DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT
| Register | USPTO Patent |
|---|---|
| Application Number | 17481247 |
| Status | Pending |
| Filing Date | 2021-09-21 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques directed to a double-sided glass substrate, to which a PIC is hybrid bonded to a first side of the glass substrate. A die is coupled with the second side of the glass substrate opposite the first side, the PIC and the die are electrically coupled with electrically conductive through glass vias that extend from the first side of the glass substrate to the second side of the glass substrate. Other embodiments may be described and/or claimed.