JX Nippon Mining & Metals Corporation

Japon


 
Quantité totale PI 1 532
Quantité totale incluant filiales 1 602 (+ 70 pour les filiales)
Rang # Quantité totale PI 846
Note d'activité PI 3,3/5.0    377
Rang # Activité PI 1 903
Activité incl filiales 3/5.0    393
Parent JX Holdings, Inc.
Classe Nice dominante Métaux communs et minerais; obje...

Brevets

Marques

512 4
68 1
945 0
2
 
Dernier brevet 2024 - Positive electrode active materi...
Premier brevet 1991 - Pretreating solution for silver ...
Dernière marque 2009 - CLEEN 6N Cu
Première marque 1988 - ACROTEC

Filiales

5 subsidiaries with IP (39 patents, 31 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Sputtering target and manufacturing method therefor. A sputtering target according to one embodi...
Invention Positive electrode active material for lithium ion batteries, positive electrode for lithium ion ...
Invention Copper alloy for electronic material, and electronic component. This copper alloy for an electron...
2022 Invention Method for recovering metals from lithium ion battery waste. Provided is a method for efficiently...
Invention Nonmagnetic material-dispersed fe-pt based sputtering target. Provided is a sputtering target wh...
Invention Multilayer body having function of transparent conductive film. The present disclosure addresses ...
Invention Easily crushable electrodeposited copper. A highly pure electrodeposited copper comprising copper...
Invention Oxide film and oxide sputtering target. The present disclosure addresses the problem of providing...
Invention Method for recovering metal from lithium-ion battery waste. Provided is a method for recovering a...
Invention Metal leaching method. A metal leaching method includes contacting battery powder of lithium ion ...
Invention Metal leaching method. The present invention provides a method for leaching out a metal contained...
Invention Mosi2 heater. 2222 heater, the electrode part is provided with a metal film; and an oxide film th...
Invention Rolled copper foil for secondary batteries, secondary battery negative electrode using same, and ...
Invention Sputtering target. A sputtering target according to the present invention contains Co and Pt as ...
Invention Sputtering target member, sputtering target assembly, and film forming method. Provided is a sput...
Invention Fe-pt-c-based sputtering target member, sputtering target assembly, method for forming film, and ...
Invention Method for producing cobalt solution, method for producing cobalt salt, method for producing nick...
Invention Igzo sputtering target. The present invention provides an IGZO sputtering target which has a high...
Invention Pure copper or copper alloy powder for deposition modeling. The present invention addresses the p...
Invention Metal resin composite electromagnetic shielding material. The present invention provides a metal ...
Invention Sputtering target and method for producing sputtering target. A sputtering target comprised of a...
Invention Sputtering target and method for producing sputtering target. This sputtering target is formed fr...
Invention Sputtering target and method for manufacturing same. The present invention addresses the problem ...
Invention Layered body having function as transparent electroconductive film and method for producing same,...
Invention Magnetic particle powder and magnetic particle dispersion. Provided is a magnetic particle powder...
Invention Metal-resin composite body. A metal-resin composite body 1 is provided with a metal plate 2, and ...
Invention Indium phosphide substrate. fbb from the wafer edge on the reverse side of the main surface is 15...
Invention Laminate and method for manufacturing same. Provided is a laminate that enhances an electromagnet...
Invention Brookite-type crystalline titanium oxide powder, and method for producing brookite-type crystalli...
Invention Method for treating battery waste. This method for treating battery waste includes: a first heat ...
Invention Copper oxide-containing powder, conductive paste, and copper oxide-containing powder manufacturin...
Invention Copper powder. Copper powder comprising copper particles wherein the compacted bulk density is 1....
Invention Male pin for connector and manufacturing method of male pin for connector. Provided are a male pi...
Invention Sputtering target and method for manufacturing the same. A ceramic sputtering target, wherein wh...
Invention Surface-treated copper foil, copper-clad laminate and printed wiring board. The present invention...
Invention Surface-treated copper foil, copper-clad laminate, and printed wiring board. This surface-treated...
Invention Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board. A surface-t...
Invention Surface-treated copper foil, copper-clad laminate plate, and printed wiring board. Provided is a ...
Invention Surface-treated copper foil, copper-clad laminate board, and printed wiring board. This surface-t...
2021 Invention Electrical and electronic component scrap processing method, and electrical and electronic compon...
Invention Indium phosphide substrate, method for manufacturing indium phosphide substrate, and semiconducto...
Invention Copper powder, and method for manufacturing copper powder. A copper powder containing copper par...
Invention Smelting furnace and method for operating same. The smelting furnace according to the present inv...
Invention Equipment and method for leaching copper, and method for producing electrolytic copper using said...
Invention Sulfide-based solid electrolyte and all-solid lithium ion battery. Provided are sulfide-based so...
Invention Mg2si single crystal, mg2si single crystal substrate, infrared light receiving element and method...
2019 Invention Novel peptide and method for using same. Provided is a method for selecting arsenic-containing m...
2009 P/S Copper and copper alloy for use as sputtering targets. Sputtering targets made of copper and copp...
P/S sputtering targets made of copper and copper alloy
2008 P/S Industrial chemicals; chemical reagents, other than for medical or veterinary purposes; copper su...
2001 P/S Copper foil having a layer of resistive material thereon for use in forming printed circuit boards
1988 P/S Semiconductor wafers, and connectors for optical fibers.
P/S SEMICONDUCTOR CHIPS, SEMICONDUCTOR WAFERS, [ LARGE-SCALE INTEGRATED CIRCUITS, SURFACE ACOUSTIC WA...