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2024
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Invention
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Methods of gate contact formation for vertical transistors.
Structures and methods that facilita... |
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2023
|
Invention
|
Structures of gate contact formation for vertical transistors.
Structures and methods that facil... |
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2021
|
Invention
|
Methods for three-dimensional cmos integrated circuit formation.
Disclosed are novel structures ... |
|
|
Invention
|
Structures for three-dimensional cmos integrated circuit formation.
Disclosed are novel structur... |
|
|
Invention
|
Methods for novel three-dimensional nonvolatile memory. Disclosed are novel structures and method... |
|
|
Invention
|
Structures for novel three-dimensional nonvolatile memory. Disclosed are novel structures and met... |
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2020
|
Invention
|
Methods of making novel three-dimensional dram.
Novel three-dimensional DRAM structures are disc... |
|
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Invention
|
3d memory with 3d sense amplifier. Structures for 3D sense amplifiers for 3D memories are disclos... |
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|
Invention
|
Methods of gate contact formation for vertical transistors. Structures and methods that facilitat... |
|
|
Invention
|
Novel three-dimensional dram structures.
Novel three-dimensional DRAM structures are disclosed, ... |
|
|
Invention
|
Structures of gate contact formation for vertical transistors. Structures and methods that facili... |
|
|
Invention
|
Bitline structure for three-dimensional integrated circuit and method of forming the same. The in... |
|
2011
|
Invention
|
Semiconductor structure and method of fabricating the same.
A method of fabricating a semiconduc... |
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Invention
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Semiconductor memory device and method of fabricating the same. A method for fabricating semicond... |
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2010
|
Invention
|
Semiconductor circuit. A semiconductor memory device includes a substrate and an interconnect reg... |
|
|
Invention
|
Semiconductor circuit structure and method of making the same. A semiconductor circuit structure ... |
|
|
Invention
|
Semiconductor circuit structure and method of forming the same using a capping layer. A semicondu... |
|
|
Invention
|
Three-dimensional semiconductor structure and method of manufacturing the same.
A semiconductor ... |
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2009
|
Invention
|
Electronic circuit with embedded memory.
Circuitry includes first and second circuits spaced apa... |
|
|
Invention
|
Method for fabricating a semiconductor memory device.
A method for fabricating semiconductor mem... |
|
|
Invention
|
Semiconductor memory device. A method includes forming a switching device which includes a vertic... |
|
|
Invention
|
Information storage system which includes a bonded semiconductor structure. An information storag... |
|
|
Invention
|
Bonded semiconductor structure and method of fabricating the same. A method of forming a bonded s... |
|
|
Invention
|
Bonded semiconductor structure and method of making the same. A bonded semiconductor structure st... |
|
|
Invention
|
Semiconductor circuit and method of fabricating the same. A bonded semiconductor structure includ... |
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2008
|
Invention
|
Wafer bonding method. A method includes steps of providing first and second substrates, and formi... |
|
|
Invention
|
Semiconductor layer structure and method of making the same. A semiconductor layer structure incl... |
|
|
Invention
|
Semiconductor layer structure and method of making the same. A method of forming a semiconductor ... |
|
2007
|
Invention
|
Semiconductor bonding and layer transfer method. The present invention provides a method of coupl... |
|
|
Invention
|
Semiconductor memory device.
A method of forming a circuit includes providing a substrate; provi... |
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2006
|
Invention
|
Three-dimensional integrated circuit structure. A semiconductor structure includes an interconnec... |
|
|
Invention
|
Three-dimensional integrated circuit structure and method of making same.
Vertically oriented se... |
|
|
Invention
|
Leak indicator comprising a sniffer probe. The leak detector includes a basic device which includ... |
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2005
|
Invention
|
Semiconductor device with base support structure. An apparatus includes a semiconductor chip with... |
|
|
Invention
|
Semiconductor memory device. A method of forming a circuit includes providing a substrate; provid... |
|
|
Invention
|
Wafer bonding method. A method of coupling substrates together includes steps of providing first ... |
|
|
Invention
|
Semiconductor layer structure and method of making the same. A method of forming a circuit includ... |
|
|
Invention
|
Semiconductor bonding and layer transfer method.
The present invention provides a method of coup... |
|
|
Invention
|
Electronic circuit with embedded memory. Circuitry includes first and second circuits spaced apar... |
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2004
|
Invention
|
Vertical memory device structures. Vertically oriented semiconductor memory cells are added to a ... |
|
|
Invention
|
Method for making a three-dimensional integrated circuit structure. Vertically oriented semicondu... |
