Register USPTO Patent
Application Number 17479854
Status Pending
Filing Date 2021-09-20
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
  • Ozkan, Onur
  • Cetegen, Edvin
  • Cho, Steve
  • Haehn, Nicholas S.
  • Vehonsky, Jacob
  • Duan, Gang


A semiconductor device may include a first plate-like element having a first substantially planar connection surface with a first connection pad and a second plate-like element having a second substantially planar connection surface with a second connection pad corresponding to the first connection pad. The device may also include a connection electrically and physically coupling the first and second plate-like elements and arranged between the first and second connection pads. The connection may include a deformed elongate element arranged on the first connection pad and extending toward the second connection pad and solder in contact with the second connection pad and the elongate element.

IPC Classes  ?

  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices