Advanced Semiconductor Engineering, Inc.

Taïwan, Province de Chine


 
Quantité totale PI 1 536
Quantité totale incluant filiales 1 588 (+ 54 pour les filiales)
Rang # Quantité totale PI 805
Note d'activité PI 3,7/5.0    1 288
Rang # Activité PI 554
Activité incl filiales 3,4/5.0    1 292
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

1 513 15
0 0
0 0
8
 
Dernier brevet 2023 - Electronic package
Premier brevet 1994 - Method of making laminar stackab...
Dernière marque 2022 - VIPack
Première marque 2005 - ACSP

Filiales

7 subsidiaries with IP (48 patents, 6 trademarks)

4 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Embedded component package structure and manufacturing method thereof. A manufacturing method of...
Invention Semiconductor packages and methods of manufacturing the same. A semiconductor package includes a...
Invention Semiconductor device package and method of manufacturing the same. The present disclosure provid...
2022 Invention Method and system for manufacturing a semiconductor package structure. A method and a system for...
Invention Semiconductor device package with conductive pillars and reinforcing and encapsulating layers. A...
Invention Antenna module and semiconductor device package. The present disclosure provides an antenna modu...
Invention Semiconductor device package including promoters and method of manufacturing the same. The subje...
Invention Semiconductor package structure and method for manufacturing the same. A semiconductor package s...
Invention Package structure and method for manufacturing the same. A semiconductor package structure inclu...
P/S Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circ...
P/S Chips (integrated circuits); circuit board; semiconductors; semiconductor substrates; micro-circu...
P/S Etching process of semiconductor wafer; semiconductor packaging processing; etching processing of...
Invention Semiconductor device package and acoustic device having the same. A semiconductor device package...
2021 Invention Electronic package. An electronic package is provided. The electronic package includes a semicon...
Invention Electronic package structure and method for manufacturing the same. An electronic package struct...
Invention Semiconductor device package and method of manufacturing the same. A semiconductor device packag...
Invention Electronic package, optoelectronic package and method of manufacturing the same. An electronic p...
Invention Optoelectronic package structure and method of manufacturing the same. An optoelectronic package...
Invention Optoelectronic package and method for manufacturing the same. An optoelectronic package includes...
Invention Antenna device. The present disclosure provides an antenna device. The antenna device includes a...
Invention Optoelectronic package structure and method for manufacturing the same. An optoelectronic packag...
Invention Electronic package structure. An electronic package structure includes an electronic structure, ...
Invention Electronic package structure. At least some embodiments of the present disclosure relate to an e...
Invention Electronic device package and method of manufacturing the same. An electronic device package and...
Invention Method of manufacturing electrical package. A method for manufacturing an electrical package is ...
Invention Semiconductor package shielding structure. A selective EMI shielding structure for a semiconduct...
Invention Optoelectronic package and method for manufacturing the same. An optoelectronic package is provi...
Invention Optoelectronic package and method of manufacturing the same. An optoelectronic package and a met...
Invention Electronic package structure and method of manufacturing the same. An electronic package structu...
Invention Semiconductor device package. A semiconductor device package and a fabrication method thereof ar...
Invention Electronic package. An electronic package includes a carrier, a protection layer and an electron...
Invention Photonic package and method of manufacturing the same. A photonic package and a method of manufa...
Invention Optoelectronic device. An optoelectronic device includes a carrier, an electronic component, a ph...
Invention Optical adaptive device and wearable device. The present disclosure provides an optical adaptive...
Invention Electronic module and optical device. The present disclosure provides an electronic module inclu...
Invention Optical module. The present disclosure provides an optical module. The optical module includes a...
Invention Electronic package structure, electronic substrate and method of manufacturing electronic package...
Invention Electronic package. An electronic package is provided. The electronic package includes a first c...
Invention Electronic device. An electronic device includes a first electronic component, an encapsulant an...
Invention Electronic device and method for manufacturing the same. An electronic device and a method for m...
Invention Electronic package, semiconductor package structure, and method for manufacturing the semiconduct...
Invention Electronic device. The present disclosure relates to an electronic device that includes a first ...
Invention Optoelectronic device and method for manufacturing the same. An optoelectronic device includes a...
Invention Electronic carrier and method of manufacturing the same. An electronic carrier and a method of m...
Invention Optical device. An optical element is provided. The optical device includes a carrier, a first r...
Invention Electronic package and method of manufacturing the same. The present disclosure provides an elec...
Invention Semiconductor package structure and method for manufacturing the same. The present disclosure pr...
Invention Antenna device and method for manufacturing the same. An antenna device and a method for manufac...
Invention Electronic package and method for manufacturing the same. An electronic package includes a patte...
2018 P/S Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housi...
P/S Integrated packages of semiconductor integrated circuits, packages, components and modules; integ...
2015 P/S Custom fabrication of electronic modules, namely, the assembly of semiconductor devices for other...
2012 P/S Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, i...
2010 P/S Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the n...
2009 P/S Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electro...
P/S Semiconductor Chip; Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integra...
P/S Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circu...
P/S Treatment of materials; processing and treatment of materials in the field of semiconductors, and...
2008 P/S Processing of materials, namely, silicon wafers and single silicon wafers Design for others in th...
P/S Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the ...
2005 P/S Integrated circuits; integrated circuits that contain solder balls; semiconductor device