STATS ChipPAC Pte. Lte.

Singapour

 
Quantité totale PI 1 479
Rang # Quantité totale PI 832
Note d'activité PI 3/5.0    178
Rang # Activité PI 3 877
Parent JCET-SC (Singapore) Pte. Ltd

Brevets

Marques

1 479 0
0 0
0 0
0
 
Dernier brevet 2023 - Laser-based redistribution and m...
Premier brevet 1998 - Method of forming extended lead ...

Derniers inventions, produits et services

2023 Invention Laser-based redistribution and multi-stacked packages. A semiconductor device has a first packag...
Invention Molded laser package with electromagnetic interference shield and method of making. A semiconduc...
Invention Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip m...
2022 Invention Semiconductor device and method of forming dual-sided interconnect structures in fo-wlcsp. A sem...
Invention Semiconductor device and method of forming embedded wafer level chip scale packages. A semicondu...
Invention Semiconductor device and method of using a standardized carrier to form embedded wafer level chip...
Invention Semiconductor device and method of compartment shielding using bond wires. A semiconductor devic...
Invention Semiconductor device with partial emi shielding removal using laser ablation. A semiconductor de...
Invention Antenna in embedded wafer-level ball-grid array package. A semiconductor device has a semiconduc...
Invention Cooling device and process for cooling double-sided sip devices during sputtering. A semiconduct...
Invention Mask design for improved attach position. A semiconductor device has a semiconductor package inc...
Invention Semiconductor device and method of forming microelectromechanical systems (mems) package. A semi...
Invention Emi shielding for flip chip package with exposed die backside. A semiconductor device has a subs...
2021 Invention Method and device for reducing metal burrs when sawing semiconductor packages. A semiconductor d...
Invention Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die...
Invention Semiconductor manufacturing equipment and method of providing support base with filling material ...
Invention Semiconductor device and method for reducing metal burrs using laser grooving. A semiconductor d...
Invention Antenna-in-package devices and methods of making. A semiconductor device has a PCB with an anten...
Invention Semiconductor device and method of forming embedded die substrate, and system-in-package modules ...
Invention Semiconductor device and method of making a photonic semiconductor package. A semiconductor devi...
Invention Semiconductor device and method of forming rdl hybrid interposer substrate. A semiconductor devi...
Invention Package with compartmentalized lid for heat spreader and emi shield. A semiconductor device has ...
Invention Package with windowed heat spreader. A semiconductor device has a substrate and a first semicond...
Invention Semiconductor device and method of forming semiconductor package with rf antenna interposer havin...
Invention Semiconductor device and method of controlling warpage during lab. A semiconductor device has a ...
Invention Double-sided partial molded sip module. A semiconductor device has a substrate and a first compo...
Invention Compartment shielding with metal frame and cap. A semiconductor device has a substrate and a fir...
Invention Semiconductor device and method of integrating rf antenna interposer with semiconductor package. ...
Invention Semiconductor device and method of forming bump pad array on substrate for ground connection for ...
Invention Split rdl connection between die and ubm. A semiconductor device has a semiconductor die. A firs...
Invention Semiconductor device and method of stacking devices using support frame. A semiconductor device ...
Invention Thermally enhanced fcbga package. A semiconductor device has a heat spreader with an opening for...
Invention Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to red...
Invention Semiconductor device and method of forming hybrid tim layers. A semiconductor device has an elec...
Invention Semiconductor device and method of forming vertical interconnect structure for pop module. A sem...
Invention Region-of-interest positioning for laser-assisted bonding. A semiconductor device is formed by p...
Invention Pspi-based patterning method for rdl. A semiconductor device is formed by providing a semiconduc...
Invention Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufa...
Invention Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photo...
Invention Semiconductor device and method of forming multi-layer shielding structure over the semiconductor...
Invention Laser-based redistribution and multi-stacked packages. A semiconductor device has a first package...
Invention Semiconductor device and method of forming a slot in emi shielding with improved removal depth. ...
Invention Semiconductor device and method of forming a slot in emi shielding layer using a plurality of slo...
Invention Semiconductor device and method of embedding circuit pattern in encapsulant for sip module. An SI...
2020 Invention Selective emi shielding using preformed mask with fang design. A semiconductor device has a semic...
Invention Mask design for improved attach position. A semiconductor device has a semiconductor package incl...
Invention Selective emi shielding using preformed mask. A semiconductor package has a substrate, a first co...
Invention Semiconductor device and method of forming discrete antenna modules. A semiconductor device has ...