MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS

Register USPTO Patent
Application Number 17481068
Status Pending
Filing Date 2021-09-21
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
Inventor
  • Brun, Xavier Francois
  • Ganesan, Sanka
  • Sawyer, Holly
  • Lambert, William J.
  • Gosselin, Timothy A.
  • Wang, Yuting

Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL is electrically coupled to the second surface of the first die by solder interconnects, and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by non-solder interconnects.

IPC Classes  ?

  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices