iCometrue Company Limited

Taïwan, Province de Chine

 
Quantité totale PI 63
Rang # Quantité totale PI 20 924
Note d'activité PI 2,7/5.0    79
Rang # Activité PI 8 896

Brevets

Marques

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0 0
0 0
0
 
Dernier brevet 2024 - Logic drive using standard commo...
Premier brevet 2017 - Logic drive based on standard co...

Derniers inventions, produits et services

2023 Invention Logic drive using standard commodity programmable logic ic chips comprising non-volatile random a...
Invention Logic drive based on standard commodity fpga ic chips using non-volatile memory cells. A field-p...
Invention Logic drive based on multichip package comprising standard commodity fpga ic chip with cooperatin...
Invention Non-volatile field programmable multichip package. A multi-chip package includes a ball-grid-arr...
Invention Non-volatile field programmable multichip package. A multi-chip package includes a first semicon...
Invention Logic drive based on chip scale package comprising standardized commodity programmable logic ic c...
Invention Multi-output look-up table (lut) for use in coarse-grained field-programmable-gate-array (fpga) i...
Invention Logic drive using standard commodity programmable logic ic chips. An expandable logic scheme bas...
Invention Logic drive based on standard commodity fpga ic chips. A chip package used as a logic drive, inc...
Invention 3d chip package based on through-silicon-via interconnection elevator. A chip package includes a...
Invention Chip package based on through-silicon-via connector and silicon interconnection bridge. A method...
2022 Invention Logic drive based on standardized commodity programmable logic semiconductor ic chips. A chip pa...
Invention Field programmable multichip package based on field-programmable-gate-array (fpga) integrated-cir...
Invention Logic drive using standard commodity programmable logic ic chips. A three-dimensional programmab...
Invention Logic drive with brain-like elasticity and integrality based on standard commodity fpga ic chips ...
Invention 3d chip package based on vertical-through-via connector. A connector may include: a first substr...
Invention Micro heat pipe for use in semiconductor ic chip package. A micro heat transfer component includ...
2021 Invention Logic drive using standard commodity programmable logic ic chips. An expandable logic scheme base...
Invention Logic drive based on standard commodity fpga ic chips. A chip package used as a logic drive, incl...
Invention Logic drive based on standard commodity fpga ic chips using non-volatile memory cells. A field-pr...
Invention Logic drive based on standardized commodity programmable logic semiconductor ic chips. A chip pac...
Invention Chip package based on through-silicon-via connector and silicon interconnection bridge. A method ...
Invention Logic drive based on multichip package using interconnection bridge. A multi-chip package compri...
2020 Invention Logic drive using standard commodity programmable logic ic chips. A three-dimensional programmabl...
Invention Method for data management and machine learning with fine resolution. A method for obtaining a pr...
Invention 3d chip package based on through-silicon-via interconnection elevator. A chip package includes a ...
Invention Vertical interconnect elevator based on through silicon vias. A chip package includes a first int...
Invention Logic drive based on multichip package comprising standard commodity fpga ic chip with cryptograp...