Advanced Semiconductor Engineering, Inc.

Taïwan, Province de Chine


 
Quantité totale PI 1 539
Quantité totale incluant filiales 1 590 (+ 53 pour les filiales)
Rang # Quantité totale PI 819
Note d'activité PI 3,7/5.0    1 334
Rang # Activité PI 538
Activité incl filiales 3,4/5.0    1 337
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

1 517 14
0 0
0 0
8
 
Dernier brevet 2024 - Semiconductor package structure ...
Premier brevet 1994 - Method of making laminar stackab...
Dernière marque 2022 - VIPack
Première marque 2005 - ACSP

Filiales

7 subsidiaries with IP (47 patents, 6 trademarks)

4 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Semiconductor package structure and method of manufacturing the same. A semiconductor package st...
Invention Substrate, semiconductor device package and method of manufacturing the same. A substrate includ...
Invention Semiconductor package structure. A semiconductor package structure is provided. The semiconducto...
Invention Semiconductor device packages and methods of manufacturing the same. A semiconductor device pack...
Invention Package structure and testing method. A package structure and a testing method are provided. The...
Invention Package structure, assembly structure and method for manufacturing the same. A package structure...
Invention Wiring structure and method for manufacturing the same. A wiring structure and a method for manu...
Invention System comprising packaged optical devices. A system including optical devices is provided. The ...
Invention Semiconductor device package including stress buffering layer. A semiconductor device package in...
Invention Conductive structure and wiring structure including the same. A conductive structure includes a ...
Invention Electronic device, package structure and electronic manufacturing method. An electronic device, ...
Invention Package structure and method for manufacturing the same. A package structure and a method for ma...
Invention Device package. An electronic device package includes a first substrate, a second substrate and ...
Invention Semiconductor device package and acoustic device including the same. A wireless earphone compris...
Invention Semiconductor device package and method for manufacturing the same. A semiconductor device inclu...
Invention Semiconductor device package and method of manufacturing the same. The present disclosure provid...
Invention Manufacturing process steps of a semiconductor device package. The present disclosure provides a...
Invention Semiconductor device package and method for manufacturing the same. A semiconductor device packa...
Invention Package structure. A package structure is provided. The package structure includes a substrate, ...
2022 P/S Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circ...
P/S Chips (integrated circuits); circuit board; semiconductors; semiconductor substrates; micro-circu...
P/S Etching process of semiconductor wafer; semiconductor packaging processing; etching processing of...
Invention Package structures and methods of manufacturing the same. A package structure is disclosed. The ...
Invention Electronic device. An electronic device is disclosed. The electronic device includes a first int...
Invention Semiconductor device package and method of manufacturing the same. A semiconductor device packag...
Invention Electronic devices. The present disclosure provides an electronic device. The electronic device ...
Invention Electronic device. The present disclosure provides an electronic device. The electronic device i...
Invention Electronic device. An electronic device is disclosed. The electronic device includes a carrier i...
Invention Electronic device. An electronic device is disclosed. The electronic device includes a first cir...
Invention Optoelectronic package. An optoelectronic package is provided. The optoelectronic package includ...
Invention Electronic device. An electronic device is disclosed. The electronic device includes a carrier, ...
Invention Optical device. An optical device is provided. The optical device includes a processing componen...
Invention Electronic devices. An electronic device is provided. The electronic device includes a first die...
Invention Electronic package. The present disclosure provides an electronic package. The electronic packag...
Invention Method for manufacturing a package. A method for manufacturing a package includes generating an ...
Invention Electronic package. An electronic package includes an electronic structure, a first circuit patt...
Invention Power module packaging structure. A power module is disclosed. The power module includes a first...
Invention Sensing package, optical module and method for detecting light. The present disclosure provides ...
Invention Testing device and method for testing a device under test. A testing device is disclosed. The te...
Invention Electronic package. An electronic device is disclosed. The electronic device includes a carrier,...
Invention Electronic device. An electronic device is disclosed. The electronic device includes a carrier a...
Invention Electronic package. An electronic package is provided. The electronic package includes a first p...
Invention Electronic package. An electronic package is provided. The electronic package includes a process...
Invention Electronic package and suction device. A method for manufacturing an electronic package and a su...
2018 P/S Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housi...
P/S Integrated packages of semiconductor integrated circuits, packages, components and modules; integ...
2012 P/S Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, i...
2010 P/S Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the n...
2009 P/S Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electro...
P/S Semiconductor Chip; Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integra...
P/S Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circu...
P/S Treatment of materials; processing and treatment of materials in the field of semiconductors, and...
2008 P/S Processing of materials, namely, silicon wafers and single silicon wafers Design for others in th...
P/S Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the ...
2005 P/S Integrated circuits; integrated circuits that contain solder balls; semiconductor device