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2023
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Invention
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Electronic device and method for manufacturing the same.
An electronic device and a method for m... |
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Invention
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Sensor device package and method for manufacturing the same.
A sensor device package and method ... |
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Invention
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Electronic device package and method for manufacturing the same.
An electronic device package in... |
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Invention
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Optical module and method of making the same.
An optical module includes: a carrier; an optical ... |
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Invention
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Semiconductor package structure and method of manufacturing the same.
A semiconductor package st... |
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Invention
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Substrate, semiconductor device package and method of manufacturing the same.
A substrate includ... |
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Invention
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Semiconductor device package, electronic assembly and method for manufacturing the same.
A semic... |
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Invention
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Semiconductor package structure.
A semiconductor package structure is provided. The semiconducto... |
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Invention
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Semiconductor device packages and methods of manufacturing the same.
A semiconductor device pack... |
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Invention
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Package structure and testing method.
A package structure and a testing method are provided. The... |
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Invention
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Package structure, assembly structure and method for manufacturing the same.
A package structure... |
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Invention
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Wiring structure and method for manufacturing the same.
A wiring structure and a method for manu... |
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Invention
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System comprising packaged optical devices.
A system including optical devices is provided. The ... |
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Invention
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Semiconductor device package including stress buffering layer.
A semiconductor device package in... |
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Invention
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Conductive structure and wiring structure including the same.
A conductive structure includes a ... |
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Invention
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Electronic device, package structure and electronic manufacturing method.
An electronic device, ... |
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Invention
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Package structure and method for manufacturing the same.
A package structure and a method for ma... |
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Invention
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Package structure.
A package structure is provided. The package structure includes a substrate, ... |
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2022
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P/S
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Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circ... |
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P/S
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Chips being integrated circuits; circuit board; semiconductors; semiconductor substrates, namely,... |
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P/S
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Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of s... |
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Invention
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Package structure.
A package structure is provided. The package structure includes an electronic... |
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Invention
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Electronic package.
An electronic package is provided. The electronic package includes an insul... |
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Invention
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Semiconductor package.
A semiconductor package and a lid structure are disclosed. The semiconduc... |
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Invention
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Optical device including an optical component an electrical component, assembly structure includi... |
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Invention
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Flexible package.
A flexible package is provided. The flexible package includes a first carrier ... |
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Invention
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Optoelectronic package.
An optoelectronic package is provided. The optoelectronic package includ... |
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Invention
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Optical module.
An optical module is disclosed. The optical module includes a carrier, an optica... |
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Invention
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Method for manufacturing a package structure.
A method for manufacturing a package structure inc... |
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Invention
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Electronic device.
An electronic device is provided. The electronic device includes an antenna a... |
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Invention
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Package structures and methods of manufacturing the same.
A package structure is disclosed. The ... |
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|
Invention
|
Electronic device.
An electronic device is disclosed. The electronic device includes a first int... |
|
|
Invention
|
Semiconductor device package and method of manufacturing the same.
A semiconductor device packag... |
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|
Invention
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Electronic devices.
The present disclosure provides an electronic device. The electronic device ... |
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|
Invention
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Electronic device.
The present disclosure provides an electronic device. The electronic device i... |
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|
Invention
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Electronic device.
An electronic device is disclosed. The electronic device includes a carrier i... |
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|
Invention
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Electronic device.
An electronic device is disclosed. The electronic device includes a first cir... |
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|
Invention
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Electronic device.
An electronic device is disclosed. The electronic device includes a carrier, ... |
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|
Invention
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Optical device.
An optical device is provided. The optical device includes a processing componen... |
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|
Invention
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Electronic devices.
An electronic device is provided. The electronic device includes a first die... |
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|
Invention
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Electronic package.
The present disclosure provides an electronic package. The electronic packag... |
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Invention
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Method for manufacturing a package. A method for manufacturing a package includes generating an e... |
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2018
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P/S
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Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housi... |
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P/S
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Integrated packages of semiconductor integrated circuits, packages, components and modules; integ... |
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2012
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P/S
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Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, i... |
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2010
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P/S
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Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the n... |
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2009
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P/S
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Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electro... |
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P/S
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Semiconductor Chip; Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integra... |
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P/S
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Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circu... |
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P/S
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Treatment of materials; processing and treatment of materials in the field of semiconductors, and... |
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2008
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P/S
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Processing of materials, namely, silicon wafers and single silicon wafers Design for others in th... |
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P/S
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Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the ... |
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2005
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P/S
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Integrated circuits; integrated circuits that contain solder balls; semiconductor device |
