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2023
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Invention
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Wideband class-e amplifier. The present invention relates to a wideband class-E amplifier having ... |
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Invention
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Digital rf amplifier.
Example embodiments relate to digital RF amplifiers. One example digital R... |
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P/S
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Integrated circuits (ICs), chips, diodes, transistors, semiconductors and semiconductor devices; ... |
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P/S
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Integrated circuits (ICS), chips, diodes, transistors, semiconductors and semiconductor devices; ... |
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P/S
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Integrated circuits (ICS); radio frequency power chips and semiconductor chips; diodes; transisto... |
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P/S
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Integrated circuits (ICS), chips, diodes, transistors,
semiconductors and semiconductor devices;... |
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P/S
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Integrated circuits (ICs), chips, diodes, transistors,
semiconductors and semiconductor devices;... |
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Invention
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Doherty amplifier.
Example embodiments relate to Doherty amplifiers. One example includes a radi... |
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Invention
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Rf amplifier and electronic device comprising the same.
Example embodiments relate to radiofrequ... |
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Invention
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Doherty amplifier.
Example embodiments relate to Doherty amplifiers. One Doherty amplifier inclu... |
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Invention
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Compact doherty amplifier having improved video bandwidth. The present invention relates to an am... |
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2022
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Invention
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Power amplifier. The present invention relates to a power amplifier. The present invention partic... |
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Invention
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Power amplifier and doherty amplifier comprising the same.
Example embodiments relate to power a... |
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Invention
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Doherty power amplifier.
The present invention relates to a Doherty power amplifier, and a Doher... |
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Invention
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Doherty power amplifier. The present invention relates to a Doherty power amplifier, and a Dohert... |
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Invention
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Hybrid doherty power amplifier module.
Example embodiments relate to hybrid Doherty power amplif... |
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2021
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Invention
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Power amplifier device and semiconductor die.
Example embodiments relate to power amplifier devi... |
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Invention
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Electronic package and device comprising the same.
The present invention relates to an electroni... |
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Invention
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Electronic package and device comprising the same. The present invention relates to an electronic... |
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Invention
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Rf amplifier package.
Example embodiments relate to RF amplifier packages. One example RF amplif... |
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Invention
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Molded rf power package. The present disclosure relates to a molded radiofrequency, ‘RF’, power p... |
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Invention
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Push-pull class e amplifier. Example embodiments relate to push-pull class E amplifiers. One exam... |
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Invention
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Molded air-cavity package and device comprising the same. The present invention relates to a mold... |
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Invention
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Field-effect transistor.
Example embodiments relate to field-effect transistors. An example fiel... |
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Invention
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Electronic package and electronic device comprising the same.
Example embodiments relate to elec... |
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Invention
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Electronic package and electronic device comprising the same. The present invention relates to an... |
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Invention
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Wireless synchronization for multi-channel rf heating and drying devices. Example embodiments rel... |
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2020
|
Invention
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Field-effect transistor having improved layout.
Example embodiments relate to a field-effect tra... |
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Invention
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Field-effect transistor having improved layout. The present invention relates to a field-effect t... |
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Invention
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Electrical component, device and package. The present invention relates to an electrical componen... |
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Invention
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Amplifier having improved stability. Example embodiments relate to amplifiers having improved sta... |
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Invention
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Amplifier having improved stability. The present application relates to an amplifier. It further ... |
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Invention
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Electronic molded package. Example embodiments relate to an electronic package, to an electronic ... |
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Invention
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Electronic molded package. The present invention relates to an electronic package, to an electron... |
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Invention
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Amplifying device and amplifying system comprising the same. The present invention relates to an ... |
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Invention
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Packaged electronic device.
Example embodiments relate to packaged electronic devices. One examp... |
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Invention
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Packaged electronic device. The present invention relates to a packaged electronic device, and to... |
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2019
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Invention
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Power divider.
Example embodiments relate to power dividers. One example power divider includes ... |
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Invention
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Power divider. The present invention relates to a power divider. The invention further relates to... |
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Invention
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Lead frame based molded radio frequency package.
Example embodiments relate to lead frame based ... |
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Invention
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Lead frame based molded radio frequency package. The present invention relates to a lead frame ba... |
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Invention
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Rf power amplifier pallet. An example embodiment relates to a radiofrequency (RF) power amplifier... |
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Invention
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Solid-state cooking apparatus.
The present invention relates to a solid-state cooking apparatus.... |
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Invention
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Impedance control unit. An impedance control unit is disclosed. Also disclosed are a balun unit, ... |
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Invention
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Seed layer for electroplating eutectic ausn solder. The present invention relates to a packaged r... |
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Invention
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Power amplifier with decreased rf return current losses. Example embodiments relate to power ampl... |
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Invention
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Power amplifier with decreased rf return current losses. The present invention is related to a ra... |
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Invention
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Integrated passive device for rf power amplifier package. The present disclosure relates to a rad... |
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2018
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Invention
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Packaged rf power amplifier. The present disclosure relates to a packaged radiofrequency (RF) pow... |
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Invention
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Four-way doherty amplifier and mobile telecommunications base station. The present invention rela... |
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Invention
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Rf power amplifier system. At least one embodiment relates to a radio-frequency (RF) power amplif... |
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Invention
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Rf power amplifier system. The present invention relates to a radio-frequency (RF) power amplifie... |
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2017
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Invention
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Packaged rf power amplifier having a high power density. A packaged RF power amplifier comprises ... |
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2016
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P/S
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Integrated circuits (ICs), electronic chips for the manufacture of integrated circuits, diodes, t... |
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P/S
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Integrated circuits, electronic chips for the manufacture of integrated circuits, diodes, transis... |
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Invention
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Guard bond wires in an integrated circuit package. An integrated circuit package is provided. The... |
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2015
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P/S
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integrated circuits (ICs), semiconductor chips, semiconductor diodes, transistors, semiconductor... |
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P/S
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Integrated circuits, chips, [ diodes, ] transistors, semiconductors and semiconductor devices; po... |
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P/S
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Integrated circuits (ics), chips, diodes, transistors,
semiconductors and semiconductor devices;... |
