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2023
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Invention
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Package-on-package assembly with wire bond vias.
A microelectronic package includes a substrate ... |
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Invention
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Correction die for wafer/die stack.
Representative implementations of devices and techniques pro... |
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2022
|
Invention
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3d-interconnect with electromagnetic interference ("emi") shield and/or antenna. A method of manu... |
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Invention
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Capacitive coupling in a direct-bonded interface for microelectronic devices.
Capacitive couplin... |
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Invention
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Stacked structure with interposer.
Stacked structures having interposers adhered to packaging su... |
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Invention
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Dielets on flexible and stretchable packaging for microelectronics.
Dielets on flexible and stre... |
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Invention
|
Symbiotic network on layers. The technology relates to a system on chip (SoC). The SoC may includ... |
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Invention
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Network on layer enabled architectures.
The technology relates to a system on chip (SoC). The So... |
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2021
|
Invention
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Package-on-package assembly with wire bond vias. A microelectronic package includes a substrate h... |
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Invention
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Techniques for manufacturing split-cell 3d-nand memory devices.
Techniques for manufacturing mem... |
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Invention
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3d-interconnect. A microelectronic assembly comprises a microelectronic element, a redistribution... |
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Invention
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Systems and methods for flash stacking.
A three-dimensional stacking technique performed in a wa... |
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Invention
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Stretchable film assembly with conductive traces.
Apparatus and method relating generally to ele... |
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2020
|
Invention
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3d memory circuit. Some embodiments provide a three-dimensional (3D) circuit that has data lines ... |
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Invention
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Mixed exposure for large die. Techniques and arrangements for performing exposure operations on a... |
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Invention
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Capacitive coupling in a direct-bonded interface for microelectronic devices. Capacitive coupling... |
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Invention
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Remote optical engine for virtual reality or augmented reality headsets. A virtual reality/augmen... |
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Invention
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Connecting multiple chips using an interconnect device.
Techniques are disclosed herein for con... |
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|
Invention
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Active bridging apparatus. Techniques and mechanisms for coupling chiplets to microchips utilizin... |
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Invention
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Over and under interconnects. Techniques are disclosed herein for creating over and under interco... |
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Invention
|
Wire bonding method and apparatus for electromagnetic interference shielding. Apparatuses relatin... |
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Invention
|
Correction die for wafer/die stack. Representative implementations of devices and techniques prov... |
|
|
Invention
|
Systems and methods for flash stacking. A three-dimensional stacking technique performed in a waf... |
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|
Invention
|
Nanowire bonding interconnect for fine-pitch microelectronics. A nanowire bonding interconnect fo... |
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Invention
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Fine pitch bva using reconstituted wafer with area array accessible for testing. A method for sim... |
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2019
|
Invention
|
Multi-chip modules formed using wafer-level processing of a reconstituted wafer. Apparatuses and ... |
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Invention
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Network on layer enabled architectures. The technology relates to a system on chip (SoC). The SoC... |
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Invention
|
Integrated circuits protected by substrates with cavities, and methods of manufacture. Dies (110)... |
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Invention
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Flat metal features for microelectronics applications. Advanced flat metals for microelectronics ... |
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Invention
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Embedded organic interposer for high bandwidth. Embedded organic interposers for high bandwidth a... |
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Invention
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Dielets on flexible and stretchable packaging for microelectronics. Dielets on flexible and stret... |
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Invention
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Image sensor device. Methods of forming a back side image sensor device, as well as back side ima... |
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Invention
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Multi-die module with low power operation. A module for multiple dies is disclosed. The module ca... |
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Invention
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Nanoscale interconnect array for stacked dies. A microelectronic assembly including an insulating... |
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Invention
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Diffused bitline replacement in stacked wafer memory. Techniques are disclosed herein for creatin... |
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Invention
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Image sensor device. An image sensor device, as well as methods therefor, is disclosed. This imag... |
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Invention
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3d-interconnect. A method of making a microelectronic package includes bonding a conductive struc... |
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2018
|
Invention
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Multichip modules and methods of fabrication. In a multi-chip module (MCM), a “super” chip (110N)... |
|
|
Invention
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Stacked transmission line. A stacked, multi-layer transmission line is provided. The stacked tran... |
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Invention
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Interconnect structures and methods for forming same. A method for forming an interconnect struct... |
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Invention
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Stretchable film assembly with conductive traces. Apparatus and method relating generally to elec... |
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Invention
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Embedded vialess bridges. Embedded vialess bridges are provided. In an implementation, discrete p... |
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2017
|
Invention
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Multi-chip modules formed using wafer-level processing of a reconstitute wafer. Apparatuses and m... |
