STATS ChipPAC Pte. Lte.

Singapour

 
Quantité totale PI 1 503
Rang # Quantité totale PI 841
Note d'activité PI 3,1/5.0    228
Rang # Activité PI 3 066
Parent JCET-SC (Singapore) Pte. Ltd

Brevets

Marques

1 503 0
0 0
0 0
0
 
Dernier brevet 2024 - Semiconductor device and method ...
Premier brevet 1998 - Method of forming extended lead ...

Derniers inventions, produits et services

2023 Invention Shielded semiconductor package with open terminal and methods of making. A semiconductor device ...
Invention Compartment shielding with metal frame and cap. A semiconductor device has a substrate and a fir...
Invention Semiconductor device and method of providing high density component spacing. A semiconductor dev...
Invention Semiconductor devices with pyramidal shielding and method for making the same. A semiconductor d...
Invention Semiconductor device and method of forming a slot in emi shielding with improved removal depth. ...
Invention Pspi-based patterning method for rdl. A semiconductor device is formed by providing a semiconduc...
Invention Heat spreader assembly for use with a semiconductor device. Provided is a heat spreader assembly...
Invention Electronic components with improved insulation, electronic packages incorporating such electronic...
Invention Semiconductor device and method of forming hybrid tim layers. A semiconductor device has an elec...
Invention Semiconductor device and method of integrating rf antenna interposer with semiconductor package. ...
Invention Semiconductor device and method of forming discrete antenna modules. A semiconductor device has ...
Invention Antenna module, semiconductor device and methods for making the same. An antenna module comprise...
Invention Developing apparatus and substrate processing apparatus. The present application relates to a de...
Invention Modular semiconductor devices and electronic devices incorporating the same. A modular semicondu...
Invention Partially shieded semiconductor device and method for making the same. A method for making a sem...
Invention Semiconductor device and method for making the same. A semiconductor device and a method for for...
Invention Semiconductor device and method for making the same. A semiconductor device comprises a substrat...
Invention Heat spreader for use with a semiconductor device. Provided is a heat spreader for use with a se...
Invention Method and apparatus for forming semiconductor device. A method for forming a semiconductor devi...
Invention Semiconductor device and method of forming bump pad array on substrate for ground connection for ...
Invention Methods for making semiconductor devices. A method for making semiconductor devices includes: at...
Invention Semiconductor device and method of controlling warpage during lab. A semiconductor device has a ...
Invention Method for selectively forming a shielding layer on a semiconductor device. A method for selecti...
Invention Apparatus and method for selectively forming a shielding layer on a semiconductor package. An ap...
Invention Heat spreader for use with a semiconductor device. A heat spreader can be used with a semiconduc...
Invention Semiconductor device and method for making the same. A semiconductor device and a method for mak...
Invention Method and apparatus for testing a semiconductor device. A method and an apparatus for testing a...
Invention Interconnect device and semiconductor assembly incorporating the same. An interconnect device co...
Invention Selective emi shielding using preformed mask. A semiconductor package has a substrate, a first c...
Invention Stencil mask and stencil printing method. A stencil mask and a stencil printing method are provi...
Invention Method for making semiconductor device. A method for making a semiconductor device is provided. ...
Invention Test socket and apparatus for testing a semiconductor package. A test socket and a test apparatu...
2022 Invention Semiconductor device and method for partial emi shielding. A semiconductor device includes a sub...
Invention Semiconductor device and method of forming module-in-package structure using redistribution layer...
Invention Semiconductor device and method of forming package with double-sided integrated passive device. ...
Invention Semiconductor device and method of forming dummy vias in wlp. A semiconductor device has a semic...
Invention Semiconductor device and method of forming hybrid substrate with ipd over active semiconductor wa...
Invention Power envelope analysis for the thermal optimization of multi-chip modules. A semiconductor devi...
Invention Semiconductor device and method of forming underfill dam for chip-to-wafer device. A semiconduct...
Invention Semiconductor device and method of forming thin heat sink using e-bar substrate. A semiconductor...
Invention Semiconductor device and method of forming emi shielding material in two-step process to avoid co...
Invention Semiconductor device and method of heat dissipation using graphene. A semiconductor device has a...
Invention Semiconductor device and method of forming embedded magnetic shielding. A semiconductor device h...
Invention Semiconductor device and method of double shielding. A semiconductor device has a substrate. A f...
Invention Semiconductor device and method of selective shielding using fod material. A semiconductor devic...
Invention Semiconductor device and method for advanced thermal dissipation. A semiconductor device has a s...
Invention Semiconductor device and method of disposing electrical components over side surfaces of intercon...
Invention Semiconductor device and method of forming sip module absent substrate. A semiconductor device h...
Invention Semiconductor device and method using an emi-absorbing metal bar. A semiconductor device has a s...
Invention Semiconductor device and method of forming an embedded redistribution layer. A semiconductor dev...