2023
|
Invention
|
Low stress asymmetric dual side module.
Implementations of semiconductor packages may include: a... |
|
Invention
|
Low-latency communication protocol for binaural applications.
Hearing instruments, such as heari... |
|
Invention
|
Power module package for direct cooling multiple power modules.
According to an aspect, a power ... |
|
Invention
|
Systems and methods for designing a discrete device product.
Implementations disclosed herein ma... |
|
Invention
|
Semiconductor devices with single-photon avalanche diodes and light spreading lenses.
An imaging... |
|
Invention
|
Semiconductor packages with an array of single-photon avalanche diodes split between multiple sem... |
|
Invention
|
Acoustic obstacle detection with enhanced resistance to systematic interference.
An illustrative... |
|
Invention
|
Leadframe spacer for double-sided power module.
A semiconductor device module may include a lead... |
|
Invention
|
Supports for thinned semiconductor substrates and related methods.
Implementations of a semicond... |
|
Invention
|
Die cleaning systems and related methods.
Implementations of methods of forming a plurality of s... |
|
Invention
|
Semiconductor device and method of integrating power module with interposer and opposing substrat... |
|
Invention
|
High power module package structures.
In a general aspect, a package includes a semiconductor di... |
|
Invention
|
Semiconductor devices with single-photon avalanche diodes, light scattering structures, and multi... |
|
Invention
|
Plasma-singulated, contaminant-reduced semiconductor die.
Described implementations include a co... |
|
Invention
|
Semiconductor package and related methods.
Implementations of semiconductor packages may include... |
|
Invention
|
Assemblies with embedded semiconductor device modules and related methods.
In a general aspect, ... |
|
Invention
|
Semiconductor device with stacked conductive layers and related methods.
A device may include an... |
|
Invention
|
Power module package having mirrored leads.
In one general aspect, an apparatus can include a se... |
|
Invention
|
A combined short-wavelength infrared and visible light sensor. A sensor (200, 500, 700) includes ... |
|
Invention
|
Integrated substrates and related methods. An integrated substrate (88) may include a conductor l... |
|
Invention
|
Silicon photomultiplier (sipm) having an improved signal-to-noise ratio. A method includes identi... |
|
Invention
|
Black mask on glass systems and related methods.
Implementations of a cover for an image sensor ... |
|
Invention
|
Termination structures for mosfets. Shielded gate semiconductor devices are disclosed for use in ... |
|
Invention
|
Semiconductor device termination structures and methods of manufacturing semiconductor device ter... |
|
Invention
|
Frequency-dependent ground fault circuit interrupter.
Illustrative GFCI devices and methods main... |
|
Invention
|
Sealing method for direct liquid cooled power electronics package.
A package includes a power el... |
|
Invention
|
Transfer molded power modules and methods of manufacture.
In a general aspect, an electronic dev... |
|
Invention
|
Short-circuit detector for electronic fuse circuit.
An electronic fuse that includes a clamp cir... |
|
Invention
|
Negative charge extraction structure for edge termination.
A gallium nitride (GaN) power device ... |
|
Invention
|
Integrated substrates and related methods.
An integrated substrate may include a conductor layer... |
|
Invention
|
Fast device reinitialization on dsi3 bus.
Accordingly, there is disclosed herein host device and... |
2022
|
Invention
|
Imaging systems with distributed and delay-locked control. An image sensor may include an array o... |
|
Invention
|
Power system having multi-trigger all-phase activation.
A multi-phase power system configured to... |
|
Invention
|
Body brake control for multistage power converter.
Systems for power conversion, and controllers... |
|
Invention
|
Reference pixel column readout.
An image sensor may include an image sensor pixel array. The ima... |
|
Invention
|
Dual-channel acoustic distance measurement circuit and method. An acoustic distance measurement c... |
|
Invention
|
Bootstrap clamp circuit and method.
A driver is suitable for use with a gallium nitride (GaN) po... |
|
Invention
|
Slew-rate boost circuitry.
The techniques described herein relate to a circuit including an oper... |
|
Invention
|
Power module package with stacked direct bonded metal substrates.
A package includes a first dir... |
|
Invention
|
Leadframe mounting with lead insertion for lead wall bonding.
A semiconductor device package may... |
|
Invention
|
Inductive angular position sensor.
A receiver coil of an inductive angular position sensor can h... |
|
Invention
|
Cyclic redundancy check (crc) generation.
A system such as an imaging system may include Cyclic ... |
|
Invention
|
Battery hazard detection.
A method, system, and integrated circuit are provided for testing a ba... |
|
Invention
|
Methods of manufacturing semiconductor devices semiconductor devices.
In an example, a method of... |
|
Invention
|
Motion-compensated distance sensing with concurrent up-chirp down-chirp waveforms.
Various senso... |
|
Invention
|
Adjustable clamp finger design.
Implementations of a clamp finger may include a first portion in... |
|
Invention
|
Semiconductor devices and methods of manufacturing semiconductor devices.
In an example, a semic... |
|
Invention
|
Precision operational amplifier with a floating input stage.
The operational amplifier disclosed... |
|
Invention
|
Precision operational amplifier using floating input stage.
The operational amplifier disclosed ... |
2021
|
P/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
|
P/S
|
Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
2015
|
P/S
|
Semiconductors and integrated circuits. |
|
P/S
|
Semiconductor devices and integrated circuits. |
|
P/S
|
Semiconductor devices and integrated circuits |
2014
|
P/S
|
Semiconductor devices |
2008
|
P/S
|
Reference designs in the field of technical design of low-power products, namely computer boards,... |
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely, compute... |
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely computer... |
|
P/S
|
Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
|
P/S
|
Printed reference designs related to the technical design of low-power products, namely, computer... |
|
P/S
|
Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
2006
|
P/S
|
Integrated circuits. |
|
P/S
|
Integrated circuits |
|
P/S
|
Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
|
P/S
|
Design of low-power products, namely computers, semiconductors, microprocessors, power supplies, ... |
|
P/S
|
Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
|
P/S
|
semiconductor devices |
2001
|
P/S
|
Semiconductors |
2000
|
P/S
|
Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
|
P/S
|
Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
|
P/S
|
Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
|
P/S
|
SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
|
P/S
|
transistors, namely metal-oxide silicon field effect transistors |
1999
|
P/S
|
Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
|
P/S
|
[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
|
P/S
|
Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
|
P/S
|
Semiconductors and parts therefor |
|
P/S
|
Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
|
P/S
|
Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
|
P/S
|
Semiconductors and parts therefore |
|
P/S
|
Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
|
P/S
|
Semiconductors and parts therefor, in class 9. Storage of inventory of semiconductors and parts t... |