Jcet Semiconductor (shaoxing) Co., Ltd.

Chine

 
Quantité totale PI 365
Rang # Quantité totale PI 3 429
Note d'activité PI 2/5.0    15
Rang # Activité PI 56 145

Brevets

Marques

365 0
0 0
0 0
0
 
Dernier brevet 2022 - Semiconductor device and method ...
Premier brevet 2004 - System for fabricating an integr...

Derniers inventions, produits et services

2021 Invention Semiconductor device and method of forming ultra high density embedded semiconductor die package....
2019 Invention Semiconductor device and method of forming double-sided fan-out wafer level package. A semiconduc...
Invention Semiconductor device and method of forming encapsulated wafer level chip scale package (ewlcsp). ...
2018 Invention Method of packaging thin die and semiconductor device including thin die. A semiconductor device ...
2017 Invention Semiconductor device and method of using partial wafer singulation for improved wafer level embed...
Invention Semiconductor device and method of forming conductive vias by direct via reveal with organic pass...
Invention Semiconductor device and method of making embedded wafer level chip scale packages. A semiconduct...
Invention Semiconductor device and method of forming 3d dual side die embedded build-up semiconductor packa...
Invention Semiconductor device and method of forming interconnect substrate for fo-wlcsp. A semiconductor d...
Invention Semiconductor device and method of making wafer level chip scale package. A semiconductor device ...
Invention Semiconductor device and method of forming interposer frame over semiconductor die to provide ver...
2016 Invention Semiconductor device and method of using substrate having base and conductive posts to form verti...
Invention Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified...
Invention Semiconductor device and method of forming emi shielding layer with conductive material around se...
Invention Semiconductor device and method of forming a thin wafer without a carrier. A semiconductor device...
Invention Semiconductor device and method of forming wire studs as vertical interconnect in fo-wlp. A semic...
Invention Semiconductor device and method of forming wafer level ground plane and power ring. A semiconduct...
Invention Semiconductor device and method of forming stacked vias within interconnect structure for fo-wlcs...
Invention Semiconductor device and method of forming an embedded sop fan-out package. A semiconductor devic...
Invention Semiconductor device and method of forming a package in-fan out package. A semiconductor device c...
Invention Semiconductor device and method of forming shielding layer over integrated passive device using c...
Invention Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconducto...
Invention Semiconductor device and method for forming a low profile embedded wafer level ball grid array mo...
2015 Invention Semiconductor device and method of forming ewlb semiconductor package with vertical interconnect ...
Invention Integrated circuit packaging system with under bump metallization and method of manufacture there...
Invention Integrated circuit system with debonding adhesive and method of manufacture thereof. A system and...
Invention Semiconductor device and method of forming wlp with semiconductor die embedded within penetrable ...
Invention Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carri...
Invention Semiconductor device and method of forming insulating layer disposed over the semiconductor die f...
Invention Semiconductor device and method of embedding thermally conductive layer in interconnect structure...
2014 Invention Semiconductor device and method of forming conductive vias by backside via reveal with cmp. A sem...
Invention Semiconductor device and method of forming adhesive layer over insulating layer for bonding carri...
Invention Semiconductor device and method of forming rdl and vertical interconnect by laser direct structur...
2013 Invention Semiconductor device and method of wafer thinning involving edge trimming and cmp. A semiconducto...
Invention Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio. A semic...
Invention Integrated circuit through-substrate via system with a buffer layer and method of manufacture the...
Invention Integrated circuit packaging system with posts and method of manufacture thereof. A method of man...
Invention Integrated circuit packaging system with package underfill and method of manufacture thereof. A m...