Unimicron Technology Corp.

Taïwan, Province de Chine

 
Quantité totale PI 441
Quantité totale incluant filiales 450 (+ 9 pour les filiales)
Rang # Quantité totale PI 2 885
Note d'activité PI 3,2/5.0    330
Rang # Activité PI 2 189
Activité incl filiales 2,9/5.0    331
Symbole boursier 3037 (twse)
ISIN TW0003037008
Capitalisation 212.6B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

439 1
0 0
1 0
0
 
Dernier brevet 2024 - Manufacturing method of circuit ...
Premier brevet 2001 - Method of producing external con...
Dernière marque 2017 - UNIMICRON
Première marque 2017 - UNIMICRON

Filiales

4 subsidiaries with IP (9 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Manufacturing method of circuit board structure. A manufacturing method of a circuit board struc...
Invention Manufacturing method of circuit board. A manufacturing method of the circuit board includes the ...
Invention Package structure. Disclosed is a package structure including a circuit board, a co-packaged opt...
Invention Vapor chamber structure and manufacturing method thereof. A vapor chamber structure includes a f...
2023 Invention Integrated circuit package structure. An integrated circuit (IC) package structure includes a ch...
Invention Circuit board assembly. A circuit board assembly is provided and includes a first circuit board,...
Invention Manufacturing method of circuit board. Provided is a manufacturing method of circuit board, inclu...
Invention Electronic packaging structure and manufacturing method thereof. An electronic packaging structu...
Invention Package structure and manufacturing method thereof. A package structure includes a circuit board...
Invention Multi-layered resonator circuit structure and multi-layered filter circuit structure. A multi-la...
Invention Circuit board structure and manufacturing method thereof. The invention provides a circuit board...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a pac...
Invention Circuit board structure. Provided is a circuit board structure including a substrate, a loop-wra...
Invention Bare circuit board. A bare circuit board is provided, in which the bare circuit board includes a...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a b...
2022 Invention Anti-diffusion substrate structure and manufacturing method thereof. An anti-diffusion substrate...
Invention Circuit board with low grain boundary density and forming method thereof. The present disclosure...
Invention Circuit board structure and method for forming the same. A circuit board structure is provided. ...
Invention Transmission device. A transmission device includes a daisy chain structure composed of at least...
Invention Transmission device for suppressing glass fiber effect. A transmission device for suppressing th...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a c...
Invention Electronic device. An electronic device including a light-emitting element, an IC chip, a substr...
Invention Package structure and method for manufacturing the same. A package structure includes a first su...
Invention Circuit board with embedded chip and method of manufacturing the same. The present disclosure pr...
Invention Circuit board assembly and manufacturing method thereof. This disclosure provides a circuit boar...
Invention Circuit board structure. A circuit board structure includes a substrate, a first build-up struct...
Invention Circuit board structure and manufacturing method thereof. A manufacturing method for circuit boa...
Invention Circuit board, manufacturing method thereof, and electronic device. A circuit board, including a...
Invention Electronic package structure and manufacturing method thereof. An electronic package structure a...
Invention Printed circuit board and manufacturing method thereof. The present disclosure provides a printe...
Invention Package structure and manufacturing method thereof. A manufacturing method of a package structur...
Invention Method for manufacturing circuit board and stacked structure. A method for manufacturing a circu...
Invention Package structure and optical signal transmitter. A package structure includes a circuit board, a...
Invention Etching device and etching method. The present invention provides an etching device which compri...
Invention Circuit board and circuit board module with docking structure and manufacture method of the circu...
Invention Electronic circuit assembly and method for manufacturing thereof. An electronic circuit assembly ...
Invention Circuit board and manufacturing method thereof. The present disclosure provides a circuit board a...
Invention Connector and method for manufacturing the same. A connector includes a substrate, a coverlay an...
Invention Circuit board and method of manufacturing the same. A circuit board includes a conductive metal l...
Invention Circuit signal enhancement method of circuit board and structure thereof. A method of a circuit s...
Invention Package structure and manufacturing method of the same. A package structure includes a substrate,...
Invention Printed circuit board stack structure and manufacturing method thereof. A printed circuit board s...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a ci...
Invention Glass carrier having protection structure and manufacturing method thereof. The invention disclo...
Invention Light-emitting diode package structure and manufacturing method thereof. A light-emitting diode ...
Invention Light-emitting diode package and manufacturing method thereof. A light-emitting diode package in...
2017 P/S Custom manufacture of printed circuit boards, electronic equipment and appliances for others Test...