Shinko Electric Industries Co., Ltd.

Japon


 
Quantité totale PI 1 185
Rang # Quantité totale PI 1 107
Note d'activité PI 3,4/5.0    466
Rang # Activité PI 1 541
Symbole boursier
ISIN JP3375800004
Capitalisation 642742584210.0  (JPY)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

1 166 15
1 0
3 0
0
 
Dernier brevet 2024 - Optical waveguide device
Premier brevet 1979 - Method of making a take-carrier ...
Dernière marque 2013 - I-THOP
Première marque 1984 - SD

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Ceramic substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device...
Invention Optical waveguide device. An optical waveguide device includes a first cladding layer, a core la...
Invention Wiring board, semiconductor device, and wiring board manufacturing method. A wiring board includ...
Invention Optical waveguide device. An optical waveguide device includes an interconnect substrate, a firs...
Invention Optical waveguide device. An optical waveguide device includes an optical waveguide substrate, a...
Invention Optical waveguide device and method of making the same. An optical waveguide device includes an ...
Invention Optical waveguide mounted substrate and method of making the same. An optical waveguide mounted ...
Invention Wiring substrate and method of manufacturing wiring substrate. A wiring substrate includes: a wi...
Invention Optical waveguide device and manufacturing method thereof. An optical waveguide device includes ...
Invention Wiring substrate. A wiring substrate includes a first wiring layer, an insulation layer covering...
Invention Lead frame and semiconductor device. A lead frame includes a die pad having an upper surface and...
Invention Semiconductor device. A semiconductor device includes a wiring substrate, a semiconductor chip, ...
Invention Semiconductor device and wiring substrate. A semiconductor device includes a wiring substrate, a...
Invention Semiconductor device. A semiconductor device includes a wiring substrate, a semiconductor elemen...
Invention Substrate fixing device. A substrate fixing device includes a base plate, a heating portion prov...
Invention Waveguide substrate and method of making waveguide substrate. A waveguide substrate includes a c...
Invention Wiring board and wiring board manufacturing method. A wiring board includes a wiring layer, an i...
Invention Wiring board. A wiring board includes an insulating layer, first and second pads provided on the...
Invention Wiring board. A wiring board includes an insulating layer covering upper and side surfaces of a ...
Invention Substrate fixing device. A substrate fixing device includes a base plate having a first surface ...
Invention Loop-type heat pipe. An evaporator includes a first metal layer having a first inner surface and...
Invention Myoelectric sensor. A myoelectric sensor includes a wearable portion configured to be worn on a ...
Invention Wiring substrate. A wiring substrate includes a first insulation layer, a first wiring layer inc...
2023 Invention Electronic apparatus. An electronic apparatus includes a first metal layer, a component mounting...
Invention Electronic apparatus. An electronic apparatus includes a lead frame, a wiring board, and a seali...
Invention Wiring board. A wiring board includes a first interconnect layer, an insulating layer covering t...
Invention Wiring board. A wiring board has a built-in post wall waveguide having a region surrounded by tw...
Invention Optical connector. An optical connector includes a holding member to which a waveguide member is...
Invention Tray and substrate fixing device. A tray mounted on an electrostatic chuck includes an accommoda...
Invention Wiring substrate. A wiring substrate includes a metal layer, a resin layer, and a wiring structu...
Invention Stem and method of manufacturing stem. A stem includes a base member and a block member. The bas...
Invention Heat conductor and thermal management part. A heat conductor includes a base including a forest ...
Invention Semiconductor device. A semiconductor device includes a laminate including a semiconductor eleme...
Invention Interconnect substrate, method of making the same, and semiconductor apparatus. An interconnect ...
Invention Interconnect substrate and method of making the same. A method of making an interconnect substra...
Invention Optical connection structure and optical module. An optical connection structure includes a firs...
Invention Cap housing, cap, and semiconductor device. A cap housing includes a tubular part, and a top pla...
Invention Heat spreader and electronic component device. A heat spreader includes a metal substrate and a ...
Invention Biological information measurement device and biological information measurement method. A biolo...
Invention Substrate fixing device. A substrate fixing device includes a base plate having a first bonding ...
Invention Temperature adjusting member. A temperature adjusting member includes a base body, an insulator ...
Invention Electrostatic chuck, substrate fixing device and paste. An electrostatic chuck includes a base b...
Invention Semiconductor device. A semiconductor device includes a first inorganic insulating layer, a meta...
Invention Myoelectric sensor array. A myoelectric sensor array includes a plurality of myoelectric sensors...
Invention Wiring board assembly, wiring board, and wiring board manufacturing method. A wiring board assem...
Invention Substrate with optical waveguide and optical communication device. A substrate with optical wave...
Invention Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate. A wiri...
2013 P/S multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-...
2007 P/S Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ...
P/S Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit
2004 P/S Computer program for the purpose of determining exposing conditions, and determining the pattern ...
P/S Computer program for the purpose of determining exposing conditions, pattern data of mask less ex...
2000 P/S Lead frames for semiconductor devices
1997 P/S Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout...
1992 P/S [ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c...
P/S components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp...
P/S components for the manufacture of semiconductors and electronic devices;, namely, glass to metal ...
P/S components for the manufacture of semiconductors and electronic devices; namely, glass to metal s...
1985 P/S ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS...