Besi Netherlands B.V.

Pays‑Bas

 
Quantité totale PI 48
Rang # Quantité totale PI 28 387
Note d'activité PI 2,3/5.0    28
Rang # Activité PI 27 935

Brevets

Marques

21 0
0 0
27 0
0
 
Dernier brevet 2024 - Sawing device for forming saw-cu...
Premier brevet 2001 - Mould, encapsulating device and ...

Derniers inventions, produits et services

2023 Invention Sawing device for forming saw-cuts into a semiconductor product and method therefor. The present ...
Invention Cleaning unit for a mould for encapsulating electronic components, moulding system and method for...
Invention Method, mould, and housing for forming an electronic component package. The present invention rel...
Invention Lead forming device for forming an electronic component lead and a method for forming an electron...
Invention Gripper head, device, and method for handling and varying the spacing of electronic components ar...
2021 Invention Press, actuator set and method for encapsulating electronic components with at least two individu...
Invention Method and mould for encapsulating electronic components mounted on a carrier. The invention rel...
Invention Method and mould for encapsulating electronic components mounted on a carrier. The invention rela...
Invention Sawing device and method for forming saw-cuts into a semiconductor product. The invention relates...
2019 Invention Mould half and mould method for transfer moulding encapsulating electronic components mounted on ...
Invention Method and device for selectively separating electronic components from a frame with electronic c...
Invention Mould for encapsulating electronic components, insert for such a mould, method for producing an i...
Invention Method, foil, mould part and surface layer for encapsulating electronic components mounted on a c...
Invention Handler device for handling substrates. The present invention relates to a handler device for han...
2018 Invention Press part for supporting a mould part for encapsulating electronic components mounted on a carri...
Invention Mould, carrier with encapsulated electronic components, separated encapsulated electronic compone...
Invention Plunger for feeding encapsulating material to a mould cavity. The present invention relates to a ...
2016 Invention Mould, moulding press and method for encapsulating electronic components mounted on a carrier usi...
Invention Modular system for moulding electronic components and kit-of-parts for assembling such a modular ...
2015 Invention Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic com...
2014 Invention Method for positioning a carrier with electronic components and electronic component produced wit...
Invention Method for moulding and surface processing electronic components and electronic component produce...
2013 Invention Device and method for separating, at least partially drying and inspecting electronic components....
Invention Method and device for spacing apart electronic components arranged in a matrix structure. The inv...
2012 Invention Method and device for encapsulating electronic components using a reduction material which underg...
Invention Device for cleaning an encapsulating device for electronic components. The invention relates to a...
2011 Invention Seal for a sawing machine for separating electronic components and sawing machine provided with s...
Invention Carrier for separated electronic components and method for visual inspection of separated electro...
2009 Invention Device for separating electronic components. A device for separating electronic components includ...
Invention Device and method for drying separated electronic components. The invention relates to a device f...
2005 Invention Method and device for encapsulating electronic components with a conditioning gas. The invention ...
Invention Method and device for controllable encapsulation of electronic components. The invention relates ...
Invention Plunger assembly system. The invention relates to a plunger for feeding encapsulating material to...
2001 Invention Mould, encapsulating device and method of encapsulation. The invention relates to a mould for enc...