Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 31 520
Quantité totale incluant filiales 31 601 (+ 150 pour les filiales)
Rang # Quantité totale PI 15
Note d'activité PI 4,8/5.0    26 071
Rang # Activité PI 11
Activité incl filiales 4,7/5.0    26 112
Symbole boursier
ISIN TW0002330008
Capitalisation 12.5T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

31 416 34
10 4
17 0
39
 
Dernier brevet 2022 - Semiconductor package structure ...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2022 - TSMC 3DBLOX
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (147 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2022 Invention Method for detecting environmental parameter in semiconductor fabrication facility. A semiconduc...
Invention Thermal interface materials, 3d semiconductor packages and methods of manufacture. 3D semiconduc...
Invention Method for forming semiconductor device structure with gate and resulting structures. A semicond...
Invention Carrier barrier layer for tuning a threshold voltage of a ferroelectric memory device. The prese...
Invention Semiconductor package. A semiconductor package includes a multilayer substrate, a device die, an...
Invention Multi-wafer capping layer for metal arcing protection. The present disclosure, in some embodimen...
Invention Methods for forming image sensors. Various embodiments of the present disclosure are directed to...
Invention Image sensor device. The present disclosure relates to a method of forming an integrated chip. T...
Invention Defect offset correction. A method includes: receiving a defect map from a defect scanner, where...
Invention Novel resistive random access memory device. A memory cell includes: a first contact feature par...
Invention Multifunctional collimator for contact image sensors. Disclosed is a method to fabricate a multi...
Invention Semiconductor device and method of manufacturing the same. A semiconductor device includes: firs...
Invention Vertical fuse memory in one-time program memory cells. In some embodiments, the present disclosu...
Invention Method of mask data synthesis and mask making. A method for mask data synthesis and mask making ...
Invention Selective dual silicide formation. A semiconductor device and a method of making the same are pr...
Invention Puf cell array, system and method of manufacturing same. A physically unclonable function (PUF) ...
Invention Source and drain epitaxial layers. The present disclosure is directed to source/drain (S/D) epit...
Invention Semiconductor device and manufacturing method thereof. A method includes forming a mask layer ab...
Invention Interconnect structures having varied materials. A semiconductor device includes a first underly...
Invention Stacked semiconductor devices and methods of forming same. Stacked semiconductor devices and met...
Invention Interfacial layer between fin and source/drain region. An embodiment is a semiconductor structur...
Invention Microelectromechanical system with piezoelectric film and manufacturing method thereof. A method...
Invention Laterally etched spacers for semiconductor device. The present disclosure relates to a semicondu...
Invention Soic chip architecture. A device, such as a computer system, includes an interconnection device ...
Invention Semiconductor device structure. A semiconductor device structure is provided. The semiconductor ...
Invention Semiconductor device structure and methods of forming the same. A semiconductor device structure...
Invention Packages with si-substrate-free interposer and method forming same. A method includes forming a ...
Invention Semiconductor arrangement and method of making. A semiconductor arrangement is provided. The sem...
Invention Semiconductor device and manufacturing method thereof. A semiconductor device includes a gate el...
Invention 3dic package integration for high-frequency rf system. A three-Dimensional Integrated Circuit (3...
Invention Method of reducing undesired light influence in extreme ultraviolet exposure. A method of genera...
Invention E-fuse enhancement by underlayer layout design. In the present disclosure, a semiconductor struc...
Invention Method of manufacturing semiconductor devices and semiconductor devices. A gate structure of a f...
Invention Plasma etcher edge ring with a chamfer geometry and impedance design. An edge ring, for a plasma...
Invention Semiconductor device and method. Improved inner spacers for semiconductor devices and methods of...
Invention Multilevel interconnection structure and method for forming the same. A semiconductor device inc...
Invention Semiconductor device and method of making. A semiconductor device is provided. The semiconductor...
Invention Spacer structure for nano-sheet-based devices. A device includes a first channel layer over a se...
Invention Structure and method for an mram device with a multi-layer top electrode. A memory device includ...
Invention Structure and method for transistors having backside power rails. The present disclosure provide...
Invention Semiconductor package and method of manufacturing the same. A method includes forming a set of t...
Invention Sram speed and margin optimization via spacer tuning. An N-type metal oxide semiconductor (NMOS)...
Invention Germanium hump reduction. The present disclosure provides methods of forming semiconductor devic...
Invention Fin field effect transistor device structure. A fin field effect transistor device structure is ...
Invention Finfet mos capacitor. Various embodiments of the present disclosure are directed towards a FinFE...
Invention Reducing parasitic capacitance in semiconductor devices. A semiconductor structure includes semi...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
Invention Method of forming semiconductor device having more similar cell densities in alternating rows. A...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
P/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2021 Invention Semiconductor structure and method of forming the same. A semiconductor device includes a gate s...
Invention Crack stop ring trench to prevent epitaxy crack propagation. In some embodiments, the present di...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
Invention Semiconductor package structure and method for forming the same. A semiconductor package structu...
2020 P/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
2018 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and structured semi-conduct...
P/S Custom manufacture of semiconductors, memory chips, wafers, and integrated circuits Product resea...
2012 P/S Financing of photovoltaic solar power generation projects. Licensing of technology, business and ...
2011 P/S Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of sem...
2008 P/S Semiconductors and integrated circuits. Custom manufacture of semiconductors, memory chips, wafer...
P/S Semiconductors and integrated circuits
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Scientific res...
2004 P/S Semiconductors, memory chips, wafers and integrated circuits
2003 P/S product research, custom design and testing for new product development, and technology consultat...