Meiko Electronics Co., Ltd.

Japon


 
Quantité totale PI 139
Rang # Quantité totale PI 9 124
Note d'activité PI 2,4/5.0    34
Rang # Activité PI 22 568
Symbole boursier 67870 (tse)
ISIN JP3915350007
Capitalisation 103192782000.0  (JPY)
Industrie Electric Appliances
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

9 1
0 0
126 3
0
 
Dernier brevet 2024 - Soldering system, and device and...
Premier brevet 1986 - Connector for optical fiber
Dernière marque 2014 - M-VIA Flex
Première marque 2009 - MEIKO

Filiales

1 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Soldering system, and device and robot using same. A soldering system (1) comprises: a display im...
2022 Invention Component mounting substrate. The present invention provides a component mounting substrate (1) o...
Invention Component mounting substrate. A component mounting substrate (10) on which an electronic componen...
2021 Invention Substrate having lands for soldering. A substrate (1) having lands for soldering comprises: metal...
Invention Memory device and memory device module. A memory device includes: a wiring substrate including a...
Invention Storage device and storage device module. This storage device comprises: a wiring board that has ...
Invention Board with built-in component, and method for manufacturing same. A board (1) with a built-in com...
Invention Printed board. The printed board has a plurality of through-holes (11) that pass through a board ...
2020 Invention Method for manufacturing wiring pattern, and wiring pattern with resist. Provided is a method for...
Invention Thin temperature sensor. This thin temperature sensor (1) comprises: an insulating substrate (2);...
Invention Substrate with insulating heat dissipation block and method for producing same. This substrate (1...
Invention Heat-radiating member and heat-radiating substrate using same. A heat-radiating member (2) compri...
Invention Circuit board production method. A circuit board production method of the present invention compr...
Invention Ivh multilayer substrate and method for manufacturing same. This IVH multilayer substrate (1) com...
Invention Planar antenna board. A planar antenna board (1) comprises a dielectric (2), an antenna layer (3...
Invention Planar antenna board. A planar antenna board (1) comprises a dielectric (2), an antenna layer (3)...
2019 Invention Heat dissipation substrate and production method therefor. A heat dissipation substrate (1) is pr...
Invention Interposer mounted substrate. An interposer mounted substrate (1) is provided with: a mother boar...
Invention Heat dissipation substrate and production method therefor. This heat dissipation substrate 1 for ...
Invention High-density multilayer substrate and method for manufacturing same. A high-density multilayer su...
Invention Substrate with built-in component and method for manufacturing substrate with built-in component....
Invention Press device and method for manufacturing circuit substrate. [Problem] To provide a press device ...
2018 Invention Three-dimensional wiring board production method, three-dimensional wiring board, and substrate f...
Invention Method for manufacturing board with embedded components, and board with embedded components. [Pro...
2017 Invention Substrate production method. Provided is a substrate production method comprising: a substrate mo...
2016 Invention Metal mask and manufacturing method for same. A metal mask (1) comprises: a substantially plate-s...
Invention Inlay board inspecting method for, inspecting device, and manufacturing method. This inlay board ...
Invention Three-dimensional wiring board, method for manufacturing three-dimensional wiring board, and base...
Invention Substrate and method for producing substrate. A substrate (1) is provided with: a laminated wirin...
Invention Metal core substrate and method for manufacturing metal core substrate. Disclosed is a metal core...
Invention Substrate and method for manufacturing substrate. A substrate of the present invention is provide...
2015 Invention Substrate and method for manufacturing substrate. A substrate (1) is provided with: a laminated w...
Invention Component embedded substrate and method for manufacturing component embedded substrate. A compone...
Invention Three-dimensional molded component production method and three-dimensional molded component. Prov...
Invention Three-dimensional wiring board and method for producing three-dimensional wiring board. A three-d...
Invention Encapsulated circuit module, and production method therefor. To improve, in an encapsulated circ...
Invention Print curing method, print curing device, and method for manufacturing printed wiring board. A pr...
Invention Encapsulated circuit module, and production method therefor. To reduce, when a single encapsulate...
Invention Substrate detecting sensor and substrate suction-attachment pad employing same. This substrate de...
Invention Printed circuit board production method and etch resist pattern forming method. The invention com...
Invention Printed wiring board and production method for printed wiring board. A printed wiring board (1) h...
Invention Printed wiring board and production method for printed wiring board. A printed wiring board (1) t...
2014 Invention Encapsulated circuit module, and production method therefor. To provide a technique of preventing...
P/S Printed circuits; integrated circuits; integrated circuit chips; printed circuit boards; electro...
2009 P/S Printed circuit boards; integrated circuits; circuit boards; semi-conductors; cinematographic mac...
P/S Telecommunication device and apparatus; printed circuit boards; integrated circuits; circuit boa...