Register USPTO Patent
Application Number 17482311
Status Pending
Filing Date 2021-09-22
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
  • Li, Xiaoqian
  • Karhade, Omkar G.
  • Deshpande, Nitin A.
  • Pietambaram, Srinivas V.
  • Modi, Mitul


Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer having a first surface and an opposing second surface, wherein the first layer includes an insulating material, wherein the PIC has an active side, an opposing backside, and a lateral side substantially perpendicular to the active side and backside, and wherein the PIC is embedded in the insulating material with the active side facing up; an integrated circuit (IC) in a second layer at the second surface of the first layer, wherein the IC is electrically coupled to the active side of the PIC; and an optical component, having a reflector, optically coupled to the lateral side of the PIC and extending at least partially through the insulating material in the first layer along the lateral side of the PIC.

IPC Classes  ?

  • G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
  • G02B 6/42 - Coupling light guides with opto-electronic elements