Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 36 954
Quantité totale incluant filiales 37 045 (+ 215 pour les filiales)
Rang # Quantité totale PI 13
Note d'activité PI 4,9/5.0    29 871
Rang # Activité PI 8
Activité incl filiales 4,8/5.0    29 931
Symbole boursier
ISIN TW0002330008
Capitalisation 20.7T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

36 848 34
10 5
17 0
40
 
Dernier brevet 2024 - Integrated circuit device and me...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2023 - N6e
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (212 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Transistor including a hydrogen-diffusion barrier and methods for forming the same. A thin film ...
Invention Apparatus and method for wafer cleaning. The present disclosure relates to an apparatus and a me...
Invention Semiconductor structure having air gaps and method for manufacturing the same. A method for manu...
Invention Integrated chip and method of forming thereof. An integrated chip comprises a substrate, an isol...
Invention Dielectric protection layer in middle-of-line interconnect structure manufacturing method. In so...
Invention Folded waveguide phase shifters. In an embodiment, a phase shifter includes: a light input end; ...
Invention Independent control of stacked semiconductor device. The present disclosure describes a semicond...
Invention Phase-change memory device and method. A method includes forming a dielectric layer over a subst...
Invention Thermal interface material having different thicknesses in packages. A package includes a packag...
Invention Method of manufacturing composite article. A method of manufacturing a composite article include...
Invention Method of manufacturing semiconductor device. A method of manufacturing a semiconductor device, ...
Invention Semiconductor package and manufacturing method thereof. Semiconductor package includes a pair of...
Invention Signal generator for controlling timing of signal in memory device. A device includes a memory a...
Invention Integrated circuit device. An integrated circuit device includes an interconnect layer, a memory...
Invention Die attached leveling control by metal stopper bumps. In some embodiments, the present disclosur...
Invention Integrated circuit device and methods. An integrated circuit (IC) device includes memory cells e...
Invention Diagonal via manufacturing method. A method of manufacturing a plurality of via structures inclu...
Invention Bilayer seal material for air gaps in semiconductor devices. The present disclosure relates to a...
Invention Semiconductor device and method of manufacture. Semiconductor devices and methods of manufacturi...
Invention Integrated circuit layout generation method. A method of generating an IC layout diagram include...
Invention Gate resistance reduction through low-resistivity conductive layer. A device includes a semicond...
Invention Method and apparatus for controlling droplet in extreme ultraviolet light source. A lithography ...
Invention Magnetic thin film inductor structures. Various magnetic thin film inductor structures are discl...
Invention Annealed seed layer to improve ferroelectric properties of memory layer. In some embodiments, th...
Invention Semiconductor devices and methods of manufacturing. Semiconductor devices and their manufacturin...
Invention Multi-flip semiconductor die sorter tool. A die sorter tool may include a first conveyor, and a ...
Invention Attribute-point-based timing constraint formal verification. Systems and methods are described h...
Invention Method for fabricating device die. A device die including a first semiconductor die, a second se...
Invention Memory device with word line pulse recovery. A memory device includes a plurality of memory cell...
Invention Box erecting apparatus and method. An apparatus and method for expanding a box blank into a box,...
Invention Resistor within a via. In some implementations, one or more semiconductor processing tools may f...
Invention Three-dimensional memory devices. In an embodiment, a device includes: a word line extending in ...
Invention Semiconductor device structure and method for forming the same. A semiconductor device structure...
Invention Device over photodetector pixel sensor. Various embodiments of the present application are direc...
2023 Invention Semiconductor device structure including forksheet transistors and methods of forming the same. ...
Invention Direct writing system used for electron beam lithography. A deflecting plate includes a silicon-...
Invention Memory device. A method of operating a memory device is provided. A clock signal is received. Ea...
Invention Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate s...
Invention Semiconductor structure and method for forming the same. Semiconductor structures and methods fo...
Invention Resistive random access memory device with improved bottom electrode. A resistive random access ...
Invention Semiconductor structure and method for manufacturing the same. A semiconductor structure include...
Invention Memory device and manufacturing thereof. Embodiments of the present disclosure relate to a memor...
Invention Semiconductor device and method for manufacturing thereof. The present disclosure provides a sem...
Invention Method of measuring chip characteristics, test device and non-transitory computer readable media....
Invention Structure and method for multi-gate semiconductor devices. The present disclosure provides a met...
Invention Semiconductor die package and methods of formation. Semiconductor dies in a semiconductor die pa...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
Invention Package with improved heat dissipation efficiency and method for forming the same. In an embodim...
Invention Semiconductor device and method. An embodiment is a method including forming a first interconnec...
Invention Multi-function etching sacrificial layers to protect three-dimensional dummy fins in semiconducto...
2022 P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
P/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
P/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2021 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
2020 P/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
2018 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and structured semi-conduct...
P/S Custom manufacture of semiconductors, memory chips, wafers, and integrated circuits Product resea...
2011 P/S Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of sem...
2008 P/S Semiconductors and integrated circuits. Custom manufacture of semiconductors, memory chips, wafer...
P/S Semiconductors and integrated circuits
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Scientific res...
2004 P/S Semiconductors, memory chips, wafers and integrated circuits