Heraeus Materials Singapore, PTE., Ltd.

Singapour

 
Quantité totale PI 39
Rang # Quantité totale PI 35 023
Note d'activité PI 2,2/5.0    24
Rang # Activité PI 33 279

Brevets

Marques

9 0
0 0
30 0
0
 
Dernier brevet 2024 - Coated wire
Premier brevet 1998 - Composite noble metal wire

Derniers inventions, produits et services

2023 Invention Method for manufacturing a biocompatible wire. The disclosure relates to a method for manufactur...
2022 Invention Coated round wire. A round wire comprising a wire core with a surface, the wire core having a coa...
2021 Invention Ball-bond arrangement. A ball-bond arrangement comprising a bond pad of a semiconductor device an...
Invention Method for producing an ablated wire. One aspect pertains to a method for producing an ablated w...
Invention Coated wire. A wire comprising a silver-based wire core having a double-layer coating comprised ...
Invention Coated wire. A wire comprising a silver-based wire core having a double-layer coating comprised o...
Invention Method for increasing the straightness of a thin wire. A method for producing a further wire, whe...
Invention Coated wire. A wire comprising a wire core with a surface, the wire core having a coating layer ...
Invention Coated wire. A wire comprising a wire core with a surface, the wire core having a coating layer s...
2020 Invention Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconduct...
Invention Manufacturing and tape transfer method for a patterned preform. The invention relates to a manufa...
2018 Invention Process for electrically connecting contact surfaces of electronic components. A process for elec...
Invention Composite wire. One aspect relates to a coil comprising at least two composite wires. The compos...
Invention Method for manufacturing a composite wire. One aspect relates to a method for manufacturing a co...
Invention Method for manufacturing a cable. One aspect relates to a method for manufacturing a cable. The ...
Invention Method for manufacturing a passivated product. One aspect relates to a method for manufacturing ...
2017 Invention Coated wire. wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer ...
Invention Process for electrically connecting the contact surfaces of electronic components by a bonding wi...
2016 Invention Sputtering target of ruthenium-containing alloy and production method thereof. The present invent...
Invention Silver alloyed copper wire. A silver alloyed copper wire comprising a wire core, the wire core it...
Invention Alloyed silver wire. An alloyed silver wire comprising or consisting of a wire core, the wire cor...
Invention Co-based alloy sputtering target having boride and method for producing the same. The present inv...
2015 Invention Coated copper (cu) wire for bonding applications. The invention relates to a wire and a method of...
Invention Copper based bonding wire for a semiconductor device. The present invention relates to a wire, co...
Invention Improved coated copper wire for bonding applications. The present invention relates to a wire com...
Invention Corrosion and moisture resistant copper based bonding wire comprising nickel. A wire comprising a...
Invention Metal sintering preparation and the use thereof of the connecting of components. A metal sinterin...
Invention Ball-bond arrangement. A ball-bond arrangement comprising an aluminum bond pad of a semiconductor...
Invention Epoxy resin-based electroconductive composition. An electrically conductive composition comprisin...
Invention Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying...
2014 Invention Copper bond wire and method of making the same. The invention is related to a bonding wire, compr...
Invention Palladium coated copper wire for bonding applications. The invention is related to a bonding wire...
1998 Invention Composite noble metal wire. Composite wires in which a noble metal annulus is welded to an electr...