Tessera, Inc.

États‑Unis d’Amérique


 
Quantité totale PI 669
Rang # Quantité totale PI 1 876
Note d'activité PI 2,4/5.0    36
Rang # Activité PI 21 129
Parent Xperi Corporation
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

544 2
0 1
119 1
2
 
Dernier brevet 2020 - Asymmetric high-k dielectric for...
Premier brevet 1989 - Extended integration semiconduct...
Dernière marque 2006 - TESSERA COMPLIANT CHIP
Première marque 1993 - TESSERA

Industrie (Classification de Nice)

Derniers inventions, produits et services

2020 Invention Asymmetric high-k dielectric for reducing gate induced drain leakage. An asymmetric high-k dielec...
Invention Low aspect ratio interconnect. A low aspect ratio interconnect is provided and includes a metall...
Invention Efficient metal-insulator-metal capacitor. A capacitor includes a stack. The stack has a first me...
Invention Sidewall image transfer nanosheet. A method for forming active regions of a semiconductor device ...
Invention Alternating hardmasks for tight-pitch line formation. Methods of forming fins include masking a r...
Invention Iii-v semiconductor devices with selective oxidation. Embodiments of the present invention provi...
2019 Invention Homogeneous densification of fill layers for controlled reveal of vertical fins. In accordance wi...
Invention Iii-v semiconductor devices with selective oxidation. Embodiments of the present invention provid...
Invention Spin transfer torque cell for magnetic random access memory. Embodiments are directed to STT MRAM...
Invention Reduction of stress in via structure. Methods for fabricating a via structure are disclosed. In ...
Invention Reduced resistance source and drain extensions in vertical field effect transistors. Semiconducto...
Invention Low aspect ratio interconnect. A low aspect ratio interconnect is provided and includes a metalli...
Invention Uniform fin dimensions using fin cut hardmask. A semiconductor device includes a substrate, a fin...
2018 Invention Sidewall image transfer nanosheet. Provided are embodiments of a method for forming active region...
Invention Efficient metal-insulator-metal capacitor. Capacitors include a stack that has a first metallic l...
Invention Preserving channel strain in fin cuts. A method of forming a semiconductor structure includes for...
Invention Self-aligned contact process enabled by low temperature. Self-aligned contacts of a semiconductor...
Invention Nanosheet transistors on bulk material. A semiconductor structure. The structure includes first s...
Invention Integrating and isolating nfet and pfet nanosheet transistors on a substrate. Embodiments of the ...
Invention Forming a hybrid channel nanosheet semiconductor structure. A method for fabricating a nanosheet ...
Invention Low resistance contact structures for trench structures. An electrical device including at least...
Invention Fin type field effect transistors with different pitches and substantially uniform fin reveal. A ...
Invention Microelectronic elements with post-assembly planarization. A microelectronic unit can include a c...
Invention Perpendicular magnetic anisotropy free layers with iron insertion and oxide interfaces for spin t...
Invention Margin for fin cut using self-aligned triple patterning. A method for fabricating a semiconductor...
Invention Multi-level metallization interconnect structure. A semiconductor structure is provided that incl...
2017 Invention Reduction of stress in via structure. A via structure for electric connection is disclosed. The v...
Invention Nanosheet transistors having different gate dielectric thicknesses on the same chip. Embodiments ...
Invention Finfet with uniform shallow trench isolation recess. Disclosed herein are processes and structure...
Invention Integration of thick and thin nanosheet transistors on a single chip. A method is presented for i...
Invention Self-aligned air gap spacer for nanosheet cmos devices. A semiconductor structure is provided tha...
Invention Wet etch removal of ru selective to other metals. A method for forming a conductive structure for...
Invention Efficient metal-insulator-metal capacitor fabrication. Methods of forming capacitors include form...
Invention Cobalt contact and interconnect structures. Methods and structures for forming cobalt contact and...
Invention Integration of super via structure in beol. Semiconductor devices including super via structures ...
Invention Semiconductor device formed by wet etch removal of ru selective to other metals. A method for for...
Invention Alternating hardmasks for tight-pitch line formation. Methods of forming fins include forming mas...
Invention Efficient metal-insulator-metal capacitor. Capacitors and methods of forming the same include for...
Invention Nanosheet transistors on bulk material. A method of forming a semiconductor device and resulting ...
2008 P/S Integrated circuits; computer software in the field of image processing; optical lenses; printed ...
2006 P/S Semiconductor chip packages.
2004 P/S WHOLESALE SERVICES FEATURING HANDCRAFTED HOME ACCESSORIES AND SPECIALTY GOODS
1996 P/S Electronic and computer components. Consulting and design services in the field of computers.
P/S Computer hardware, computer systems and sub-assemblies and related equipment, namely; semi-conduc...
1993 P/S [ semiconductor and carrier in combination; circuit boards; circuit board layers; computer chips;...