Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 36 182
Quantité totale incluant filiales 36 259 (+ 193 pour les filiales)
Rang # Quantité totale PI 14
Note d'activité PI 4,9/5.0    29 737
Rang # Activité PI 8
Activité incl filiales 4,8/5.0    29 774
Symbole boursier
ISIN TW0002330008
Capitalisation 16.800001T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

36 074 36
10 5
17 0
40
 
Dernier brevet 2024 - Memory device and operating meth...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2023 - N6e
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (190 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Patterning semiconductor devices and structures resulting therefrom. A method includes depositin...
Invention Methods to improve magnetic tunnel junction memory cells by treating native oxide. Methods of fo...
Invention Patterning method and structures resulting therefrom. A method includes depositing a first work ...
Invention Photoresist system and method. A photoresist apparatus and a method are provided. The photoresis...
Invention Dual etch-stop layer structure. The present disclosure relates to an integrated chip including a...
Invention Semiconductor structure and manufacturing method thereof. The present disclosure relates to a me...
Invention Method of making semiconductor structure including buffer layer. A method of making a semiconduc...
Invention Trench capacitor. A semiconductor device includes a substrate, a first multilayer capacitor, and...
Invention Cmos image sensor having indented photodiode structure. The present disclosure relates to a CMOS...
Invention Backside power rail structure and methods of forming same. Nanostructure field-effect transistor...
Invention Method for mask data synthesis with wafer target adjustment. A method for manufacturing a lithog...
Invention Semiconductor device and method of forming the same. A semiconductor device includes a first Chi...
Invention Semiconductor device. A semiconductor device includes a substrate, a channel layer, an insulatin...
Invention Package assembly and manufacturing method thereof. A package assembly and a manufacturing method...
Invention Liquid supply system and liquid preparation method. A liquid preparation method is provided. The...
Invention Two-dimensional (2d) metal structure. A semiconductor structure includes: a first gate structure...
Invention Memory sense amplifier with precharge. A memory device includes a memory cell and a sense amplif...
Invention Power gating cell structure. A power gating cell on an integrated circuit is provided. The power...
Invention Semiconductor bonding structure and method of forming the same. A semiconductor structure and a ...
Invention Optical device and method of fabricating thereof. Optical devices and methods of fabricating the...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 Invention Memory device and programming method thereof. A programming method of a memory device comprising...
Invention Memory device, operation method of the memory device and semiconductor die. A memory device, an ...
Invention Semiconductor structure and manufacturing method thereof. A structure including a redistribution...
Invention Semiconductor structure with roughened sidewall and method of manufacturing thereof. A semicondu...
Invention Redistribution structure with warpage tuning layer. A semiconductor device includes: a die havin...
Invention Semiconductor device and method of manufacturing the same. A semiconductor device is provided. T...
Invention Package with improved heat dissipation efficiency and method for forming the same. In an embodim...
Invention Semiconductor device structure and method for forming the same. A method of forming a semiconduc...
Invention Memory device and method of forming the same. A memory device includes a plurality of first cond...
Invention Semiconductor device having nanosheet transistor and methods of fabrication thereof. Embodiments...
Invention Memory device with jogged backside metal lines. A semiconductor device includes a first source/d...
Invention Semiconductor device. A semiconductor device includes a substrate, an interlayer dielectric laye...
Invention Memory device and operating method of the same. A memory device is provided, including a first w...
Invention Reflector and/or method for ultraviolet curing of semiconductor. An ultraviolet (UV) lamp assemb...
Invention Semiconductor device and manufacturing method thereof. A method includes forming an epitaxial st...
Invention Semiconductor packages and methods of manufacturing thereof. A semiconductor package is disclose...
Invention Package structure and fabricating method thereof. A package structure including a redistribution...
Invention Curved semiconductor chip and method for forming the same. The present disclosure provides a sem...
Invention Semiconductor device structure and methods of forming the same. A semiconductor device structure...
Invention Calibration hardware for ion implanter. A horizontally oriented calibration jig for a wafer grip...
Invention Package structure and manufacturing method thereof. A package structure including a semiconducto...
Invention Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods fo...
Invention Semiconductor package including reinforcement structure and methods of forming the same. A semic...
Invention Semiconductor device and method of forming the same. Provided is a semiconductor device includin...
Invention System for processing semiconductor device, method for forming semiconductor device, and method f...
Invention Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package. A ...
Invention Reduction of cracks in redistribution structure. The present disclosure provides methods and str...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package and a manufactur...
Invention Semiconductor manufacturing apparatus and method of forming semiconductor device. A method for f...
Invention Method of fabricating transistor structure. A method of fabricating a transistor structure is pr...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
P/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
P/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2021 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
2020 P/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
2018 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and structured semi-conduct...
P/S Custom manufacture of semiconductors, memory chips, wafers, and integrated circuits Product resea...
2011 P/S Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of sem...
2008 P/S Semiconductors and integrated circuits. Custom manufacture of semiconductors, memory chips, wafer...
P/S Semiconductors and integrated circuits
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Scientific res...