Amkor Technology Singapore Holding Pte.ltd.

Singapour

 
Quantité totale PI 559
Rang # Quantité totale PI 2 284
Note d'activité PI 2,5/5.0    44
Rang # Activité PI 16 921

Brevets

Marques

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Dernier brevet 2023 - Semiconductor device and method ...
Premier brevet 1988 - Method of building solder bumps

Derniers inventions, produits et services

2023 Invention Semiconductor device and method of manufacturing thereof. A semiconductor device and a method of...
2018 Invention Method of forming a packaged semiconductor device having enhanced wettable flank and structure. A...
Invention Semiconductor package having inspection structure and related methods. An electronic device struc...
Invention Semiconductor package and fabricating method thereof. A semiconductor package structure and a met...
Invention Semiconductor device and method of manufacturing a semiconductor device. An exemplary semiconduct...
Invention Semiconductor device and manufacturing method thereof. A method for manufacturing a semiconductor...
Invention Semiconductor package with high routing density patch. Methods and systems for a semiconductor pa...
Invention Semiconductor device with improved thermal dissipation and manufacturing methods. A semiconductor...
Invention Manufacturing method of semiconductor device and semiconductor device thereof. A semiconductor de...
Invention Semiconductor device and method of manufacturing thereof. A semiconductor device and a method of ...
Invention Stackable via package and method. A stackable via package includes a substrate having an upper su...
Invention Sensor package and manufacturing method thereof. A fingerprint sensor device and a method of maki...
Invention Semiconductor device and method of manufacturing semiconductor device. Provided are a semiconduc...
Invention Semiconductor device and manufacturing method thereof. Provided are a semiconductor device includ...
Invention Semiconductor device package and manufacturing method thereof. Methods and systems for a semicond...
Invention Semiconductor package using cavity substrate and manufacturing methods. A semiconductor package i...
Invention Electronic device comprising a conductive pad on a protruding-through electrode. An electronic de...
Invention Embedded ball land substrate, semiconductor package, and manufacturing methods. A electronic devi...
Invention Electronic device with adaptive vertical interconnect and fabricating method thereof. Electronic ...
Invention Wafer level package and fabrication method. A method of forming an electronic component package i...
2017 Invention Semiconductor device with integrated heat distribution and manufacturing method thereof. A semico...
Invention Semiconductor device and manufacturing method thereof. A method of manufacturing a semiconductor ...
Invention Heat sink attached to an electronic component in a packaged device. A method for forming a packag...
Invention Electronic device with top side pin array and manufacturing method thereof. An electronic device ...
Invention Packaged electronic device having stepped conductive structure and related methods. An electronic...
Invention Method of manufacturing an electronic device and electronic device manufactured thereby. Various ...
Invention Methods and structures for increasing the allowable die size in tmv packages. A package includes ...
Invention Thin bonded interposer package. Methods and systems for a thin bonded interposer package are disc...
Invention Packaging for fingerprint sensors and methods of manufacture. A fingerprint sensor package, inclu...
Invention Semiconductor device having emi shielding structure and related methods. An electronic device st...
Invention Semiconductor device and manufacturing method thereof. A semiconductor device having an EMI shiel...
Invention Semiconductor device with leadframe configured to facilitate reduced burr formation. A semiconduc...
Invention Stress relieving through-silicon vias. Methods and systems for stress relieving through-silicon v...
Invention Semiconductor device with tiered pillar and manufacturing method thereof. A semiconductor device ...
Invention Method of forming a packaged semiconductor device using ganged conductive connective assembly and...
2016 Invention Semiconductor device and manufacturing method thereof. A semiconductor device and a manufacturing...
Invention Robust pillar structure for semicondcutor device contacts. Methods and systems for a robust pilla...
Invention Fine pitch copper pillar package and method. An electronic component package includes a substrate...
Invention Top port mems package and method. A top port MEMS microphone package includes a substrate having ...
Invention Trace stacking structure and method. Methods and systems for a trace stacking structure may compr...
2015 Invention Wafer level fan out package and method of fabricating wafer level fan out package. A wafer level ...
2014 Invention Encapsulated semiconductor package. A method of manufacturing a semiconductor package includes mo...
2013 Invention Stackable variable height via package and method. A stackable variable height via package include...
Invention Semiconductor device with metal dam and fabricating method. A semiconductor device is disclosed t...
2011 Invention Integrated shield package and method. An integrated shield electronic component package includes ...