Siliconware Precision Industries Co., Ltd.

Taïwan, Province de Chine

 
Quantité totale PI 499
Rang # Quantité totale PI 2 536
Note d'activité PI 3,1/5.0    260
Rang # Activité PI 2 733

Brevets

Marques

499 0
0 0
0 0
0
 
Dernier brevet 2024 - Electronic package including ele...
Premier brevet 1997 - Method of connecting tehs on pbg...

Derniers inventions, produits et services

2024 Invention Electronic package including electronic structure and electronic component. An electronic packag...
2023 Invention Electronic package and fabrication method thereof. An electronic package is provided and include...
Invention Electronic package, manufacturing method for the same, and electronic structure. An electronic p...
Invention Carrying substrate, electronic package having the carrying substrate, and methods for manufacturi...
Invention Electronic module, manufacturing method thereof and electronic package having the same. An elect...
Invention Electronic package and method for manufacturing the same. An electronic package is provided, whi...
Invention Electronic package and method for fabricating the same. An electronic package and a method for f...
Invention Method for fabricating electronic package. An electronic package is provided, including: an enca...
Invention Electronic package and manufacturing method thereof. An electronic package includes a first elec...
2022 Invention Electronic package and manufacturing method thereof. An electronic package is provided, in which...
Invention Electronic package and manufacturing method thereof. An electronic package and a manufacturing m...
Invention Electronic package and manufacturing method thereof, and substrate structure. A substrate struct...
Invention Electronic package. An electronic package is provided, in which a first electronic module and a ...
Invention Carrier structure. A carrier structure is provided, in which at least one positioning area is de...
Invention Electronic package. An electronic package is provided, in which a circuit structure is stacked o...
Invention Carrier structure. A carrier structure is provided with a plurality of package substrates connec...
Invention Electronic package and manufacturing method thereof, and electronic structure and manufacturing m...
Invention Manufacturing method of electronic package. A method of manufacturing an electronic package is p...
Invention Electronic package. An electronic package is provided, in which an electronic element is arrange...
Invention Carrier structure. A carrying structure is provided and is defined with a main area and a periph...
Invention Electronic package and manufacturing method thereof. An electronic package is provided with a pl...
Invention Electronic package and manufacturing method thereof. An electronic package is provided and inclu...
Invention Electronic package and electronic structure thereof. An electronic package is provided in which ...
Invention Ultrasonic device. An ultrasonic device is provided and includes an action member, a driving mem...
Invention Electronic package and substrate structure thereof. An electronic package is provided and includ...
Invention Electronic package and manufacturing method thereof. An electronic package and manufacturing met...
Invention Electronic package. An electronic package is provided, in which an electronic structure is embed...
Invention Electronic package and manufacturing method thereof. An electronic package is provided, and the ...
Invention Electronic package and manufacturing method thereof, and antenna module and manufacturing method ...
Invention Electronic package and manufacturing method thereof. An electronic package is provided in which ...