to a package substrate to form the chip package.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/498 - Connexions électriques sur des substrats isolants
20.
FLEXIBLE QUEUE PROVISIONING FOR PARTITIONED ACCELERATION DEVICE
Embodiments herein describe partitioning an acceleration device based on the needs of each user application executing in a host. In one embodiment, a flexible queue provisioning method allows the acceleration device to be dynamically partitioned by pushing the configuration through a control command queue to the device by management software running in a trusted zone. The new configuration is parsed and verified by trusted firmware, which, then, creates isolated IO command queues on the acceleration device. These IO command queues can be directly mapped to a user application, VM, or other PCIe devices. In one embodiment, each IO command queue exposes only the compute resource assigned by the trusted firmware in the acceleration device.
A universal interposer for an integrated circuit (IC) device has a body having a first surface and a second surface opposite the first surface. A first region is formed on a first side of the body along a first edge. The first region has first slots, each having an identical first bond pad layout. A second region is formed on the first side along a second edge, opposite the first edge. The second region has second slots having an identical second bond pad layout. A third region having third slots is formed on the first side between the first and second regions, each slot having an identical third bond pad layout. A pad density of the third bond pad layout is greater than the first bond pad layout. One of the third slots is coupled to contact pads disposed in a region not directly below any of the second slots.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
Circuitry for multiplying a sparse matrix by a dense vector includes a first switching circuit (302) for routing input triplets from N input ports to N output ports based on column indices of the triplets. Each triplet includes a non-zero value, a row index, and a column index. N first memory banks (303) store subsets of vector elements and are addressed by the column indices of the triplets. N multipliers (305) multiply the non-zero values of the triplets by the vector element read from the respective memory bank. A second switching circuit (304) routes tuples based on row indices of the tuples. Each tuple includes a product output by the one of the N multipliers and a row index output by an output port of the first switching circuit. N accumulator circuits (307) sum products of tuples having equal row indices.
An integrated circuit can include a communication endpoint configured to maintain a communication link with a host computer, a queue configured to receive a plurality of host commands from the host computer via the communication link, and a processor configured to execute a device runtime. The processor, responsive to executing the device runtime, is configured to perform validation of the host commands read from the queue and selectively execute the host commands based on a result of the validation on a per host command basis. The host commands are executable by the processor to manage functions of the integrated circuit. The queue is implemented in a region of memory that is shared by the integrated circuit and the host computer.
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p.ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
G06F 21/64 - Protection de l’intégrité des données, p.ex. par sommes de contrôle, certificats ou signatures
G06F 21/71 - Protection de composants spécifiques internes ou périphériques, où la protection d'un composant mène à la protection de tout le calculateur pour assurer la sécurité du calcul ou du traitement de l’information
G06F 13/16 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus de mémoire
Testbench creation for sub-design verification can include receiving, using computer hardware, a selection of a sub-design of a circuit design. The sub-design is one of a plurality of sub-designs of the circuit design. The circuit design includes a plurality of parameter values. A list of port-level signal information is generated for the selected sub-design. The one or more parameter values of the circuit design are extracted. Switching activity of each port-level signal from the list is logged in a switching activity file while running a circuit design testbench for the circuit design with the selected sub-design in scope. From the list, the switching activity, and the one or more parameter values, a sub-design testbench for the selected sub-design is generated.
G06F 30/333 - Conception en vue de la testabilité [DFT], p.ex. chaîne de balayage ou autotest intégré [BIST]
G06F 30/3308 - Vérification de la conception, p.ex. simulation fonctionnelle ou vérification du modèle par simulation
G06F 30/327 - Synthèse logique; Synthèse de comportement, p.ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
25.
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
26.
DIGITAL-TO-ANALOG CONVERTER (DAC)-BASED VOLTAGE-MODE TRANSMIT DRIVER ARCHITECTURE WITH TUNABLE IMPEDANCE CONTROL AND TRANSITION GLITCH REDUCTION TECHNIQUES
A digital-to-analog converter (DAC)-based voltage-mode transmit driver architecture. One example transmit driver circuit generally includes an impedance control circuit coupled to a plurality of DAC driver slices. The impedance control circuit generally includes a tunable impedance configured to be adjusted to match a load impedance for the transmit driver circuit. Another example transmit driver circuit generally has an output impedance that is smaller than the load impedance for the transmit driver circuit, such that an output voltage swing at differential output nodes of the transmit driver circuit is greater than a voltage of a power supply rail. Another example transmit driver circuit generally includes a predriver circuit with a first inverter coupled to a first output of the predriver circuit and a second inverter coupled to a second output of the predriver circuit, the transistors in at least one of the first inverter or the second inverter having different strengths.
A unified container file can be selected using computer hardware. The unified container file can include a plurality of files embedded therein used to configure a programmable integrated circuit (IC). The plurality of files can include a first partial configuration bitstream and a second partial configuration bitstream. The unified container file also includes metadata specifying a defined relationship between the first partial configuration bitstream and the second partial configuration bitstream for programming the programmable IC. The defined relationship can be determined using computer hardware by reading the metadata from the unified container file. The programmable IC can be configured, using the computer hardware, based on the defined relationship specified by the metadata using the first partial configuration bitstream and the second partial configuration bitstream.
G06F 21/53 - Contrôle des usagers, programmes ou dispositifs de préservation de l’intégrité des plates-formes, p.ex. des processeurs, des micrologiciels ou des systèmes d’exploitation au stade de l’exécution du programme, p.ex. intégrité de la pile, débordement de tampon ou prévention d'effacement involontaire de données par exécution dans un environnement restreint, p.ex. "boîte à sable" ou machine virtuelle sécurisée
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p.ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
A method includes receiving a value and an identifier from a first memory and hashing the identifier to produce a memory block identifier. The method also includes routing, based on the memory block identifier, a read request to a memory block of a plurality of memory blocks and updating the value received from the first memory based on a property received from the memory block in response to the read request. The memory further includes storing the updated value in the first memory.
Embodiments herein describe using an adaptive chip-to-chip (C2C) interface to interconnect two chips, wherein the adaptive C2C interface indudes circuitry for performing multiple different C2C protocois to communicate with the other chip. One or both of the chips in the C2C connection can include the adaptive C2C interface. During boot time, the adaptive C2C interface is configured to perform one of the different C2C protocois. During runtime, the chip then uses the selected C2C protocol to communicate with the other chip in the C2C connection.
Embodiments herein describe using an adaptive chip-to-chip (C2C) interface to interconnect two chips, wherein the adaptive C2C interface includes circuitry for performing multiple different C2C protocols to communicate with the other chip. One or both of the chips in the C2C connection can include the adaptive C2C interface. During boot time, the adaptive C2C interface is configured to perform one of the different C2C protocols. During runtime, the chip then uses the selected C2C protocol to communicate with the other chip in the C2C connection.
A rearranger circuit rearranges data elements of each raw image of a plurality of raw images according to a plurality of raw color channel arrays. The data elements of each raw image are input to the rearranger circuit according to instances of a pattern of color channels of a color filter array (CFA). The data elements specify values of the color channels in the instances of the pattern, and each raw color channel array has the data elements of one color channel of the color channels in the instances of the pattern. The rearranger circuit can be used in neural network training or in generating raw color channel arrays for performing neural network inference.
An inference server is capable of receiving a plurality of inference requests from one or more client systems. Each inference request specifies one of a plurality of different endpoints. The inference server can generate a plurality of batches each including one or more of the plurality of inference requests directed to a same endpoint. The inference server also can process the plurality of batches using a plurality of workers executing in an execution layer therein. Each batch is processed by a worker of the plurality of workers indicated by the endpoint of the batch.
A biasing scheme for a voltage-to-time converter (VTC). An example biasing circuit generally includes a reference current source; a feedback loop current source; an amplifier having a first input coupled to a target voltage node, having a second input, and having an output coupled to a control input of the reference current source and to a control input of the feedback loop current source; a first capacitive element; a first switch coupled in parallel with the first capacitive element; a second switch coupled between the feedback loop current source and the first capacitive element; and a third switch coupled between the first capacitive element and the second input of the amplifier.
An electronic device and methods for fabricating the same are disclosed herein that utilize a dam formed on a printed circuit board (PCB) that is positioned to substantially prevent edge bond material, utilized to secure a chip package to the PCB, from interfacing with the solder balls transmitting signals between the PCB and chip package.
Embodiments herein describe partitioning hardware and software in a system on a chip (SoC) into a hierarchy. In one embodiment, the hierarchy includes three levels of hardware-software configurations, enabling security and/or safety isolation across those three levels. The levels can cover the processor subsystem with compute, memory, acceleration, and peripheral resources shared or divided across those three levels.
G06F 9/455 - Dispositions pour exécuter des programmes spécifiques Émulation; Interprétation; Simulation de logiciel, p.ex. virtualisation ou émulation des moteurs d’exécution d’applications ou de systèmes d’exploitation
36.
Synchronous clock domain crossing skew optimization and multi-clock buffer (MBUFG)
Synthetizing a hardware description language code into a netlist comprising loads and a multi-clock buffer (MBUF). The MBUF receives a global clocking signal and generates a first and a second related clocking signals. The loads are grouped into a first and a second groups receiving the first and the second clocking signals respectively. A first/second clock modifying leaf are placed between a common node and the first/group groups respectively, wherein the common node is positioned closer in proximity to the first/second groups in comparison to a clock source generating the global clocking signal. The first/second clock modifying leaves receive a least divided clocking signal from the MBUF and generate the first/second clocking signals respectively. The least divided clocking signal is routed from the MBUF to the first/second clock modifying leaves. The first/second clocking signals are routed from the first/second clock modifying leaves to the first/second group respectively.
Embodiments herein describe techniques for managing power consumption and temperature in an electronic circuits or integrated chips driven by clock signals (collectively referred to as “cards”) by throttling the clock signals on those cards. The cards often allow users to implement customized hardware acceleration functions via Field Programmable Gate Arrays or the like, which can lead to variable workloads on different cards (or regions of individual cards) based on the customized functionality. By throttling the clock signal based on continuously monitored power consumption or temperature, the user is enabled to use the card more aggressively (e.g., based on average rather than worst-case power consumption), and the card automatically throttles operations when power consumption or temperature exceeds operational thresholds.
Embodiments herein describe partitioning hardware and software in a system on a chip (SoC) into a hierarchy. In one embodiment, the hierarchy includes three levels of hardware-software configurations, enabling security and/or safety isolation across those three levels. The levels can cover the processor subsystem with compute, memory, acceleration, and peripheral resources shared or divided across those three levels.
G06F 21/53 - Contrôle des usagers, programmes ou dispositifs de préservation de l’intégrité des plates-formes, p.ex. des processeurs, des micrologiciels ou des systèmes d’exploitation au stade de l’exécution du programme, p.ex. intégrité de la pile, débordement de tampon ou prévention d'effacement involontaire de données par exécution dans un environnement restreint, p.ex. "boîte à sable" ou machine virtuelle sécurisée
G06F 9/455 - Dispositions pour exécuter des programmes spécifiques Émulation; Interprétation; Simulation de logiciel, p.ex. virtualisation ou émulation des moteurs d’exécution d’applications ou de systèmes d’exploitation
39.
TRANSPARENT AND REMOTE KERNEL EXECUTION IN A HETEROGENEOUS COMPUTING SYSTEM
Remote kernel execution in a heterogeneous computing system can include executing, using a device processor of a device communicatively linked to a host processor, a device runtime and receiving from the host processor within a hardware submission queue of the device, a command. The command requests execution of a software kernel and specifies a descriptor stored in a region of a memory of the device shared with the host processor. In response to receiving the command, the device runtime, as executed by the device processor, invokes a runner program associated with the software kernel. The runner program can map a physical address of the descriptor to a virtual memory address corresponding to the descriptor that is usable by the software kernel. The runner program can execute the software kernel. The software kernel can access data specified by the descriptor using the virtual memory address as provided by the runner program.
An integrated circuit (IC) device for detecting errors within a register, the IC device includes registers and parity checking circuitry. The parity checking circuitry is coupled to the registers and comprises a first parity circuity, a second parity circuit, and error detection circuitry. The first parity circuit receives first register values from the registers and determine a first value from the first register values. The second parity circuit is receives second register values from the registers and determines a second value from the second register values. The error detection circuitry compares the first value and the second value to detect a first error within the registers, and output an error signal indicating the first error.
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
Embodiments herein describe end-to-end bindings to create zones that extend between different components in a SoC, such as an I/O gateway, a processor subsystem, a NoC, storage and data accelerators, programmable logic, etc. Each zone can be assigned to a different domain that is controlled by a tenant such as an external host, or software executing on that host. Embodiments herein create end-to-end bindings between acceleration engines, I/O gateways, and embedded cores in SoCs. Instead of these components being treated as disparate monolithic components, the bindings divide up the hardware and memory resources across components that make up the SoC, into different zones. Those zones in turn can have unique bindings to multiple tenants. The bindings can be configured in bridges between components to divide resources into the zones to enable tenants of those zones to have dedicated available resources that are secure from the other tenants.
Examples herein describe hardware architecture for processing and accelerating data passing through layers of a neural network. In one embodiment, a reconfigurable integrated circuit (IC) for use with a neural network includes a digital processing engine (DPE) array, each DPE having a plurality of neural network units (NNUs). Each DPE generates different output data based on the currently processing layer of the neural network, with the NNUs parallel processing different input data sets. The reconfigurable IC also includes a plurality of ping-pong buffers designed to alternate storing and processing data for the layers of the neural network.
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06N 3/063 - Réalisation physique, c. à d. mise en œuvre matérielle de réseaux neuronaux, de neurones ou de parties de neurone utilisant des moyens électroniques
G06F 5/16 - Systèmes multiplexés, c. à d. utilisant plusieurs dispositifs similaires à accès alterné pour des opérations de mise en file d'attente et de retrait de file d'attente, p.ex. des tampons ping-pong
Disclosed approaches for convolving input feature maps in a neural network include a circuit arrangement circuit that includes memory circuitry and convolution circuitry. The memory circuitry is configured to store K NxN first filters, and C 1x1 second filters, wherein N ≥ 1, and 1 < K < C. The convolution circuitry is coupled to the memory circuitry and configured to convolve a three-dimensional input feature map with the K NxN first filters into an intermediate volume having a depth of K, and convolve the intermediate volume with the C 1x1 second filters into an output feature map having a depth of C.
An integrated circuit (IC) device for detecting errors within a register, the IC device includes registers and parity checking circuitry. The parity checking circuitry is coupled to the registers and comprises a first parity circuitry, a second parity circuit, and error detection circuitry. The first parity circuit receives first register values from the registers and determine a first value from the first register values. The second parity circuit is receives second register values from the registers and determines a second value from the second register values. The error detection circuitry compares the first value and the second value to detect a first error within the registers, and output an error signal indicating the first error.
G06F 11/07 - Réaction à l'apparition d'un défaut, p.ex. tolérance de certains défauts
G06F 11/10 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle en ajoutant des chiffres binaires ou des symboles particuliers aux données exprimées suivant un code, p.ex. contrôle de parité, exclusion des 9 ou des 11
45.
ADAPTIVE INTEGRITY LEVELS IN ELECTRONIC AND PROGRAMMABLE LOGIC SYSTEMS
Methods and apparatus for adaptive integrity levels in electronic and programmable logic systems. In one example, an interface for communication between a first component and a second component is provided. The interface includes logic configured to change an integrity level for a communication from the first component to the second component during operation of the first component and the second component.
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p.ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
A network interface device has data path circuitry configured to cause data to be moved into and/or out of the network interface device. The data path circuitry comprises: first circuitry for providing one or more data processing operations; and interface circuitry supporting channels. The channels comprises command channels receiving command information from a plurality of data path circuitry user instances, event channels providing respective command completion information to the plurality of data path user instances; and data channels providing the associated data.
G06F 13/28 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus d'entrée/sortie utilisant le transfert par rafale, p.ex. acces direct à la mémoire, vol de cycle
Embodiments herein describe end-to-end bindings to create zones that extend between different components in a SoC, such as an I/O gateway, a processor subsystem, a NoC, storage and data accelerators, programmable logic, etc. Each zone can be assigned to a different domain that is controlled by a tenant such as an external host, or software executing on that host. Embodiments herein create end-to-end bindings between acceleration engines, I/O gateways, and embedded cores in SoCs. Instead of these components being treated as disparate monolithic components, the bindings divide up the hardware and memory resources across components that make up the SoC, into different zones. Those zones in turn can have unique bindings to multiple tenants. The bindings can be configured in bridges between components to divide resources into the zones to enable tenants of those zones to have dedicated available resources that are secure from the other tenants.
A network interface device (109) has data path circuitry (102,) configured to cause data to be moved into and/or out of the network interface device (109). The data path circuitry comprises: first circuitry (128) for providing one or more data processing operations; and interface circuitry (126) supporting channels. The channels comprises command channels receiving command information from a plurality of data path circuitry user instances (101), event channels providing respective command completion information to the plurality of data path user instances (101); and data channels providing the associated data.
G06F 13/16 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus de mémoire
G06F 13/28 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus d'entrée/sortie utilisant le transfert par rafale, p.ex. acces direct à la mémoire, vol de cycle
G06F 12/0806 - Systèmes de mémoire cache multi-utilisateurs, multiprocesseurs ou multitraitement
H04L 49/00 - TRANSMISSION D'INFORMATION NUMÉRIQUE, p.ex. COMMUNICATION TÉLÉGRAPHIQUE Éléments de commutation de paquets
H04L 49/101 - TRANSMISSION D'INFORMATION NUMÉRIQUE, p.ex. COMMUNICATION TÉLÉGRAPHIQUE Éléments de commutation de paquets caractérisés par la construction de la matrice de commutation utilisant un crossbar ou une matrice
H04L 49/109 - TRANSMISSION D'INFORMATION NUMÉRIQUE, p.ex. COMMUNICATION TÉLÉGRAPHIQUE Éléments de commutation de paquets caractérisés par la construction de la matrice de commutation intégrés sur micropuce, p.ex. interrupteurs sur puce
G06F 9/50 - Allocation de ressources, p.ex. de l'unité centrale de traitement [UCT]
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 13/12 - Commande par programme pour dispositifs périphériques utilisant des matériels indépendants du processeur central, p.ex. canal ou processeur périphérique
49.
ADAPTIVE INTEGRITY LEVELS IN ELECTRONIC AND PROGRAMMABLE LOGIC SYSTEMS
Methods and apparatus for adaptive integrity levels in electronic and programmable logic systems. In one example, an interface for communication between a first component and a second component is provided. The interface includes logic configured to change an integrity level for a communication from the first component to the second component during operation of the first component and the second component.
G06F 21/85 - Protection des dispositifs de saisie, d’affichage de données ou d’interconnexion dispositifs d’interconnexion, p.ex. les dispositifs connectés à un bus ou les dispositifs en ligne
G06F 11/07 - Réaction à l'apparition d'un défaut, p.ex. tolérance de certains défauts
G06F 11/08 - Détection ou correction d'erreur par introduction de redondance dans la représentation des données, p.ex. en utilisant des codes de contrôle
Methods and apparatus for quickly changing line rates in PCIe analyzers without resetting the receivers. One example circuit for multi-rate reception generally includes: a receiver having a data input, a data output, and a clock input configured to receive a clock signal from a clock generator, the receiver being configured to switch between receiving data at a first data rate and at least one second data rate and to sample data according to the first data rate, wherein the first data rate is higher than the at least one second data rate; a phase detector having an input coupled to the data output of the receiver; and a filter having an input coupled to an output of the phase detector and having an output configured to effectively control a phase of the sampling by the receiver when the data is at the at least one second data rate.
H03L 7/081 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase avec un déphaseur commandé additionnel
G06F 13/42 - Protocole de transfert pour bus, p.ex. liaison; Synchronisation
H03K 19/21 - Circuits OU EXCLUSIF, c. à d. donnant un signal de sortie si un signal n'existe qu'à une seule entrée; Circuits à COÏNCIDENCES, c. à d. ne donnant un signal de sortie que si tous les signaux d'entrée sont identiques
H03L 7/08 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase
Auxiliary power connector PCBs are described. In one example, an auxiliary power connector is described. The auxiliary power connector includes a printed circuit board (PCB) and a PCI express graphics (PEG) connector mounted to the PCB, the PEG connector configured to connect to an auxiliary power source. The auxiliary power connector further includes a set of connectors provided on the PCB, the set of connectors configured to connect the PCB to a main PCB of a device.
H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
H01R 12/75 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se raccordant à des câbles à l'exclusion des câbles plats ou à rubans
An adaptive memory expansion scheme is proposed, where one or more memory expansion capable Hosts or Accelerators can have their memory mapped to one or more memory expansion devices. The embodiments below describe discovery, configuration, and mapping schemes that allow independent SCM implementations and CPU-Host implementations to match their memory expansion capabilities. As a result, a memory expansion host (e.g., a memory controller in a CPU or an Accelerator) can declare multiple logical memory expansion pools, each with a unique capacity. These logical memory pools can be matched to physical memory in the SCM cards using windows in a global address map. These windows represent shared memory for the Home Agents (HAs) (e.g., the Host) and the Slave Agent (SAs) (e.g., the memory expansion device).
A device may include a processor system and an array of data processing engines (DPEs) communicatively coupled to the processor system. Each of the DPEs includes a core and a DPE interconnect. The processor system is configured to transmit configuration data to the array of DPEs, and each of the DPEs is independently configurable based on the configuration data received at the respective DPE via the DPE interconnect of the respective DPE. The array of DPEs enable, without modifying operation of a first kernel of a first subset of the DPEs of the array of DPEs, reconfiguration of a second subset of the DPEs of the array of DPEs.
G06F 15/177 - Commande d'initialisation ou de configuration
G06F 15/173 - Communication entre processeurs utilisant un réseau d'interconnexion, p.ex. matriciel, de réarrangement, pyramidal, en étoile ou ramifié
G06F 15/80 - Architectures de calculateurs universels à programmes enregistrés comprenant un ensemble d'unités de traitement à commande commune, p.ex. plusieurs processeurs de données à instruction unique
54.
CIRCULAR BUFFER ARCHITECTURE USING LOCAL MEMORIES WITH LIMITED RESOURCES
A circular buffer architecture includes a memory coupled to a producer circuit and a consumer circuit. The memory is configured to store objects. The memory can include memory banks. The number of the memory banks is less than a number of the objects. The circular buffer can include hardware locks configured to reserve selected ones of the memory banks for use by the producer circuit or the consumer circuit. The circular buffer can include a buffer controller coupled to the memory and configured to track a plurality of positions. The positions can include a consumer bank position, a consumer object position, a producer bank position, and a producer object position. The buffer controller is configured to allocate selected ones of the objects from the memory banks to the producer circuit and to the consumer circuit according to the tracked positions and using the hardware locks.
An integrated circuit includes an intellectual property core, scan data pipeline circuitry configured to convey scan data to the intellectual property core, and scan control pipeline circuitry configured to convey one or more scan control signals to the intellectual property core. The integrated circuit also includes a wave shaping circuit configured to detect a trigger event on the one or more scan control signals and, in response to detecting the trigger event, suppress a scan clock to the intellectual property core for a selected number of clock cycles.
G06F 30/333 - Conception en vue de la testabilité [DFT], p.ex. chaîne de balayage ou autotest intégré [BIST]
G06F 30/367 - Vérification de la conception, p.ex. par simulation, programme de simulation avec emphase de circuit intégré [SPICE], méthodes directes ou de relaxation
G06F 30/398 - Vérification ou optimisation de la conception, p.ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
G06F 30/20 - Optimisation, vérification ou simulation de l’objet conçu
G06F 11/267 - Reconfiguration pour les tests, p.ex. LSSD, découpage
H03K 19/17764 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de configuration pour la fiabilité
G06F 115/08 - Blocs propriété intellectuelle [PI] ou cœur PI
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
Disclosed herein is a heat spreader for use with an IC package, the heat spreader having features for enhanced temperature control of the IC package. A heat spreader for use with an IC package is disclosed. In one example, the heat spreader includes a metal body that has a sealed internal cavity. A thermally conductive material fills the sealed internal cavity. The thermally conductive material has an interstitial space sufficient to allow fluid to pass therethrough. A first phase change material fills at least a portion of the interstitial space of the thermally conductive material.
Various noise isolation structures and methods for fabricating the same are presented. In one example, a substrate for chip package is provided. The substrate includes a core region, top build-up layers and bottom build-up layers. The top build-up layers are formed on a first side of the core region and the bottom build-up layers are formed on a second side of the core region that is opposite the first side. Routing circuitry formed in the bottom build-up layers is coupled to routing circuitry formed in the top build-up layers by vias formed through the core region. A void is formed in the bottom build-up layers. The void is configured as a noise isolation structure. The void has a sectional area that is different in at least two different distances from the core region.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
58.
Wide frequency range voltage controlled oscillators
Phase-locked loop circuitry generates an output signal based on transformer based voltage controlled oscillator (VCO) circuitry. The VCO circuitry includes upper band circuitry including first oscillation circuitry, a first harmonic filter circuitry coupled to the first oscillation circuitry, and a first selection transistor coupled to the first harmonic filter circuitry and a current source. The first harmonic filter circuitry filters the output signal. The lower band circuitry includes second oscillation circuitry, a second harmonic filter circuitry coupled to the second oscillation circuitry, and a second selection transistor coupled to the second harmonic filter circuitry and the current source. The second harmonic filter circuitry filters the output signal.
H03L 7/099 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase concernant principalement l'oscillateur commandé de la boucle
H03B 5/12 - Eléments déterminant la fréquence comportant des inductances ou des capacités localisées l'élément actif de l'amplificateur étant un dispositif à semi-conducteurs
H03L 7/093 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase concernant principalement l'agencement de détection de phase ou de fréquence y compris le filtrage ou l'amplification de son signal de sortie utilisant des caractéristiques de filtrage ou d'amplification particulières dans la boucle
N key generation circuits are arranged in a pipeline having N stages. Each key generation circuit is configured to generate a round key as a function of a respective input key and a respective round constant. Output signal lines that carry the round key from a key generation circuit in a stage of the pipeline, except the key generation circuit in a last stage of the pipeline, are coupled to the key generation circuit in a successive stage of the pipeline to provide the respective input key.
H04L 9/06 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité l'appareil de chiffrement utilisant des registres à décalage ou des mémoires pour le codage par blocs, p.ex. système DES
H03K 19/21 - Circuits OU EXCLUSIF, c. à d. donnant un signal de sortie si un signal n'existe qu'à une seule entrée; Circuits à COÏNCIDENCES, c. à d. ne donnant un signal de sortie que si tous les signaux d'entrée sont identiques
H04L 9/34 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité des bits ou des blocs de bits du message télégraphique étant interchangés dans le temps
Examples herein describe a peripheral I/O device with a hybrid gateway that permits the device to have both I/O and coherent domains. As a result, the compute resources in the coherent domain of the peripheral I/O device can communicate with the host in a similar manner as CPU-to-CPU communication in the host. The dual domains in the peripheral I/O device can be leveraged for machine learning (ML) applications. While an I/O device can be used as an ML accelerator, these accelerators previously only used an I/O domain. In the embodiments herein, compute resources can be split between the I/O domain and the coherent domain where a ML engine is in the I/O domain and a ML model is in the coherent domain. An advantage of doing so is that the ML model can be coherently updated using a reference ML model stored in the host.
Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.
A multiplication injection locked oscillator (MIILO) circuitry includes a ring injection locked oscillator (ILO) circuitry that outputs clock signals, a first switching circuitry and a second switching circuitry. The ring ILO circuitry includes a first path having first delay stages, and a second path having a second delay stages. The first switching circuitry is connected to the first path and a voltage supply node. The first switching circuitry receives a first control signal and a second control signal and selectively connects the voltage supply node to the first path. The second switching circuitry is connected to the second path and a reference voltage node. The second switching circuitry receives the first control signal and the second control signal and selectively connects the reference voltage node to the second path.
H03L 7/099 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase concernant principalement l'oscillateur commandé de la boucle
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
G06F 1/06 - Générateurs d'horloge produisant plusieurs signaux d'horloge
63.
DAC-BASED TRANSMIT DRIVER ARCHITECTURE WITH IMPROVED BANDWIDTH
A DAC-based transmit driver architecture with improved bandwidth and techniques for driving data using such an architecture. One example transmit driver circuit generally includes an output node and a plurality of digital-to-analog converter (DAC) slices. Each DAC slice has an output coupled to the output node of the transmit driver circuit and includes a bias transistor having a drain coupled to the output of the DAC slice and a multiplexer having a plurality of inputs and an output coupled to a source of the bias transistor.
Clock generation circuitry includes quadrature locked loop circuitry having first injection locked oscillator circuitry, second injection locked oscillator circuitry, and XOR circuitry. The first injection locked oscillator circuitry receives a first input signal and a second input signal and outputs first clock signals. The first input signal and the second input signal correspond to a reference clock signal. The second injection locked oscillator circuitry is coupled to outputs of the first injection locked oscillator circuitry, and receives the first clock signals and generates second clock signals. The XOR circuitry receives the second clock signals and generates a first clock signal, a second clock signal, a third clock signal, and a fourth clock signal. The frequencies of the first clock signal, the second clock signal, the third clock signal, and the fourth clock signal are greater than the frequency of the reference clock signal.
H03L 7/099 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence qui est appliqué à une boucle verrouillée en fréquence ou en phase - Détails de la boucle verrouillée en phase concernant principalement l'oscillateur commandé de la boucle
H03L 7/24 - Commande automatique de fréquence ou de phase; Synchronisation utilisant un signal de référence directement appliqué au générateur
A semiconductor device comprises a design under test (DUT), a testing interface, pattern generation circuitry, and pattern checker circuitry. The pattern generation circuitry is connected to the DUT and the testing interface. The pattern generation circuitry is configured to generate a test data sequence and control data based on configuration data received from the testing interface, and communicate the test data sequence and the control data to the DUT. The pattern checker circuitry is connected to the DUT and the testing interface. The pattern checker circuitry is configured to generate a comparison test sequence based on the configuration data received from the testing interface, receive resultant test data sequence and output control data from the DUT, and generate a first error signal based on a comparison of the resultant test data sequence and the comparison test sequence and a comparison of the output control data and the configuration data.
G06F 30/333 - Conception en vue de la testabilité [DFT], p.ex. chaîne de balayage ou autotest intégré [BIST]
G06F 30/31 - Saisie informatique, p.ex. éditeurs spécifiquement adaptés à la conception de circuits
G06F 119/02 - Analyse de fiabilité ou optimisation de fiabilité; Analyse de défaillance, p.ex. performance dans le pire scénario, analyse du mode de défaillance et de ses effets [FMEA]
66.
Sub-FPGA level compilation platform with adjustable dynamic region for emulation/prototyping designs
A method of FPGA compilation for an emulation system includes receiving a netlist for an FPGA, partitioning the netlist into a set of sub-FPGA netlists, and mapping each of the sub-FPGA netlists in the set to a corresponding dynamic sub-FPGA region of the FPGA. The method further includes implementing the sub-FPGA netlists of the set in parallel to obtain a corresponding set of sub-FPGA bitstreams.
A System-on-Chip includes a first partition configured to implement a first application using of at least a first portion of one or more of a plurality of subsystems of the System-on-Chip and a second partition configured to implement a second application concurrently with the first partition. The second application uses at least a second portion of one or more of the plurality of subsystems. The first partition is isolated from the second partition.
H03K 19/17728 - Blocs logiques reconfigurables, p.ex. tables de consultation
H03K 19/17736 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de routage
H03K 19/17704 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle les fonctions logiques étant réalisées par l'interconnexion des lignes et des colonnes
Approaches for data compression involve a compression circuit packing non-zero data elements of a succession of words of a plurality of blocks into packed words by packing non-zero data elements of one or more words of the succession in each packed word, and restricting each packed word to data elements of one uncompressed block. The compression circuit writes each packed word in a RAM and within a compressed address range associated with the uncompressed block when the packed word is full of non-zero data elements, or before the packed word is full if the next input word is of another uncompressed block.
Clock generation circuitry includes quadrature locked loop circuitry having first injection locked oscillator circuitry, second injection locked oscillator circuitry, and XOR circuitry. The first injection locked oscillator circuitry receives a first input signal and a second input signal and outputs first clock signals. The first input signal and the second input signal correspond to a reference clock signal. The second injection locked oscillator circuitry is coupled to outputs of the first injection locked oscillator circuitry, and receives the first clock signals and generates second clock signals. The XOR circuitry receives the second clock signals and generates a first clock signal, a second clock signal, a third clock signal, and a fourth clock signal. The frequencies of the first clock signal, the second clock signal, the third clock signal, and the fourth clock signal are greater than the frequency of the reference clock signal.
H04L 7/00 - Dispositions pour synchroniser le récepteur avec l'émetteur
H03K 19/21 - Circuits OU EXCLUSIF, c. à d. donnant un signal de sortie si un signal n'existe qu'à une seule entrée; Circuits à COÏNCIDENCES, c. à d. ne donnant un signal de sortie que si tous les signaux d'entrée sont identiques
70.
Software or firmware managed hardware capability and control configuration for PCIe devices
Embodiments herein describe using software or firmware to manage the device capability list of a PCIe device. That is, rather than relying on pure hardware to advertise the capabilities of a PCIe device, the embodiments herein permit software or firmware executing on a processor in the PCIe device to manage read and write requests associated with discovering the capabilities of the device and configuring the device.
Embodiments herein describe offloading encryption activities to a network interface controller/card (NIC) (e.g., a SmartNIC) which frees up server compute resources to focus on executing customer applications. In one embodiment, the smart NIC includes a system on a chip (SoC) implemented on an integrated circuit (IC) that includes an embedded processor. Instead of executing a transport layer security (TLS) stack entirely in the embedded processor, the embodiments herein offload certain TLS tasks to a Public Key Infrastructure (PKI) accelerator such as generating public-private key pairs.
G06F 21/72 - Protection de composants spécifiques internes ou périphériques, où la protection d'un composant mène à la protection de tout le calculateur pour assurer la sécurité du calcul ou du traitement de l’information dans les circuits de cryptographie
72.
Application implementation and buffer allocation for a data processing engine array
Implementing an application can include generating, from the application, a compact data flow graph (DFG) including load nodes, inserting, in the compact DFG, a plurality of virtual buffer nodes (VBNs) for each of a plurality of buffers of a data processing engine (DPE) array to be allocated to nets of the application, and, forming groups of one or more load nodes of the compact DFG based on shared buffer requirements of the loads on a per net basis. Virtual driver nodes (VDNs) that map to drivers of nets can be added to the compact DFG, where each group of the compact DFG is driven by a dedicated VDN. Connections between VDNs and load nodes through selected ones of the VBNs are created according to a plurality of constraints. The plurality of buffers are allocated to the nets based on the compact DFG as connected.
Embodiments herein describe offloading encryption activities to a network interface controller/card (NIC) (e.g., a SmartNIC) which frees up server compute resources to focus on executing customer applications. In one embodiment, the smart NIC includes a system on a chip (SoC) implemented on an integrated circuit (IC) that includes an embedded processor. Instead of executing a transport layer security (TLS) stack entirely in the embedded processor, the embodiments herein offload certain TLS tasks to a Public Key Infrastructure (PKI) accelerator such as generating public-private key pairs.
G06F 21/54 - Contrôle des usagers, programmes ou dispositifs de préservation de l’intégrité des plates-formes, p.ex. des processeurs, des micrologiciels ou des systèmes d’exploitation au stade de l’exécution du programme, p.ex. intégrité de la pile, débordement de tampon ou prévention d'effacement involontaire de données par ajout de routines ou d’objets de sécurité aux programmes
G06F 21/85 - Protection des dispositifs de saisie, d’affichage de données ou d’interconnexion dispositifs d’interconnexion, p.ex. les dispositifs connectés à un bus ou les dispositifs en ligne
G06F 21/62 - Protection de l’accès à des données via une plate-forme, p.ex. par clés ou règles de contrôle de l’accès
74.
MICRO DEVICE WITH ADAPTABLE THERMAL MANAGEMENT DEVICE
Micro devices having enhanced through heat transfer utilizing plungers extending from a heat spreader are provided. In one example, a micro device is provided that includes a plunger retaining block, a plurality of plungers, a mounting substrate and an integrated circuit (IC) die. The plunger retaining block includes a top surface and a bottom surface. The plurality of plungers extend from the bottom surface of the plunger retaining block with at least some of the plurality of plungers contacting the IC die. The IC die is disposed between the plunger retaining block and the mounting substrate, and coupled to the mounting substrate.
A multiplexer (MUX) calibration system includes main MUX circuitry, first replica MUX circuitry, digital-to-analog (DAC) circuitry, detection circuitry, and control circuitry. The main MUX circuitry receives clock signals and outputs a first data signal based on the clock signals. The first replica MUX circuitry receives the clock signals and outputs a second data signal based on the clock signals. The DAC circuitry generates an offset voltage. The detection circuitry receives the second data signal and the offset voltage and generates a first error signal based on one or more of the second data signal and the offset voltage. The control circuitry receives the first error signal and generates a first control signal indicating an adjustment to the clock signals.
Circuits and methods for computing an order N polynomial include V decimation stages, each stage including respective multiply-and-accumulate circuitry. The multiply-and-accumulate circuitry in each stage k, in response to an input r-term and a plurality of input z-terms 0 through (Nk−1), generates output z-terms 0 through (Nk/2−1) and an output r-term as a square of the input r-term. Each output z-term i is a sum of input z-term (2i+1) of the input z-terms and a product of input z-term 2i and the input r-term. The multiply-and-accumulate circuitry in decimation stages k for k≤(V−1) provides the output r-term and one or more output z-terms from decimation stage k as the input r-term and one or more input z-terms to the respective multiply-and-accumulate circuitry of decimation stage k+1. A recursive stage inputs from decimation stage V, the output r-term as a recursive r-term and the output z-terms as a-terms, and generates a polynomial output value z by a recursive evaluation of the recursive r-term, the a-terms, and a modulus, p.
G06F 7/556 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul de fonctions logarithmiques ou exponentielles
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
G06F 7/57 - Unités arithmétiques et logiques [UAL], c. à d. dispositions ou dispositifs pour accomplir plusieurs des opérations couvertes par les groupes ou pour accomplir des opérations logiques
Disclosed herein is an optical filter configured for wavelength division and multiplexing capable of transmitting and receiving signals. The optical filter includes an optical waveguide configured to receive at an input multiple signals with different wavelengths. The optical filter includes a plurality of channels coupled at different locations along a length of the optical waveguide. Each of the plurality of channels is configured to transmit a respective one of the multiple signals. A number of ring filter stages in a first channel of the plurality of channels that is closer to the input of the optical waveguide is greater than a second channel in the plurality of channels further away from the input of the optical waveguide.
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c. à d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
78.
Power distribution for active-on-active die stack with reduced resistance
Active-on-active microelectronic devices are described. For example, a first die is on a second die with a bottom surface of a first substrate facing a top surface of a second substrate, respectively, to provide a die stack. The first and second dies each have metal layers in ILD layers to provide a first stack structure and a second stack structure, respectively. The first stack structure is interconnected to an upper end of a TSV of the first die. A metal layer of the second stack structure near a bottom surface of the first substrate is interconnected to a lower end of the TSV. A power distribution network layer of the second stack structure is located between lower and upper layers of the metal layers thereof. A transistor located at least in part in the second substrate is interconnected to the power distribution network layer to receive supply voltage or ground.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/528 - Configuration de la structure d'interconnexion
C07K 16/32 - Immunoglobulines, p.ex. anticorps monoclonaux ou polyclonaux contre du matériel provenant d'animaux ou d'humains contre des produits de traduction des oncogènes
C12Q 1/6886 - Produits d’acides nucléiques utilisés dans l’analyse d’acides nucléiques, p.ex. amorces ou sondes pour les maladies provoquées par des altérations du matériel génétique pour le cancer
G01N 33/574 - Tests immunologiques; Tests faisant intervenir la formation de liaisons biospécifiques; Matériaux à cet effet pour le cancer
79.
Multi-addressing mode for DMA and non-sequential read and write patterns
Examples herein describe performing non-sequential DMA read and writes. Rather than storing data sequentially, a DMA engine can write data into memory using non-sequential memory addresses. A data processing engine (DPE) controller can submit a first job using first parameters that instruct the DMA engine to store data using a first non-sequential write pattern. The DPE controller can also submit a second job using second parameters that instruct the DMA engine to store data using a second, different non-sequential write pattern. In this manner, the DMA engine can switch to performing DMA writes using different non-sequential patterns. Similarly, the DMA engine can use non-sequential reads to retrieve data from memory. When performing a first DMA read, the DMA engine can retrieve data from memory using a first sequential pattern and then perform a second DMA read where data is retrieved from memory using a second non-sequential read pattern.
G06F 12/1081 - Traduction d'adresses pour accès périphérique à la mémoire principale, p.ex. accès direct en mémoire [DMA]
G06F 12/06 - Adressage d'un bloc physique de transfert, p.ex. par adresse de base, adressage de modules, extension de l'espace d'adresse, spécialisation de mémoire
G06F 9/52 - Synchronisation de programmes; Exclusion mutuelle, p.ex. au moyen de sémaphores
G06F 15/78 - Architectures de calculateurs universels à programmes enregistrés comprenant une seule unité centrale
G06F 12/02 - Adressage ou affectation; Réadressage
80.
METHOD AND SYSTEM FOR INTERFACING A TESTBENCH TO CIRCUIT SIMULATION
Approaches for simulating a circuit include receiving simulation input data from a testbench executing on a computer system by a simulator interface executing on the computer system. The simulator interface receives simulation output data the according to a hardware bus protocol specified by a simulated circuit for communication and simulates handshaking with the simulated circuit according to the hardware bus protocol in response to receiving the simulation input data and simulation output data. The simulator interface provides the simulation input data to the simulated circuit by according to the hardware bus protocol and provides the simulation output data to the testbench.
An example method of implementing a quantized neural network (QNN) for a programmable device includes: identifying multiply-accumulate operations of neurons in the QNN; converting the multiply-accumulate operations to memory lookup operations; and implementing the memory lookup operations using a pre-compute circuit for the programmable device, the pre-compute circuit storing a pre-computed output of a neuron in the QNN for each of the memory lookup operations.
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
82.
Circuit for and method of implementing IO connections in an integrated circuit device
A circuit for implementing an input/output connection in an integrated circuit device is described. The circuit comprises a pull-up circuit comprising a first plurality of transistors coupled in series, wherein a gate of a first transistor of the first plurality of transistors is configured to receive a first dynamic bias signal; a pull-down circuit comprising a second plurality of transistors coupled in series, the pull-down circuit being coupled to the pull-up circuit at an output node, wherein a gate of a first transistor of the second plurality of transistors is configured to receive a second dynamic bias signal; and an input/output contact coupled to the output node. A circuit for implementing an input/output connection in an integrated circuit device including a splitter circuit for receiving an input signal on an input pad is also described. A method of implementing an input/output connection in an integrated circuit device is also described.
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
83.
SYNTHESIS FLOW FOR DATA PROCESSING ENGINE ARRAY APPLICATIONS RELYING ON HARDWARE LIBRARY PACKAGES
Implementing an application for a data processing engine (DPE) array can include detecting, using computer hardware, a component of a hardware library package instantiated by an application. The application is specified in source code and is configured to execute on a DPE array. An instance of the component is extracted from the application. The extracted instance specifies values of parameters for the instance of the component. The instance can be partitioned by generating program code defining one or more kernels corresponding to the instance of the component. The partitioning is based on a defined performance metric of the component and a defined performance requirement of the application. The application is transformed by replacing the instance of the component with the program code generated by the partitioning. The application, as transformed, is compiled into program code executable by the DPE array.
A transmit driver architecture with a test mode (e.g., a JTAG configuration mode), extended equalization range, and/or multiple power supply domains. One example transmit driver circuit generally includes one or more driver unit cells having a differential input node pair configured to receive an input data signal and having a differential output node pair configured to output an output data signal; a plurality of power switches coupled between the differential output node pair and one or more power supply rails; a first set of one or more drivers coupled between a first test node of a differential test data path and a first output node of the differential output node pair; and a second set of one or more drivers coupled between a second test node of the differential test data path and a second output node of the differential output node pair.
Synchronizing system resources of a multi-socket data processing system can include providing, from a primary System-on-Chip (SOC), a trigger event to a global synchronization circuit. The primary SOC is one of a plurality of SOCS and the trigger event is provided over a first sideband channel. In response to the trigger event, the global synchronization circuit is capable of broadcasting a synchronization event to the plurality of SOCS over a second sideband channel. In response to the synchronization event, the system resource of each SOC of the plurality of SOCS is programmed with a common value. The programming synchronizes the system resources of the plurality of SOCS.
Processing of a neural network specification includes gathering first layers of a neural network graph into groups of layers based on profiled compute times of the layers and equalized compute times between the groups. Each group is a subgraph of one or more of the layers of the neural network. The neural network graph is compiled into instructions for pipelined execution of the neural network graph by compute circuits. The compiling includes designating, for each first subgraph of the subgraphs having output activations that are input activations of a second subgraph of the subgraphs, operations of the first subgraph to be performed by a first compute circuit and operations of the second subgraph to be performed by a second compute circuit. The compute circuits are configured to execute the instructions.
Synchronizing system resources of a multi-socket data processing system can include providing, from a primary System-on-Chip (SOC), a trigger event to a global synchronization circuit. The primary SOC is one of a plurality of SOCS and the trigger event is provided over a first sideband channel. In response to the trigger event, the global synchronization circuit is capable of broadcasting a synchronization event to the plurality of SOCS over a second sideband channel. In response to the synchronization event, the system resource of each SOC of the plurality of SOCS is programmed with a common value. The programming synchronizes the system resources of the plurality of SOCS.
A system includes a bridge circuit configured for low latency communication among integrated circuits (ICs). The bridge circuit includes a plurality of transceiver circuits. Each transceiver circuit is coupled to a corresponding parallel channel in the IC. Each transceiver circuit is configured to send and receive data over the corresponding parallel channel. Each transceiver circuit includes a transmit channel configured to packetized data received from the corresponding parallel channel for transmission over a serial link to a second IC. Each transceiver circuit includes a receive channel configured to depacketize data received from the serial link from the second IC. The serial link is asynchronous to each of parallel channel coupled to the first bridge circuit.
A transmit driver architecture with a test mode (e.g., a JTAG configuration mode), extended equalization range, and/or multiple power supply domains. One example transmit driver circuit generally includes one or more driver unit cells having a differential input node pair configured to receive an input data signal and having a differential output node pair configured to output an output data signal; a plurality of power switches coupled between the differential output node pair and one or more power supply rails; a first set of one or more drivers coupled between a first test node of a differential test data path and a first output node of the differential output node pair; and a second set of one or more drivers coupled between a second test node of the differential test data path and a second output node of the differential output node pair.
H03K 19/17736 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels des ressources de routage
H03K 19/17788 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion utilisant des éléments spécifiés utilisant des circuits logiques élémentaires comme composants disposés sous forme matricielle - Détails structurels pour l'adaptation des paramètres physiques pour les tensions d'entrée/sortie [E/S]
H04J 3/04 - Distributeurs combinés avec des modulateurs ou des démodulateurs
G06F 13/10 - Commande par programme pour dispositifs périphériques
Examples described herein generally relate to wafer testing and structures implemented on a wafer for wafer testing. In an example method for testing a wafer, power is applied to a first pad in a test site (TS) region on the wafer. The TS region is electrically connected to a device under test (DUT) region on the wafer. The DUT region includes a DUT. The TS region and DUT region are in a first and second scribe line, respectively, on the wafer. A third scribe line is disposed on the wafer between the TS region and the DUT region. A signal is detected from a second pad in the TS region on the wafer. The signal is at least in part a response of the DUT to the power applied to the first pad.
A system can include a microprocessor having a prefetch queue including a plurality of slots configured to store program counter values (PCVs) and instructions, a pipeline configured to receive instructions from the prefetch queue, and a select circuit coupled to the prefetch queue. The select circuit may selectively freeze a first slot of the plurality of slots and selectively output a frozen PCV and a frozen instruction from the first slot while frozen. The microprocessor can include write logic coupled to the prefetch queue and a comparator circuit coupled to the prefetch queue and the select circuit. The write logic may load data into unfrozen slots of the prefetch queue. The comparator circuit may compare a target PCV with the frozen PCV to determine a match. The select circuit indicates, to the pipeline, whether the frozen instruction is valid based on the comparing.
Resource estimation for implementing circuit designs in an integrated circuit (IC) can include detecting, using computer hardware, a plurality of Intellectual Property (IP) cores within a circuit design, extracting, using the computer hardware and from the circuit design, parameterizations for the plurality of IP cores as used in the circuit design, and selecting, using the computer hardware, a machine learning (ML) model corresponding to each IP core, wherein each selected ML model is specific to the corresponding IP core. Each selected ML model can be provided input specifying a target IC for the circuit design and the parameterization for the corresponding IP core. An estimate of resource usage for the circuit design can be generated by executing the selected ML models. The resource usage specifies an amount of resources of the target IC needed to implement the circuit design in the target IC.
Dynamic port handling for circuit designs can include inserting, within a static isolated module of a circuit design, static drivers configured to drive isolated modules of reconfigurable module (RM) instances for inclusion in an RM of the circuit design. For each RM instance of a plurality of RM instances to be inserted into the RM, one or more additional ports can be inserted in the RM based on a number of isolated modules included in a current RM instance. Further, net(s) corresponding to the additional port(s) can be created. The circuit design, including the current RM instance, the additional port(s), and the net(s), can be placed and routed. Prior to the inserting and the performing place and route for a next RM instance to be inserted into the RM, the current RM instance can be removed from the RM along with the additional port(s) and the net(s).
G06F 30/347 - Niveau physique , p.ex. positionnement ou routage
G06F 30/327 - Synthèse logique; Synthèse de comportement, p.ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
94.
CIRCUITS AND METHODS FOR MULTIPLYING LARGE INTEGERS OVER A FINITE FIELD
Multiplication of integers over a finite field involves an array of arithmetic circuits configured to input a-limbs, d-limbs, and r-limbs. The array determines an intermediate term, Z, having z-limbs 0 through Kby determining respective sets of intermediate z-limbs 0 through K- 1 for r-limbs i for i = 0 to K - 1, and summing corresponding ones of the intermediate z-limbs of sets i through K - 1. The arithmetic circuits determine for r-limb 0, intermediate z-limbs 0 through K - 1 of set 0 as products of r-limb 0 and a-limbs 0 through K - 1, and for the remaining r-limbs determines intermediate z-limbs using different combinations of a-limbs, r-limbs, modulus, and d-limbs. A modulo circuit computes G as (most significant M bits of Z* m) + (least significant Q bits of Z, wherein M is a number of bits by which a number of bits of Z exceeds N, and Q is equal to M + ceil (log2 m), and increases G by m if bits Q through N - 1 of Z all having bit value one, and G ≥ 2Q - m. Circuitry assigns bits G bits 0 through Q-1 to Y bits 0 through Q- 1, and G bit Q to Y bit Q.
G06F 7/544 - Méthodes ou dispositions pour effectuer des calculs en utilisant exclusivement une représentation numérique codée, p.ex. en utilisant une représentation binaire, ternaire, décimale utilisant des dispositifs non spécifiés pour l'évaluation de fonctions par calcul
G06F 7/72 - Méthodes ou dispositions pour effectuer des calculs en utilisant une représentation numérique non codée, c. à d. une représentation de nombres sans base; Dispositifs de calcul utilisant une combinaison de représentations de nombres codées et non codées utilisant l'arithmétique des résidus
G06F 5/01 - Procédés ou dispositions pour la conversion de données, sans modification de l'ordre ou du contenu des données maniées pour le décalage, p.ex. la justification, le changement d'échelle, la normalisation
Systems, methods, and apparatuses are described that enable IC architectures to enable a single anchor to connect to and accept a variety of chiplets at any port by way of a programming model that enables the anchor or chiplet to dynamically adapt to configurations, requirements, or aspects of any coupled component and provide an interface for the coupled components.
Training of a machine learning model used to infer estimated delays of circuit routes during placement and routing of a circuit design. Training can include selecting sample pairs of source pins and destination pins of an integrated circuit (IC) device, and determining respective delays of shortest paths that connect the source pins to the destination pins of the sample pairs based on a resistance-capacitance model of wires that form the shortest paths on the IC device. Respective sets of features are determined for the shortest paths, and the model is trained using the respective sets of features and the respective delays as labels. The machine learning model can be provided to an electronic design automation tool for estimating delays.
G06F 30/398 - Vérification ou optimisation de la conception, p.ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
G06F 30/392 - Conception de plans ou d’agencements, p.ex. partitionnement ou positionnement
G06F 30/33 - Vérification de la conception, p.ex. simulation fonctionnelle ou vérification du modèle
G06F 30/3315 - Vérification de la conception, p.ex. simulation fonctionnelle ou vérification du modèle utilisant une analyse temporelle statique [STA]
G06F 111/06 - Optimisation multi-objectif, p.ex. optimisation de Pareto utilisant le recuit simulé, les algorithmes de colonies de fourmis ou les algorithmes génétiques
97.
INTERWAFER CONNECTION STRUCTURE FOR COUPLING WAFERS IN A WAFER STACK
An integrated circuit (IC) device is disclosed which includes at least a first hybrid bond interface layer disposed between adjacent wafers of a wafer stack. Routing within the hybrid bond interface layer allows test pads exposed on a top wafer of the wafer stack to electrically couple test keys within the wafer stack. By utilizing the routing within the hybrid bond interface layer to index electrical connections between adjacent wafers, IC dies stacked on the wafers may be fabricated with less mask sets as compared to conventional designs.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
98.
Scalable scan architecture for multi-circuit block arrays
An integrated circuit (IC) can include a plurality of circuit blocks, wherein each circuit block includes design for testability (DFT) circuitry. The DFT circuitry can include a scan interface, wherein each scan interface is uniform with the scan interface of each other circuit block of the plurality of circuit blocks, an embedded deterministic test circuit coupled to the scan interface, wherein the embedded deterministic test circuit couples to circuitry under test, and a scan response analyzer coupled to the scan interface. The scan response analyzer is configured to operate in a selected scan response capture mode selected from a plurality of scan response capture modes. The IC can include a global scan router connected to the scan interfaces of the plurality of circuit blocks. The global scan router is configured to activate a subset of the plurality of circuit blocks in parallel for a scan test.
Examples herein describe an acceleration framework that includes a hybrid congestion control (CC) engine where some components are implemented in software (e.g., a CC algorithm) while other components are implemented in hardware (e.g., measurement and enforcement modules and a flexible processing unit). The hardware components can be designed to provide measurements that can be used by multiple different types of CC algorithms. Depending on which CC algorithms are currently enabled, the hardware components can be programmed to perform measurement, processing, and enforcement tasks, thereby freeing the CPUs in the host to perform other tasks. In this manner, the hybrid CC engine can have the flexibility of a pure software CC algorithm with the advantage of performing many of the operations associated with the CC algorithm in hardware.
H04L 41/00 - Dispositions pour la maintenance, l’administration ou la gestion des réseaux de commutation de données, p.ex. des réseaux de commutation de paquets
A device includes a data processing engine array having a plurality of data processing engines organized in a grid having a plurality of rows and a plurality of columns. Each data processing engine includes a core, a memory module including a memory and a direct memory access engine. Each data processing engine includes a stream switch connected to the core, the direct memory access engine, and the stream switch of one or more adjacent data processing engines. Each memory module includes a first memory interface directly coupled to the core in the same data processing engine and one or more second memory interfaces directly coupled to the core of each of the one or more adjacent data processing engines.
